IQ-8275

The Qualcomm Dragonwing™ IQ8 Series is designed to deliver high‑compute, power‑efficient AI performance for demanding industrial applications operating in extreme environments, with thermal junction support from ‑40°C to 125°C.

The IQ‑8275 SoC is offered in two configurations: a 20 TOPS variant requiring two PMICs and a 40 TOPS variant requiring four PMICs, allowing designers to scale performance to system needs. The platform supports the Qualcomm^® Linux^® software stack and Ubuntu, includes 10+ years of product longevity support. It can be evaluated today with the IQ-8275 EVK.

The IQ-8275 is featured in the Arduino VENTUNO Q developement platform, which is designed for easy prototyping of edge AI and industrial applications.

Product license agreement

Applications

Industrial Vision

In-Store Retail

Industrial HMI

Fleet Management

Medical Devices

Robotics

AMR, Drones

Industrial Edge AI

OS Support

Qualcomm IoT software offerings

Benefits

On-Device AI Performance

20-40 Dense TOPS with dedicated NPU
Runs 13B-parameter models on-device
Positioned to eliminate unpredictable cost and latency from cloud AI

Heterogenous Edge Computing

Streamlined task offloading with CPU, GPU, NPU, MCU
4 high-performance and 4 efficiency CPU cores
Integrated GPU for parallel compute workloads
Real-time subsystem with 4-core MCU with independent I/Os

Multi-Camera Computer Vision

Supports up to 12 camera inputs
C/D-PHY MIPI CSI interface support

Industrial-Grade Reliability

Operating range: -40ºC to 125ºC
Long-term availability and supply chain commitment

Block Diagram

Companion parts

PMIC

PMM8650

CONNECTIVITY (OPTIONAL)

Wi-fi & Bluetooth: WCN6856

5G RedCap: SDX35

5G NR: SDX72

I/O EXPANDER (OPTIONAL)

QPS615

Specifications

QCS8275-0-AC

QCS8275-0-AA

CPU

8-core Qualcomm® Kryo™ Gen 61 @ Up to 2.05 GHz

8-core Qualcomm® Kryo™ Gen 61 @ Up to 2.35 GHz

NPU

Qualcomm® Hexagon™

202 TOPS

Qualcomm® Hexagon™

402 TOPS

GPU

Qualcomm® Adreno™ 623 @ 599 MHz

Qualcomm® Adreno™ 623 @ 877 MHz

Memory

4x16-bitLPDDR5x @ 3200 MHz

With inline ECC, up to 32 GB

DSP

1x Qualcomm® Hexagon™ V66, 1x Qualcomm® Hexagon™ V73

(4 efficient cores + 4 high-performance cores)
Scales 20–40 INT8 TOPS
With TSN (SGMII)
Up to SIL3-capable with dedicated safety island
Flexible Data-Rate
RGMII
Subject to change without notice. Refer to the Product Longevity Program page for the latest information.

Evaluation Hardware

FEATURED

IQ-8275 Evaluation Kit

The Dragonwing IQ-8275 EVK showcases the key capabilities of the Dragonwing IQ-8275 processor, purpose-built for robotics, edge AI boxes, gateways, AMRs, industrial automation, and many more applications that require multi-thread computing, independent AI, and graphics processing while minimizing cost and power requirements. Engineered for edge AI operations, it is designed to enable robust computing, high-speed connectivity, and long lifecycle support for mission-critical deployments.

By:Qualcomm

Chipset:

QCS8275

Development Hardware

See all development hardware

Arduino®️ VENTUNO™ Q

The Arduino®️ VENTUNO™ Q is the edge AI computer that redefines what is possible at the edge, serving as the definitive powerhouse for AI and robotics applications. At its core lies a revolutionary Dual-Brain architecture: the robust Qualcomm Dragonwing™ IQ-8275 delivers a massive up to 40 dense TOPS of AI compute for advanced computer vision and local LLMs, VLMs, gesture recognition and more, while the dedicated STM32H5 Microcontroller ensures the low-latency precision required for complex motor control and robotics. Designed for a zero-friction start, the VENTUNO Q ensures you remain connected and ready to execute. It features integrated Wi-Fi® 6 connectivity for fast, reliable data transfer, alongside a suite of built-in connectors, including high-speed USB 3.0, HDMI, 2.5 Gb Ethernet, and expandable NVMe Gen.4 storage, eliminating the need for messy adapters. Compatible with Arduino® UNO Shields and Carriers, Raspberry Pi Hat and Arduino Modulino Nodes for rapid prototyp and development.

KEY FEATURES:

Dual-Brain Architecture — Powered by Qualcomm Dragonwing™ IQ8 NPU + STM32H5 MCU
40 Dense TOPS NPU for Edge AI — Run local LLMs, VLMs and more AI models on-device
16GB RAM + 64GB eMMC — Expandable with M.2 NVMe Gen.4 for memory-intensive AI workloads
Universal Compatibility — supports Arduino UNO Shields, Carrier, Raspberry Pi Hats, and Modulin
Production-Ready Connectivity — Wi-Fi 6, 2.5Gb Ethernet, CAN Bus, MIPI camera connector, USB 3.0
Robotics Control — Support ROS 2, Deterministic, low-latency actuation via MCU

The Arduino®️ VENTUNO™ Q is the edge AI computer that redefines what is possible at the edge, serving as the definitive powerhouse for AI and robotics applications. At its core lies a revolutionary Dual-Brain architecture: the robust Qualcomm Dragonwing™ IQ-8275 delivers a massive up to 40 dense TOPS of AI compute for advanced computer vision and local LLMs, VLMs, gesture recognition and more, while the dedicated STM32H5 Microcontroller ensures the low-latency precision required for complex motor control and robotics. Designed for a zero-friction start, the VENTUNO Q ensures you remain connected and ready to execute. It features integrated Wi-Fi® 6 connectivity for fast, reliable data transfer, alongside a suite of built-in connectors, including high-speed USB 3.0, HDMI, 2.5 Gb Ethernet, and expandable NVMe Gen.4 storage, eliminating the need for messy adapters. Compatible with Arduino® UNO Shields and Carriers, Raspberry Pi Hat and Arduino Modulino Nodes for rapid prototyp and development.

KEY FEATURES:

Dual-Brain Architecture — Powered by Qualcomm Dragonwing™ IQ8 NPU + STM32H5 MCU
40 Dense TOPS NPU for Edge AI — Run local LLMs, VLMs and more AI models on-device
16GB RAM + 64GB eMMC — Expandable with M.2 NVMe Gen.4 for memory-intensive AI workloads
Universal Compatibility — supports Arduino UNO Shields, Carrier, Raspberry Pi Hats, and Modulin
Production-Ready Connectivity — Wi-Fi 6, 2.5Gb Ethernet, CAN Bus, MIPI camera connector, USB 3.0
Robotics Control — Support ROS 2, Deterministic, low-latency actuation via MCU

By:Arduino S.r.l.

Chipset:

QCS8275

SECO SOM-SMARC-Dragonwing-IQ8

SECO SOM-SMARC-Dragonwing-IQ8 is a compact, industrial-grade SMARC System-on-Module powered by the Qualcomm® Dragonwing™ IQ8 platform, designed to accelerate the transition from AI prototyping to scalable edge deployment. Combining high-performance AI processing with robust industrial features, it enables low-latency on-device inference for industrial automation, robotics, smart surveillance, and smart infrastructure applications.

KEY FEATURES:

Powered by Qualcomm® Dragonwing™ IQ8 with octa-core Kryo CPU
Qualcomm Hexagon NPU delivering up to 40 TOPS AI performance
High-speed connectivity and expansion with PCIe Gen4, MIPI-CSI camera interfaces, and 2.5GbE
Enhanced security with TPM 2.0 and support for SECO Clea OS, simplifying AI deployment at the edge

SECO SOM-SMARC-Dragonwing-IQ8 is a compact, industrial-grade SMARC System-on-Module powered by the Qualcomm® Dragonwing™ IQ8 platform, designed to accelerate the transition from AI prototyping to scalable edge deployment. Combining high-performance AI processing with robust industrial features, it enables low-latency on-device inference for industrial automation, robotics, smart surveillance, and smart infrastructure applications.

KEY FEATURES:

Powered by Qualcomm® Dragonwing™ IQ8 with octa-core Kryo CPU
Qualcomm Hexagon NPU delivering up to 40 TOPS AI performance
High-speed connectivity and expansion with PCIe Gen4, MIPI-CSI camera interfaces, and 2.5GbE
Enhanced security with TPM 2.0 and support for SECO Clea OS, simplifying AI deployment at the edge

By:SECO spa

Chipset:

QCS8275

Complete your design

Discover certified peripherals and components like memory, camera modules, sensors, and cables to speed up development with Dragonwing IQ-8275.

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