Q2 Series
Qualcomm Dragonwing™
Q2 Series
Q2

The Dragonwing Q2 Series offers entry-tier SoCs designed to bring superior performance, connectivity, and longevity to industrial and commercial IoT applications. These processors offer a cost-effective solution with essential performance, integrated connectivity, and support for smart devices in industrial and enterprise environments.

Target Applications
 

Industrial handhelds icon
Industrial handhelds
Tracking and logistics devices icon
Tracking and logistics devices
Connected healthcare devices icon
Connected healthcare devices
Point-of-sale (POS) terminals icon
Point-of-sale (POS) terminals
Smart retail systems icon
Smart retail systems
Entry-level edge AI devices icon
Entry-level edge AI devices

Featured specs

ESSENTIAL IOT

Entry-level processor delivering superior compute, integrated connectivity, and cost-effective efficiency for industrial and enterprise devices.

Qualcomm® AI Engine

AI ENGINE

4x ARM Cortex-A53 up to 2.0 GHz

COMPUTE

Qualcomm® Adreno™ 702

GRAPHICS & MULTIMEDIA

LTE Cat 4 modem, Wi-Fi, Bluetooth 5

CONNECTIVITY

1080p Video Capture & Playback

VIDEO

Up to 13 MP

CAMERA SUPPORT

Compare Dragonwing Q2 products

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3 of 3 total products

Product

CPU

Name

Number of Cores

Clock Speed

GPU

Name

Clock Speed

Memory

Speed

Type

DSP

Name

Display

Number of Concurrent Displays

Interface Type

Interfaces

Supported Interfaces

Software Options

Operating System

Wi-Fi

Generation

Standards

MIMO Configuration

Bluetooth

Specification Version

Process Node and Technology

Process Node

Qualcomm® Dragonwing™ Q2 Series

QCS2290
Active

Qualcomm® Kryo™ CPU

4

Up to 2 GHz

Qualcomm® Adreno™ 702

845 GHz

1804 MHz1


933 MHz2

LPDDR4x1


LPDDR32

1

USB 3.1

Android
Linux

Wi-Fi 4
Wi-Fi 5

802.11ac
802.11a
802.11b
802.11g
802.11n

1x1

Bluetooth® 5.0

4 nm

QRB2210
Active

Qualcomm® Kryo™

4

Up to 2.0 GHz

Qualcomm® Adreno™ 702

845 MHz

1804 MHz3

LPDDR4x

Qualcomm® Hexagon™

1

1x 4-lane Display Serial Interface (DSI)

102x GPIO
27x LPI GPIO
10x QUP4


9x PWM
2x I²C5

Linux Yocto

4 nm

QCM2290
Active

Qualcomm® Kryo™

4

2.0 GHz

Qualcomm® Adreno™ 702

4200 MHz

LPDDR5x

1

USB 3.1

Android
Linux

Wi-Fi 5
Wi-Fi 4

802.11n
802.11g
802.11b
802.11a
802.11ac

1x1

Bluetooth® 5.0

4 nm

  1. LPDDR4x @ 1804 MHz; 2 x 16 bit
  2. LPDDR3 @ 933 MHz; 1 x 32 bit
  3. SDRAM designed for 1804 MHz clock (2 × 16 bit); 1x32-bit LPDDR3 @ 933 MHz
  4. Support UART, I2C, I3C, SPI
  5. Dedicated for Camera

Efficiency at the edge

Cost Efficiency

Delivers essential performance and connectivity at a lower cost, ideal for budget-conscious industrial and commercial deployments.

Integrated Connectivity

Built-in LTE, Wi-Fi, and Bluetooth® provide reliable wireless communication for mobile and fixed IoT devices.

Compact Multimedia

Supports HD+ displays and 1080p video, enabling basic multimedia and UI capabilities for smart devices.

Extended Lifecycle

Designed for long-term deployments with support through 2028, reducing maintenance and upgrade costs.

Product Longevity Program

Qualcomm Technologies designs SoCs with longevity and durability to support applications requiring extended life cycles, helping ensure stability in customer product designs.

* Subject to change without notice

How companies are harnessing the power of Dragonwing Q

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HIGH-PERFORMANCE COMPUTE

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SCALABLE AI IOT

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SMART SYSTEMS

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Support

Resources and support to help you get started.

The Qualcomm Dragonwing™ RB3 Gen 2 Development Kit

Develop advanced AI edge computing for diverse IoT applications.

Contact Sales

Get in touch with an expert to learn more about our Q8 offerings.

Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Our leading-edge AI, high performance, low-power computing, and unrivaled connectivity deliver proven solutions that transform major industries. At Qualcomm, we are engineering human progress.

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