Dragonwing products have been purpose-built for commercial and industrial applications, helping enable next-generation intelligence at the edge with high performance on-device AI, compute, and connectivity.
Choose the right platform for your edge AI system
Dragonwing IQ Family | INDUSTRIAL GRADE
Built for the extremes — the Dragonwing IQ Series is designed to deliver scalable edge AI performance with industrial-grade reliability, long lifecycle and extended temperature support.
Performance
Actual longevity values are product dependent, please see our product longevity program for more information.
Product specifications may vary within each series. Check the individual product documentation for exact specs.
IQ Family Product Roadmap
IQ10
Series
Up to 350 TOPS, Linux Yocto, Ubuntu, ‑40°C to 125°C temp range, ≥10-year product longevity
BEST FOR: Advanced robotics
IQ-X
Series
Up to 45 TOPS, Windows, ‑40°C to 105°C temp range, ≥10-year product longevity
BEST FOR: Windows industrial PCs, factory automation, panel PCs, smart displays, surveillance and NVR
IQ9
Series
Up to 100 TOPS, Linux Yocto, Ubuntu, ‑40°C to 115°C temp range, ≥10-year product longevity
BEST FOR: Edge AI boxes, robotics, gateways, vision kiosks, machine vision, factory automation, unified HMI + PLC, fleet cameras, surveillance and NVR boxes
IQ8
Series
Up to 40 TOPS, Linux Yocto, Ubuntu, ‑40°C to 125°C temp range, ≥10-year product longevity
BEST FOR: Fleet cameras, machine vision, smart hospital hubs, gateways, PLCs, factory automation, edge AI boxes and robotics
IQ6
Series
Up to 1.1 TOPS, Linux Yocto, Ubuntu, ‑40°C to 105°C temp range, ≥10-year product longevity
BEST FOR: HMIs, edge controllers, industrial gateways
IQ2
Series
Up to 1.1 TOPS, Android, Linux, Yocto, Ubuntu, Zephyr, -30°C to 115°C temp range, ≥10-year product longevity
BEST FOR: Industrial HMIs, micro/small PLCs, industrial gateways, machine vision, building and energy control, e-meters, energy storage, and panels.
Dragonwing Q Family | COMMERCIAL GRADE
Engineered for enterprise and commercial applications — the Dragonwing Q Series accelerates smarter decision-making and simplifies complexities with on-device AI, compute, and connectivity.
Performance
Actual longevity values are product dependent, please see our product longevity program for more information.
Product specifications may vary within each series. Check the individual product documentation for exact specs.
Q Family Product Roadmap
Q8
Series
BEST FOR: Smart displays, body, motion and video conferencing systems, set-top boxes and media hubs, wearables, collaboration gear
Q7
Series
BEST FOR: Smart displays and home hubs, smart appliances, AI TVs and media stations, industrial handhelds, body and dash cameras
Q6
Series
BEST FOR: Retail and e-commerce, transportation and logistics, smart warehousing, manufacturing, and healthcare
Q5
Series
BEST FOR: Ruggedized handhelds, tablets, industrial scanners and Human Machine Interfaces, cameras and edge AI boxes, kiosks and POS Systems, and autonomous mobile robots
Q4
Series
BEST FOR: Industrial handheld devices, smart retail solutions, edge AI cameras, industrial computing systems, healthcare devices, robotics and automation
Q2
Series
BEST FOR: Industrial handhelds, tracking and logistics devices, POS terminals, smart retail systems, connected healthcare devices, entry-level edge AI devices
Product Longevity Program
The Qualcomm IoT Product Longevity Program helps ensure extended availability, consistent software support, and lifecycle stability so you can design with confidence and scale deployments over time.
* Subject to change without notice
Meet the lineup
Qualcomm Dragonwing™ IQ Next-gen IoT chips for rugged Industrial Performance
AI FOR EXTREME ENVIRONMENTS
Dragonwing IQ9
Ideal for high-stakes factory automation, advanced robotics, autonomous systems, and applications where reliability is essential.
HIGH PERFORMANCE AI
Dragonwing IQ8
Ideal for factory automation, industrial robots, machine vision, and AI applications requiring significant compute power.
EFFICIENT INDUSTRIAL PERFORMANCE
Dragonwing IQ6
Ideal for industrial gateways, controllers, HMI devices, and handheld industrial devices where budget and reliability are key.
All products
Explore our portfolio of cutting-edge IoT products driving intelligent innovation.
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Product | CPU Name | Number of Cores | Clock Speed | GPU Name | Clock Speed | Memory Speed | Type | DSP Name | Display Number of Concurrent Displays | Interface Type | Interfaces Supported Interfaces | Software Options Operating System | Cellular Modem-RF Modem Name | Wi-Fi Generation | Standards | MIMO Configuration | Bluetooth Specification Version | Process Node and Technology Process Node | Longevity Program Longevity Period |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Qualcomm® Dragonwing™ Q8 Series | |||||||||||||||||||
Qualcomm® Oryon™ | 8 | Up to 4.32 GHz | Qualcomm® Adreno™ | 1.1 GHz | 4800 MHz | LPDDR5x | Qualcomm® Hexagon™ | — | 2x Mobile Industry Processor Interface (MIPI)1 | 215x GPIO | Version 15+ Android | — | Supported with companion chips - Wi-Fi 7 | — | — | Supported with companion chips - Bluetooth® 6.0 | — | — | |
Active | Qualcomm® Kryo™ | 8 | Up to 3.2 GHz | Qualcomm® Adreno™ | 680 MHz | 4200 MHz | LPDDR5x | — | 4 | 2x Display Serial Interface (DSI) | — | Android | Snapdragon™ X70 5G Modem-RF System | Wi-Fi 7 | 802.11be | 2x2 | Bluetooth® 5.3 | 4 nm | 10 year(s) |
Active | Qualcomm® Kryo™ 585 | 8 | Up to 2.85 GHz | Qualcomm® Adreno™ 650 | — | 2750 MHz | LPDDR54 | Qualcomm® Hexagon™ V66Q | 3 | 2x 4-lane Display Serial Interface (DSI) | — | Android | — | Wi-Fi 4 | 802.11ax | 2x2 | Bluetooth® 5.1 | 4 nm | 15 year(s) |
Active | Qualcomm® Kryo™ | 8 | Up to 3.2 GHz | Qualcomm® Adreno™ | 680 MHz | 4200 MHz | LPDDR5x | — | 4 | 2x Display Serial Interface (DSI) | — | Android | — | Wi-Fi 7 | 802.11be | 2x2 | Bluetooth® 5.3 | 4 nm | 10 year(s) |
Active | 8x Qualcomm® Kryo™ 385 | — | Up to 2.8 GHz | Qualcomm® Adreno™ 630 | — | 1866 MHz | LPDDR4x | Qualcomm® Hexagon™ 685 | — | — | — | — | — | Wi-Fi 5 | 802.11ac | — | Bluetooth® 5.0 | — | — |
Qualcomm® Dragonwing™ Q7 Series | |||||||||||||||||||
Active | Qualcomm® Kryo™ | 8 | Up to 2.8 GHz | Qualcomm® Adreno™ 722 | Up to 1.15 GHz | 4200 MHz | LPDDR5x | — | — | 2x Display Serial Interface (DSI) | GPIO | Android | — | 2x2 Wi-Fi 7 | — | — | Bluetooth® 5.4 | — | — |
Qualcomm® Dragonwing™ Q6 Series | |||||||||||||||||||
Qualcomm® Kryo™ | 8 | Up to 2.9 GHz | Qualcomm® Adreno™ | 1.15 GHz | 3200 MHz | LPDDR5 | Qualcomm® Hexagon™ | 2 | DisplayPort | 167x GPIO | Android | — | 2x2 Wi-Fi 7 | — | — | Bluetooth® 6.0 | 4 nm | — | |
Active | Qualcomm® Kryo™ 670 | 8 | Up to 2.4 GHz | Qualcomm® Adreno™ 643L | Up to 812 MHz | 4200 MHz | LPDDR5x | Qualcomm® Hexagon™ | 2 | USB-C with DisplayPort | 2x PCIe | Android | — | Wi-Fi 6E | 802.11ac | 2x2 | Bluetooth® 5.2 | 6 nm | — |
Active | Qualcomm® Kryo™ 670 | 8 | Up to 2.7 GHz | Qualcomm® Adreno™ 643 | Up to 812 MHz | 3200 MHz | LPDDR5 | Qualcomm® Hexagon™ | 2 | 1x DisplayPort 1.4 Single-Stream Transport (SST) | 169x GPIO | Ubuntu | — | Wi-Fi 6E | 802.11b | 2x2 | Bluetooth® 5.2 | 6 nm | 15 year(s) |
Active | Qualcomm® Kryo™ 460 | 8 | Up to 2.2 GHz | Qualcomm® Adreno™ 612 | — | 1804 MHz | LPDDR4x | Qualcomm® Hexagon™ 685 | 2 | — | USB 2.0 | Linux | — | Wi-Fi 5 | 802.11n | 1x1 | Bluetooth® 5.0 | 11 nm | 10 year(s) |
Active | Qualcomm® Kryo™ | 8 | Up to 2 GHz | Qualcomm® Adreno™ | — | 933 MHz | LPDDR4x | Qualcomm® Hexagon™ | — | USB-C with DisplayPort | PCIe 3.0 | Linux | Qualcomm® Snapdragon™ X12 LTE modem | Wi-Fi 5 | 802.11a | 1x1 | Bluetooth® 5.0 | 11 nm | — |
Qualcomm® Dragonwing™ Q5 Series | |||||||||||||||||||
Active | Qualcomm® Kryo™ 670 | 6 | Up to 2.1 GHz | Qualcomm® Adreno™ 643L | Up to 812 GHz | 3200 MHz | LPDDR4x | — | 2 | DisplayPort 1.4 Single-Stream Transport (SST) | 1x USB 2.0 | Windows | — | Wi-Fi 6 | 802.11ax | 1x1 | Bluetooth® 5.2 | 6 nm | 10 year(s) |
Active | Qualcomm® Kryo™ 585 | 8 | Up to 2.84 GHz | Qualcomm® Adreno™ 650 | — | 2133 MHz | LPDDR4x | Qualcomm® Hexagon™ | 3 | — | USB 3.1 | Linux | — | Wi-Fi 5 | 802.11ac | 2x2 | Bluetooth® 5.1 | 4 nm | 11 year(s) |
Active | Qualcomm® Kryo™ 670 | 8 | 2.7 GHz | Qualcomm® Adreno™ 642L | 812 MHz | 4200 MHz | non-POP | — | — | 2x PCIe | 2x PCIe | Linux | — | Wi-Fi 6E | 802.11ax | 2x2 | Bluetooth® 5.2 | 6 nm | — |
Qualcomm® Dragonwing™ Q4 Series | |||||||||||||||||||
Active | Qualcomm® Kryo™ CPU | 8 | Up to 2.4 GHz | Qualcomm® Adreno™ 613 | 1.01 GHz | 3.2 GHz | LPDDR5 | — | 1 | — | 1x PCIe | Android | — | Wi-Fi 6E | 802.11b | 2x2 | Bluetooth® 5.2 | 4 nm | 7 year(s) |
Active | Qualcomm® Kryo™ CPU | 8 | Up to 2.4 GHz | Qualcomm® Adreno™ 613 | 1.01 GHz | 3.2 GHz | LPDDR5 | — | 1 | — | 1x PCIe | Android | — | Wi-Fi 6E | 802.11b | 2x2 | Bluetooth® 5.2 | 4 nm | 7 year(s) |
Active | Qualcomm® Kryo™ | 8 | Up to 2.2 GHz | Qualcomm® Adreno™ 613 | 738 MHz | 2.75 GHz | LPDDR5 | — | 1 | — | 1x PCIe | Android | — | Wi-Fi 6E | 802.11n | 2x2 | Bluetooth® 5.2 | 4 nm | — |
Active | Qualcomm® Kryo™ 460 | 8 | Up to 2.2 GHz | Qualcomm® Adreno™ 612 | — | 1804 MHz | LPDDR4x | 2x Qualcomm® Hexagon™ Vector Processor | 2 | — | USB 2.0 | Android | — | Wi-Fi 5 | 802.11b | 1x1 | Bluetooth® 5.0 | 11 nm | 10 year(s) |
Active | 8x Qualcomm® Kryo™ 260 | 8 | Up to 2 GHz | Qualcomm® Adreno™ 610 | — | 933 MHz | LPDDR5x | Qualcomm® Hexagon™ Vector Processor | 1 | — | USB-C | Linux | — | Wi-Fi 5 | 802.11a | 8x8 (ready) | Bluetooth® 5.1 | 11 nm | 7 year(s) |
Active | Qualcomm® Kryo™ 260 | 8 | Up to 2 GHz | Qualcomm® Adreno™ 610 | — | 4200 MHz | LPDDR4x | Qualcomm® Hexagon™ | 1 | — | USB 3.1 | Linux | — | Wi-Fi 4 | 802.11ac | 1x1 | Bluetooth® 5.0 | 4 nm | — |
Active | Qualcomm® Kryo™ 260 | 8 | Up to 2 GHz | Qualcomm® Adreno™ 610 | — | 933 MHz | non-POP | Qualcomm® Hexagon™ Vector Processor | — | — | USB-C | Linux | — | Wi-Fi 5 | 802.11b | 8x8 (ready) | Bluetooth® 5.0 | 11 nm | 7 year(s) |
Qualcomm® Dragonwing™ Q2 Series | |||||||||||||||||||
1x Arm® Cortex®-A78 Processor | 1 | Up to 1.9 GHz | Qualcomm® Adreno™ 704 | 1.1 GHz | 1.8 GHz | LPDDR4x | Qualcomm® Hexagon™ V66 | — | 1x 4-lane Mobile Industry Processor Interface (MIPI) | 10 x QUP | Android | — | Wi-Fi 5 | — | — | Bluetooth® 5.0 | — | — | |
Active | Qualcomm® Kryo™ | 4 | Up to 2.0 GHz | Qualcomm® Adreno™ 702 | 845 MHz | 1804 MHz | LPDDR4x | — | 1 | — | USB 3.1 | Android | — | Wi-Fi 4 | 802.11a | 1x1 | Bluetooth® 5.0 | 11 nm | — |
Active | Qualcomm® Kryo™ | 4 | Up to 2.0 GHz | Qualcomm® Adreno™ 702 | 845 MHz | 1804 MHz | LPDDR4x | — | 1 | — | USB 3.1 | Android | — | Wi-Fi 4 | 802.11a | 1x1 | Bluetooth® 5.0 | 11 nm | — |
Active | Qualcomm® Kryo™ | 4 | Up to 2.0 GHz | Qualcomm® Adreno™ 702 | 845 MHz | 1804 MHz | LPDDR4x | Qualcomm® Hexagon™ | 1 | 1x 4-lane Display Serial Interface (DSI) | 102x GPIO | Linux Yocto | — | — | — | — | — | 4 nm | — |
- Up to 8K @ 60fps
- For ASC
- USB-C with DisplayPort
- Quad-channel PoP high speed LPDDR5/LPDDR4x SDRAM
