Active
IQ-9075

Optimized for high-performance industrial AI use cases, supporting up to 100 TOPS, Linux Yocto, Ubuntu, ‑40°C to 115°C temp range, and ≥10-year product longevity. 

IQ9

The Qualcomm Dragonwing™ IQ9 Series is design to deliver high‑compute, power‑efficient AI performance for demanding industrial applications operating in extreme environments, with thermal junction support from ‑40°C to 115°C. 

The IQ‑9075 SoC is offered in two configurations: a 50 TOPS variant requiring two PMICs and a 100 TOPS variant requiring four PMICs, allowing designers to scale performance to system needs. The platform supports the Qualcomm® Linux® software stack and Ubuntu, includes 10+ years of product longevity support, and can be evaluated today using the Dragonwing IQ‑9075 EVK.

To reduce design complexity and accelerate time to market, the Dragonwing IQ‑9075 Module provides a pre‑integrated, industrial‑grade solution while maintaining the performance and flexibility of the IQ9 Series.

Applications

Industrial Gateways
Robotics
AMR, Drones
Industrial Edge AI

Benefits

On-Device AI Performance

  • 100 Dense TOPS dedicated NPU
  • Runs 13B-parameter models on-device
  • Positioned to elminate unpredictable cost and latency from cloud AI

Heterogenous Edge Computing

  • Seamless task offloading with CPU, GPU, NPU, MCU
  • 8 high-performance CPU cores
  • Integrated GPU for parallel compute workloads
  • Real-time subsystem with 4-core MCU with independent I/Os

Multi-Camera Computer Vision

  • Supports up to 16 concurrent cameras inputs
  • 4 concurrent 4K streams, up-to 4k170 encode
  • C/D-PHY MIPI CSI interface support

Industrial-Grade Reliability

  • Operating range: -40ºC to 115ºC
  • Long-term availability and supply chain commitment

Block Diagram

Companion parts

PMIC

PMM8650

CONNECTIVITY (OPTIONAL)

Wi-fi & Bluetooth: WCN6856

5G RedCap: SDX35

5G NR: SDX72

I/O EXPANDER (OPTIONAL)

QPS615

Features

  • Qualcomm IQ9 Series delivers unmatched on-device AI performance with 100 INT8 TOPS, LLM flexibility that allows customers to use their own LLMs or integrate existing and open sourced LLM models.

  • ​Featuring 8 high-performance CPU cores, the IQ9 Series is also rich in peripherals including integrated ethernet, multiple ports, and interfaces, and storage.

  • Qualcomm IQ9 Series enables customers to create a variety of applications via ultra-high compute capabilities and a flexible design. 
     
  • Qualcomm IQ9 Series enables customers to create a variety of applications via ultra-high compute capabilities and a flexible design.
     
  • 2 Hexagon Tensor Processors that deliver up to 100 TOPS that power high-compute AI-centric and generative AI industrial use cases​

  • LLM flexibility so customers can use own model or integrate existing or open-source models

  • Designed for use in extreme temperatures (-40 to +85 ambient degrees Celsius; -40 to 115 degrees Celsius junction)​

  • An octa-core processor that includes eight high-performance CPU cores, a GPU, and two Hexagon Tensor Processors with vector and matrix extensions for managing various concurrent compute and AI workloads simultaneously.
Specifications
Qualcomm® Artificial Intelligence (AI) Engine
GPU Name
Qualcomm® Adreno™
CPU Name
Qualcomm® Kryo™
Qualcomm® Hexagon™ Processor Features
Fused AI Accelerator architecture
Qualcomm® Sensing Hub Features
Dual-core AI processor
CPU
Name
Qualcomm® Kryo™
Architecture
64-bit
Clock Speed
Up to 2.36 GHz
LLM
Models
Llama 2
Number of Parameters
7 B
Tokens Per Second
Up to 22 Tokens/s
NPU
Name
Qualcomm® Hexagon™
Tera Operations Per Second
Up to 100 TOPS1
GPU
Name
Qualcomm® Adreno™ 663
Clock Speed
800 MHz
APIs
OpenGL® ES 3.2
  1. Dense TOPS
  2. For Radio Front-End
  3. With TSN
  4. Supports UART/I2C/SPI
  5. Flexible Data-Rate
  6. Subject to change without notice. Refer to the Product Longevity Program page for the latest information.
Specifications
QCS9075-0-AC
QCS9075-0-AA
CPU
8-core Qualcomm® Kryo™ @ Up to 2.1 GHz
8-core Qualcomm® Kryo™ @ Up to 2.36 GHz
NPU
Qualcomm® Hexagon™
501 TOPS
Qualcomm® Hexagon™
1001 TOPS
GPU
Qualcomm® Adreno™ 663 @ 530 MHz
Qualcomm® Adreno™ 663 @ 800 MHz
Memory
6x16-bitLPDDR5 @ 3200 MHz
With inline ECC, Up to 36 GB
DSP
Up to 1980 MPPS
  1. Dense TOPS
  2. For Radio Front-End
  3. With TSN
  4. Supports UART/I2C/SPI
  5. Flexible Data-Rate
  6. Subject to change without notice. Refer to the Product Longevity Program page for the latest information.

Evaluation Hardware

FEATURED
IQ-9075 Evaluation Kit
The Dragonwing IQ-9075 EVK is a comprehensive evaluation platform to test the industrial-grade performance of the Dragonwing IQ-9075 processor for IoT solutions. The Dragonwing IQ-9075 EVK showcases the most common features of the Dragonwing IQ-9075 processor, which is optimized for industrial IoT and robotics applications involving heavy workloads in the most demanding environments like autonomous mobile robots (AMRs) and industrial machinery. The Dragonwing IQ-9075 EVK consists of a mainboard, supporting key interfaces, and optional expansion mezzanine boards to support additional features. It enables developers, OEMs, and ODMs to design and test their solutions powered by the industrial-grade Dragonwing IQ9075 processor integrated with standard interfaces and connectors, mezzanine expandability, and wireless connectivity. Test and prototype software development and hardware designs with less effort and cost to get your product to market faster.
By:Qualcomm

Development Hardware

AOM-6741
The AOM-6741 is a SMARC 2.2 full-size computer-on-module powered by the Qualcomm Dragonwing IQ-9075 processor. It features octa-core Kryo Gen6 CPUs and a 5th-generation VPU, delivering up to 100 TOPS of edge AI performance. The module supports 4 × 4-lane MIPI-CSI (D-PHY) and 4 × DisplayPort, making it ideal for vision intelligence applications. Ubuntu Pro is supported, providing up to 10 years of Expanded Security Maintenance for Ubuntu Classic LTS.

KEY FEATURES:

  • Compact and high performance Edge AI Module, up to 100 TOPS AI computing
  • Qualcomm ® DragonWing IQ9075 processor
  • 1 x PCIe 3.0 x4, 1 x PCIe 3.0 x2, 2 x USB 3.2 Gen2, 3 x USB2.0, 4 x 4-Lane MIPI-CSI
  • Supports Ubuntu 24.04 and Advantech Robotic Suite
EXEC-Q911
The Innodisk EXEC-Q911 is a complete starter kit featuring a COM-HPC Mini Module and carrier board for immediate development and evaluation. The COM-HPC Mini Module leverages Qualcomm’s latest innovation—the Dragonwing™ IQ-9075 SoC—to deliver high AI computing performance with low power consumption. Combined with Innodisk’s comprehensive customization services and self-developed software toolkit, it provides customers with a fast, time-to-market solution to stay ahead in the edge AI era. Innodisk leverages this innovation to develop the EXEC-Q911 starter kit, integrating a COM-HPC Mini Module and carrier board to deliver ready-to-use, high-performance, reliable, and scalable on-device AI computing with low power consumption at the edge.

KEY FEATURES:

  • Ready-to-use starter kit with COM-HPC Mini Module and carrier board
  • Up to 36 GB onboard memory and 128 GB UFS 3.1 storage
  • Dual 2.5G Ethernet and dual 4-lane MIPI CSI-2 interfaces
  • Industrial-grade design with operating temperature range from -40°C to 85°C (Ta)
  • Long-term chipset longevity supported through 2038

Complete your design

Discover certified peripherals and components like memory, camera modules, sensors, and cables to speed up development with Dragonwing IQ-9075.

Qualcomm AI Assistant

Beta
AI Assistant
Related:
Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Our leading-edge AI, high performance, low-power computing, and unrivaled connectivity deliver proven solutions that transform major industries. At Qualcomm, we are engineering human progress.

Stay connected

Get the latest Qualcomm and industry information delivered to your inbox.

Subscribe
Manage your subscription

© Qualcomm Technologies, Inc. and/or its affiliated companies.

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patented technologies are licensed by Qualcomm Incorporated.

Note: Certain services and materials may require you to accept additional terms and conditions before accessing or using those items.

References to "Qualcomm" may mean Qualcomm Incorporated, or subsidiaries or business units within the Qualcomm corporate structure, as applicable.

Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering, research and development functions, and substantially all of our products and services businesses, including our QCT semiconductor business.

Materials that are as of a specific date, including but not limited to press releases, presentations, blog posts and webcasts, may have been superseded by subsequent events or disclosures.

Nothing in these materials is an offer to sell or license any of the services or materials referenced herein.