The Qualcomm Dragonwing™ QCM5430Processor is a scalable 5G-enabled mid-tier platform for IOT.
The QCM5430 is optimized for premium connectivity, high-level performance, and edge AI-powered camera capabilities with the option to upgrade features over-the-air via software now or later, according to your product needs.
The scalable performance of these Systems-on-a-Chip (SOC)s are designed to deliver superior features and performance across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications. This includes support for 5G and Wi-Fi 6E for ubiquitous cove...
Features
- Designed with the 6 nm process, for superior performance and power efficiency.
- Extended support for Windows 11 Enterprise IoT, Linux, Android and Ubuntu OS upgrades, security updates and enterprise grade hardware.
- Software-defined SKU allows customers to choose pre-set feature packs or customize packs or upgrade OTA in the future via software licensing
- All feature packs include premium connectivity and enterprise-grade security features with upgradeable options for:
- Increased CPU, GPU, and AI performance
- Expanded peripherals support
- Significant reductions in latency, smooth handoffs and increased responsiveness for latency sensitive applications
- Reliable location accuracy
- QCM5430 also includes:
- 5G modem – Sub6/mmW for True Global Support
- VoNR
- Qualcomm® AI Engine includes a hardware and software AI solution with on-device machine learning to enable Edge computing
- Edge AI intelligently chooses between device edge or cloud processing of multiple camera connections, optimizing processing time and power efficiency
- Support for up to five concurrent vision sensor inputs
- Qualcomm® Kryo™ 670 CPU built on Arm v8 Cortex technology
- 6th Gen Qualcomm AI Engine: A fused AI accelerator packing Qualcomm® Hexagon™ Tensor Accelerator (HTA), Large shared AI memory, Hexagon Scalar Accelerator, Hexagon Vector eXtensions (HVX)
- Dual channel, non-PoP LPDDR5/LPDDR4X SDRAM, UFS 2.x/3.1, two-lane HS gear 4, SD v3.0, and eMMC 5.1
- AI performance of up to 12.5 INT8 TOPS
- Audio ML DSP: LPI, Shared 2MB
