--- title: "QCS2290" url: "https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290" description: "QCS2290 is a Bluetooth 5 and Wi-Fi 5 combination chipset for entry-level IoT applications that need efficient performance and improved graphics abilities." --- # QCS2290 Qualcomm Dragonwing™ Buy Now Save to Workspace On this page [Introduction](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290/#overview) [Benefits](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290/#benefits) [Block Diagram](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290/#blockdiagram) [Product Longevity Program](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290/#productLongevityProgram) [Features / Specs](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290/#specs) [Product Comparison](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290/#comparison) Buy Now The application processor that delivers flexible connectivity, enhanced GPS and advanced camera features. The Qualcomm Dragonwing™ QCS2290 is robust entry-level offering, enabling reliable performance and power-conservation with upgraded features and memory support for low power consumption in its tier. Equipped with the Cortex A53 CPU architecture, the entry-level application processor is a cost-effective solution, delivering greater performance, higher graphics capabilities, better quality images, and improved power performance.* This application processor is well-suited for retail point-of-sale (POS), industrial handheld, tracking and camera applications. *Compared to previous generations Qualcomm Dragonwing QCS2290 is a product of Qualcomm Technologies, Inc. and/or its subsidiaries. [Product license agreement](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290) **Featured Documents** [Qualcomm Dragonwing QCS2290/QCM2290 Processors Product Brief](https://docs.qualcomm.com/doc/87-28731-1/87-28731-1_REV_E_Qualcomm_Dragonwing_QCS2290_QCM2290_Processors_Product_Brief.pdf) ## Benefits #### Powerful CPU and GPU in its tier Reliable performance and power-conservation; 11nm process node offers improved power performance.* #### Flexible connectivity solutions From Bluetooth to Wi-Fi, the QCS2290 supports a range of connectivity options. #### Accelerate time to commercialization The QCS2290 baseband chipset is pin-to-pin compatible with Qualcomm Dragonwing™ QCS4290 which helps customers leverage software development across various IoT devices to reduce cost and time to commercialization. ### QCS2290 Block Diagram ![](https://www.qualcomm.com/content/dam/qcomm-martech/dm-assets/images/pdp/block_diagram/image/qcm2290-block-diagram-v2.svg) **Product Longevity Program** **Product Longevity Program** This product is a part of the Product Longevity Program for Qualcomm IoT Portfolio. These products are developed and engineered with product longevity and durability in mind, helping to bring stability to our customer product designs. [Learn more about the program](https://www.qualcomm.com/products/product-longevity-program) ![test](https://s7d1.scene7.com/is/image/dmqualcommprod/product-longevity-program-icon-180x180?$QC_Responsive$&fmt=png-alpha) ## Features - Customized 64-bit Arm Cortex quad-core applications processor at up to 2.0 GHz - Dedicated DSP shared between sensor core and low-power audio subsystem - Qualcomm® Adreno™ GPU 702 @ 845 MHz, 3D graphics accelerator with 64-bit addressing - Dual-channel non-PoP high-speed memory LPDDR4x SDRAM designed for 1804 MHz clock (2 × 16 bit) LPDDR3 SDRAM designed for 933 MHz clock (1 × 32 bit) - Qualcomm® Universal Bandwidth Compression (UBWC) with GPU - Display support: HD+, 720 × 1680 at 60 Hz, 10 bit end-to-end, and up to four hardware layer composition. Features Qualcomm® Low-Power Picture Enhancement and Qualcomm® True Palette Display - One 4-lane DSI D-PHY 1.2 at 1.5 Gbps per lane, split link supported - 2x ISP (13 MP + 13 MP or 25 MP) at 30 fps ZSL - Two 4-lane CSIs (4/4 or 4/2/1) D-PHY 1.2 at 2.5 Gbps per lane or C-PHY 1.0 at 10 Gbps (3.42 Gbps/trio) - Support for USB 3.1 Type-C/Micro USB - Always-on subsystem with RPM for power management - Long term support with extended life hardware and software support through 2034 **Specifications** **Qualcomm® Artificial Intelligence (AI) Engine** | | | |---|---| | GPU Name | Qualcomm® Adreno™ | | CPU Name | Qualcomm® Kryo™ | **CPU** | | | |---|---| | Name | Qualcomm® Kryo™ | | Architecture | 64-bit | | Clock Speed | Up to 2.0 GHz | **GPU** | | | |---|---| | Name | Qualcomm® Adreno™ 702 | | Clock Speed | 845 MHz | | APIs | OpenGL® ES 3.1 | **Memory** | | | |---|---| | Bit Width | 16-bit¹, 32-bit² | | Number of Channels | 1², 2¹ | | Speed | 1804 MHz¹, 933 MHz² | | Type | LPDDR4x¹, LPDDR3² | **Audio** | | | |---|---| | Qualcomm Aqstic™ technology support | Qualcomm Aqstic™ smart speaker amplifier | | Qualcomm® aptX™ audio technology support | Qualcomm® aptX™ Voice | | Qualcomm® cVc™ Echo Cancelling and Noise Suppression (ECNS) technology support | Qualcomm® cVc™ Echo Cancelling and Noise Suppression | | Audio Capturing Technologies | Qualcomm® Voice Suite | 1. LPDDR4x @ 1804 MHz; 2 x 16 bit 2. LPDDR3 @ 933 MHz; 1 x 32 bit 3. Subject to change without notice. Refer to the Product Longevity Program page for the latest information. Show more ## Compare related products. Note: to leverage the best experience for the product comparison table, please use the desktop to view content. Show All Filters Customize Columns 4 of 4 total products ### Qualcomm® Dragonwing™ Q2 Series | Product | Buy Online | CPU Name | Number of Cores | Clock Speed | GPU Name | Clock Speed | Memory Speed | Type | DSP Name | Display Number of Concurrent Displays | Interface Type | Interfaces Supported Interfaces | Software Options Operating System | Wi-Fi Generation | Standards | MIMO Configuration | Bluetooth Specification Version | Process Node and Technology Process Node | Longevity Program Longevity Period | |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| | [QCS2290](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290) — Active | Buy Now | Qualcomm® Kryo™ | 4 | Up to 2.0 GHz | Qualcomm® Adreno™ 702 | 845 MHz | 1804 MHz¹ 933 MHz² | LPDDR4x¹ LPDDR3² | — | 1 | — | USB 3.1 | Android Linux | Wi-Fi 4 Wi-Fi 5 | 802.11a 802.11b 802.11g 802.11n 802.11ac (Show More) | 1x1 | Bluetooth® 5.0 | 11 nm | — | ### Qualcomm® Dragonwing™ Q4 Series | Product | Buy Online | CPU Name | Number of Cores | Clock Speed | GPU Name | Clock Speed | Memory Speed | Type | DSP Name | Display Number of Concurrent Displays | Interface Type | Interfaces Supported Interfaces | Software Options Operating System | Wi-Fi Generation | Standards | MIMO Configuration | Bluetooth Specification Version | Process Node and Technology Process Node | Longevity Program Longevity Period | |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| | [QCS4290](https://www.qualcomm.com/internet-of-things/products/q4-series/qcs4290) — Active | Buy Now | 8x Qualcomm® Kryo™ 260 | 8 | Up to 2 GHz | Qualcomm® Adreno™ 610 | — | 933 MHz 1866 MHz | LPDDR5x | Qualcomm® Hexagon™ Vector Processor | 1 | — | USB-C | Linux Android | Wi-Fi 5 Wi-Fi 4 Wi-Fi 6 (ready) (Show More) | 802.11a 802.11b 802.11ac 802.11ax (ready) 802.11n 802.11g (Show More) | 8x8 (ready) 1x1 | Bluetooth® 5.1 | 11 nm | — | ### Qualcomm® Dragonwing™ Q6 Series | Product | Buy Online | CPU Name | Number of Cores | Clock Speed | GPU Name | Clock Speed | Memory Speed | Type | DSP Name | Display Number of Concurrent Displays | Interface Type | Interfaces Supported Interfaces | Software Options Operating System | Wi-Fi Generation | Standards | MIMO Configuration | Bluetooth Specification Version | Process Node and Technology Process Node | Longevity Program Longevity Period | |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| | [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) — Active | Buy Now | Qualcomm® Kryo™ 670 | 8 | Up to 2.7 GHz | Qualcomm® Adreno™ 643 | Up to 812 MHz | 3200 MHz | LPDDR5 | Qualcomm® Hexagon™ | 2 | 1x DisplayPort 1.4 Single-Stream Transport (SST) 1x 4-lane Display Serial Interface (DSI) 2x PCIe (Show More) | 169x GPIO 21x QUP | Ubuntu Windows Android Linux (Show More) | Wi-Fi 6E | 802.11b 802.11ac 802.11g 802.11n 802.11ax (Show More) | 2x2 | Bluetooth® 5.2 | 6 nm | 15 year(s) | ### Qualcomm® Dragonwing™ Q8 Series | Product | Buy Online | CPU Name | Number of Cores | Clock Speed | GPU Name | Clock Speed | Memory Speed | Type | DSP Name | Display Number of Concurrent Displays | Interface Type | Interfaces Supported Interfaces | Software Options Operating System | Wi-Fi Generation | Standards | MIMO Configuration | Bluetooth Specification Version | Process Node and Technology Process Node | Longevity Program Longevity Period | |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| | [QCS8250](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8250) — Active | Buy Now | Qualcomm® Kryo™ 585 | 8 | Up to 2.85 GHz | Qualcomm® Adreno™ 650 | — | 2750 MHz | LPDDR5 | Qualcomm® Hexagon™ V66Q | 3 | 2x 4-lane Display Serial Interface (DSI) DisplayPort (Show More) | — | Android | Wi-Fi 4 Wi-Fi 6 | 802.11ax 802.11be | 2x2 8x8 | Bluetooth® 5.1 Bluetooth® 5.3 | 4 nm 7 nm | 15 year(s) | 1. LPDDR4x @ 1804 MHz; 2 x 16 bit 2. LPDDR3 @ 933 MHz; 1 x 32 bit