Intelligent In-store Retail

Overview

To deliver a unified shopping experience, retailers must connect fragmented in-store touchpoints, personalize shopper engagement in real time, and prove the business impact of retail media. The In-store Intelligent Retail application outlines a store architecture powered by Qualcomm Dragonwing™ processors running agentic edge AI that aims to bring together multimodal AI, multi-device coordination, location intelligence, and coordinated software agents to turn disconnected devices into a unified intelligence layer. By running AI locally at the edge, the solution can understand shopper intent, coordinate actions across phones, signage, shelves, associate devices, and sensors, and create a closed-loop view from engagement to purchase.

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Benefits

This application is designed to:

Measure true in-store ROI by linking ad exposure, shopper interactions, navigation, product engagement, cart activity, and purchase into a closed-loop attribution model.

Accelerate decision-making and shopper engagement with real-time, context-aware insights powered by multimodal inputs (vision, speech, device events, and precise location).

Drive immediate, personalized in-store experiences with low-latency edge AI that helps reduce cloud dependency and enables real-time response.

Deliver a seamless omni-channel in-store experience by unifying mobile, voice, XR, signage, ESL, and associate workflows on a single edge AI platform.

Increase retail media revenue and ROAS by directly connecting shopper engagement to transactions and campaign performance.

Enable privacy-first shopper engagement at scale by processing data locally to support both anonymous and known experiences while minimizing data exposure.

Use Cases

Retail media attribution

Connect ad exposure, shopper engagement, product interaction, and purchase to measure true in-store campaign effectiveness.

AI-powered customer assistant

Support product discovery, conversational guidance, and location-aware navigation inside the store.

Associate co-pilot

Equip store associates with real-time intent signals, product comparisons, and upsell recommendations.

Smart upsell and basket integrity

Drive complementary purchases while validating cart and basket accuracy using sensors and analytics.

Store intelligence and operations

Generate footfall insights, engagement analytics, and optimization recommendations for store performance.

Block Diagram

AI Processor
Connectivity Chipsets
XR Chipsets
IQ9
IQ-9075
IQ8
IQ-8275
Q8
QCS8550
Q6
QCS6490
IQ-X
IQ-X7181
IQ-X
IQ-X5121
100 UltraCloud AI
Cloud AI 100 Ultra
Q2
Q-2390

Partner Hardware

Zebra PS20 Personal Shoppers

Guided engagement and assistance for customers and associates.

Elo Backpack 4

Enterprise Android in a box.

Zebra TC501 Mobile Computer

RFID handheld for inventory and assisted selling.

Vusion EdgeSense

Shelf rail integrating communication, indoor location, and Bluetooth connectivity.

Software Stack

Multimodal AI layer: ASR for speech input, LLM orchestration for reasoning, TTS for voice responses, computer vision for interaction detection, and location intelligence for contextual awareness

Agent framework: Customer Assistant Agent, Associate Agent, Attribution Agent, and Analytics Agent operating with shared context and coordinated decision-making

Event and memory layer: Event graph, journey timeline, and correlation engine to link interactions, movement, engagement, and transactions

Integration layer: APIs and connectors for signage, ESL, POS, retail media platforms, CRM/CDP systems, and store devices

Edge runtime environment: On-device execution environment designed for real-time responsiveness, reliability, and privacy-conscious deployment

Location service: Qualcomm® Terrestrial Positioning Services is offered as a cloud-based platform that delivers accurate positioning even in challenging signal environments

Video intelligence: Qualcomm® Insight Platform designed as an edge-first, AI-powered video intelligence solution that unifies video analytics, security, and operational insights

This stack helps enable coordinated multi-agent retail experiences by combining multimodal perception, contextual reasoning, real-time orchestration, and enterprise integration on a single edge platform.

Ready to get started

FEATURED
IQ-9075 Evaluation Kit
The Dragonwing IQ-9075 EVK is a comprehensive evaluation platform to test the industrial-grade performance of the Dragonwing IQ-9075 processor for IoT solutions. The Dragonwing IQ-9075 EVK showcases the most common features of the Dragonwing IQ-9075 processor, which is optimized for industrial IoT and robotics applications involving heavy workloads in the most demanding environments like autonomous mobile robots (AMRs) and industrial machinery. The Dragonwing IQ-9075 EVK consists of a mainboard, supporting key interfaces, and optional expansion mezzanine boards to support additional features. It enables developers, OEMs, and ODMs to design and test their solutions powered by the industrial-grade Dragonwing IQ9075 processor integrated with standard interfaces and connectors, mezzanine expandability, and wireless connectivity. Test and prototype software development and hardware designs with less effort and cost to get your product to market faster.
By:Qualcomm
FEATURED
IQ-8275 Evaluation Kit
The Dragonwing IQ-8275 EVK showcases the key capabilities of the Dragonwing IQ-8275 processor, purpose-built for robotics, edge AI boxes, gateways, AMRs, industrial automation, and many more applications that require multi-thread computing, independent AI, and graphics processing while minimizing cost and power requirements. Engineered for edge AI operations, it is designed to enable robust computing, high-speed connectivity, and long lifecycle support for mission-critical deployments.
By:Qualcomm
Chipset:
FEATURED
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit)
The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.

KEY FEATURES:

  • Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
By:Qualcomm
Chipset:
Type: Development Board / Kit

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