--- title: "Qualcomm Dragonwing™ QCM5430" url: "https://www.qualcomm.com/internet-of-things/products/q5-series/qcm5430" description: "The Qualcomm Dragonwing™ QCM5430 is optimized for premium connectivity, high-level performance, and edge AI-powered camera capabilities with the option to upgrade features over-the-air via software now or later, according to your product needs. " canonicalUrl: "https://www.qualcomm.com/internet-of-things/products/q5-series/qcm5430" --- # Qualcomm Dragonwing™ QCM5430 Active Contact Sales Save to Workspace ## The Qualcomm Dragonwing™ QCM5430Processor is a scalable 5G-enabled mid-tier platform for IOT. The QCM5430 is optimized for premium connectivity, high-level performance, and edge AI-powered camera capabilities with the option to upgrade features over-the-air via software now or later, according to your product needs. The scalable performance of these Systems-on-a-Chip (SOC)s are designed to deliver superior features and performance across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications. This includes support for 5G and Wi-Fi 6E for ubiquitous cove... Read More [Product license agreement](https://www.qualcomm.com/product license agreement) **Featured Documents** [Qualcomm QCS5430/QCM5430 Processors Product Brief](https://docs.qualcomm.com/doc/87-43681-1/87-43681-1_REV_C_Qualcomm_QCS5430_QCM5430_Processors_Product_Brief.pdf) ## Benefits ![default icon alt text](https://s7d1.scene7.com/is/image/dmqualcommprod/icn-check-circle-3) ### New Scalable Performance via Software-Defined SKU Customize performance or upgrade features via software now or later according to your IoT product needs. Select between pre-defined feature packs or work with our team on designing a Custom Feature Pack. ![default icon alt text](https://s7d1.scene7.com/is/image/dmqualcommprod/icn-check-circle-3) ### Premium connectivity at mid-tier Enjoy premium connectivity with this mid-tier processor for multi-gigabit speeds, massive capacity and ultra-low latency, Enterprise grade Wi-Fi 6 and Wi-Fi 6E (6 GHz) featuring Qualcomm® 4K QAM, 160MHz bandwidth, bi-directional Multi-User MIMO and advanced Dual Band Simultaneous functionality. Transforms connectivity experiences with multi-gigabit support. ![default icon alt text](https://s7d1.scene7.com/is/image/dmqualcommprod/icn-check-circle-3) ### AI-powered camera features Connect, upload, and process streams from multiple connected cameras using low power with advanced edge AI processing. The Qualcomm® AI Engine features a fused, scalable AI-accelerator architecture and brings the total performance up to 13 TOPS via software defined SKUs. On-device machine learning enables Edge computing use cases growing at an exponential scale. ![default icon alt text](https://s7d1.scene7.com/is/image/dmqualcommprod/icn-check-circle-3) ### Expanded interfaces and peripherals Many features supported to enable industrial and commercial IoT devices like: USB 3.1 Type-C with DisplayPort, USB2.0, 2xPCIe and discrete memory beyond LP4X/LP5 MCP. ![default icon alt text](https://s7d1.scene7.com/is/image/dmqualcommprod/icn-check-circle-3) ### Long lifecycle support for hardware and software Extended support for Yocto Embedded Linux, Windows 11 Enterprise IoT, Android and Ubuntu. OS upgrades, security updates and enterprise grade hardware cover a wider footprint of IoT devices and deployment configurations. ## Product Longevity Program ### Product Longevity Program This product is a part of the Product Longevity Program for Qualcomm IoT Portfolio. These products are developed and engineered with product longevity and durability in mind, helping to bring stability to our customer product designs. [Learn more about the program](https://www.qualcomm.com/products/product-longevity-program) ![test](https://s7d1.scene7.com/is/image/dmqualcommprod/product-longevity-program-icon-180x180?$QC_Responsive$&fmt=png-alpha) ## QCM5430 Block Diagram ![https://www.qualcomm.com/content/dam/qcomm-martech/dm-assets/images/pdp/block_diagram/image/dragonwing-QCM5430-diagram.svg](https://www.qualcomm.com/content/dam/qcomm-martech/dm-assets/images/pdp/block_diagram/image/dragonwing-QCM5430-diagram.svg) QCS5430 is available via two pre-defined feature packs, or through custom build. The scalable specs are CPU, GPU, DSP, Display, Camera, and USB. Please find full details of various feature sets in the QCM5430/QCS5430 Product Brief. The specifications shown below show the maximum range available through the QCS5430. ## Features - Designed with the 6 nm process, for superior performance and power efficiency. - Extended support for Windows 11 Enterprise IoT, Linux, Android and Ubuntu OS upgrades, security updates and enterprise grade hardware. - Software-defined SKU allows customers to choose pre-set feature packs or customize packs or upgrade OTA in the future via software licensing - All feature packs include premium connectivity and enterprise-grade security features with upgradeable options for: - Increased CPU, GPU, and AI performance - Expanded peripherals support - Significant reductions in latency, smooth handoffs and increased responsiveness for latency sensitive applications - Reliable location accuracy - QCM5430 also includes: - 5G modem – Sub6/mmW for True Global Support - VoNR - Qualcomm® AI Engine includes a hardware and software AI solution with on-device machine learning to enable Edge computing - Edge AI intelligently chooses between device edge or cloud processing of multiple camera connections, optimizing processing time and power efficiency - Support for up to five concurrent vision sensor inputs - Qualcomm® Kryo™ 670 CPU built on Arm v8 Cortex technology - 6th Gen Qualcomm AI Engine: A fused AI accelerator packing Qualcomm® Hexagon™ Tensor Accelerator (HTA), Large shared AI memory, Hexagon Scalar Accelerator, Hexagon Vector eXtensions (HVX) - Dual channel, non-PoP LPDDR5/LPDDR4X SDRAM, UFS 2.x/3.1, two-lane HS gear 4, SD v3.0, and eMMC 5.1 - AI performance of up to 12.5 INT8 TOPS - Audio ML DSP: LPI, Shared 2MB ## Specifications ### Qualcomm® Artificial Intelligence (AI) Engine | Field | Value | | --- | --- | | GPU Name | Qualcomm® Adreno™ | | CPU Name | Qualcomm® Kryo™ | | CPU Number of Cores | 8 | | Qualcomm® Hexagon™ Processor Name | Qualcomm® Hexagon™ 770 | | Qualcomm® Hexagon™ Processor Features | Fused AI Accelerator architecture | | Qualcomm® Sensing Hub Features | Dual-core AI processor | | Machine Learning | Audio ML DSP | ### CPU | Field | Value | | --- | --- | | Name | Qualcomm® Kryo™ 670 | | Architecture | 64-bit | | Clock Speed | 2.7 GHz | ### GPU | Field | Value | | --- | --- | | Name | Qualcomm® Adreno™ 642L, Qualcomm® Adreno™ 643 | | Clock Speed | 812 MHz | | APIs | OpenGL® ES 3.2 | ### Memory | Field | Value | | --- | --- | | Speed | 4200 MHz | | Type | non-POP, LPDDR4x, LPDDR5 | ### DSP | Field | Value | | --- | --- | | Clock Speed | 1.4 GHz | | Qualcomm® Hexagon™ Processor Features | 2 Qualcomm® Hexagon™ Vector eXtensions (HVX), 4K HMX | Show more