Qualcomm Dragonwing™
Q-6690
Q6

Presenting the world’s first enterprise mobile processor with fully integrated UHF (RAIN) RFID capabilities. Designed to be a future-ready processor for enterprise and industrial devices—offered in both standalone and modem-integrated variants—enabling compact mobility, advanced connectivity, and software-configurable features without hardware redesign.

The Dragonwing™ Q-6690 processor features Wi-Fi 7, Bluetooth 6.0, 5G + Dual SIM Dual Active (DSDA) that allows two active 5G connections simultaneously, and Ultra Wide Band (UWB) support, ensuring future-ready connectivity.

The Q-6690 processor supports four software-configurable feature packs that allow scaling of compute, AI performance, multimedia, and camera capabilities across product lines without hardware redesigns.

With 8 years of Android software upgrades support and hardware long lifecycle support, the Q-6690 processor minimizes risk, accelerates development, and streamlines product roadmaps—ensuring edge devices stay secure, scalable, and future-ready. with long lifecycle support.

Benefits

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Fully integrated UHF (RAIN) RFID Reader Functionality
The Q-6690 processor features fully integrated UHF RFID reader functionality. This reduces device footprint and helps OEMs lower their bill of materials (BOM) costs. It also expands industry use cases by enabling broader availability and accelerating time to market.
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Premium Connectivity
Designed for next-gen connectivity, the device supports 5G + 5G DSDA enabling a 5G device to maintain two active 5G connections simultaneously—one on each SIM, all at optimized power consumption. It also features Wi-Fi 7 for faster, more reliable wireless performance, and the latest Bluetooth 6.0 for enhanced data transfer speeds and reduced latency.
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Enhanced Performance, On-device AI
Equipped with a cutting-edge a Qualcomm® Kryo™ 7-Series CPU with a maximum clock speed of 2.9 GHz, featuring an octa-core architecture, this device delivers the high performance required for premium enterprise and industrial applications. Built on a 4 nm process node, it balances power efficiency and performance—ideal for on-device AI workloads and resource-intensive tasks.
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Future-Proof, Scalable Performance
The Q-6690 processor offers four preset software feature packs, upgradable over-the-air so you can design and develop products for now or later meeting your customers’ needs. The feature packs come with premium connectivity and commercial-grade security included in all the packs, multiple options for CPU, GPU, and AI performance, enhanced multi-camera capability, and expanded peripherals support.

Use Cases

Retail

  • Electronic cash register
  • POS terminals
  • Self-checkout kiosks
  • Tablets, etc

Transportation & Logistics

  • Industrial handhelds
  • Tablets, etc.

Home & Life Appliances

  • Smart displays

Healthcare

  • Patient monitoring devices
  • Tablets, etc.

Features

  • The Q-6690 introduces unique Software Feature Packs, allowing users to easily adjust performance levels with a simple software license, providing greater flexibility and customization.
  • The Q-6690 with modem variant features a DE3.x R16 Modem-RF. The Q-6690 processor also supports Wi-Fi 7 solutions and Integrated UWB for further cost effectiveness while supporting enhanced data transfer speeds and lower latency applications.
  • Built on a 4 nm node technology, the Q-6690 delivers superior compute performance while consuming less power, making it more efficient and powerful than its predecessor.
  • On-chip edge AI capabilities enable faster and more efficient processing of AI tasks directly on the device, reducing latency and improving overall performance.
  • Advanced camera features provide higher image quality and more sophisticated imaging capabilities, enhancing user experience in photography and video applications.
  • The 5G + 5G DSDA technology ensures better power management, extended battery life, and improved device efficiency.
  • Enhanced nearby location and proximity technologies improve the accuracy and reliability of location-based services and device interactions.
Specifications
CPU
Name
Qualcomm® Kryo™
Clock Speed
Up to 2.9 GHz
NPU
Name
Qualcomm® Hexagon™
Tera Operations Per Second
6 TOPS
GPU
Name
Qualcomm® Adreno™
Clock Speed
1.15 GHz
Memory
Density
3 GB
Bit Width
16-bit
Number of Channels
2
Speed
3200 MHz
Type
LPDDR5
DSP
Name
Qualcomm® Hexagon™
  1. With Multi Stream Transport (MST)
  2. 30 fps ZSL
  3. Supports UART/SPI/I2C/I3C
Specifications
CPU
8-core Qualcomm® Kryo™ @ Up to 2.9 GHz
NPU
Qualcomm® Hexagon™
6 TOPS
GPU
Qualcomm® Adreno™ @ 1.15 GHz
Memory
2x16-bitLPDDR5 @ 3200 MHz
3 GB
DSP
Qualcomm® Hexagon™
  1. With Multi Stream Transport (MST)
  2. 30 fps ZSL
  3. Supports UART/SPI/I2C/I3C

Companion Chip

RF/Connectivity

SDR435, SDR735/SDR735G, WCN7881/WCN7861, WCN6775, WCN6450; SMR546 and QTM545 (core chipsets) chips

PMIC

PM7550, PM8550VS, PMR735B, PMK7635, PMG1110, PM3001A, PM8010, PMR735A

PMI/Charging

PMIV010x, SMB1355

Audio/NFC

WCD9378, WCD9395, WSA883x, SN220T, ST54L

Meet the Qualcomm Dragonwing Q-6690 Processor

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Meet the Qualcomm Dragonwing Q-6690 Processor

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Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Our leading-edge AI, high performance, low-power computing, and unrivaled connectivity deliver proven solutions that transform major industries. At Qualcomm, we are engineering human progress.

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