The Dragonwing Q6 Series offers premium-tier SoCs built for industrial and commercial IoT, offering 5G, Wi-Fi 6E, advanced AI, and multi-camera support with low power consumption and longer support.
Target Applications
Featured specs
5G INDUSTRIAL
Built for industrial and commercial IoT, delivering 5G, Wi-Fi 6E, advanced AI, and multi-camera performance with longer support.
8-core Qualcomm® Kryo™ 670
CPU PERFORMANCE
Up to 12 TOPS
AI PROCESSING
5G and Wi-Fi 6E Support
CONNECTIVITY
Triple 14-bit ISPs + Dual Lite ISPs
CAMERA & IMAGING
Qualcomm® Adreno™ 643 GPU @ 812 MHz
GRAPHICS & MULTIMEDIA
Compare Dragonwing Q6 products
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Product | CPU Name | Number of Cores | Clock Speed | GPU Name | Clock Speed | Memory Speed | Type | DSP Name | Display Number of Concurrent Displays | Interface Type | Interfaces Supported Interfaces | Software Options Operating System | Cellular Modem-RF Modem Name | Wi-Fi Generation | Standards | MIMO Configuration | Bluetooth Specification Version | Process Node and Technology Process Node | Longevity Program Longevity Period |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Qualcomm® Dragonwing™ Q6 Series | |||||||||||||||||||
QCS6490 Active | Qualcomm® Kryo™ 670 | 8 | Up to 2.7 GHz | Qualcomm® Adreno™ 643 | Up to 812 MHz | 3200 MHz | LPDDR5 | Qualcomm® Hexagon™ | 2 | 1x DisplayPort 1.4 Single-Stream Transport (SST) | 169x GPIO | Ubuntu | — | Wi-Fi 6E | 802.11b | 2x2 | Bluetooth® 5.2 | 6 nm | 15 year(s) |
Q-6690 Active | Qualcomm® Kryo™ | 8 | Up to 2.9 GHz | Qualcomm® Adreno™ | 1.15 GHz | 3200 MHz | LPDDR5 | Qualcomm® Hexagon™ | 2 | DisplayPort2 | 167x GPIO | Android | — | — | — | — | — | — | — |
QCM6490 Active | Qualcomm® Kryo™ 670 | 8 | Up to 2.4 GHz | Qualcomm® Adreno™ 643L | Up to 812 GHz | 4200 MHz | LPDDR5x | Qualcomm® Hexagon™ | 2 | USB-C with DisplayPort | 2x PCIe | Android | — | Wi-Fi 6E | 802.11ac | 2x2 | Bluetooth® 5.2 | 6 nm | — |
QCS610 Active | Qualcomm® Kryo™ 460 | 8 | Up to 2.2 GHz | Qualcomm® Adreno™ 612 | — | 1804 MHz | LPDDR4x | Qualcomm® Hexagon™ 685 | 2 | — | USB 2.0 | Linux | — | Wi-Fi 5 | 802.11n | 1x1 | Bluetooth® 5.0 | 11 nm | 10 year(s) |
QCS6125 Active | Qualcomm® Kryo™ | 8 | Up to 2 GHz | Qualcomm® Adreno™ | — | 933 MHz3 | LPDDR4x4 | Qualcomm® Hexagon™ | — | USB-C with DisplayPort | PCIe 3.0 | Linux | Qualcomm® Snapdragon™ X12 LTE modem | Wi-Fi 5 | 802.11a | 1x1 | Bluetooth® 5.0 | 11 nm | — |
- Supports UART/SPI/I2C/I3C
- With Multi Stream Transport (MST)
- 1x32, LPDDR3, 933 MHz
- 2x16, LPDDR4x, 1804 MHz
AI for everyday edge
Scalable Performance via Software
Customize or upgrade features over time with software-defined SKUs, enabling flexibility to meet evolving product requirements without hardware changes.
Premium Connectivity
Supports 5G, Wi-Fi 6, and Wi-Fi 6E with multi-gigabit speeds, low latency, and enterprise-grade reliability for superior, high-speed data transmission.
AI-Powered Camera Capabilities
Edge AI enables low-power, real-time processing for multiple camera streams, supporting up to 12 TOPS for advanced vision-based applications.
Long Lifecycle and Broad OS Support
Designed for longevity with support for Android, Ubuntu, Windows 11 IoT, and Yocto Linux.
Product Longevity Program
Qualcomm Technologies designs SoCs with longevity and durability to support applications requiring extended life cycles, helping ensure stability in customer product designs.
* Subject to change without notice
How companies are harnessing the power of Dragonwing Q
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Support
Resources and support to help you get started.
The Qualcomm Dragonwing™ RB3 Gen 2 Development Kit
Develop advanced AI edge computing for diverse IoT applications.
