The Qualcomm® SDA845 SoC combines high-performance heterogeneous computing, Qualcomm® Artificial Intelligence (AI) Engine for on-device machine learning, computer vision, hardware-based security, multimedia, and Wi-Fi.
A System-on-Chip (SoC) designed using next generation mobile technology with tech savvy consumers in mind.
SDA845 utilizes heterogenous compute capabilities to enable immersive multimedia experiences including eXtended reality (XR), on-device artificial intelligence (AI) and lightning-fast connectivity. The SDA845 also introduces a hardware isolated subsystem called the secure processing unit (SPU), which is designed to add vault-like characteristics to existing layers of Qualcomm Technologies’ security features.
The 3rd generation ...
Qualcomm SDM845, Qualcomm SDA845, Qualcomm AI Engine, Qualcomm Adreno, Qualcomm Kryo, Qualcomm Universal Bandwidth Compression, Qualcomm Spectra, Qualcomm Hexagon, Qualocmm Aqstic, Qualcomm aptX, Qualcomm WCN3990, Qualcomm QCA6335, Qualcomm QCA6310 and Qualcomm Snapdragon are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
Features
- Customized 64-bit octacore Kryo 385 applications processor
- Always-on subsystem with RPMh for hardware-based resource and power management
- Qualcomm® Universal Bandwidth Compression (UBWC) 2.0, 2x compression with camera, display, and DSP
- Two 4-lane DSI D-PHY 1.2 at 2.5 Gbps per lane
- 3840 × 2400 display at 60 fps, 2560 buffer width (10 layers blending), and VESA DSC 1.1
- A complete 4K60 entertainment system 4K60 10b encode + 4K60 10b decode
- Qualcomm® Spectra™ 280 camera: dual 14-bit image signal processing (ISP) + Lite ISP: 16 + 16 + 2 megapixels (MP) to support 32 MP/30 fps
- Three 4-lane CSI with C-PHY/D-PHY and one 2-lane CSI with D-PHY to support 4 + 4 + 4 + 2
- 1x UFS 2.1, 2x USB 3.1, DisplayPort
- One 1-lane PCIe Gen 2 and one 1-lane PCIe Gen 3
- WLAN 802.11ac and Bluetooth 5.0 with the Qualcomm® WCN3990 device; WiGig (802.11ad/60 GHz) with the Qualcomm® QCA6335 + Qualcomm® QCA6310 device
- Audio DSP for low-power audio subsystem (LPASS)
- Compute DSP with Qualcomm® Hexagon™ Vector eXtensions (HVX)
- Dedicated low-power Qualcomm® Snapdragon™ sensor core with DSP to support always-on use cases
- Secure processor
Compare related products.
Note: to leverage the best experience for the product comparison table, please use the desktop to view content.
4 of 4 total products
Product | CPU Name | Number of Cores | Clock Speed | GPU Name | DSP Name | Wi-Fi Generation | Standards | MIMO Configuration | Bluetooth Specification Version | Display Number of Concurrent Displays | Interfaces Supported Interfaces | Memory Speed | Type | Longevity Program Longevity Period | Process Node and Technology Process Node |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Other | |||||||||||||||
SDA845 Active | 8x Qualcomm® Kryo™ 385 | — | Up to 2.8 GHz | Qualcomm® Adreno™ 630 | Qualcomm® Hexagon™ 685 | Wi-Fi 5 | 802.11ac | — | Bluetooth® 5.0 | — | — | 1866 MHz | LPDDR4x | — | — |
— | 4 | Up to 1.2 GHz | Qualcomm® Adreno™ 306 | Qualcomm® Hexagon™ QDSP6 V5 | Wi-Fi 4 | 802.11a | — | Bluetooth® 4.1 | — | HSIC | 533 MHz | LPDDR3 | — | — | |
8x Qualcomm® Kryo™ 260 | — | Up to 2.2 GHz | Qualcomm® Adreno™ 630 | Qualcomm® Hexagon™ | Wi-Fi 4 | 802.11ac | 2x2 | Bluetooth® 5.0 | — | USB 3.1 | 1866 MHz | LPDDR4x | 10 year(s) | 4 nm | |
Qualcomm® Kryo™1 | 4 | Up to 2.34 GHz | Qualcomm® Adreno™ 530 | Qualcomm® Hexagon™ | Wi-Fi 5 | 802.11ac | 2x2 | Bluetooth® 4.2 | Up to 32 | USB 2.0 | 1866 MHz | LPDDR4 | — | 14 nm |
- Gold Cluster = 2x high-performance Kryo cores up to 2.15GHz, Silver Cluster = 2x low power Kryo cores up to 1.593GHz
- Two panels, plus external
