Powering the most demanding industrial-grade, compute-heavy, and AI based devices in extreme temperatures.
The Qualcomm Dragonwing™ IQ9 Series delivers high‑compute, power‑efficient AI performance for demanding industrial applications operating in extreme environments, with thermal junction support from ‑40°C to 115°C.
The IQ‑9075 SoC is offered in two configurations: a 50 TOPS variant requiring two PMICs and a 100 TOPS variant requiring four PMICs, allowing designers to scale performance to system needs. The platform supports the Qualcomm® Linux® software stack and Ubuntu, includes 10+ years of product longevity support, and can be evaluated today using the Dragonwing IQ‑9075 EVK.
To reduce design complexity and accelerate time to market, the Dragonwing IQ‑9075 Module provides a pre‑integrated, industrial‑grade solution while maintaining the performance and flexibility of the IQ9 Series.
Features
- Qualcomm IQ9 Series delivers unmatched on-device AI performance with 100 INT8 TOPS, LLM flexibility that allows customers to use their own LLMs or integrate existing and open sourced LLM models.
- Featuring 8 high-performance CPU cores, the IQ9 Series is also rich in peripherals including integrated ethernet, multiple ports, and interfaces, and storage.
- Qualcomm IQ9 Series enables customers to create a variety of applications via ultra-high compute capabilities and a flexible design.
- Qualcomm IQ9 Series enables customers to create a variety of applications via ultra-high compute capabilities and a flexible design.
- 2 Hexagon Tensor Processors that deliver up to 100 TOPS that power high-compute AI-centric and generative AI industrial use cases
- LLM flexibility so customers can use own model or integrate existing or open-source models
- Designed for use in extreme temperatures (-40 to +85 ambient degrees Celsius; -40 to 115 degrees Celsius junction)
- An octa-core processor that includes eight high-performance CPU cores, a GPU, and two Hexagon Tensor Processors with vector and matrix extensions for managing various concurrent compute and AI workloads simultaneously.
- Dense TOPS
- For Radio Front-End
- With TSN
- Supports UART/I2C/SPI
- Flexible Data-Rate
- Subject to change without notice. Refer to the Product Longevity Program page for the latest information.
- Dense TOPS
- For Radio Front-End
- With TSN
- Supports UART/I2C/SPI
- Flexible Data-Rate
- Subject to change without notice. Refer to the Product Longevity Program page for the latest information.
