The Qualcomm Dragonwing™ SDA660 System-on-Chip (SoC) supports a leap in performance, engineered to allow enhanced user experiences and battery performance.
Designed to support on-device artificial intelligence, advanced photography and enhanced user experiences with low power consumption and fast LTE speeds.
The SDA660 uses an advanced 14 nm FinFET process for lower active power dissipation and faster CPU performance. It features eight Qualcomm® Kryo™ 260 CPU 64-bit cores that are divided in two clusters – a fast cluster of four cores with up to 2.2 GHz and a power saving efficiency cluster of four cores with up to 1.8 GHz. High-end features make for a powerful and optimized unique user experiences.
Qualcomm SDM660, Qualcomm® SDA660, Qualcomm AI Engine, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Qualcomm Hexagon, Qualcomm Aqstic, Qualcomm aptX and Qualcomm Snapdragon are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
Features
- Custom built 64-bit octa-core Kryo 260 CPU arranged in two dual-clusters:
- Quad high-performance Kryo cores operating at 2.2 GHz – Gold cluster with 1 MB L2
- Quad low-power Kryo cores operating at 1.8 GHz – Silver cluster with 1 MB L2
- Qualcomm® Hexagon™ DSP with Hexagon Vector eXtensions (HVX) (dual-HVX512) 787 MHz
- Qualcomm® Adreno™ GPU 512 with 64-bit addressing; designed for 650 MHz
- Dual-channel non package-on-package (non-PoP) high-speed memory, LPDDR4/4x SDRAM designed for 1866 MHz clock
- Display support: up to 2560 × 1600 10-bit at 60 Hz, up to eight hardware layers
- Two 4-lane DSIs D-PHY 1.2 at 2.1 Gbps per lane and 1080p30 Miracast/4K30DP
- Three 4-lane CSIs (4/4/4 or 4/4/2/1) D-PHY 1.2 at 2.1 Gbps per lane or three 3-lane C-PHY 1.0 at 17 Gbps (2.5 G symbols per trio per second)
- Video support: 3840 × 2160 at 30 Hz, HEVC Main 10, VP9, H264, and other popular video formats
- Dual 14-bit image signal processing (ISP): 16 +16 MP, 540 MHz each; 24MP30 ZSL with dual ISP; 16 MP 30 ZSL with a single ISP
- Support for UFS 2.1 gear 3 (one-lane), eMMC 5.1, and SD 3.0
- Support for USB 3.1 Type-C with DisplayPort and USB2.0
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Product | CPU Name | Number of Cores | Clock Speed | GPU Name | DSP Name | Wi-Fi Generation | Standards | MIMO Configuration | Bluetooth Specification Version | Display Number of Concurrent Displays | Interfaces Supported Interfaces | Memory Speed | Type | Longevity Program Longevity Period | Process Node and Technology Process Node |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Other | |||||||||||||||
— | 4 | Up to 1.2 GHz | Qualcomm® Adreno™ 306 | Qualcomm® Hexagon™ QDSP6 V5 | Wi-Fi 4 | 802.11a | — | Bluetooth® 4.1 | — | HSIC | 533 MHz | LPDDR3 | — | — | |
8x Qualcomm® Kryo™ 260 | — | Up to 2.2 GHz | Qualcomm® Adreno™ 630 | Qualcomm® Hexagon™ | Wi-Fi 4 | 802.11ac | 2x2 | Bluetooth® 5.0 | — | USB 3.1 | 1866 MHz | LPDDR4x | 10 year(s) | 4 nm | |
Qualcomm® Kryo™1 | 4 | Up to 2.34 GHz | Qualcomm® Adreno™ 530 | Qualcomm® Hexagon™ | Wi-Fi 5 | 802.11ac | 2x2 | Bluetooth® 4.2 | Up to 32 | USB 2.0 | 1866 MHz | LPDDR4 | — | 14 nm |
- Gold Cluster = 2x high-performance Kryo cores up to 2.15GHz, Silver Cluster = 2x low power Kryo cores up to 1.593GHz
- Two panels, plus external
