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IQ-8275 Evaluation Kit
The Dragonwing IQ-8275 EVK showcases the key capabilities of the Dragonwing IQ-8275 processor, purpose-built for robotics, edge AI boxes, gateways, AMRs, industrial automation, and many more applications that require multi-thread computing, independent AI, and graphics processing while minimizing cost and power requirements. Engineered for edge AI operations, it is designed to enable robust computing, high-speed connectivity, and long lifecycle support for mission-critical deployments.
ByQualcomm
Chipset
SECO SOM-SMARC-Dragonwing-IQ8
SECO SOM-SMARC-Dragonwing-IQ8 is a compact, industrial-grade SMARC System-on-Module powered by the Qualcomm® Dragonwing™ IQ8 platform, designed to accelerate the transition from AI prototyping to scalable edge deployment. Combining high-performance AI processing with robust industrial features, it enables low-latency on-device inference for industrial automation, robotics, smart surveillance, and smart infrastructure applications.

KEY FEATURES:

  • Powered by Qualcomm® Dragonwing™ IQ8 with octa-core Kryo CPU
  • Qualcomm Hexagon NPU delivering up to 40 TOPS AI performance
  • High-speed connectivity and expansion with PCIe Gen4, MIPI-CSI camera interfaces, and 2.5GbE
  • Enhanced security with TPM 2.0 and support for SECO Clea OS, simplifying AI deployment at the edge
Arduino®️ VENTUNO™ Q
The Arduino®️ VENTUNO™ Q is the edge AI computer that redefines what is possible at the edge, serving as the definitive powerhouse for AI and robotics applications. At its core lies a revolutionary Dual-Brain architecture: the robust Qualcomm Dragonwing™ IQ-8275 delivers a massive up to 40 dense TOPS of AI compute for advanced computer vision and local LLMs, VLMs, gesture recognition and more, while the dedicated STM32H5 Microcontroller ensures the low-latency precision required for complex motor control and robotics. Designed for a zero-friction start, the VENTUNO Q ensures you remain connected and ready to execute. It features integrated Wi-Fi® 6 connectivity for fast, reliable data transfer, alongside a suite of built-in connectors, including high-speed USB 3.0, HDMI, 2.5 Gb Ethernet, and expandable NVMe Gen.4 storage, eliminating the need for messy adapters. Compatible with Arduino® UNO Shields and Carriers, Raspberry Pi Hat and Arduino Modulino Nodes for rapid prototyp and development.

KEY FEATURES:

  • Dual-Brain Architecture — Powered by Qualcomm Dragonwing™ IQ8 NPU + STM32H5 MCU
  • 40 Dense TOPS NPU for Edge AI — Run local LLMs, VLMs and more AI models on-device
  • 16GB RAM + 64GB eMMC — Expandable with M.2 NVMe Gen.4 for memory-intensive AI workloads
  • Universal Compatibility — supports Arduino UNO Shields, Carrier, Raspberry Pi Hats, and Modulin
  • Production-Ready Connectivity — Wi-Fi 6, 2.5Gb Ethernet, CAN Bus, MIPI camera connector, USB 3.0
  • Robotics Control — Support ROS 2, Deterministic, low-latency actuation via MCU