The Dragonwing Q4 Series processors are designed for industrial and commercial IoT, offering premium connectivity, AI, and multimedia capabilities with long-term support. These processors deliver high performance, advanced AI, and superior connectivity for next-gen industrial handhelds, edge devices, and smart systems with extended support.
Target Applications
Featured specs
SMART SYSTEM
Optimized for industrial handhelds and smart edge devices, combining advanced AI, multimedia, and connectivity with extended support.
6th Gen Qualcomm® AI Engine
AI ENGINE
Octa-core up to 2.7GHz
COMPUTE
Qualcomm® Adreno™ 613
VIDEO
Wi-Fi 6E, Bluetooth® 5.3, Optional 5G
CONNECTIVITY
4K Video Capture & Playback
VIDEO
Up to 48MP single or 25MP dual
CAMERA SUPPORT
Compare Dragonwing Q4 products
Note: to leverage the best experience for the product comparison table, please use the desktop to view content.
6 of 0 total products
Product | CPU Name | Number of Cores | Clock Speed | GPU Name | Clock Speed | DSP Name | Wi-Fi Generation | Standards | MIMO Configuration | Bluetooth Specification Version | Display Number of Concurrent Displays | Interfaces Supported Interfaces | Software Options Operating System | Memory Speed | Type | Longevity Program Longevity Period | Process Node and Technology Process Node |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Qualcomm® Dragonwing™ Q4 Series | |||||||||||||||||
QCM4290 Active | Qualcomm® Kryo™ 260 | 8 | Up to 2 GHz | Qualcomm® Adreno™ 610 | — | Qualcomm® Hexagon™ Vector Processor | Wi-Fi 5 | 802.11b | 8x8 (ready) | Bluetooth® 5.0 | — | USB-C | Linux | 933 MHz | non-POP | 7 year(s) | 11 nm |
QCM4490 Active | Qualcomm® Kryo™ CPU | 8 | Up to 2 GHz | Qualcomm® Adreno™ 613 | 1.01 GHz | — | Wi-Fi 6E | 802.11b | 2x2 | Bluetooth® 5.2 | 1 | PCIe | Android | 3.2 MHz | LPDDR51 | 7 year(s) | 4 nm |
QCS4490 Active | Qualcomm® Kryo™ CPU | 8 | Up to 2.4 GHz | Qualcomm® Adreno™ 613 | 1.01 GHz | — | Wi-Fi 6E | 802.11n | 2x2 | Bluetooth® 5.2 | 1 | 1x PCIe | Android | 2.1 MHz | LPDDR51 | 7 year(s) | 4 nm |
QRB4210 Active | Qualcomm® Kryo™ 260 | 8 | Up to 2 GHz | Qualcomm® Adreno™ 610 | — | Qualcomm® Hexagon™ | Wi-Fi 4 | 802.11ac | 1x1 | Bluetooth® 5.0 | 1 | USB 3.1 | Linux | 4200 MHz | LPDDR4x2 | — | 4 nm |
QCS4290 Active | 8x Qualcomm® Kryo™ 260 | 8 | Up to 2 GHz | Qualcomm® Adreno™ 610 | — | Qualcomm® Hexagon™ Vector Processor | Wi-Fi 5 | 802.11a | 8x8 (ready) | Bluetooth® 5.1 | 1 | USB-C | Linux | 933 MHz | LPDDR5x | 7 year(s) | 11 nm |
QCS410 Active | Qualcomm® Kryo™ 460 | 8 | Up to 2.2 GHz | Qualcomm® Adreno™ 612 | — | 2x Qualcomm® Hexagon™ Vector Processor | Wi-Fi 5 | 802.11b | 1x1 | Bluetooth® 5.0 | 2 | USB 2.0 | Android | 1804 MHz | LPDDR4x | 10 year(s) | 11 nm |
- SDRAM 2x16
- SDRAM designed for 1866 MHz clock (2×16 bit)
- SDRAM designed for 933 MHz clock (1×32 bit)
Smarter devices start here
AI Acceleration
Delivers powerful on-device AI processing for real-time decision-making and intelligent edge applications, reducing latency and cloud dependency.
Advanced Connectivity
Supports Wi-Fi 6E and Bluetooth 5.3 for fast, superior, and low-latency wireless communication in dense environments.
Graphics & Display
Features advanced GPU and display capabilities for high-resolution, responsive user interfaces and rich multimedia experiences.
Longevity Support
Designed with extended lifecycle support through 2030, making it ideal for long-term industrial deployments and reducing total cost of ownership.
Product Longevity Program
Qualcomm Technologies designs SoCs with longevity and durability to support applications requiring extended life cycles, helping ensure stability in customer product designs.
* Subject to change without notice
How companies are harnessing the power of Dragonwing Q
Similar series
PREMIUM EDGE AI
Dragonwing Q8
Best for next-gen smart devices needing immersive multimedia, powerful on-device AI, and enterprise-grade security features at the edge.
HIGH-PERFORMANCE COMPUTE
Dragonwing Q6
Built for advanced IoT applications that need high-performance, low power compute and robust edge AI capabilities.
SCALABLE AI IOT
Dragonwing Q5
Low-power SoC offering modular performance packs with AI, camera, and compute for flexible, evolving industrial IoT deployments.
ESSENTIAL IOT
Dragonwing Q2
Entry-level processor delivering superior compute, integrated connectivity, and cost-effective efficiency for industrial and enterprise devices.
Support
Resources and support to help you get started.
The Qualcomm Dragonwing™ RB3 Gen 2 Development Kit
Develop advanced AI edge computing for diverse IoT applications.
