The Dragonwing Q2 Series is designed to deliver a highly integrated combination of application processing, on-device AI, multimedia, and flexible connectivity for commercial, enterprise, and consumer IoT products, with power-efficient performance and design flexibility for compact, cost-effective systems.
Applications
How the Dragonwing Q2 Series fits in
Performance
Actual longevity values are product dependent, please see our product longevity program for more information.
Product specifications may vary within each series. Check the individual product documentation for exact specs.
Q2 Series
Q-2390
Optimized for compact, cost-effective connected commercial enterprise and consumer devices. The modem SKU adds integrated 4G LTE data connectivity and GPS.
Up to 1.9 GHz clock speed
Quad-core Qualcomm® Kryo™ CPU
Up to 1.1 INT8 TOPS
AI Performance
RISC-V MCU
Real-time processing
-30°C to 115°C
Operating temperature
4G LTE, Wi-Fi, Bluetooth, GNSS
Connectivity options
Decode: 1080p30 8-bit/ Encode: 1080p30 8-bit for H.264/H.265
Video processing
Compare Dragonwing Q2 products
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4 of 4 total products
Product | CPU Name | Number of Cores | Clock Speed | GPU Name | Clock Speed | Memory Speed | Type | DSP Name | Display Number of Concurrent Displays | Interface Type | Interfaces Supported Interfaces | Software Options Operating System | Wi-Fi Generation | Standards | MIMO Configuration | Bluetooth Specification Version | Process Node and Technology Process Node |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Qualcomm® Dragonwing™ Q2 Series | |||||||||||||||||
1x Arm® Cortex®-A78 Processor | 11 | Up to 1.9 GHz | Qualcomm® Adreno™ 704 | 1.1 GHz | 1.8 GHz | LPDDR4x | Qualcomm® Hexagon™ V663 | — | 1x 4-lane Mobile Industry Processor Interface (MIPI) | 10 x QUP | Android | Wi-Fi 55 | — | — | Bluetooth® 5.0 | — | |
Active | Qualcomm® Kryo™ | 4 | Up to 2.0 GHz | Qualcomm® Adreno™ 702 | 845 MHz | 1804 MHz6 | LPDDR4x6 | — | 1 | — | USB 3.1 | Android | Wi-Fi 4 | 802.11a | 1x1 | Bluetooth® 5.0 | 11 nm |
Active | Qualcomm® Kryo™ | 4 | Up to 2.0 GHz | Qualcomm® Adreno™ 702 | 845 MHz | 1804 MHz6 | LPDDR4x6 | — | 1 | — | USB 3.1 | Android | Wi-Fi 4 | 802.11a | 1x1 | Bluetooth® 5.0 | 11 nm |
Active | Qualcomm® Kryo™ | 4 | Up to 2.0 GHz | Qualcomm® Adreno™ 702 | 845 MHz | 1804 MHz8 | LPDDR4x | Qualcomm® Hexagon™ | 1 | 1x 4-lane Display Serial Interface (DSI) | 102x GPIO | Linux Yocto | — | — | — | — | 4 nm |
- A78 @ 1.9 GHz
- A55 @ 1.8 GHz
- 2x HVX
- MCU
- via WCN3950/WCN398x
- LPDDR4x @ 1804 MHz; 2 x 16 bit
- LPDDR3 @ 933 MHz; 1 x 32 bit
- SDRAM designed for 1804 MHz clock (2 × 16 bit); 1x32-bit LPDDR3 @ 933 MHz
- Support UART, I2C, I3C, SPI
- Dedicated for Camera
EARLY ACCESS
Ready to get started?
Apply to join the early access program for the Dragonwing IQ-2390 and Dragonwing Q-2390.
Product Longevity Program
The Qualcomm® IoT Product Longevity Program helps ensure extended availability, consistent software support, and lifecycle stability so you can design with confidence and scale deployments over time.
* Subject to change without notice
