The Dragonwing Q8 series delivers superior and intelligent edge performance with immersive multimedia, on-device AI, and superior security features—ideal for next-gen smart devices across consumer, industrial, and collaboration environments.
Target Applications
Featured specs
PREMIUM EDGE AI
Best for next-gen smart devices needing immersive multimedia, powerful on-device AI, and enterprise-grade security features at the edge.
Data point
LABEL
Data point
LABEL
Data point
LABEL
Data point
LABEL
Data point
LABEL
Data point
LABEL
Compare Dragonwing Q8 products
Note: to leverage the best experience for the product comparison table, please use the desktop to view content.
5 of 0 total products
Product | CPU Name | Number of Cores | Clock Speed | GPU Name | Clock Speed | Memory Speed | Type | DSP Name | Display Number of Concurrent Displays | Interface Type | Interfaces Supported Interfaces | Software Options Operating System | Cellular Modem-RF Modem Name | Wi-Fi Generation | Standards | MIMO Configuration | Bluetooth Specification Version | Process Node and Technology Process Node | Longevity Program Longevity Period |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Qualcomm® Dragonwing™ Q8 Series | |||||||||||||||||||
QCS8550 Active | Qualcomm® Kryo™ | 8 | Up to 3.2 GHz | Qualcomm® Adreno™ | 680 GHz | 4200 MHz | LPDDR5x | — | 4 | 2x Display Serial Interface (DSI) | — | Android | — | Wi-Fi 7 | 802.11be | 2x2 | Bluetooth® 5.3 | 4 nm | 10 year(s) |
Q-8750 Active | Qualcomm® Oryon™ | 8 | 4.32 GHz | Qualcomm® Adreno™ | 1.1 GHz | 4800 MHz | LPDDR5x | Qualcomm® Hexagon™ | — | 2x Mobile Industry Processor Interface (MIPI)2 | 215x GPIO | Version 15+ Android | — | Supported with companion chips - Wi-Fi 7 | — | — | Supported with companion chips - Bluetooth® 6.0 | — | — |
QCM8550 Active | Qualcomm® Kryo™ | 8 | Up to 3.2 GHz | Qualcomm® Adreno™ | 680 MHz | 4200 MHz | LPDDR5x | — | 4 | 2x Display Serial Interface (DSI) | — | Android | Snapdragon™ X70 5G Modem-RF System | Wi-Fi 7 | 802.11be | 2x2 | Bluetooth® 5.3 | 4 nm | 10 year(s) |
QCS8250 Active | Qualcomm® Kryo™ 585 | 8 | Up to 2.85 GHz | Qualcomm® Adreno™ 650 | — | 2750 MHz | LPDDR54 | Qualcomm® Hexagon™ V66Q | 3 | 2x 4-lane Display Serial Interface (DSI) | — | Android | — | Wi-Fi 4 | 802.11ax | 2x2 | Bluetooth® 5.1 | 4 nm | 15 year(s) |
SDA845 Active | 8x Qualcomm® Kryo™ 385 | — | Up to 2.8 GHz | Qualcomm® Adreno™ 630 | — | 1866 MHz | LPDDR4x | Qualcomm® Hexagon™ 685 | — | — | — | — | — | Wi-Fi 5 | 802.11ac | — | Bluetooth® 5.0 | — | — |
- USB-C with DisplayPort
- Up to 8K @ 60fps
- For ASC
- Quad-channel PoP high speed LPDDR5/LPDDR4x SDRAM
Performance that learns
Smarter Edge AI
On-device AI ranging up to 77 TOPS delivers real-time personalization, voice recognition, and gesture control—no cloud dependency, improved responsiveness, and superior user experiences.
Immersive Visuals Everywhere
The Dragonwing Q8 series supports dual 4K displays, 4K120 decoding, and AV1/H.265 playback—ideal for fluid, cinematic visuals in TVs, conferencing, and dash cams
Secure By Design
The Dragonwing Q8 series integrates Secure Boot, Qualcomm® Trusted Execution Environment (TEE), and FIPS-compliant modules to protect user data, AI models, and device integrity across consumer and enterprise deployments.
Always Connected Performance
The Dragonwing Q8 series features multiple premium connectivity choices such as Wi-Fi 7, Bluetooth 5.3, and 5G—enabling ultra-fast, low-latency connectivity for real-time collaboration and streaming.
Product Longevity Program
Qualcomm Technologies designs SoCs with longevity and durability to support applications requiring extended life cycles, helping ensure stability in customer product designs.
* Subject to change without notice
How companies are harnessing the power of Dragonwing Q
Similar series
HIGH-PERFORMANCE COMPUTE
Dragonwing Q6
Built for advanced IoT applications that need high-performance, low power compute and robust edge AI capabilities.
SCALABLE AI IOT
Dragonwing Q5
Low-power SoC offering modular performance packs with AI, camera, and compute for flexible, evolving industrial IoT deployments.
SMART SYSTEMS
Dragonwing Q4
Optimized for industrial handhelds and smart edge devices, combining advanced AI, multimedia, and connectivity with extended support.
ESSENTIAL IOT
Dragonwing Q2
Entry-level processor delivering superior compute, integrated connectivity, and cost-effective efficiency for industrial and enterprise devices.
Support
Resources and support to help you get started.
The Qualcomm Dragonwing™ RB3 Gen 2 Development Kit
Develop advanced AI edge computing for diverse IoT applications.
