---
title: "QCM4490"
url: "https://www.qualcomm.com/internet-of-things/products/q4-series/qcm4490"
description: "Premium connectivity meets next-gen processing with the Qualcomm Dragonwing™ QCM4490."
---

# QCM4490

**Qualcomm Dragonwing™**

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- [Introduction](https://www.qualcomm.com/internet-of-things/products/q4-series/qcm4490/#overview)
- [Benefits](https://www.qualcomm.com/internet-of-things/products/q4-series/qcm4490/#benefits)
- [Block Diagram](https://www.qualcomm.com/internet-of-things/products/q4-series/qcm4490/#blockdiagram)
- [Product Longevity Program](https://www.qualcomm.com/internet-of-things/products/q4-series/qcm4490/#productlongevityprogram)
- [Features/Specs](https://www.qualcomm.com/internet-of-things/products/q4-series/qcm4490/#specs)

Premium connectivity meets next-gen processing with the Qualcomm Dragonwing™ QCM4490.

The Qualcomm Dragonwing™ QCM4490 system on chip (SoC) delivers key, advanced features now required by industrial handheld, industrial computing, and other IoT devices. It comes loaded with 5G NR connectivity, Wi-Fi 6E for multi-gigabit speeds, extended range, and low latency, and powerful, efficient processing to handle complex computing tasks. With planned support for Android releases through version 18, you can use this SoC for industrial designs through 2030, helping save costs and development time. We’ve designed a mid-tier s...

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[Product license agreement](https://www.qualcomm.com/internet-of-things/products/q4-series/qcm4490/#)

**Featured Documents**

[Qualcomm Dragonwing QCS4490/QCM4490 Processors Product Brief](https://docs.qualcomm.com/doc/87-43685-1/87-43685-1_REV_D_Qualcomm_Dragonwing_QCS4490_QCM4490_Processors_Product_Brief.pdf)

## Benefits

![default icon alt text](https://s7d1.scene7.com/is/image/dmqualcommprod/icn-check-circle-3)

#### Premium Connectivity at the Mid Tier

Enjoy multi-gigabit speeds, extended range, massive capacity, and ultra-low latency through Wi-Fi 6E.

![default icon alt text](https://s7d1.scene7.com/is/image/dmqualcommprod/icn-check-circle-3)

#### Next-Gen System Performance

Build in powerful, efficient processing for advanced IoT device computing tasks.

![default icon alt text](https://s7d1.scene7.com/is/image/dmqualcommprod/icn-check-circle-3)

#### Longevity & Cost Savings

Save costs and development time with long lifecycle support.

### QCM4490 Block Diagram

![IMAGE_URL](https://www.qualcomm.com/content/dam/qcomm-martech/dm-assets/images/pdp/block_diagram/image/Dragonwing-QCM4490-diagram-V02.svg)

## Product Longevity Program

**Product Longevity Program**

This product is a part of the Product Longevity Program for Qualcomm IoT Portfolio. These products are developed and engineered with product longevity and durability in mind, helping to bring stability to our customer product designs.

[Learn more about the program](https://www.qualcomm.com/products/product-longevity-program)

![test](https://s7d1.scene7.com/is/image/dmqualcommprod/product-longevity-program-icon-180x180?$QC_Responsive$&fmt=png-alpha)

## Features

- Wi-Fi 6E that uses the 6GHz spectrum to extend advanced Wi-Fi 6 MU-MIMO and OFDMA into the new band and deliver reliable performance, even in congested areas
- Delivers speeds of up to 3.6 Gbps, supported by Qualcomm® 4K Quadrature Amplitude Modulation (QAM), 160MHz channel support and unique 4-stream (2x2 + 2x2) Dual Band Simultaneous (DBS)
- 4th generation 5G NR Sub 6 modem with 3GPP Rel. 16 capable and true global carrier support
- Voice over NR (VoNR), 5G location (E-CID)
- Multi-gen leap to Qualcomm® Kryo™ Octa-core CPU (up to 2x over previous generation in performance benchmarks)
- On-device processing allows for efficient data analysis between device and cloud (intelligent edge computing)
- Planned SW support for Android releases 13 through 18 allows you to design products up to 2030*
- Save costs by investing in just one IoT chipset for multi-year industrial design, development, and maintenance support from Qualcomm Technologies and ODMs
- Significant reductions in latency and increased responsiveness for latency sensitive applications (voice, video)
- Smooth handoffs and superior connectivity, even in large, complex environments with multiple, high-demand devices such as hospitals and warehouses
- Audio AI accelerator enhances voice quality and voice UI accuracy
- Enhanced camera ISP hardware to support superior image quality

*\* Subject to change without notice.*

### Specifications

| Category | Field | Value |
|---|---|---|
| Qualcomm® Artificial Intelligence (AI) Engine | GPU Name | Qualcomm® Adreno™ |
| Qualcomm® Artificial Intelligence (AI) Engine | CPU Name | Qualcomm® Kryo™ |
| Qualcomm® Artificial Intelligence (AI) Engine | Qualcomm® Hexagon™ Processor Features | Fused AI Accelerator architecture |
| Qualcomm® Artificial Intelligence (AI) Engine | Qualcomm® Sensing Hub Features | Dual-core AI processor |
| CPU | Name | Qualcomm® Kryo™ CPU, Qualcomm® Kryo™ Octa-core CPU |
| CPU | Architecture | 64-bit |
| CPU | Clock Speed | Up to 2.4 GHz |
| GPU | Name | Qualcomm® Adreno™ 613 |
| GPU | Clock Speed | 1.01 GHz |
| GPU | APIs | OpenGL® ES 3.2 |
| Memory | Speed | 3.2 GHz, 2.1 GHz |
| Memory | Type | LPDDR5[1], LPDDR4x[1] |
| DSP | Features | CPU/GPU for AI |

1. SDRAM 2x16
2. Up to 1080p60D video decoding. Up to 1080p60E video encoding
3. Up to 1080p60D video decoding
4. ZSL, 30 fps
5. ZSL
6. Type-C
7. Gen3 1-lane
8. 2G/3G/4G/5G
9. WCN6750
10. WCN6856

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