195 products
Sort
Filter
195 results
Categories
Filter by:
Thundercomm TurboX I8275 Development Kit
TurboX I8275 Development Kit is an evaluation platform designed to accelerate development with the TurboX I8275 SOM family. The initial configuration integrates the I8275-AC SOM, providing up to 20 TOPS of AI performance for machine vision, robotics and industrial IoT evaluation. 2 3 The 120 mm x 100 mm carrier board provides HDMI and DisplayPort outputs, three MIPI CSI camera connectors, multiple USB interfaces, Gigabit Ethernet, M.2 Key M and Key E expansion, a 40-pin expansion connector and 12V power input. Qualcomm® Linux is supported for application development and system evaluation. 4 5 Initial development kit samples are targeted for late November to early December 2026, subject to PCB availability, board bring-up and validation.
KEY FEATURES:
- Initial configuration with the I8275-AC SOM
- Up to 40 TOPS of edge AI performance
- Three 22-pin MIPI CSI camera connectors
- HDMI output and DisplayPort 1.4
- Three USB 3.0 Type-A ports
- One USB 3.0 Type-C and one USB 2.0 Type-A port
- Gigabit Ethernet
- M.2 Key M and M.2 Key E expansion
- 40-pin expansion connector and PWM fan connector
- Qualcomm Linux support
- Compact 120 mm x 100 mm carrier board
TurboX I8275 Development Kit is an evaluation platform designed to accelerate development with the TurboX I8275 SOM family. The initial configuration integrates the I8275-AC SOM, providing up to 20 TOPS of AI performance for machine vision, robotics and industrial IoT evaluation. 2 3 The 120 mm x 100 mm carrier board provides HDMI and DisplayPort outputs, three MIPI CSI camera connectors, multiple USB interfaces, Gigabit Ethernet, M.2 Key M and Key E expansion, a 40-pin expansion connector and 12V power input. Qualcomm® Linux is supported for application development and system evaluation. 4 5 Initial development kit samples are targeted for late November to early December 2026, subject to PCB availability, board bring-up and validation.
KEY FEATURES:
- Initial configuration with the I8275-AC SOM
- Up to 40 TOPS of edge AI performance
- Three 22-pin MIPI CSI camera connectors
- HDMI output and DisplayPort 1.4
- Three USB 3.0 Type-A ports
- One USB 3.0 Type-C and one USB 2.0 Type-A port
- Gigabit Ethernet
- M.2 Key M and M.2 Key E expansion
- 40-pin expansion connector and PWM fan connector
- Qualcomm Linux support
- Compact 120 mm x 100 mm carrier board
SECO SOM-COMe-CT6-Dragonwing-IQ9
SECO SOM-COMe-CT6-Dragonwing-IQ9 is a compact, high-performance COM Express Type 6 System-on-Module powered by the Qualcomm Dragonwing™ IQ9 platform, designed for demanding industrial Edge AI applications. Combining on-device AI acceleration, advanced multimedia capabilities and industrial-grade reliability, it supports low-latency inference and vision-intensive workloads for robotics, AMR/AGV, machine vision, intelligent HMI and industrial automation systems.
KEY FEATURES:
- Powered by Dragonwing IQ9 with 8-core Qualcomm® Kryo™ CPU and up to 100 TOPS AI performance
- Industrial reliability with ECC memory and extended temperature support
- Vision-ready platform for multi-camera and sensor-fusion workloads
- Clea OS support with OTA updates, device management and managed edge deployment capabilities
- COM Express Type 6 Compact for scalable embedded designs and custom carrier board integration
SECO SOM-COMe-CT6-Dragonwing-IQ9 is a compact, high-performance COM Express Type 6 System-on-Module powered by the Qualcomm Dragonwing™ IQ9 platform, designed for demanding industrial Edge AI applications. Combining on-device AI acceleration, advanced multimedia capabilities and industrial-grade reliability, it supports low-latency inference and vision-intensive workloads for robotics, AMR/AGV, machine vision, intelligent HMI and industrial automation systems.
KEY FEATURES:
- Powered by Dragonwing IQ9 with 8-core Qualcomm® Kryo™ CPU and up to 100 TOPS AI performance
- Industrial reliability with ECC memory and extended temperature support
- Vision-ready platform for multi-camera and sensor-fusion workloads
- Clea OS support with OTA updates, device management and managed edge deployment capabilities
- COM Express Type 6 Compact for scalable embedded designs and custom carrier board integration
TRIA SM2S-QCS6490
The TRIA SM2S-QCS6490 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS6490 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS6490 integrates Qualcomm® Kryo™ 670 CPU which contains up to eight cores: four Arm® Cortex®-A78 cores, four Arm® Cortex®-A55 cores, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K60 and many different display connictities (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with upto 12 TOPS at low power and massive camera support with 4 MIPI-CSI inputs.
KEY FEATURES:
- Quad core Arm Cortex-A78 up to 2.7GHz
- And Quad core Arm Cortex-A55 @ 1.95GHz
- Adreno 643 GPU @ 812MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 12(15) TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- Display up to FHD+144Hz
- Video up to 4k30(E)/4K60(D)
- 5xUSB 2.0, 2x USB 3.1
- 2x PCIe Gen3 x1, 1x PCIe Gen3 x2
- 1x MIPI-DSI or LVDS
- 1x DP 1.4 (2 lane) + 1x eDP/DP
- 4x MIPI-CSI Camera Interface
- WLAN/BT Wireless Module (option)
- 2x Gigabit Ethernet
- 2x I2S Audio Interface
- 4x UART, 2x SPI, 2x CAN2.0-FD
- 5x I²C
- HW Key manager and ECC, Secure boot, Crypto engines, etc.
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
The TRIA SM2S-QCS6490 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS6490 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS6490 integrates Qualcomm® Kryo™ 670 CPU which contains up to eight cores: four Arm® Cortex®-A78 cores, four Arm® Cortex®-A55 cores, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K60 and many different display connictities (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with upto 12 TOPS at low power and massive camera support with 4 MIPI-CSI inputs.
KEY FEATURES:
- Quad core Arm Cortex-A78 up to 2.7GHz
- And Quad core Arm Cortex-A55 @ 1.95GHz
- Adreno 643 GPU @ 812MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 12(15) TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- Display up to FHD+144Hz
- Video up to 4k30(E)/4K60(D)
- 5xUSB 2.0, 2x USB 3.1
- 2x PCIe Gen3 x1, 1x PCIe Gen3 x2
- 1x MIPI-DSI or LVDS
- 1x DP 1.4 (2 lane) + 1x eDP/DP
- 4x MIPI-CSI Camera Interface
- WLAN/BT Wireless Module (option)
- 2x Gigabit Ethernet
- 2x I2S Audio Interface
- 4x UART, 2x SPI, 2x CAN2.0-FD
- 5x I²C
- HW Key manager and ECC, Secure boot, Crypto engines, etc.
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
TRIA SM2S-QCS5430
The MSC SM2S-QCS5430 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS5430 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS5430 integrates Qualcomm® Kryo™ 670 CPU which contains up to six cores, Qualcomm® Adreno™ 642L GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K30 and many different display connectivity (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with up to 3.5 TOPS at low power and massive camera support with 4 MIPI-CSI inputs
KEY FEATURES:
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
- Dual core Arm Cortex-A78 up to 2.1GHz
- Adreno 642L GPU @ 315MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 3.5 TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- 4x MIPI-CSI Camera Interface
- Video up to 4k30(E)/4K30(D)
- 5xUSB 2.0, 2x USB 3.1
- 1x MIPI-DSI or LVDS
The MSC SM2S-QCS5430 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS5430 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS5430 integrates Qualcomm® Kryo™ 670 CPU which contains up to six cores, Qualcomm® Adreno™ 642L GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K30 and many different display connectivity (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with up to 3.5 TOPS at low power and massive camera support with 4 MIPI-CSI inputs
KEY FEATURES:
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
- Dual core Arm Cortex-A78 up to 2.1GHz
- Adreno 642L GPU @ 315MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 3.5 TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- 4x MIPI-CSI Camera Interface
- Video up to 4k30(E)/4K30(D)
- 5xUSB 2.0, 2x USB 3.1
- 1x MIPI-DSI or LVDS
EXMP-Q911
This collaboration centers on the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm Dragonwing™ IQ-9075 SoC featuring an 8-core Qualcomm® Kryo™ Gen 6 CPU and a Qualcomm® Adreno™ 663 GPU, enabling 100 TOPS dense or up to 200 TOPS sparse AI compute.
Under defined 30W test scenarios, the EXMP-Q911 achieves up to 10× higher AI inference FPS compared to similar modules when running the YOLOv10n object detection model across 10 concurrent video channels.
Designed for demanding edge workloads, the EXMP-Q911 integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, paired with a rich set of high-speed interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP 1.2, MIPI CSI-2, CAN FD, and more, providing exceptional connectivity and performance density for compact edge AI systems.
KEY FEATURES:
- Powered by : Dragonwing IQ-9075 SoC, compliant with COM-HPC Mini form factor
- Up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI computing power
- 36 GB onboard memory, 128 GB UFS 3.1 storage, 2 x 2.5G Ethernet and 2 x 4-lane MIPI CSI-2 interfaces
- -40°C to 85°C (Ta) operating temperature
This collaboration centers on the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm Dragonwing™ IQ-9075 SoC featuring an 8-core Qualcomm® Kryo™ Gen 6 CPU and a Qualcomm® Adreno™ 663 GPU, enabling 100 TOPS dense or up to 200 TOPS sparse AI compute.
Under defined 30W test scenarios, the EXMP-Q911 achieves up to 10× higher AI inference FPS compared to similar modules when running the YOLOv10n object detection model across 10 concurrent video channels.
Designed for demanding edge workloads, the EXMP-Q911 integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, paired with a rich set of high-speed interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP 1.2, MIPI CSI-2, CAN FD, and more, providing exceptional connectivity and performance density for compact edge AI systems.
KEY FEATURES:
- Powered by : Dragonwing IQ-9075 SoC, compliant with COM-HPC Mini form factor
- Up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI computing power
- 36 GB onboard memory, 128 GB UFS 3.1 storage, 2 x 2.5G Ethernet and 2 x 4-lane MIPI CSI-2 interfaces
- -40°C to 85°C (Ta) operating temperature
Quectel Pi H1 SBC (SG565D)
Quectel Pi H1 is a smart Single-Board Computer (SBC) based on the Qualcomm QCS6490 platform. It integrates a high-performance 64-bit octa-core processor delivering up to 12 TOPS of computing power, along with the Qualcomm Adreno™ 643L GPU. Supporting Yocto Linux, Debian, and Ubuntu operating systems, the product comes equipped with 8 GB of LPDDR4X memory and features a USB Type-C power interface, expandable with external eMMC or SSD storage. It offers dual-band Wi-Fi (2.4 & 5 GHz) compliant with IEEE 802.11a/ b/ g/ n/ ac and Bluetooth 5.0, while enabling dual-display output via DP and LCM or DP and Micro HDMI. Combining powerful performance with rich multimedia capabilities, the Quectel Pi H1 is designed to meet the demands of both industrial and consumer applications for high-speed connectivity, advanced multimedia, and robust computing power.
KEY FEATURES:
- Robust computing power: Up to 12 TOPS, well-suited for most algorithm prototyping & inference applic
- Feature-rich interfaces: USB, Micro HDMI, ADC, audio, Ethernet, camera, PCIe , antenna, etc.
- Dual displays: DP and LCM or DP and Micro HDMI.
- Wireless connectivity: Wi-Fi 5, 802.11a/ b/ g/ n/ ac, delivering enhanced wireless connectivity.
- Multiple operating systems: Yocto Linux/ Debian/ Ubuntu.
- Extended temperature range: For harsh outdoor & industrial use; and withstand ambient temperatures f
- Diverse application scenarios: Edge computing, robotics, industrial automation, multimedia terminals
- High-performance 64-bit octa-core processor, delivering up to 12 TOPS of computing power
- 1 x A78 @ 2.7 GHz + 3 x A78 @ 2.4 GHz + 4 x A55 @ 1.9 GHz
- 32 KB L1I cache, 32 KB L1D cache and 512 KB L2 cache
- Adreno 643L @ 812 MHz
- 8 GB LPDDR4X + 128 GB UFS
- Yocto Linux/ Debian/ Ubuntu*
Quectel Pi H1 is a smart Single-Board Computer (SBC) based on the Qualcomm QCS6490 platform. It integrates a high-performance 64-bit octa-core processor delivering up to 12 TOPS of computing power, along with the Qualcomm Adreno™ 643L GPU. Supporting Yocto Linux, Debian, and Ubuntu operating systems, the product comes equipped with 8 GB of LPDDR4X memory and features a USB Type-C power interface, expandable with external eMMC or SSD storage. It offers dual-band Wi-Fi (2.4 & 5 GHz) compliant with IEEE 802.11a/ b/ g/ n/ ac and Bluetooth 5.0, while enabling dual-display output via DP and LCM or DP and Micro HDMI. Combining powerful performance with rich multimedia capabilities, the Quectel Pi H1 is designed to meet the demands of both industrial and consumer applications for high-speed connectivity, advanced multimedia, and robust computing power.
KEY FEATURES:
- Robust computing power: Up to 12 TOPS, well-suited for most algorithm prototyping & inference applic
- Feature-rich interfaces: USB, Micro HDMI, ADC, audio, Ethernet, camera, PCIe , antenna, etc.
- Dual displays: DP and LCM or DP and Micro HDMI.
- Wireless connectivity: Wi-Fi 5, 802.11a/ b/ g/ n/ ac, delivering enhanced wireless connectivity.
- Multiple operating systems: Yocto Linux/ Debian/ Ubuntu.
- Extended temperature range: For harsh outdoor & industrial use; and withstand ambient temperatures f
- Diverse application scenarios: Edge computing, robotics, industrial automation, multimedia terminals
- High-performance 64-bit octa-core processor, delivering up to 12 TOPS of computing power
- 1 x A78 @ 2.7 GHz + 3 x A78 @ 2.4 GHz + 4 x A55 @ 1.9 GHz
- 32 KB L1I cache, 32 KB L1D cache and 512 KB L2 cache
- Adreno 643L @ 812 MHz
- 8 GB LPDDR4X + 128 GB UFS
- Yocto Linux/ Debian/ Ubuntu*
Kiteboard 8250 SOM
The Kiteboard 8250 System-on-Module (SOM) is a premier-tier, production-ready SOM built on the Qualcomm® Dragonwing™ QCS8250 SoC, designed to enable OEMs and ODMs to develop high-performance edge AI devices for multi-camera vision and intelligent IoT deployments. Combining powerful compute with advanced connectivity, the module supports real-time edge analytics and video processing for applications such as video telematics, industrial vision systems, AI-connected cameras, smart retail analytics, and healthcare edge devices
KEY FEATURES:
- SMARC Compatible with Customizable Carrier Board
- Optimized for multi-camera edge AI deployments
- Supports Multiple AI Models (e.g. YOLO, MobileNet, SAM-HQ, PatchCore)
- Compatible with SNPE, QAIRT and Edge Impulse
The Kiteboard 8250 System-on-Module (SOM) is a premier-tier, production-ready SOM built on the Qualcomm® Dragonwing™ QCS8250 SoC, designed to enable OEMs and ODMs to develop high-performance edge AI devices for multi-camera vision and intelligent IoT deployments. Combining powerful compute with advanced connectivity, the module supports real-time edge analytics and video processing for applications such as video telematics, industrial vision systems, AI-connected cameras, smart retail analytics, and healthcare edge devices
KEY FEATURES:
- SMARC Compatible with Customizable Carrier Board
- Optimized for multi-camera edge AI deployments
- Supports Multiple AI Models (e.g. YOLO, MobileNet, SAM-HQ, PatchCore)
- Compatible with SNPE, QAIRT and Edge Impulse
Kiteboard 5165 SOM
The Kiteboard 5165 is a high-compute, production-ready System-on-Module (SoM) based on the Qualcomm® Dragonwing™ QRB5165 SoC, designed to enable OEMs and robotics developers to build intelligent autonomous machines and AI-powered edge systems. Optimized for real-time perception, navigation, and multi-sensor processing, the module supports advanced robotics and autonomy workloads for applications such as autonomous delivery vehicles, industrial AMRs and AGVs, commercial and enterprise drones, industrial robotics, and defense and professional service robots.
KEY FEATURES:
- SMARC Compatible with Customizable Carrier Board
- Optimized for ROS2 & robotics stacks
- Supports Multiple AI Models (e.g. YOLO, MobileNet, SAM-HQ, PatchCore)
- Compatible with SNPE, QAIRT and Edge Impulse
The Kiteboard 5165 is a high-compute, production-ready System-on-Module (SoM) based on the Qualcomm® Dragonwing™ QRB5165 SoC, designed to enable OEMs and robotics developers to build intelligent autonomous machines and AI-powered edge systems. Optimized for real-time perception, navigation, and multi-sensor processing, the module supports advanced robotics and autonomy workloads for applications such as autonomous delivery vehicles, industrial AMRs and AGVs, commercial and enterprise drones, industrial robotics, and defense and professional service robots.
KEY FEATURES:
- SMARC Compatible with Customizable Carrier Board
- Optimized for ROS2 & robotics stacks
- Supports Multiple AI Models (e.g. YOLO, MobileNet, SAM-HQ, PatchCore)
- Compatible with SNPE, QAIRT and Edge Impulse
Kiteboard 2290 SOM
The Kiteboard 2290 is a cost-efficient, production-ready System-on-Module (SOM) based on the Qualcomm® Dragonwing™ QCS2290 SoC. Designed in an ultra-small form factor with integrated compute and connectivity, it enables OEMs, entrepreneurs, and device makers to build custom connected devices for vertical-specific solutions. Available in both Wi-Fi only and LTE variants, the Kiteboard 2290 is optimized for cost-efficient, feature-rich IoT deployments and enables OEMs and ODMs to rapidly develop and commercialize smart devices such as industrial handhelds, retail POS systems, connected cameras, and asset-tracking solutions while accelerating time-to-market.
KEY FEATURES:
- Ultra small form factor
- Integrated with Digital FM Technology
- Reference design for offroad vehicle telematics
- Reference design for field diagnostics device
- Reference design for two-wheeler device cluster
- Integrated LTE Cat 4 modem with Dual SIM (DSDS) support
- Azure/AWS cloud orchestration for device provisioning and management
The Kiteboard 2290 is a cost-efficient, production-ready System-on-Module (SOM) based on the Qualcomm® Dragonwing™ QCS2290 SoC. Designed in an ultra-small form factor with integrated compute and connectivity, it enables OEMs, entrepreneurs, and device makers to build custom connected devices for vertical-specific solutions. Available in both Wi-Fi only and LTE variants, the Kiteboard 2290 is optimized for cost-efficient, feature-rich IoT deployments and enables OEMs and ODMs to rapidly develop and commercialize smart devices such as industrial handhelds, retail POS systems, connected cameras, and asset-tracking solutions while accelerating time-to-market.
KEY FEATURES:
- Ultra small form factor
- Integrated with Digital FM Technology
- Reference design for offroad vehicle telematics
- Reference design for field diagnostics device
- Reference design for two-wheeler device cluster
- Integrated LTE Cat 4 modem with Dual SIM (DSDS) support
- Azure/AWS cloud orchestration for device provisioning and management
Arduino UNO Q
Arduino UNO Q’s hybrid design makes it the ideal dual-brain platform for your next innovation. It combines a Linux® Debian-capable Qualcomm Dragonwing™ QRB2210 microprocessor with a real-time STM32U585 microcontroller (MCU). It’s Arduino, it’s a computer, it’s anything you want to build.
KEY FEATURES:
- AI in a blink: Unlock AI-powered vision and sound solutions that react to their environment in real time.Quick start apps: Jumpstart development with plenty of pre-built examples and templates available through Arduino App Lab.Designed to expand: Expandable with Qwiic connector for Modulino nodes, carriers and more.
Arduino UNO Q’s hybrid design makes it the ideal dual-brain platform for your next innovation. It combines a Linux® Debian-capable Qualcomm Dragonwing™ QRB2210 microprocessor with a real-time STM32U585 microcontroller (MCU). It’s Arduino, it’s a computer, it’s anything you want to build.
KEY FEATURES:
- AI in a blink: Unlock AI-powered vision and sound solutions that react to their environment in real time.Quick start apps: Jumpstart development with plenty of pre-built examples and templates available through Arduino App Lab.Designed to expand: Expandable with Qwiic connector for Modulino nodes, carriers and more.
MitySOM-QC6490 / 5430
The MitySOM-QC6490 / 5430 is a system on module family featuring a Qualcomm Dragonwing™ QCS6490 or Dragonwing QCS5430 processor with on-board power supplies, an LPDDR5 RAM memory subsystem, and a UFS configuration memory. Specifications: Dragonwing QCS6490 or Dragonwing QCS5430 SoC Processor. - Memory: 8 GB LPDDR5, 256GB Flash. - Power: 5-12Vdc Input, generated on board. - Interfaces: 2x PCIe Gen 3 (1x 1 lane, 1x 2), 5x MIPI x4 input + DSI output, USB 3.1 Gen 2, USB 2.0. - Mechanical: 45mm x 45mm (1.77″ x 1.77″).
KEY FEATURES:
- Production-ready system on module
- Expanded interfaces for industrial use cases
- Long-term support expected through July 2036 with the Critical Link Product Longevity Program
The MitySOM-QC6490 / 5430 is a system on module family featuring a Qualcomm Dragonwing™ QCS6490 or Dragonwing QCS5430 processor with on-board power supplies, an LPDDR5 RAM memory subsystem, and a UFS configuration memory. Specifications: Dragonwing QCS6490 or Dragonwing QCS5430 SoC Processor. - Memory: 8 GB LPDDR5, 256GB Flash. - Power: 5-12Vdc Input, generated on board. - Interfaces: 2x PCIe Gen 3 (1x 1 lane, 1x 2), 5x MIPI x4 input + DSI output, USB 3.1 Gen 2, USB 2.0. - Mechanical: 45mm x 45mm (1.77″ x 1.77″).
KEY FEATURES:
- Production-ready system on module
- Expanded interfaces for industrial use cases
- Long-term support expected through July 2036 with the Critical Link Product Longevity Program
COREXOM R6490WGQ SOM
COREXOM R6490WGQ SOM – Powered by the Qualcomm® QCS6490 SoC, the R6490WGQ SOM features the Qualcomm® Kryo™ 670 CPU and a fused AI-accelerator in the Qualcomm® Hexagon™ processor, offering exceptional computational power with energy efficiency. It supports up to five MIPI CSI interfaces, triple ISPs, 4K@60FPS video decoding, and 4K@30FPS encoding. With a wide range of external interfaces like GPIO, UART, I2C, SPI, DSI, USB 3.1, and PCIe, plus integrated GPS and Wi-Fi 6E/Bluetooth, it’s ideal for complex IoT applications.Supporting Android, Ubuntu, Linux, and Windows 11 IoT Enterprise, this SOM is designed to reduce design complexity and speed up time to market. It’s perfect for rugged handhelds, tablets, POS, kiosks, AI Box, AI cameras, robotics, and HMI, enabling developers to efficiently bring innovative products to market.
KEY FEATURES:
- High Performance Qualcomm® 6nm QCS6490 SoC
- 8G / 128GB uMCP
- AI Performance: Up to 12 TOPS
- Five 4-lane MIPI-CSIs; 3x ISP@22MP, 2x IFE lite
- Support Wi-Fi 6E / BT, and GPS
- Supports Android, Linux, Ubuntu, Windows 11 IoT Enterprise
COREXOM R6490WGQ SOM – Powered by the Qualcomm® QCS6490 SoC, the R6490WGQ SOM features the Qualcomm® Kryo™ 670 CPU and a fused AI-accelerator in the Qualcomm® Hexagon™ processor, offering exceptional computational power with energy efficiency. It supports up to five MIPI CSI interfaces, triple ISPs, 4K@60FPS video decoding, and 4K@30FPS encoding. With a wide range of external interfaces like GPIO, UART, I2C, SPI, DSI, USB 3.1, and PCIe, plus integrated GPS and Wi-Fi 6E/Bluetooth, it’s ideal for complex IoT applications.Supporting Android, Ubuntu, Linux, and Windows 11 IoT Enterprise, this SOM is designed to reduce design complexity and speed up time to market. It’s perfect for rugged handhelds, tablets, POS, kiosks, AI Box, AI cameras, robotics, and HMI, enabling developers to efficiently bring innovative products to market.
KEY FEATURES:
- High Performance Qualcomm® 6nm QCS6490 SoC
- 8G / 128GB uMCP
- AI Performance: Up to 12 TOPS
- Five 4-lane MIPI-CSIs; 3x ISP@22MP, 2x IFE lite
- Support Wi-Fi 6E / BT, and GPS
- Supports Android, Linux, Ubuntu, Windows 11 IoT Enterprise
COREXOM R405LQ Long Range WIFI Module
The CRI R405LQ Long Range WiFi Module is a WiFi 6 connectivity solution designed for long-range communication on both the 2.4GHz and 5GHz frequency bands. Ideal for applications requiring reliable wireless communication over extended distances (>10Km), such as robotics, drones, and IoT deployments, the R405LQ ensures robust performance in demanding environments.This module seamlessly integrates with host controllers via USB interfaces and functions similarly to an external WiFi network module. It supports the USB RNDIS (Remote Network Driver Interface Specification) standard, providing straightforward and reliable module interface control.
KEY FEATURES:
- Powered by Qualcomm® QCS405 and Qualcomm® QCN9074
- Wi-Fi 6 support on 2.4GHz & 5GHz bands
- 4T/4R antenna configuration with up to 15km range; optional 2T/4R and 2T/2R settings
- USB Ethernet Adapter with standard RNDIS driver
The CRI R405LQ Long Range WiFi Module is a WiFi 6 connectivity solution designed for long-range communication on both the 2.4GHz and 5GHz frequency bands. Ideal for applications requiring reliable wireless communication over extended distances (>10Km), such as robotics, drones, and IoT deployments, the R405LQ ensures robust performance in demanding environments.This module seamlessly integrates with host controllers via USB interfaces and functions similarly to an external WiFi network module. It supports the USB RNDIS (Remote Network Driver Interface Specification) standard, providing straightforward and reliable module interface control.
KEY FEATURES:
- Powered by Qualcomm® QCS405 and Qualcomm® QCN9074
- Wi-Fi 6 support on 2.4GHz & 5GHz bands
- 4T/4R antenna configuration with up to 15km range; optional 2T/4R and 2T/2R settings
- USB Ethernet Adapter with standard RNDIS driver
MRD5165 SOM
The MRD5165 SOM (System on Module) integrates advanced AI-ML and IoT technologies within a compact form-factor, powering the next generation of high-compute, low-power smart robots, intelligent machines, autonomous devices, and drones across consumer, enterprise, defense, and industrial sectors. These devices can seamlessly connect over 5G networks.The MRD5165 SOM based on Qualcomm® QRB5165 features a robust heterogeneous computing architecture, complemented by the cutting-edge 5th generation Qualcomm® AI Engine, delivering an impressive 15 Trillion Operations Per Second (TOPS) of AI performance. This computational power efficiently handles complex AI and deep learning workloads, along with on-device edge inferencing, making it exceptionally well-suited for autonomous drone and robotics applications.
KEY FEATURES:
- Powerful ISP supports 6 concurrent cameras & computer vision engine for video analytics
- Multiple high-speed interconnects w/ storage, LTE, high-speed wireless/radio etc.
- Seamlessly blends AI, ML & IoT for autonomous machines and smart devices
The MRD5165 SOM (System on Module) integrates advanced AI-ML and IoT technologies within a compact form-factor, powering the next generation of high-compute, low-power smart robots, intelligent machines, autonomous devices, and drones across consumer, enterprise, defense, and industrial sectors. These devices can seamlessly connect over 5G networks.The MRD5165 SOM based on Qualcomm® QRB5165 features a robust heterogeneous computing architecture, complemented by the cutting-edge 5th generation Qualcomm® AI Engine, delivering an impressive 15 Trillion Operations Per Second (TOPS) of AI performance. This computational power efficiently handles complex AI and deep learning workloads, along with on-device edge inferencing, making it exceptionally well-suited for autonomous drone and robotics applications.
KEY FEATURES:
- Powerful ISP supports 6 concurrent cameras & computer vision engine for video analytics
- Multiple high-speed interconnects w/ storage, LTE, high-speed wireless/radio etc.
- Seamlessly blends AI, ML & IoT for autonomous machines and smart devices
qSmartAI80_CUQ610 - Qualcomm AI vision kit with multi-camera support
qSmartAI80_CUQ610 is a ready-to-deploy AI vision kit based on the Qualcomm® QCS610 processor with powerful AI processing capabilities. This Qualcomm vision kit comprises of e-con's Sony STARVIS IMX415 based 4K MIPI CSI-2 camera module, a SoM based on Qualcomm® QCS610 SoC, and a carrier board.This Qualcomm camera kit is suited for running image-based machine learning and deep learning models at the edge making it perfect for industrial and retail applications. In addition, this is a multi-camera solution enabling an extended field of view for applications that need to cover a large area or scene. e-con Systems also provides all the necessary customization services for this AI vision development kit including the camera, carrier board, BSP, software, and enclosure.
KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- 4K ultra low light camera based on Sony Starvis IMX415 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
qSmartAI80_CUQ610 is a ready-to-deploy AI vision kit based on the Qualcomm® QCS610 processor with powerful AI processing capabilities. This Qualcomm vision kit comprises of e-con's Sony STARVIS IMX415 based 4K MIPI CSI-2 camera module, a SoM based on Qualcomm® QCS610 SoC, and a carrier board.This Qualcomm camera kit is suited for running image-based machine learning and deep learning models at the edge making it perfect for industrial and retail applications. In addition, this is a multi-camera solution enabling an extended field of view for applications that need to cover a large area or scene. e-con Systems also provides all the necessary customization services for this AI vision development kit including the camera, carrier board, BSP, software, and enclosure.
KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- 4K ultra low light camera based on Sony Starvis IMX415 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
MitySOM-QC6490/5430 Development Kit
The MitySOM-QC6490/5430 Development Kit supports Critical Link’s Qualcomm Dragonwing QCS6490 and QCS5430-based system on modules.Each Dev Kit comes complete with all the connectivity needed in any application well suited for the MitySOM-QC6490/5430, including an on-board UART to Micro-USB Port, dual USB 2.0 Host Ports, one 3.1 USB Type-C with Display Port, one 1.4 Display Port connector, five MIPI camera interface ports, one 8-bit eMMC up to 64GB and one 3.5mm 4-conductor audio interface. The kit also includes an E-key M.2 connector, a 2 channel PCIe port, and two 34-pin 0.1” headers with direct connections to the QCS6490/5430 processor supporting GPIO, SPI, I2C, SoundWire, I2S and Slimbus peripherals.Additional details can be found at https://www.criticallink.com/product/mitysom-qc6490-5430-development-kit/
KEY FEATURES:
- Full-featured development kit for Critical Link's QCS6490 and QCS5430-based system on modules
- MitySOM system on modules are production-ready industrial solutions, designed for long term availability and performance
- Developers have access to dev board design files to jump start their own baseboard design, as well as lifetime access to Critical Link's wiki-based support as well as our US-based engineering support team
The MitySOM-QC6490/5430 Development Kit supports Critical Link’s Qualcomm Dragonwing QCS6490 and QCS5430-based system on modules.Each Dev Kit comes complete with all the connectivity needed in any application well suited for the MitySOM-QC6490/5430, including an on-board UART to Micro-USB Port, dual USB 2.0 Host Ports, one 3.1 USB Type-C with Display Port, one 1.4 Display Port connector, five MIPI camera interface ports, one 8-bit eMMC up to 64GB and one 3.5mm 4-conductor audio interface. The kit also includes an E-key M.2 connector, a 2 channel PCIe port, and two 34-pin 0.1” headers with direct connections to the QCS6490/5430 processor supporting GPIO, SPI, I2C, SoundWire, I2S and Slimbus peripherals.Additional details can be found at https://www.criticallink.com/product/mitysom-qc6490-5430-development-kit/
KEY FEATURES:
- Full-featured development kit for Critical Link's QCS6490 and QCS5430-based system on modules
- MitySOM system on modules are production-ready industrial solutions, designed for long term availability and performance
- Developers have access to dev board design files to jump start their own baseboard design, as well as lifetime access to Critical Link's wiki-based support as well as our US-based engineering support team
SOM-COMe-CT6-Dragonwing-IQ-X
The SECO SOM-COMe-CT6-Dragonwing-IQ-X is a key reference platform for high-performance, AI-driven edge applications. Built on the Qualcomm® Dragonwing™ IQ-X Series and compliant with the COM Express Type 6 standard, the module is designed to support demanding workloads such as computer vision, advanced analytics, and AI inference at the edge, while ensuring long-term availability and industrial-grade reliability.
KEY FEATURES:
- CPU: Dragonwing IQ-X Series processors
- NPU: Hexagon NPU, up to 45 TOPS
- MEMORY: Up to 64GB LPDDR5 4224MT/s integrated on SiP
The SECO SOM-COMe-CT6-Dragonwing-IQ-X is a key reference platform for high-performance, AI-driven edge applications. Built on the Qualcomm® Dragonwing™ IQ-X Series and compliant with the COM Express Type 6 standard, the module is designed to support demanding workloads such as computer vision, advanced analytics, and AI inference at the edge, while ensuring long-term availability and industrial-grade reliability.
KEY FEATURES:
- CPU: Dragonwing IQ-X Series processors
- NPU: Hexagon NPU, up to 45 TOPS
- MEMORY: Up to 64GB LPDDR5 4224MT/s integrated on SiP
MRD5165 Eagle Kit LR-WiFi
The MRD5165 Eagle Kit LR-Wifi is a powerful new variant of Eagle Kit with WiFi 6e powered by Doodle Labs. The Kit from Mistral is an Advanced Aerial Robot Controller built around Qualcomm® QRB5165 SoC and Cube Pilot CubeOrange+ FCU.The MRD5165 Eagle Kit LR-WiFi variant comes integrated with Doodle Labs’ 11AX Industrial Wi-Fi Transceivers, making it one of the finest companion computers with industrial-grade wireless modules. The variant offers robust connectivity for high throughput datalinks over extremely long ranges with low latency, enhanced coverage, and high security.
KEY FEATURES:
- Integrated w/ Doodle Labs’ 11AX Industrial Wi-Fi Transceiver
- Robust connectivity for high throughput datalinks
- Low latency, enhanced coverage, and high security
The MRD5165 Eagle Kit LR-Wifi is a powerful new variant of Eagle Kit with WiFi 6e powered by Doodle Labs. The Kit from Mistral is an Advanced Aerial Robot Controller built around Qualcomm® QRB5165 SoC and Cube Pilot CubeOrange+ FCU.The MRD5165 Eagle Kit LR-WiFi variant comes integrated with Doodle Labs’ 11AX Industrial Wi-Fi Transceivers, making it one of the finest companion computers with industrial-grade wireless modules. The variant offers robust connectivity for high throughput datalinks over extremely long ranges with low latency, enhanced coverage, and high security.
KEY FEATURES:
- Integrated w/ Doodle Labs’ 11AX Industrial Wi-Fi Transceiver
- Robust connectivity for high throughput datalinks
- Low latency, enhanced coverage, and high security
qSmartAI20_CUQ610 - 2MP Qualcomm® Edge AI Vision Kit with multi-camera support
qSmartAI20_CUQ610 is a ready-to-deploy AI vision kit based on the Qualcomm® QCS610 processor with powerful AI processing capabilities. This Qualcomm vision kit comprises e-con's Sony IMX462 based Full HD MIPI CSI-2 camera module.This AI vision kit has a small form factor and can perform all image processing and analytics indigenously without the connectivity or power of the cloud. In addition, this is a multi-camera solution enabling an extended field of view for applications that need to cover a large area or scene. e-con Systems provides all the necessary customization services for this vision AI development kit including the camera, carrier board, and software.
KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- Full HD ultra low light camera based on Sony Starvis IMX462 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
qSmartAI20_CUQ610 is a ready-to-deploy AI vision kit based on the Qualcomm® QCS610 processor with powerful AI processing capabilities. This Qualcomm vision kit comprises e-con's Sony IMX462 based Full HD MIPI CSI-2 camera module.This AI vision kit has a small form factor and can perform all image processing and analytics indigenously without the connectivity or power of the cloud. In addition, this is a multi-camera solution enabling an extended field of view for applications that need to cover a large area or scene. e-con Systems provides all the necessary customization services for this vision AI development kit including the camera, carrier board, and software.
KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- Full HD ultra low light camera based on Sony Starvis IMX462 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
SagireEdge™ AI 600 Development Kit
The SagireEdge™ AI 600 Development Kit (DK) is an open-frame platform that combines the production ready SagireEdge™ AI 600 SOM with a SMARC complaint carrier board providing numerous expansion options to support development and testing of peripherals and applications.
KEY FEATURES:
- SagireEdge AI 600 SOM & open chassis carrier board powered by the Qualcomm Dragonwing™ QCS6490 SoCPreloaded with a Ubuntu Linux O/S
The SagireEdge™ AI 600 Development Kit (DK) is an open-frame platform that combines the production ready SagireEdge™ AI 600 SOM with a SMARC complaint carrier board providing numerous expansion options to support development and testing of peripherals and applications.
KEY FEATURES:
- SagireEdge AI 600 SOM & open chassis carrier board powered by the Qualcomm Dragonwing™ QCS6490 SoCPreloaded with a Ubuntu Linux O/S
KIMQ 8550
The KIMQ 8550, on Qualcomm® QCS8550, features an 8-core Qualcomm® Kryo™ CPU (4 Gold cores at 2.1 GHz, 4 Silver cores at 1.9 GHz), an AI Core achieving 48 TOPs (INT8), and a GPU delivering 12 TOPs (FP16) for efficient processing of AI applications. It supports Ubuntu 20.04, Android 13, up to 128GB memory, and offers various connectivity options: 2x Soundwire, 4x Dmic, 1x USB 3.1, 1x USB 2.0, 3x USB 3.0, 2x PCIe Gen3, SDIO, LAN Ethernet 2.5Gbps, and 3 MIPI CSI 4-lane cameras. Operating in temperatures from -25°C to 85°C, it is ideal for automation, healthcare, and smart city applications with its robust connectivity, durability, and advanced AI capabilities.
KEY FEATURES:
- KIMQ 8550 boasts powerful processing with an 6 Core Kyro CPU, its AI core supports 48 TOPS(INT8) for enhanced AI/ML/LLM, supported unbutu/Adroid/Linux. Connectivity options include USB ports, PCIe, MIPI, CSI... All in compact size 40x47x5.3mm design. It compatibility with KIMQ 6490 and 5430
The KIMQ 8550, on Qualcomm® QCS8550, features an 8-core Qualcomm® Kryo™ CPU (4 Gold cores at 2.1 GHz, 4 Silver cores at 1.9 GHz), an AI Core achieving 48 TOPs (INT8), and a GPU delivering 12 TOPs (FP16) for efficient processing of AI applications. It supports Ubuntu 20.04, Android 13, up to 128GB memory, and offers various connectivity options: 2x Soundwire, 4x Dmic, 1x USB 3.1, 1x USB 2.0, 3x USB 3.0, 2x PCIe Gen3, SDIO, LAN Ethernet 2.5Gbps, and 3 MIPI CSI 4-lane cameras. Operating in temperatures from -25°C to 85°C, it is ideal for automation, healthcare, and smart city applications with its robust connectivity, durability, and advanced AI capabilities.
KEY FEATURES:
- KIMQ 8550 boasts powerful processing with an 6 Core Kyro CPU, its AI core supports 48 TOPS(INT8) for enhanced AI/ML/LLM, supported unbutu/Adroid/Linux. Connectivity options include USB ports, PCIe, MIPI, CSI... All in compact size 40x47x5.3mm design. It compatibility with KIMQ 6490 and 5430
AIBOX 6490
AI BOX 6490 was designed and developed by HSPTEK on the KIMQ 6490 platform, providing the ability to expand diverse connections with peripheral devices. AI BOX 6490 delivers high performance, energy efficiency, up to 12 TOPS of AI processing, and simultaneous processing of 30 to 50 AI threads. Thus meeting the computational requirements for AI processing devices at the edge.AI BOX 6490 easily integrates AI models such as face detection, intrusion detection, smoke detection…, and is applied in many fields of agriculture, education, smart factory management, and construction. smart city…
KEY FEATURES:
- High AI processing performance of 12 TOPS, supports up to 8 Full HD cameras. Equipped with 4 USB-A 3.0 port, 1 USB-Type port, 1 SD card slot, and 1 Ethernet port (1 Gbps). 4G connectivity supported (optional). Compatible with multiple OS: Android, Ubuntu, and Linux.
AI BOX 6490 was designed and developed by HSPTEK on the KIMQ 6490 platform, providing the ability to expand diverse connections with peripheral devices. AI BOX 6490 delivers high performance, energy efficiency, up to 12 TOPS of AI processing, and simultaneous processing of 30 to 50 AI threads. Thus meeting the computational requirements for AI processing devices at the edge.AI BOX 6490 easily integrates AI models such as face detection, intrusion detection, smoke detection…, and is applied in many fields of agriculture, education, smart factory management, and construction. smart city…
KEY FEATURES:
- High AI processing performance of 12 TOPS, supports up to 8 Full HD cameras. Equipped with 4 USB-A 3.0 port, 1 USB-Type port, 1 SD card slot, and 1 Ethernet port (1 Gbps). 4G connectivity supported (optional). Compatible with multiple OS: Android, Ubuntu, and Linux.
KIMQ 6490
KIMQ 6490 is designed and developed by HSPTEK on the Snapdragon® SoC (QCS6490) platform with a 6nm manufacturing process, with high performance, energy saving and strong computing power (12 TOPs). This SOM supports 4K@60FPS video decoding, 4K@30FPS video encoding, three MIPI CSI interfaces, and supports diverse external interfaces (GPIO, UART, I2C, I3C, SPI, USB 3.0).KIMQ 6490 supports customers in accelerating the product development process and is applied in many fields such as specialized handheld devices, tablets, and payment devices. Besides, with powerful AI processing capabilities at the edge, KIMQ 6490 is developed for products such as AI Camera, AI Box, and other AI processing devices at the edge….
KEY FEATURES:
- Ultra-compact size 40x47mm. Modular design with plug-and-play pins. Decodes video at 250 FPS FHD, AI processing at 12 TOPS. No maintenance, high stability. Supports AI model conversion & optimization. AI Hub with KIMQ-compatible models.
KIMQ 6490 is designed and developed by HSPTEK on the Snapdragon® SoC (QCS6490) platform with a 6nm manufacturing process, with high performance, energy saving and strong computing power (12 TOPs). This SOM supports 4K@60FPS video decoding, 4K@30FPS video encoding, three MIPI CSI interfaces, and supports diverse external interfaces (GPIO, UART, I2C, I3C, SPI, USB 3.0).KIMQ 6490 supports customers in accelerating the product development process and is applied in many fields such as specialized handheld devices, tablets, and payment devices. Besides, with powerful AI processing capabilities at the edge, KIMQ 6490 is developed for products such as AI Camera, AI Box, and other AI processing devices at the edge….
KEY FEATURES:
- Ultra-compact size 40x47mm. Modular design with plug-and-play pins. Decodes video at 250 FPS FHD, AI processing at 12 TOPS. No maintenance, high stability. Supports AI model conversion & optimization. AI Hub with KIMQ-compatible models.
CQS290 DDK
Cavli’s CQS290 Device Development Kit is based on an LTE Cat 4 Android smart module with 2G fallback, powered by an ARM Cortex-A53 quad-core CPU and Qualcomm® Adreno™ 702 GPU for enhanced graphics, image quality, and battery efficiency. It supports USB 2.0 OTG, Bluetooth® 5.0, FM, and Wi-Fi 5, ideal for POS terminals, vending machines, kiosks, and more.Built on AOSP with a full SDK, the CQS290 can be tailored to OEM requirements. Global variants with configurable memory support multi-constellation GNSS (GPS, BDS, GLONASS, Galileo, QZSS, SBAS) via Qualcomm Location Suite Gen9VT. An optional integrated eSIM powered by the Cavli Hubble platform provides seamless global connectivity. The DDK offers enables customers to reduce their time-to-market and to seamlessly engage in development activity.
Cavli’s CQS290 Device Development Kit is based on an LTE Cat 4 Android smart module with 2G fallback, powered by an ARM Cortex-A53 quad-core CPU and Qualcomm® Adreno™ 702 GPU for enhanced graphics, image quality, and battery efficiency. It supports USB 2.0 OTG, Bluetooth® 5.0, FM, and Wi-Fi 5, ideal for POS terminals, vending machines, kiosks, and more.Built on AOSP with a full SDK, the CQS290 can be tailored to OEM requirements. Global variants with configurable memory support multi-constellation GNSS (GPS, BDS, GLONASS, Galileo, QZSS, SBAS) via Qualcomm Location Suite Gen9VT. An optional integrated eSIM powered by the Cavli Hubble platform provides seamless global connectivity. The DDK offers enables customers to reduce their time-to-market and to seamlessly engage in development activity.
CQS290
Cavli CQS290, a series of LTE Cat 4 module with 2G fall back. This smart module is equipped
with the Cortex A53 quad-core CPU architecture with built-in AdrenoTM 702 GPU delivering
higher graphics capabilities, better quality images and excellent power performance.
The module comes in 6 variants based on Regional LTE bands - Eurasia and Japan (EAJ),
Australia and New Zealand (AN), India (IN), Latin America (LA), North America (NA) &
Worldwide (WW). All variants supporting multi-constellation GNSS with GPS, BDS,
GLONASS, Galileo, QZSS and SBAS.
CQS290 supports versatile features such as USB 2.0 and 3.1, Bluetooth 5.0, Wi-Fi 5 & FM making it ideal for wide range of applications.
KEY FEATURES:
- LTE Cat 4 with 2G Fall back
- Quad-core ARM Cortex-A53 up to 2GHz, Multiple Memory Options
- SDK Support, FOTA, LCC+LGA Form Factor
- Integrated MIPI-DSI Interface, WiFi 5 + BLE 5.0 Support
Cavli CQS290, a series of LTE Cat 4 module with 2G fall back. This smart module is equipped
with the Cortex A53 quad-core CPU architecture with built-in AdrenoTM 702 GPU delivering
higher graphics capabilities, better quality images and excellent power performance.
The module comes in 6 variants based on Regional LTE bands - Eurasia and Japan (EAJ),
Australia and New Zealand (AN), India (IN), Latin America (LA), North America (NA) &
Worldwide (WW). All variants supporting multi-constellation GNSS with GPS, BDS,
GLONASS, Galileo, QZSS and SBAS.
CQS290 supports versatile features such as USB 2.0 and 3.1, Bluetooth 5.0, Wi-Fi 5 & FM making it ideal for wide range of applications.
KEY FEATURES:
- LTE Cat 4 with 2G Fall back
- Quad-core ARM Cortex-A53 up to 2GHz, Multiple Memory Options
- SDK Support, FOTA, LCC+LGA Form Factor
- Integrated MIPI-DSI Interface, WiFi 5 + BLE 5.0 Support
SagireEdge™ AI 600 System On Module
The SagireEdge™ AI 600 SOM is an industrial grade production ready module based upon Qualcomm Dragonwing™ QCS6490 System on Chip (SoC). It enables low power, compute intensive camera and Edge AI Applications with up to 12 TOPS.The Smart Mobility ARChitecture (SMARC) compliant form factor is designed to enable digital transformation optimized at the edge for size, weight, power and cost sensitive applications. The standardized format of the SMARC SOM facilitates fast development and enables new designs to be quickly created, resulting in significantly reduced time to market.
KEY FEATURES:
- 8GB RAM/128GB UFS Flash in a µMCP packageExtensive range of I/O, including Ethernet, USB3.1, Wi-Fi 6E and BT 5.2, MIPI-CSI, eDP, CAN, and PCIe Extended temperature range
The SagireEdge™ AI 600 SOM is an industrial grade production ready module based upon Qualcomm Dragonwing™ QCS6490 System on Chip (SoC). It enables low power, compute intensive camera and Edge AI Applications with up to 12 TOPS.The Smart Mobility ARChitecture (SMARC) compliant form factor is designed to enable digital transformation optimized at the edge for size, weight, power and cost sensitive applications. The standardized format of the SMARC SOM facilitates fast development and enables new designs to be quickly created, resulting in significantly reduced time to market.
KEY FEATURES:
- 8GB RAM/128GB UFS Flash in a µMCP packageExtensive range of I/O, including Ethernet, USB3.1, Wi-Fi 6E and BT 5.2, MIPI-CSI, eDP, CAN, and PCIe Extended temperature range
KIMQ 5430
KIMQ 5430 is designed and developed by HSPTEK on the Qualcomm® QCS5430 with a 6nm manufacturing process, with high performance, energy saving and strong computing power (3.5 TOPs). This SOM supports 4K@60FPS video decoding, 4K@30FPS video encoding, three MIPI CSI interfaces, and supports diverse external interfaces (GPIO, UART, I2C, I3C, SPI, USB 3.0).KIMQ 5430 helps customers accelerate product development and can be used in handheld and tablet devices, industrial scanners, dash cams, drones. Besides, with powerful AI processing capabilities at the edge, KIMQ 5430 is developed for products such as AI Camera, AI Box, and other AI processing devices at the edge….
KEY FEATURES:
- Ultra-compact AI computer, 40x47mm size. Modular design with plug-and-play pins. Decodes video at 250FPS FHD, AI processing at 3.5 TOPS. No maintenance, high stability. Supports AI model conversion & optimization. AI Hub with KIMQ-compatible models.
KIMQ 5430 is designed and developed by HSPTEK on the Qualcomm® QCS5430 with a 6nm manufacturing process, with high performance, energy saving and strong computing power (3.5 TOPs). This SOM supports 4K@60FPS video decoding, 4K@30FPS video encoding, three MIPI CSI interfaces, and supports diverse external interfaces (GPIO, UART, I2C, I3C, SPI, USB 3.0).KIMQ 5430 helps customers accelerate product development and can be used in handheld and tablet devices, industrial scanners, dash cams, drones. Besides, with powerful AI processing capabilities at the edge, KIMQ 5430 is developed for products such as AI Camera, AI Box, and other AI processing devices at the edge….
KEY FEATURES:
- Ultra-compact AI computer, 40x47mm size. Modular design with plug-and-play pins. Decodes video at 250FPS FHD, AI processing at 3.5 TOPS. No maintenance, high stability. Supports AI model conversion & optimization. AI Hub with KIMQ-compatible models.
AGC6490 Robot Board
AGC6490 is a Single-SoC Multi-Purpose high-performance board based on the Qualcomm Dragonwing™ QCM/QCS6490 SoC, specifically designed for robots. lt features an 8-core CPU, boast of 12 TOPS computing power by dedicated NPU, powerful intelligent edge capabilities, includes various peripheral connectors like USB*8, UART*8, and fully meets the robot multi-sensor sensing and control module access requirements, and equipped with industrial connectors, suitable for outdoor scenarios. It offers flexible operating system choices, with the standard configuration being Android+Linux dual-system integration for parallel operation, while also capable of independently running Android or Linux operating systems. It can be applied to various high-performance and high-computing power robot scenarios, including indoor and outdoor delivery robots, service robots, cleaning robots, smart lawnmowers, and more.
KEY FEATURES:
- Dual-OS: Android + Linux running concurrently to serve Android and Linux use-cases with reduced hardware footprint
- High performance: 12 TOPS dedicate NPU for AI and also strong CPU and GPU
- Extremely rich peripheral interfaces: USB*8, UART*8, CAN, RS485, mini-PCIE
AGC6490 is a Single-SoC Multi-Purpose high-performance board based on the Qualcomm Dragonwing™ QCM/QCS6490 SoC, specifically designed for robots. lt features an 8-core CPU, boast of 12 TOPS computing power by dedicated NPU, powerful intelligent edge capabilities, includes various peripheral connectors like USB*8, UART*8, and fully meets the robot multi-sensor sensing and control module access requirements, and equipped with industrial connectors, suitable for outdoor scenarios. It offers flexible operating system choices, with the standard configuration being Android+Linux dual-system integration for parallel operation, while also capable of independently running Android or Linux operating systems. It can be applied to various high-performance and high-computing power robot scenarios, including indoor and outdoor delivery robots, service robots, cleaning robots, smart lawnmowers, and more.
KEY FEATURES:
- Dual-OS: Android + Linux running concurrently to serve Android and Linux use-cases with reduced hardware footprint
- High performance: 12 TOPS dedicate NPU for AI and also strong CPU and GPU
- Extremely rich peripheral interfaces: USB*8, UART*8, CAN, RS485, mini-PCIE
IMDT QCS8550 SBC and EVK
The IMDT QCS8550 SBC redefines versatility and performance in compact system design, transforming the IMDT QCS8550 SOM into a fully featured solution tailored for demanding applications like robotics, drones, and smart city deployments.Designed to maximize the potential of the Qualcomm® Dragonwing™ QCS8550 processor, this SBC packs impressive performance with up to 55 TOPs for AI and machine learning tasks together with high-efficiency power management, support for up to 20 cameras, advanced AI and GPU capabilities, and robust connectivity options – all in a small, energy-efficient form factor.EVK available8x4-lane MIPI CSI interface for camerasM.2 NGFF Key-E, M.2 NGFF Key-B2x4-lane DSI, with touch I/F6-DOF IMU,3-Axis magnetometerDimensions: (WxLxH): 125 x 81 x 20 mm
KEY FEATURES:
- M.2 NGFF Key-E, M.2 NGFF Key-B
- Wi-Fi 802.11a/b/g/n + Bluetooth 5.2 BR/EDR/LE
- Gigabit Ethernet with RJ-45 connector
The IMDT QCS8550 SBC redefines versatility and performance in compact system design, transforming the IMDT QCS8550 SOM into a fully featured solution tailored for demanding applications like robotics, drones, and smart city deployments.Designed to maximize the potential of the Qualcomm® Dragonwing™ QCS8550 processor, this SBC packs impressive performance with up to 55 TOPs for AI and machine learning tasks together with high-efficiency power management, support for up to 20 cameras, advanced AI and GPU capabilities, and robust connectivity options – all in a small, energy-efficient form factor.EVK available8x4-lane MIPI CSI interface for camerasM.2 NGFF Key-E, M.2 NGFF Key-B2x4-lane DSI, with touch I/F6-DOF IMU,3-Axis magnetometerDimensions: (WxLxH): 125 x 81 x 20 mm
KEY FEATURES:
- M.2 NGFF Key-E, M.2 NGFF Key-B
- Wi-Fi 802.11a/b/g/n + Bluetooth 5.2 BR/EDR/LE
- Gigabit Ethernet with RJ-45 connector
5G Industrial IoT / Ruggedized Handhelds (QCM6490 Reference Design)
Accelerate Your IoT Development with QCM6490 Reference Design. QCM6490 Reference Design offer, featuring: Planning Workshop: Collaborate with us to define project objectives, requirements, and timelines with QCM6490. Reference Design: Leverage our pre-developed design to save $1M in NRE fees. Maximize Your Benefits by partnering with us, you'll accelerate the development and innovation.
We can design chip on board design with any Qualcomm's X (thin modem) or QCM line of 5G chipsets, do all pre-certification testing (FCC, CE, against carrier requirements) and help with the carrier certification process as needed.
Contact us to learn more about our IoT Solutions on the Qualcomm platform and kickstart your project. Let's work together to bring your vision to life. Contact Vesa Korkala (Vesa.Korkala@sigmaconnectivity.com)
KEY FEATURES:
- QCM/QCS6490 Ref Design to build your product upon
- Key design and build experiences with multiple Qualcomm® Chipsets
Accelerate Your IoT Development with QCM6490 Reference Design. QCM6490 Reference Design offer, featuring: Planning Workshop: Collaborate with us to define project objectives, requirements, and timelines with QCM6490. Reference Design: Leverage our pre-developed design to save $1M in NRE fees. Maximize Your Benefits by partnering with us, you'll accelerate the development and innovation.
We can design chip on board design with any Qualcomm's X (thin modem) or QCM line of 5G chipsets, do all pre-certification testing (FCC, CE, against carrier requirements) and help with the carrier certification process as needed.
Contact us to learn more about our IoT Solutions on the Qualcomm platform and kickstart your project. Let's work together to bring your vision to life. Contact Vesa Korkala (Vesa.Korkala@sigmaconnectivity.com)
KEY FEATURES:
- QCM/QCS6490 Ref Design to build your product upon
- Key design and build experiences with multiple Qualcomm® Chipsets
QCM6490 Reference Design
GET YOUR IOT PROJECT GOING!We offer the Sigma Connectivity/ Qualcomm® QCM6490 IoT Kickstarter, which includes the following:Planning Workshop:In this workshop, we will collaborate with you to establish clear objectives, define requirements, and create a realistic timeline for your project.QCM6490 Reference Design:As part of this offer, you can leverage the QCM6490 reference design. By using this design, you can save significant costs, as there will be no prototyping licensing fees involved. This translates to potential savings of up to $1M or more.By taking advantage of our expertise and the resources provided through Sigma Connectivity’ and Qualcomm Technologies' IoT Kick Starter Offer, you can accelerate the development of your 5G IoT solutions and maximize the benefits of digital transformation.
KEY FEATURES:
- Complete Ref Design to build your product upon
- Prototype Licenses covered.
- Key Design and build experiences with multiple Qualcomm® Chipsets
GET YOUR IOT PROJECT GOING!We offer the Sigma Connectivity/ Qualcomm® QCM6490 IoT Kickstarter, which includes the following:Planning Workshop:In this workshop, we will collaborate with you to establish clear objectives, define requirements, and create a realistic timeline for your project.QCM6490 Reference Design:As part of this offer, you can leverage the QCM6490 reference design. By using this design, you can save significant costs, as there will be no prototyping licensing fees involved. This translates to potential savings of up to $1M or more.By taking advantage of our expertise and the resources provided through Sigma Connectivity’ and Qualcomm Technologies' IoT Kick Starter Offer, you can accelerate the development of your 5G IoT solutions and maximize the benefits of digital transformation.
KEY FEATURES:
- Complete Ref Design to build your product upon
- Prototype Licenses covered.
- Key Design and build experiences with multiple Qualcomm® Chipsets
Development Kit based on QCS610
This development kit is based on powerful Qualcomm® QCS610 SoC along with a carrier board developed by VVDN. The system is intended for connecting camera intelligence applications such as 180° dual-camera stitching, advanced tracking algorithms, video conferencing, etc. The development system can be used for intelligent video analytics applications including smart surveillance, retail, traffic, dashcams, robotics, automotive and more.
KEY FEATURES:
- Rich I/O Peripherals including USB3.0, USB2.0, MIPI CSI(x3), HDMI, etc
- Multiple connectivity solutions such as Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0
- Compact SOM size
This development kit is based on powerful Qualcomm® QCS610 SoC along with a carrier board developed by VVDN. The system is intended for connecting camera intelligence applications such as 180° dual-camera stitching, advanced tracking algorithms, video conferencing, etc. The development system can be used for intelligent video analytics applications including smart surveillance, retail, traffic, dashcams, robotics, automotive and more.
KEY FEATURES:
- Rich I/O Peripherals including USB3.0, USB2.0, MIPI CSI(x3), HDMI, etc
- Multiple connectivity solutions such as Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0
- Compact SOM size
VVDN-QCS6490 SOM
VVDN is designing, and developing SOM based on Qualcomm® QCS6490 SoC. The SOM supports rich interfaces for connectivity including Wi-Fi 6 (802.11ax) & Bluetooth 5.2 ® technology and other rich peripherals including 5X4 lane MIPI CSI for cameras, 4 lane MIPI DSI for display, USB3.1, USB 2.0, etc.The SOM provides rich hardware interfaces and software SDKs for building quick prototypes and validation. It is ideal for developing various industrial and commercial IoT applications including Digital Signage, Retail, Smart Warehousing, Service robots, Rugged Handheld, etc.
VVDN is designing, and developing SOM based on Qualcomm® QCS6490 SoC. The SOM supports rich interfaces for connectivity including Wi-Fi 6 (802.11ax) & Bluetooth 5.2 ® technology and other rich peripherals including 5X4 lane MIPI CSI for cameras, 4 lane MIPI DSI for display, USB3.1, USB 2.0, etc.The SOM provides rich hardware interfaces and software SDKs for building quick prototypes and validation. It is ideal for developing various industrial and commercial IoT applications including Digital Signage, Retail, Smart Warehousing, Service robots, Rugged Handheld, etc.
VVDN-QCS2290 SOM
VVDN-QCS220 SOM, designed and developed by VVDN is based on the Qualcomm® QCS2290 platform. It comes with integrated Wi-Fi: IEEE 802.11 a/b/g/n/ac, Bluetooth 5.0, and FM via Qualcomm® WCN3950 chipset. The SOM supports rich I/O interfaces including MIPI-CSI, MIPI-DSI, USB, SD card, GPIO, JTAG, to connect LCD panels, and camera modules, for the development of vision intelligent IoT applications.The system on module offers tight system integration and optimization for superior performance and power management features make it the best to facilitate a cost-effective and efficient embedded system application including two-wheelers digital instrument cluster, body-worn camera, connected camera, digital signage, control panels/industrial panels, retail PoS, video doorbells, etc.
VVDN-QCS220 SOM, designed and developed by VVDN is based on the Qualcomm® QCS2290 platform. It comes with integrated Wi-Fi: IEEE 802.11 a/b/g/n/ac, Bluetooth 5.0, and FM via Qualcomm® WCN3950 chipset. The SOM supports rich I/O interfaces including MIPI-CSI, MIPI-DSI, USB, SD card, GPIO, JTAG, to connect LCD panels, and camera modules, for the development of vision intelligent IoT applications.The system on module offers tight system integration and optimization for superior performance and power management features make it the best to facilitate a cost-effective and efficient embedded system application including two-wheelers digital instrument cluster, body-worn camera, connected camera, digital signage, control panels/industrial panels, retail PoS, video doorbells, etc.
IMDT QCS8550 SOM
The IMDT QCS8550 SOM, powered by the Qualcomm Dragonwing™ QCS8550 processor, is a production-ready module. Measuring just 37 x 30 x 4mm. The IMDT QCS8550 SOM provides superior computing power, advanced Edge AI processing, and crystal-clear video and graphics, making it ideal for performance intensive AIoT applications. It supports 8 x 4-lane MIPI CSI connections, enabling attachment of up to 20 cameras, and in addition - the full module provides customizable options such as onboard Wi-Fi/Bluetooth, various memory and storage capacities, and PHY configurations, allowing users to tailor the system to their specific needs.Qualcomm® Kryo™ central processing unitQualcomm® Adreno™ GPU8th-generation Qualcomm® AI Engine
KEY FEATURES:
- 8 x 4-lane MIPI CSI interface for cameras, max 20 x cameras
- 2 x 4-lane DSI, with touch I/F
- Full connectivity: USB3.1 gen2 10Gbps (DP+data) Type-C, 2 x 4-Lane PCIe (1xGen3, 1xGen4), 2 x SDC (4-bits)
The IMDT QCS8550 SOM, powered by the Qualcomm Dragonwing™ QCS8550 processor, is a production-ready module. Measuring just 37 x 30 x 4mm. The IMDT QCS8550 SOM provides superior computing power, advanced Edge AI processing, and crystal-clear video and graphics, making it ideal for performance intensive AIoT applications. It supports 8 x 4-lane MIPI CSI connections, enabling attachment of up to 20 cameras, and in addition - the full module provides customizable options such as onboard Wi-Fi/Bluetooth, various memory and storage capacities, and PHY configurations, allowing users to tailor the system to their specific needs.Qualcomm® Kryo™ central processing unitQualcomm® Adreno™ GPU8th-generation Qualcomm® AI Engine
KEY FEATURES:
- 8 x 4-lane MIPI CSI interface for cameras, max 20 x cameras
- 2 x 4-lane DSI, with touch I/F
- Full connectivity: USB3.1 gen2 10Gbps (DP+data) Type-C, 2 x 4-Lane PCIe (1xGen3, 1xGen4), 2 x SDC (4-bits)
TobuFi
TobuFi is an advanced SOM (system on module) built using the cutting-edge Qualcomm® QCS405 chip and a high-end dual-band Wi-Fi 6 radio powered by Qualcomm® QCN9074 chipset. With an additional WiFi 6 radio, AI and DSP features integrated into the QCS405, TobuFi ensures reliable data transmission and efficient processing that are ideal for robotics and drone applications.Its secondary WiFi and BT radios provide additional versatility and flexibility for development. TobuFi’s interface-rich design offers straightforward integration, while high-end radio supports narrow channels,extended frequency range, and frequency shifting with non-standard center frequencies is ideal for long-range communication even in very noisy environments.
KEY FEATURES:
- Supports narrow channels (5 & 10 MHz) for long-distance communication.
- Qualcomm® QCS405 integrates AI and DSPs for enhanced performance and lower power use.
- Features high-capacity interfaces for audio, video, display, and more.
- WiFi 6: 2.4 & 5GHz
TobuFi is an advanced SOM (system on module) built using the cutting-edge Qualcomm® QCS405 chip and a high-end dual-band Wi-Fi 6 radio powered by Qualcomm® QCN9074 chipset. With an additional WiFi 6 radio, AI and DSP features integrated into the QCS405, TobuFi ensures reliable data transmission and efficient processing that are ideal for robotics and drone applications.Its secondary WiFi and BT radios provide additional versatility and flexibility for development. TobuFi’s interface-rich design offers straightforward integration, while high-end radio supports narrow channels,extended frequency range, and frequency shifting with non-standard center frequencies is ideal for long-range communication even in very noisy environments.
KEY FEATURES:
- Supports narrow channels (5 & 10 MHz) for long-distance communication.
- Qualcomm® QCS405 integrates AI and DSPs for enhanced performance and lower power use.
- Features high-capacity interfaces for audio, video, display, and more.
- WiFi 6: 2.4 & 5GHz
VVDN QCS 410 SOM
VVVDN QCS 410 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.
KEY FEATURES:
- High-performance IoT System-on-Chip (SoC)
- Compact SOM size
- Advanced ISP, machine learning, sensor processing, and voice control
VVVDN QCS 410 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.
KEY FEATURES:
- High-performance IoT System-on-Chip (SoC)
- Compact SOM size
- Advanced ISP, machine learning, sensor processing, and voice control
VVDN QCS 610 SOM
VVVDN QCS 610 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.
KEY FEATURES:
- Compact SOM Size
- High-performance IoT System-on-Chip (SoC)
VVVDN QCS 610 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.
KEY FEATURES:
- Compact SOM Size
- High-performance IoT System-on-Chip (SoC)
VVDN-QRB5165 Development Kit
VVDN-QRB5165 development kit designed, developed, and manufactured by VVDN comprises of carrier board and SOM based on powerful Qualcomm® QRB5165 System-on-Chip. The development kit supports multiple interfaces including 6x 4-lane MIPI CSI for camera, 2x 4-lane MIPI DSI for display, and WLAN 2 x 2 802.11ax, Bluetooth 5.1 connectivity.The development kit is suitable for developing visual intelligence applications requiring the highest AI processing performance. Some of the applications include advanced robotics, autonomous delivery vehicles, edge AI boxes, industrial drones, etc.
KEY FEATURES:
- Based on powerful Qualcomm® QRB5165 SoC
- Advanced imaging capability
- Ultra-compact form factor
VVDN-QRB5165 development kit designed, developed, and manufactured by VVDN comprises of carrier board and SOM based on powerful Qualcomm® QRB5165 System-on-Chip. The development kit supports multiple interfaces including 6x 4-lane MIPI CSI for camera, 2x 4-lane MIPI DSI for display, and WLAN 2 x 2 802.11ax, Bluetooth 5.1 connectivity.The development kit is suitable for developing visual intelligence applications requiring the highest AI processing performance. Some of the applications include advanced robotics, autonomous delivery vehicles, edge AI boxes, industrial drones, etc.
KEY FEATURES:
- Based on powerful Qualcomm® QRB5165 SoC
- Advanced imaging capability
- Ultra-compact form factor
VVDN-QCM2290 SOM
VVDN-QCM2290 SOM, designed and developed by VVDN is based on the Qualcomm® QCM2290 platform.The SOM comes with integrated Wi-Fi: IEEE 802.11 a/b/g/n/ac, Bluetooth 5.0, and FM via Qualcomm® WCN3950 chipset along with GNSS and Cellular Connectivity by Qualcomm® WTR3925 chip and supports rich I/O interfaces including MIPI-CSI, MIPI-DSI, USB, SD card, GPIO, JTAG, etc.The system on module offers tight system integration and optimization for superior performance and power management features make it the best to facilitate a cost-effective and efficient embedded system application including two-wheelers digital instrument cluster, body-worn camera, connected camera, digital signage, control panels/industrial panels, retail PoS, video doorbells, and dash camera, etc.
VVDN-QCM2290 SOM, designed and developed by VVDN is based on the Qualcomm® QCM2290 platform.The SOM comes with integrated Wi-Fi: IEEE 802.11 a/b/g/n/ac, Bluetooth 5.0, and FM via Qualcomm® WCN3950 chipset along with GNSS and Cellular Connectivity by Qualcomm® WTR3925 chip and supports rich I/O interfaces including MIPI-CSI, MIPI-DSI, USB, SD card, GPIO, JTAG, etc.The system on module offers tight system integration and optimization for superior performance and power management features make it the best to facilitate a cost-effective and efficient embedded system application including two-wheelers digital instrument cluster, body-worn camera, connected camera, digital signage, control panels/industrial panels, retail PoS, video doorbells, and dash camera, etc.
VVDN QCS 8250 Development Kit
Our QCS 8250 development kit is a powerful compact solution for edge computing applications. The QCS 8250 development kit comprises of SOM (based on Qualcomm® QCS8250 IoT Octa-core SoC) and a carrier board designed and developed by VVDN. The SOM provides multiple standard interfaces such as UART, I2C, SPI, configurable GPIOs, CAN, and USB 3.1. It can support multiple cameras with six 4-lane MIPI CSI and two 4-lane MIPI DSIThe system is intended for kickstarting the development of applications that requires intelligent processing including connected cameras, video collaboration, retail self-checkout, AR/VR, health care, fleet management, digital signage, and other AI applications on the edge.
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Powerful processing cores
- Dedicated computer vision engine
- Android 10-based OS
Our QCS 8250 development kit is a powerful compact solution for edge computing applications. The QCS 8250 development kit comprises of SOM (based on Qualcomm® QCS8250 IoT Octa-core SoC) and a carrier board designed and developed by VVDN. The SOM provides multiple standard interfaces such as UART, I2C, SPI, configurable GPIOs, CAN, and USB 3.1. It can support multiple cameras with six 4-lane MIPI CSI and two 4-lane MIPI DSIThe system is intended for kickstarting the development of applications that requires intelligent processing including connected cameras, video collaboration, retail self-checkout, AR/VR, health care, fleet management, digital signage, and other AI applications on the edge.
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Powerful processing cores
- Dedicated computer vision engine
- Android 10-based OS
VVDN QCS8250 SoM
QCS8250 SoM designed, and developed by VVDN is based on Qualcomm Technologies next-gen processor, the Qualcomm® QCS8250. The SoM can be used in the development of applications that require intelligent processing including connected cameras, video collaboration, retail self-checkout, AR/VR, health care, fleet management, digital signage and other AI applications on the edge.
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Integrated Wi-Fi – (IEEE802.11 b/g/n/ac/ax 2.4/5Ghz) + BLE V5.1
- Supports multiple rich interfaces for camera, connectivity, and display
- Android 10 OS
- Ultra-compact form factor
QCS8250 SoM designed, and developed by VVDN is based on Qualcomm Technologies next-gen processor, the Qualcomm® QCS8250. The SoM can be used in the development of applications that require intelligent processing including connected cameras, video collaboration, retail self-checkout, AR/VR, health care, fleet management, digital signage and other AI applications on the edge.
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Integrated Wi-Fi – (IEEE802.11 b/g/n/ac/ax 2.4/5Ghz) + BLE V5.1
- Supports multiple rich interfaces for camera, connectivity, and display
- Android 10 OS
- Ultra-compact form factor
QSC8250 Video Conference Development Kit
QCS8250 Video Conference Development Kit comprises 1 Qualcomm® QCS8250 processor-based SoM, 1 carrier board, mic and 3 cameras
QCS8250 Video Conference Development Kit comprises 1 Qualcomm® QCS8250 processor-based SoM, 1 carrier board, mic and 3 cameras
QCS8250 Video Collaboration Reference Design by AmTRAN
All-in-one video conference room reference designIntegrated cameras, microphones, speaker and HDMI input/outputs in one deviceWall mountable or place on tabletopCollaboration application runs on the device, no need for a separate PC to host the application.Designed for medium to large rooms, 4.5 – 5.0-meter range.Intelligent AI based features for video and audio.Qualcomm® AI Suite for Video CollaborationAI based automatic ePTZ for group framing, person framing and speaker framing to make video meetings more engaging.AI based noise suppression to eliminate audio distractions.Intelligent Acoustic Echo CancelationExcellent double-talk performanceClear voice pickup up to 5 metersReduces meeting room reverberation.3-4 microphone array
KEY FEATURES:
- Based on powerful Qualcomm® QCS8250 processorAndroid T, kernel 5.15Memory 8GB, storage 32GB4K Ultra HD video calling, 4 Microphone Array, 5 Meters Pickup RangeTested for Teams and Zoom pre-certification
All-in-one video conference room reference designIntegrated cameras, microphones, speaker and HDMI input/outputs in one deviceWall mountable or place on tabletopCollaboration application runs on the device, no need for a separate PC to host the application.Designed for medium to large rooms, 4.5 – 5.0-meter range.Intelligent AI based features for video and audio.Qualcomm® AI Suite for Video CollaborationAI based automatic ePTZ for group framing, person framing and speaker framing to make video meetings more engaging.AI based noise suppression to eliminate audio distractions.Intelligent Acoustic Echo CancelationExcellent double-talk performanceClear voice pickup up to 5 metersReduces meeting room reverberation.3-4 microphone array
KEY FEATURES:
- Based on powerful Qualcomm® QCS8250 processorAndroid T, kernel 5.15Memory 8GB, storage 32GB4K Ultra HD video calling, 4 Microphone Array, 5 Meters Pickup RangeTested for Teams and Zoom pre-certification
TurboX C8550 Development Kit
Thundercomm TurboX C8550 Development Kit is a high performance Development Kit which is powered by next Gen Flagship Qualcomm® QCS8550 processor. It supports Android, featuring in advanced AI increases, huge camera and video advancements and evolved graphics capability. It is an ideal platform for IoT products require high computing power, advanced camera capability, and superior graphics performance.
TurboX C8550 Development Kit supports customers accelerate product development process and can be widely used in Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots (AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing and other application scenarios.
KEY FEATURES:
It can be used to develop Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots(AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing etc.
Thundercomm TurboX C8550 Development Kit is a high performance Development Kit which is powered by next Gen Flagship Qualcomm® QCS8550 processor. It supports Android, featuring in advanced AI increases, huge camera and video advancements and evolved graphics capability. It is an ideal platform for IoT products require high computing power, advanced camera capability, and superior graphics performance.
TurboX C8550 Development Kit supports customers accelerate product development process and can be widely used in Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots (AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing and other application scenarios.
KEY FEATURES:
It can be used to develop Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots(AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing etc.
TurboX CM/C6125 Dev Kit
This development kit supports the pin-to-pin compatible CM6125/C6125 SOMs. Designed for development of Video Conferencing, Dash Cam, Robotics, Handheld devices, applications, its' rich hardware interfaces and software SDK can help customers validate the function and build prototypes quickly.
KEY FEATURES:
- Cost-effective platforms for video conference, camera and handheld devices
- Rich interfaces and SDK
This development kit supports the pin-to-pin compatible CM6125/C6125 SOMs. Designed for development of Video Conferencing, Dash Cam, Robotics, Handheld devices, applications, its' rich hardware interfaces and software SDK can help customers validate the function and build prototypes quickly.
KEY FEATURES:
- Cost-effective platforms for video conference, camera and handheld devices
- Rich interfaces and SDK
Kiteboard ISQ8250
The ISQ8250 is a compute and connectivity system on module which enables OEMs, entrepreneurs and makers to build custom connected devices/appliances for vertical specific solutions that call for AI on the Edge. It is based on the Qualcomm QCS8250 SoC and enables OEMs & ODMs to build and commercialize feature rich intelligent devices at an accelerated time scale.
KEY FEATURES:
- Small form factor Sysyem-On-Module
The ISQ8250 is a compute and connectivity system on module which enables OEMs, entrepreneurs and makers to build custom connected devices/appliances for vertical specific solutions that call for AI on the Edge. It is based on the Qualcomm QCS8250 SoC and enables OEMs & ODMs to build and commercialize feature rich intelligent devices at an accelerated time scale.
KEY FEATURES:
- Small form factor Sysyem-On-Module
Atlantik Elektronik – QCS6490 Based Single Board Computer
Atlantik Elektronik offers direct access to compact single board computers (SBCs) based on the Qualcomm Dragonwing™ QCS6490.Targeting Edge AI, computer vision, robotics, smart cameras, industrial IoT, and education, we offer the Thundercomm Rubik Pi 3: a versatile, Raspberry Pi–style SBC suitable for both prototyping and deployment in industrial environments.Available Dragonwing QCS6490 based SBC:Thundercomm Rubik Pi 3 – compact 100 × 75 mm SBC with broad I/O and ecosystem compatibility, designed for seamless integration into embedded systemsThe Rubik Pi 3 is available directly from Atlantik Elektronik, with optional technical support, software configuration, and long-term logistics services.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
Atlantik Elektronik offers direct access to compact single board computers (SBCs) based on the Qualcomm Dragonwing™ QCS6490.Targeting Edge AI, computer vision, robotics, smart cameras, industrial IoT, and education, we offer the Thundercomm Rubik Pi 3: a versatile, Raspberry Pi–style SBC suitable for both prototyping and deployment in industrial environments.Available Dragonwing QCS6490 based SBC:Thundercomm Rubik Pi 3 – compact 100 × 75 mm SBC with broad I/O and ecosystem compatibility, designed for seamless integration into embedded systemsThe Rubik Pi 3 is available directly from Atlantik Elektronik, with optional technical support, software configuration, and long-term logistics services.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
Atlantik Elektronik – QCS6490 Development Kits
Atlantik Elektronik provides access to a curated selection of development kits from leading manufacturers including Qualcomm Technologies, Thundercomm, and Quectel, covering official reference platforms and commercial-grade evaluation systems.Targeting Edge AI, computer vision, robotics, smart cameras, and industrial IoT, these kits are ideal for rapid prototyping, performance evaluation, and design-in of next-generation embedded systems.Available Development Kits:Qualcomm Dragonwing™ RB3 Gen2 (Core and Vision Kits)Thundercomm C6490P Development KitThundercomm C6490 Development KitThundercomm Rubik Pi 3 (Single Board Computer)Quectel SG560D Development KitAll listed kits are available directly from Atlantik Elektronik, with optional services for integration support, BSP and driver assistance, software pre-configuration, and supply logistics.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
Atlantik Elektronik provides access to a curated selection of development kits from leading manufacturers including Qualcomm Technologies, Thundercomm, and Quectel, covering official reference platforms and commercial-grade evaluation systems.Targeting Edge AI, computer vision, robotics, smart cameras, and industrial IoT, these kits are ideal for rapid prototyping, performance evaluation, and design-in of next-generation embedded systems.Available Development Kits:Qualcomm Dragonwing™ RB3 Gen2 (Core and Vision Kits)Thundercomm C6490P Development KitThundercomm C6490 Development KitThundercomm Rubik Pi 3 (Single Board Computer)Quectel SG560D Development KitAll listed kits are available directly from Atlantik Elektronik, with optional services for integration support, BSP and driver assistance, software pre-configuration, and supply logistics.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
Atlantik Elektronik – QCS6490-Based System-on-Modules (SOMs)
Atlantik Elektronik offers direct access to a wide range of Qualcomm Dragonwing™ QCS6490/QCM6490-based System-on-Modules (SOMs) from leading manufacturers such as Thundercomm, Lantronix, Silex, Wireless Mobility, and Quectel.Designed for Edge AI, computer vision, industrial IoT, and robotics, these SOMs provide scalable, production-ready solutions for high-performance embedded applications. Whether for prototyping or full product rollout, we support integration with technical expertise and long-term supply services.Available Dragonwing QCS6490/QCM6490 based SOMs:Thundercomm C6490P / C6490Lantronix OpenQ 6490CS (NDAA and TAA compliant)Silex EP-200QWireless Mobility SUD500Quectel SG560DAll SOMs are available directly from Atlantik Elektronik, with optional support for evaluation, software adaptation, integration, and logistics.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
Atlantik Elektronik offers direct access to a wide range of Qualcomm Dragonwing™ QCS6490/QCM6490-based System-on-Modules (SOMs) from leading manufacturers such as Thundercomm, Lantronix, Silex, Wireless Mobility, and Quectel.Designed for Edge AI, computer vision, industrial IoT, and robotics, these SOMs provide scalable, production-ready solutions for high-performance embedded applications. Whether for prototyping or full product rollout, we support integration with technical expertise and long-term supply services.Available Dragonwing QCS6490/QCM6490 based SOMs:Thundercomm C6490P / C6490Lantronix OpenQ 6490CS (NDAA and TAA compliant)Silex EP-200QWireless Mobility SUD500Quectel SG560DAll SOMs are available directly from Atlantik Elektronik, with optional support for evaluation, software adaptation, integration, and logistics.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
LEC-RB5N
The ADLINK LEC-RB5N is a SMARC module powered by the Qualcomm® QRB5165 SoC and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device AI capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, defense, industrial and logistics sectors.
KEY FEATURES:
- Qualcomm® Kryo™ 585 CPU, Hexagon HTA up to 15 TOPS
- 4K HDMI/MIPI DSI display, MIPI CSI cameras
- 2x PCIe x2 Gen3, 2x GbE Ethernet, 2x USB 3.1/2.0 and 4x USB 2.0, GPIO/SD and UFS, 5VDC +/-5% voltage input
The ADLINK LEC-RB5N is a SMARC module powered by the Qualcomm® QRB5165 SoC and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device AI capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, defense, industrial and logistics sectors.
KEY FEATURES:
- Qualcomm® Kryo™ 585 CPU, Hexagon HTA up to 15 TOPS
- 4K HDMI/MIPI DSI display, MIPI CSI cameras
- 2x PCIe x2 Gen3, 2x GbE Ethernet, 2x USB 3.1/2.0 and 4x USB 2.0, GPIO/SD and UFS, 5VDC +/-5% voltage input
I-Pi SMARC RB5
The ADLINK I-Pi SMARC RB5 is an advanced robotics platform development kit designed to help you build consumer, enterprise or industrial robots, drones with on-device AI and machine learning, superior computing, and intelligent sensing capabilities. The LEC-RB5 SMARC module provides on-device AI capabilities, delivering up to 15 TOPS for machine learning inference at the edge, support for up to six cameras, and low power consumption.
KEY FEATURES:
- Qualcomm® Kryo™ 585 CPU
- 4K HDMI/MIPI DSI display, up to 6 MIPI CSI cameras support
- 2x PCIe x2 Gen3, 2x GbE Ethernet, 2x USB 3.1/2.0 and 4x USB 2.0, GPIO/SD and UFS, 5VDC +/-5% voltage input
The ADLINK I-Pi SMARC RB5 is an advanced robotics platform development kit designed to help you build consumer, enterprise or industrial robots, drones with on-device AI and machine learning, superior computing, and intelligent sensing capabilities. The LEC-RB5 SMARC module provides on-device AI capabilities, delivering up to 15 TOPS for machine learning inference at the edge, support for up to six cameras, and low power consumption.
KEY FEATURES:
- Qualcomm® Kryo™ 585 CPU
- 4K HDMI/MIPI DSI display, up to 6 MIPI CSI cameras support
- 2x PCIe x2 Gen3, 2x GbE Ethernet, 2x USB 3.1/2.0 and 4x USB 2.0, GPIO/SD and UFS, 5VDC +/-5% voltage input
ROS610
The ROS610 DVK is built with SOM610 module which is based on Qualcomm® QCS610, which can support various input and output interface, which is suitable for various high-end consumer Robotics applications.
KEY FEATURES:
- . ROS610 DVK. ROS1 Melodic. ROS2 Foxy
The ROS610 DVK is built with SOM610 module which is based on Qualcomm® QCS610, which can support various input and output interface, which is suitable for various high-end consumer Robotics applications.
KEY FEATURES:
- . ROS610 DVK. ROS1 Melodic. ROS2 Foxy
QCS610 Development board
Versatile development kit based on Qualcomm® QCS610 SOC supporting MIPI DSI to HDMI/MIPI DSI to LVDS, DisplayPort to HDMI, MIPI CSI Samsung S5KGM1 12Mpixel(4K 30fps) camera module (Option), External I2S audio codec (ALC5633Q), USB 3.1, USB 2.0, 6-Axis sensor (BMI160), RGMII interface (KSZ9031 or KSZ9131), Micro SD connector for SD Card and GNSS antenna connector.
Versatile development kit based on Qualcomm® QCS610 SOC supporting MIPI DSI to HDMI/MIPI DSI to LVDS, DisplayPort to HDMI, MIPI CSI Samsung S5KGM1 12Mpixel(4K 30fps) camera module (Option), External I2S audio codec (ALC5633Q), USB 3.1, USB 2.0, 6-Axis sensor (BMI160), RGMII interface (KSZ9031 or KSZ9131), Micro SD connector for SD Card and GNSS antenna connector.
QCS610 SoM 4057
Featuring visual Intelligence platform based on Qualcomm® QCS610 SoC with Qualcomm® Kryo(TM) 460 Octa-core (x2 gold 2.2 GHz and x6 silver 1.8 GHz) CPU, Qualcomm® Hexagon(TM) DSP with dual Hexagon Vector eXtensions (HVX) 1.1 GHz and Qualcomm® Adreno(TM) 612 845 MHz GPU. Integrates a powerful image signal processor (ISP) and the Qualcomm® Artificial Intelligence (AI) Engine, along with a heterogeneous computing architecture. Supports 4K Ultra HD HEVC/VP9 video.
KEY FEATURES:
- Targeting various applications:AI cameraFace ID SystemVehicle top signageHandheld computing deviceNavigation systemVision computing
Featuring visual Intelligence platform based on Qualcomm® QCS610 SoC with Qualcomm® Kryo(TM) 460 Octa-core (x2 gold 2.2 GHz and x6 silver 1.8 GHz) CPU, Qualcomm® Hexagon(TM) DSP with dual Hexagon Vector eXtensions (HVX) 1.1 GHz and Qualcomm® Adreno(TM) 612 845 MHz GPU. Integrates a powerful image signal processor (ISP) and the Qualcomm® Artificial Intelligence (AI) Engine, along with a heterogeneous computing architecture. Supports 4K Ultra HD HEVC/VP9 video.
KEY FEATURES:
- Targeting various applications:AI cameraFace ID SystemVehicle top signageHandheld computing deviceNavigation systemVision computing
Vision AI ODK (Open Development Kit) based on the Qualcomm QCS6490
Powered by the Qualcomm® QCS6490 SoC (System on Chip) featuring the Qualcomm® Vision Intelligence Platform, the QCS6490 Open Development Kit produced by Altek Corporation is the perfect reference design for AI applications in automotive or IoT.Coupling the Qualcomm® Artificial Intelligence Engine with Altek Corporation’s industry expertise in camera and imaging, you will have the best-in-class visual quality for your product. This design will ensure that your product will be both competitive and compelling for all your needs.
KEY FEATURES:
- Dual Camera: Front and Cabin Sensors
- Memory: LPDDR5 (4GB), eMMC (128GB)
- Connectivity: 5G, WiFi, BT 5.2, GPS
- Display: 3" Display
- Video Out (MIPI DSI), Resolution 480 x 854
- Interfaces: USB Type C/3.1
- Storage: Micro SD card
Powered by the Qualcomm® QCS6490 SoC (System on Chip) featuring the Qualcomm® Vision Intelligence Platform, the QCS6490 Open Development Kit produced by Altek Corporation is the perfect reference design for AI applications in automotive or IoT.Coupling the Qualcomm® Artificial Intelligence Engine with Altek Corporation’s industry expertise in camera and imaging, you will have the best-in-class visual quality for your product. This design will ensure that your product will be both competitive and compelling for all your needs.
KEY FEATURES:
- Dual Camera: Front and Cabin Sensors
- Memory: LPDDR5 (4GB), eMMC (128GB)
- Connectivity: 5G, WiFi, BT 5.2, GPS
- Display: 3" Display
- Video Out (MIPI DSI), Resolution 480 x 854
- Interfaces: USB Type C/3.1
- Storage: Micro SD card
IPC610 Open Development Kit based on Qualcomm® QCS610 platform
Powered by the Qualcomm® QCS610 processor (Qualcomm® Vision Intelligence Platform), the IPC610 ODK produced by Altek Corporation is the perfect reference design for the AIoT camera. Combining the Qualcomm® Artificial Intelligence Engine with Altek’s industry expertise in imaging products, this is a best-in-class product for your edge computing needs.
Powered by the Qualcomm® QCS610 processor (Qualcomm® Vision Intelligence Platform), the IPC610 ODK produced by Altek Corporation is the perfect reference design for the AIoT camera. Combining the Qualcomm® Artificial Intelligence Engine with Altek’s industry expertise in imaging products, this is a best-in-class product for your edge computing needs.
SG882G-AP smart module
SG882G-AP is Quectel’s new generation of flagship Android/Linux smart module. Based on the Qualcomm® QCS8550 IoT chipset with built-in maximum octa-core high-performance CPU, GPU, DPU, VPU, DSP, and ISP. Featuring powerful performance and rich multimedia functions, it is ideal for both industrial and consumer applications requiring high computing power, edge computing and multimedia functions. A rich set of interfaces (such as LCM, Camera, touch panel, I2S, PCIe, UART, USB, I2C, SPI, etc.) extend the applicability of the module to a wide range of M2M applications, including video conference systems, live streaming devices, gaming, edge computing, robots, AR/ VR, intelligent retail, and smart safety.
KEY FEATURES:
- Android/Linux smart module, LGA package, 33 x 39 x 3.85mm. 12GB LPDDR5X + 256GB UFS, Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU. Qualcomm® Hexagon™ DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX). Qualcomm Spectra™ ISP. Adreno 8550 VPU & 1295 DPU. Neural processing unit, Security processing. Video encoder: 4K @ 120 fps; 8K @ 30 fps. Video decoder: 4K @ 240 fps; 8K @ 60fps. Computing power of up to 48 TOPS.
SG882G-AP is Quectel’s new generation of flagship Android/Linux smart module. Based on the Qualcomm® QCS8550 IoT chipset with built-in maximum octa-core high-performance CPU, GPU, DPU, VPU, DSP, and ISP. Featuring powerful performance and rich multimedia functions, it is ideal for both industrial and consumer applications requiring high computing power, edge computing and multimedia functions. A rich set of interfaces (such as LCM, Camera, touch panel, I2S, PCIe, UART, USB, I2C, SPI, etc.) extend the applicability of the module to a wide range of M2M applications, including video conference systems, live streaming devices, gaming, edge computing, robots, AR/ VR, intelligent retail, and smart safety.
KEY FEATURES:
- Android/Linux smart module, LGA package, 33 x 39 x 3.85mm. 12GB LPDDR5X + 256GB UFS, Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU. Qualcomm® Hexagon™ DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX). Qualcomm Spectra™ ISP. Adreno 8550 VPU & 1295 DPU. Neural processing unit, Security processing. Video encoder: 4K @ 120 fps; 8K @ 30 fps. Video decoder: 4K @ 240 fps; 8K @ 60fps. Computing power of up to 48 TOPS.
Qualcomm Flight RB5 5G Reference Design
5G Takes Flight with the Qualcomm Flight™ RB5 5G reference design, the world's first 5G and AI-enabled drone platform and reference design. The Qualcomm Flight RB5 5G is a comprehensive drone reference design with low-power, high-performance heterogeneous computing, artificial intelligence engine that delivers 15 TOPS, long-range Wi-Fi 6 and 5G (optional) connectivity, support for 7 camera concurrency, computer vision, and vault-like security.
KEY FEATURES:
- Autonomy: VIO, PX4, GPS-denied navigation and BVLOS
- Connectivity: 5G/LTE, long range Wi-Fi
- Computer Vision: TensorFlow Lite, depth from stereo, multi-object detection and tracking
5G Takes Flight with the Qualcomm Flight™ RB5 5G reference design, the world's first 5G and AI-enabled drone platform and reference design. The Qualcomm Flight RB5 5G is a comprehensive drone reference design with low-power, high-performance heterogeneous computing, artificial intelligence engine that delivers 15 TOPS, long-range Wi-Fi 6 and 5G (optional) connectivity, support for 7 camera concurrency, computer vision, and vault-like security.
KEY FEATURES:
- Autonomy: VIO, PX4, GPS-denied navigation and BVLOS
- Connectivity: 5G/LTE, long range Wi-Fi
- Computer Vision: TensorFlow Lite, depth from stereo, multi-object detection and tracking
SE250B4
The SE250B4 series is Telit Cinterion’s second generation of smart modules with Android that supports LTE Cat 4, Wi-Fi and Bluetooth® connectivity, and an embedded GNSS receiver in one package.Powered by the Qualcomm® QCM2290 processor with built-in Qualcomm® Adreno™ 702 GPU, the SE250B4 module is ideal forindustrial and consumer applications requiring highdata rates, multimedia functions and edge computing capabilities.
KEY FEATURES:
- Android and Linux for easy application development
- Enhanced mobile rendering APIs for image and video applications via Adreno 702 GPU
The SE250B4 series is Telit Cinterion’s second generation of smart modules with Android that supports LTE Cat 4, Wi-Fi and Bluetooth® connectivity, and an embedded GNSS receiver in one package.Powered by the Qualcomm® QCM2290 processor with built-in Qualcomm® Adreno™ 702 GPU, the SE250B4 module is ideal forindustrial and consumer applications requiring highdata rates, multimedia functions and edge computing capabilities.
KEY FEATURES:
- Android and Linux for easy application development
- Enhanced mobile rendering APIs for image and video applications via Adreno 702 GPU
