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KEY FEATURES:
- Powered by Qualcomm® Dragonwing™ IQ8 with octa-core Kryo CPU
- Qualcomm Hexagon NPU delivering up to 40 TOPS AI performance
- High-speed connectivity and expansion with PCIe Gen4, MIPI-CSI camera interfaces, and 2.5GbE
- Enhanced security with TPM 2.0 and support for SECO Clea OS, simplifying AI deployment at the edge
KEY FEATURES:
- Powered by Qualcomm® Dragonwing™ IQ8 with octa-core Kryo CPU
- Qualcomm Hexagon NPU delivering up to 40 TOPS AI performance
- High-speed connectivity and expansion with PCIe Gen4, MIPI-CSI camera interfaces, and 2.5GbE
- Enhanced security with TPM 2.0 and support for SECO Clea OS, simplifying AI deployment at the edge
KEY FEATURES:
- Dual-Brain Architecture — Powered by Qualcomm Dragonwing™ IQ8 NPU + STM32H5 MCU
- 40 Dense TOPS NPU for Edge AI — Run local LLMs, VLMs and more AI models on-device
- 16GB RAM + 64GB eMMC — Expandable with M.2 NVMe Gen.4 for memory-intensive AI workloads
- Universal Compatibility — supports Arduino UNO Shields, Carrier, Raspberry Pi Hats, and Modulin
- Production-Ready Connectivity — Wi-Fi 6, 2.5Gb Ethernet, CAN Bus, MIPI camera connector, USB 3.0
- Robotics Control — Support ROS 2, Deterministic, low-latency actuation via MCU
KEY FEATURES:
- Dual-Brain Architecture — Powered by Qualcomm Dragonwing™ IQ8 NPU + STM32H5 MCU
- 40 Dense TOPS NPU for Edge AI — Run local LLMs, VLMs and more AI models on-device
- 16GB RAM + 64GB eMMC — Expandable with M.2 NVMe Gen.4 for memory-intensive AI workloads
- Universal Compatibility — supports Arduino UNO Shields, Carrier, Raspberry Pi Hats, and Modulin
- Production-Ready Connectivity — Wi-Fi 6, 2.5Gb Ethernet, CAN Bus, MIPI camera connector, USB 3.0
- Robotics Control — Support ROS 2, Deterministic, low-latency actuation via MCU
