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VVDN QCS 410 SOM
VVVDN QCS 410 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.

KEY FEATURES:

  • High-performance IoT System-on-Chip (SoC)
  • Compact SOM size
  • Advanced ISP, machine learning, sensor processing, and voice control
VVDN QCS 610 SOM
VVVDN QCS 610 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.

KEY FEATURES:

  • Compact SOM Size
  • High-performance IoT System-on-Chip (SoC)
Development Kit based on QCS610
This development kit is based on powerful Qualcomm® QCS610 SoC along with a carrier board developed by VVDN. The system is intended for connecting camera intelligence applications such as 180° dual-camera stitching, advanced tracking algorithms, video conferencing, etc. The development system can be used for intelligent video analytics applications including smart surveillance, retail, traffic, dashcams, robotics, automotive and more.

KEY FEATURES:

  • Rich I/O Peripherals including USB3.0, USB2.0, MIPI CSI(x3), HDMI, etc
  • Multiple connectivity solutions such as Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0
  • Compact SOM size
VVDN-QCS2290 SOM
VVDN-QCS220 SOM, designed and developed by VVDN is based on the Qualcomm® QCS2290 platform. It comes with integrated Wi-Fi: IEEE 802.11 a/b/g/n/ac, Bluetooth 5.0, and FM via Qualcomm® WCN3950 chipset. The SOM supports rich I/O interfaces including MIPI-CSI, MIPI-DSI, USB, SD card, GPIO, JTAG, to connect LCD panels, and camera modules, for the development of vision intelligent IoT applications.The system on module offers tight system integration and optimization for superior performance and power management features make it the best to facilitate a cost-effective and efficient embedded system application including two-wheelers digital instrument cluster, body-worn camera, connected camera, digital signage, control panels/industrial panels, retail PoS, video doorbells, etc.
VVDN-QCS6490 SOM
VVDN is designing, and developing SOM based on Qualcomm® QCS6490 SoC. The SOM supports rich interfaces for connectivity including Wi-Fi 6 (802.11ax) & Bluetooth 5.2 ® technology and other rich peripherals including 5X4 lane MIPI CSI for cameras, 4 lane MIPI DSI for display, USB3.1, USB 2.0, etc.The SOM provides rich hardware interfaces and software SDKs for building quick prototypes and validation. It is ideal for developing various industrial and commercial IoT applications including Digital Signage, Retail, Smart Warehousing, Service robots, Rugged Handheld, etc.
VVDN-QRB5165 Development Kit
VVDN-QRB5165 development kit designed, developed, and manufactured by VVDN comprises of carrier board and SOM based on powerful Qualcomm® QRB5165 System-on-Chip. The development kit supports multiple interfaces including 6x 4-lane MIPI CSI for camera, 2x 4-lane MIPI DSI for display, and WLAN 2 x 2 802.11ax, Bluetooth 5.1 connectivity.The development kit is suitable for developing visual intelligence applications requiring the highest AI processing performance. Some of the applications include advanced robotics, autonomous delivery vehicles, edge AI boxes, industrial drones, etc.

KEY FEATURES:

  • Based on powerful Qualcomm® QRB5165 SoC
  • Advanced imaging capability
  • Ultra-compact form factor
VVDN-QCM2290 SOM
VVDN-QCM2290 SOM, designed and developed by VVDN is based on the Qualcomm® QCM2290 platform.The SOM comes with integrated Wi-Fi: IEEE 802.11 a/b/g/n/ac, Bluetooth 5.0, and FM via Qualcomm® WCN3950 chipset along with GNSS and Cellular Connectivity by Qualcomm® WTR3925 chip and supports rich I/O interfaces including MIPI-CSI, MIPI-DSI, USB, SD card, GPIO, JTAG, etc.The system on module offers tight system integration and optimization for superior performance and power management features make it the best to facilitate a cost-effective and efficient embedded system application including two-wheelers digital instrument cluster, body-worn camera, connected camera, digital signage, control panels/industrial panels, retail PoS, video doorbells, and dash camera, etc.
VVDN QCS8250 SoM
QCS8250 SoM designed, and developed by VVDN is based on Qualcomm Technologies next-gen processor, the Qualcomm® QCS8250. The SoM can be used in the development of applications that require intelligent processing including connected cameras, video collaboration, retail self-checkout, AR/VR, health care, fleet management, digital signage and other AI applications on the edge.

KEY FEATURES:

  • Qualcomm® QCS8250 processor
  • Integrated Wi-Fi – (IEEE802.11 b/g/n/ac/ax 2.4/5Ghz) + BLE V5.1
  • Supports multiple rich interfaces for camera, connectivity, and display
  • Android 10 OS
  • Ultra-compact form factor
Kiteboard ISQ5165
The ISQ5165 is an ultra small form factor, compute and connectivity system on module which enables OEMs, entrepreneurs and makers to build custom connected devices/appliances for vertical specific solutions that call for AI on the Edge. It is based on the Qualcomm QRB5165 SoC and enables OEMs & ODMs to build and commercialize feature rich intelligent devices at an accelerated time scale.

KEY FEATURES:

  • Small form factor Sysyem-On-Module
Kiteboard ISQ2290
The ISQ2290 is an ultra-small form factor, compute and connectivity system on module which enables OEMs, entrepreneurs and makers to build custom connected devices/appliances for vertical specific solutions. It is based on the Qualcomm QCS/QCM2290 and is available in both Wi-Fi only & LTE variants. It enables OEMs & ODMs to build and commercialize feature rich, low cost connected devices at an accelerated time scale.

KEY FEATURES:

  • Ultra-small form factor
RUBIK Pi 3
RUBIK Pi 3, a lightweight development board based on Qualcomm® QCS6490 platform, is the first Pi built on Qualcomm® AI platforms for developers.RUBIK Pi 3 supports multiple operating systems such as Android / Linux / LU, with SDKs from Thundercomm to provide developers with better experience. With excellent AI performance at 12 TOPS, QCS6490 can be paired with Qualcomm® AI Hub for allowing developers to personally experience the impact of AI evolution.RUBIK Pi 3 boasts rich interfaces and functions with support of USB Type-A (1x 2.0, 2x 3.0), USB 3.1 Gen 1 Type-C with DP (4K@60), Camera, HDMI OUT (4K@30), 1000M Ethernet port, 40pin header connector, 3.5mm headphone jack, Wi-Fi 5, BT 5.2, M.2 M-key connector, Micro USB and RTC, etc., to meet diverse development needs. It also has designed interfaces and is compatible with a variety of Raspberry Pi peripheral accessories, which helps reduce implementation difficulty and cost for developers.

KEY FEATURES:

  • First upstream version based on Qualcomm® QCS6490 platform for developers
  • Compatible with Raspberry Pi accessories
  • 12 Tops AI capability, Deploy 1.8B LLM
  • C5430P/6490P/C8550 SOM are P2P compatible
  • Minimalist design, affordable price
Kiteboard ISQ6490
The ISQ6490 is a compute and connectivity system on module which enables OEMs, entrepreneurs and makers to build custom connected devices/appliances for vertical specific solutions that call for AI on the Edge. It is based on the Qualcomm QCS6490 SoC and enables OEMs & ODMs to build and commercialize feature rich intelligent devices at an accelerated time scale.

KEY FEATURES:

  • SOM form-factor
  • Artificial Intelligence at the edge
  • Scalable solution, based on QCS6490
Kiteboard 4290 SBC
Kiteboard 4290 is a Single Board Compute & Connectivity Platform for accelerating the devleopment of devices and appliances. The SBC platform based on Qualcomm® Dragonwing™ QCM4290 SoC can be customized to interface to cameras, displays, sensors and peripherals through its MIPI, USB & Low speed interfaces. The platform integrates heterogenous compute and WiFi/BT/LTE connectivity.

KEY FEATURES:

  • Reference design for biometric authentication and access control
  • Support for facial recognition
  • Integrated Dual-NFC for use of Government IDs such as Passports and National IDs
TurboX C865C SOM

TurboX C865C SOM (System on Module) is a high-performance intelligent module based on Qualcomm® QCS8250 processor. It has integrated Android and the advanced 7nm Fin FET processor, a customized 64-bit Octa-core Qualcomm® Kryo™ 585 application processor.

TurboX C865C SOM supports wide-range Wi-Fi, Wi-Fi6 (Wi-Fi 802.11 a/b/g/n/ac/ax) . It supports one 4K@60FPS or two 4K@30FPS display, as well as multi-camera concurrency. It also integrates multiple audio and video input/output interfaces. TurboX C865C SOM provides a variety of GPIO, I2C, UART and SPI standard interfaces.

In addition, it supports four 4-lane MIPI-CSIs (D-PHY) and one 3-lane MIPI-CSI (C-PHY) together with SOM common standard protocol interfaces such as USB3.1, PCIE2.1/3.0 and I2S.

TurboX C865C SOM provides convenient and stable system solutions for IoT (Internet of Things) application. It can be embedded into devices including VR/AR, Robot, Smart Camera, AI devices, drones and medical devices.

KEY FEATURES:

  • Qualcomm® Hexagon™ DSP with quad HVX
  • Support one C-PHY Camera, up to 64MP sensor
  • Long life cycle, up to 2028
  • Support one 4K@60FPS or two 4K@30FPS display
  • Wi-Fi 802.11a/b/g/n/ac/ax
TurboX C865C Development Kit

Thundercomm TurboX C865C Development Kit is based on the TurboX C865C SOM that facilitates accelerated development of innovative, power-efficient, high computing robots and drones for enterprise, industrial, and professional service applications.

At the heart of the kit is the Qualcomm® QCS8250 processor. Customized for robotics applications, this processor offers powerful heterogeneous computing architecture that delivers 15 Tera Operations Per Second of compute. It also offers incredible ML (Machine Learning) accuracy, a powerful ISP (Image Signal Processor) with support for multi concurrent cameras, a dedicated computer vision engine for EVA (Enhanced Video Analytics), as well as the new HTA (Hexagon™ Tensor Accelerator). Its fifth-generation Qualcomm® AI Engine powers inferencing and accuracy with the dedicated HTA. With long life support to 2028.

KEY FEATURES:

  • Advance Imaging capability
  • On-device intelligence powered by Qualcomm Artificial Intelligence (AI) Engine
  • Advanced connectivity
  • Heterogenous computing with efficient power budgets
  • Flexible design options for commercialization
  • Advance Security
TurboX C6490P Development Kit

TurboX C6490P development kit is a hardware and software development kit based on the C6490P smart module. It integrates a high-performance and power-efficient 6nm Qualcomm® QCS6490 SoC with strong computing power (12.5 TOPS). It has the ability of 4K@60FPS decode and 4K@30FPS encode. The C6490P DK provides a rich set of interfaces for customers to evaluate performance in different application scenarios, including 2 x 1000M RJ45 Ethernet ports, 7 x USB Type-A ports, HDMI IN, HDMI OUT, 3 x MIPI camera connectors, and 2 x GMSL camera connectors. The C6490P SOM is the best platform choice for IoT products with high AI performance requirements, such as industrial handheld devices, industrial tablets, service robots, industrial robots, and edge computing.

KEY FEATURES:

  • Excellent Heat Dissipation (non-pop)
  • Pin-to-pin compatible with TurboX C5430P/C8550 SOM
  • Superior computing capability (12.5 TOPS)
  • Long life cycle: 2028
TurboX C6490P SOM

TurboX C6490P System on Module (SOM) integrates a high-performance and power-efficient Qualcomm® 6nm QCS6490 SoC with strong computing power (12.5 TOPS). This SOM supports 4K@60FPS video decoding, 4K@30FPS video encoding, five MIPI CSI interfaces, and rich external interfaces (GPIO, UART, I2C, I3C, SPI, USB 3.1, PCIe). TurboX C6490P SOM is a high-performance IoT intelligent module that can be used in industrial handheld device, industrial tablet, service robot, industrial robot, and edge computing. Customers can use its hardware interfaces and software SDK for functional verification and rapid prototyping.


TurboX C6490P SOM is pin-to-pin compatible with the TurboX C8550 SOM, with a more compact design and smaller size. It forms a high-AI performance module series matrix with the C8550 SOM, accelerating customer product iteration cycles and saving secondary development costs.

KEY FEATURES:

  • Excellent heat dissipation (non-pop)
  • Superior computing capability (12.5 TOPS)
  • Pin to Pin compatible with TurboX C5430P & C8550 SOM
  • Five MIPI-CSIs, compatible to support two C-PHY camera
  • Long life cycle: 2028
TurboX C404/C405 Development Kit

The TurboX C404/C405 development kit is designed based on Thundercomm's latest C404/C405 SOM which is intended for use as a smart audio platform. It supports far-field voice, keyword detection, multi-channel echo cancellation, beamforming, and a number of voice services such as Amazon Alexa Voice Services and Google Assistant. With on-device dual DSP, AI enhancement and rich connectivity, customers can develop complex, feature rich, voice-supported smart speaker products that get to market quickly.

Meeting Controller Console for Video Conference

Meeting Controller Console for Video Conference, which adapts different meeting rooms to make it easy for content sharing by connecting with all devices such as Laptop, USB camera, Display, Video/Sound bar w/ or w/o switch.

Heatsink with fan

Thermal solution for high performance scenarios