---
title: "Q4 Series"
url: "https://www.qualcomm.com/internet-of-things/products/q4-series"
---

# Q4 Series

Qualcomm Dragonwing™

Contact Sales

The Dragonwing Q4 Series processors are designed for industrial and commercial IoT, offering premium connectivity, AI, and multimedia capabilities with long-term support. These processors deliver high performance, advanced AI, and superior connectivity for next-gen handheld devices, edge devices, and smart systems with extended support.

[Product license agreement](https://www.qualcomm.com/internet-of-things/products/q4-series)

### Target Applications

- Handheld devices
- Smart retail solutions
- Edge AI cameras
- Industrial computing systems
- Connected healthcare devices
- Robotics and automation

## Featured specs

**SMART SYSTEM**

Optimized for industrial handhelds and smart edge devices, combining advanced AI, multimedia, and connectivity with extended support.

- **6th Gen Qualcomm® AI Engine** — AI ENGINE
- **Octa-core up to 2.7GHz** — COMPUTE
- **Qualcomm® Adreno™ 613** — VIDEO
- **Wi-Fi 6E, Bluetooth® 5.3, Optional 5G** — CONNECTIVITY
- **4K Video Capture & Playback** — VIDEO
- **Up to 48MP single or 25MP dual** — CAMERA SUPPORT

## Compare Dragonwing Q4 products

Note: to leverage the best experience for the product comparison table, please use the desktop to view content.

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7 of 7 total products

**Qualcomm® Dragonwing™ Q4 Series**

| Product | Buy Online | CPU Name | Number of Cores | Clock Speed | GPU Name | Clock Speed | Memory Speed | Memory Type | DSP Name | Display: Number of Concurrent Displays | Interfaces: Supported Interfaces | Software Options: Operating System | Wi-Fi Generation | Standards | MIMO Configuration | Bluetooth Specification Version | Process Node | Longevity Period |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| [QCS4290](https://www.qualcomm.com/internet-of-things/products/q4-series/qcs4290) (Active) | Buy Now | 8x Qualcomm® Kryo™ 260 | 8 | Up to 2 GHz | Qualcomm® Adreno™ 610 | — | 933 MHz / 1866 MHz | LPDDR5x | Qualcomm® Hexagon™ Vector Processor | 1 | USB-C | Linux / Android | Wi-Fi 5 / Wi-Fi 4 / Wi-Fi 6 (ready) | 802.11a / 802.11b / 802.11ac / 802.11ax (ready) / 802.11n / 802.11g | 8x8 (ready) / 1x1 | Bluetooth® 5.1 | 11 nm | — |
| [QCM4290](https://www.qualcomm.com/internet-of-things/products/q4-series/qcm4290) (Active) | — | Qualcomm® Kryo™ 260 | 8 | Up to 2 GHz | Qualcomm® Adreno™ 610 | — | 933 MHz / 1866 MHz | non-POP / LPDDR4x | Qualcomm® Hexagon™ Vector Processor / Qualcomm® Hexagon™ 683 | — | USB-C | Linux / Android | Wi-Fi 5 / Wi-Fi 4 | 802.11b / 802.11g / 802.11ac / 802.11a / 802.11n | 8x8 (ready) / 1x1 | Bluetooth® 5.0 | 11 nm | — |
| [Q-4390](https://www.qualcomm.com/internet-of-things/products/q4-series/q-4390) (Active) | — | Qualcomm® Kryo™ / Qualcomm® Kryo™ Octa-core CPU | 8 | Up to 2.2 GHz | Qualcomm® Adreno™ 613 | 738 MHz | 2.75 GHz / 2.1 GHz | LPDDR5¹ / LPDDR4x¹ | — | 1 | 1x PCIe² / 1x USB 3.1 | Android | Wi-Fi 6E | 802.11n / 802.11b / 802.11g / 802.11ac / 802.11ax | 2x2 | Bluetooth® 5.2 | 4 nm | — |
| [QCM4490](https://www.qualcomm.com/internet-of-things/products/q4-series/qcm4490) (Active) | — | Qualcomm® Kryo™ CPU / Qualcomm® Kryo™ Octa-core CPU | 8 | Up to 2.4 GHz | Qualcomm® Adreno™ 613 | 1.01 GHz | 3.2 GHz / 2.1 GHz | LPDDR5¹ / LPDDR4x¹ | — | 1 | 1x PCIe² / 1x USB 3.1 | Android | Wi-Fi 6E | 802.11b / 802.11g / 802.11n / 802.11ac / 802.11ax | 2x2 | Bluetooth® 5.2 | 4 nm | 7 year(s) |
| [QCS4490](https://www.qualcomm.com/internet-of-things/products/q4-series/qcs4490) (Active) | Buy Now | Qualcomm® Kryo™ CPU / Qualcomm® Kryo™ Octa-core CPU | 8 | Up to 2.4 GHz | Qualcomm® Adreno™ 613 | 1.01 GHz | 3.2 GHz / 2.1 GHz | LPDDR5¹ / LPDDR4x¹ | — | 1 | 1x PCIe² / 1x USB 3.1 | Android | Wi-Fi 6E | 802.11b / 802.11g / 802.11n / 802.11ac / 802.11ax | 2x2 | Bluetooth® 5.2 | 4 nm | 7 year(s) |
| [QCS410](https://www.qualcomm.com/internet-of-things/products/q4-series/qcs410) (Active) | Buy Now | Qualcomm® Kryo™ 460 | 8 | Up to 2.2 GHz | Qualcomm® Adreno™ 612 | — | 1804 MHz | LPDDR4x | 2x Qualcomm® Hexagon™ Vector Processor / Qualcomm® Hexagon™ / Qualcomm® Hexagon™ 685 | 2 | USB 2.0 / USB 3.1 / Ethernet RGMII | Android / Linux | Wi-Fi 5 / Wi-Fi 4 | 802.11b / 802.11g / 802.11n / 802.11ac / 802.11a | 1x1 | Bluetooth® 5.0 | 11 nm | 10 year(s) |
| [QRB4210](https://www.qualcomm.com/internet-of-things/products/q4-series/qrb4210) (Active) | Buy Now | Qualcomm® Kryo™ 260 | 8 | Up to 2 GHz | Qualcomm® Adreno™ 610 | — | 4200 MHz | LPDDR4x³ / LPDDR3⁴ / non-POP | Qualcomm® Hexagon™ | 1 | USB 3.1 | Linux | Wi-Fi 4 | 802.11ac / 802.11a / 802.11g / 802.11n / 802.11b | 1x1 | Bluetooth® 5.0 | 4 nm | — |

1. SDRAM 2x16
2. Gen3 1-lane
3. SDRAM designed for 1866 MHz clock (2×16 bit)
4. SDRAM designed for 933 MHz clock (1×32 bit)

## Smarter devices start here

### AI Acceleration
Delivers powerful on-device AI processing for real-time decision-making and intelligent edge applications, reducing latency and cloud dependency.

### Advanced Connectivity
Supports Wi-Fi 6E and Bluetooth 5.3 for fast, superior, and low-latency wireless communication in dense environments.

### Graphics & Display
Features advanced GPU and display capabilities for high-resolution, responsive user interfaces and rich multimedia experiences.

### Longevity Support
Designed with extended lifecycle support through 2030, making it ideal for long-term industrial deployments and reducing total cost of ownership.

## Product Longevity Program

Qualcomm Technologies designs SoCs with longevity and durability to support applications requiring extended life cycles, helping ensure stability in customer product designs.

* Subject to change without notice

[Learn more](https://www.qualcomm.com/internet-of-things/products/product-longevity-program)

IMAGE_URL(https://s7d1.scene7.com/is/image/dmqualcommprod/union?$QC_Responsive$&fmt=png-alpha)

## How companies are harnessing the power of Dragonwing Q

OnQ Blog

[From prototype to production: How Qualcomm Dragonwing powers industrial and enterprise transformation with edge AI](https://www.qualcomm.com/news/onq/2026/03/how-qualcomm-dragonwing-powers-industrial-edge-ai)

Mar 9, 2026 | 7 min read

[Edge AI](https://www.qualcomm.com/news/onq?tags=Edge%20AI) [Dragonwing](https://www.qualcomm.com/news/onq?tags=Dragonwing) [Industrial IoT](https://www.qualcomm.com/news/onq?tags=Industrial%20IoT)

## Similar series

[View all products](https://www.qualcomm.com/internet-of-things/products)

**PREMIUM EDGE AI**
### Dragonwing Q8
Best for next-gen smart devices needing immersive multimedia, powerful on-device AI, and enterprise-grade security features at the edge.
[View series](https://www.qualcomm.com/internet-of-things/products/q8-series)

**HIGH-PERFORMANCE COMPUTE**
### Dragonwing Q6
Built for advanced IoT applications that need high-performance, low power compute and robust edge AI capabilities.
[View series](https://www.qualcomm.com/internet-of-things/products/q6-series)

**SCALABLE AI IOT**
### Dragonwing Q5
Low-power SoC offering modular performance packs with AI, camera, and compute for flexible, evolving industrial IoT deployments.
[View series](https://www.qualcomm.com/internet-of-things/products/q5-series)

**ESSENTIAL IOT**
### Dragonwing Q2
Entry-level processor delivering superior compute, integrated connectivity, and cost-effective efficiency for industrial and enterprise devices.
[View series](https://www.qualcomm.com/internet-of-things/products/q2-series)

## Support

Resources and support to help you get started.

IMAGE_URL(https://s7d1.scene7.com/is/image/dmqualcommprod/dragon-chip?fmt=webp-alpha&qlt=85)

### The Qualcomm Dragonwing™ RB3 Gen 2 Development Kit

Develop advanced AI edge computing for diverse IoT applications.

[Learn more](https://www.qualcomm.com/developer/hardware/rb3-gen-2-development-kit)

IMAGE_URL(https://s7d1.scene7.com/is/image/dmqualcommprod/chat-icon?$QC_Responsive$&fmt=png-alpha)

### Contact Sales

Get in touch with an expert to learn more about our Q8 offerings.

[Get in touch](https://www.qualcomm.com/support/contact/forms/iot-contact-sales)