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IQ-9075 Evaluation Kit
The Dragonwing IQ-9075 EVK is a comprehensive evaluation platform to test the industrial-grade performance of the Dragonwing IQ-9075 processor for IoT solutions. The Dragonwing IQ-9075 EVK showcases the most common features of the Dragonwing IQ-9075 processor, which is optimized for industrial IoT and robotics applications involving heavy workloads in the most demanding environments like autonomous mobile robots (AMRs) and industrial machinery. The Dragonwing IQ-9075 EVK consists of a mainboard, supporting key interfaces, and optional expansion mezzanine boards to support additional features. It enables developers, OEMs, and ODMs to design and test their solutions powered by the industrial-grade Dragonwing IQ9075 processor integrated with standard interfaces and connectors, mezzanine expandability, and wireless connectivity. Test and prototype software development and hardware designs with less effort and cost to get your product to market faster.
The Dragonwing IQ-9075 EVK is a comprehensive evaluation platform to test the industrial-grade performance of the Dragonwing IQ-9075 processor for IoT solutions. The Dragonwing IQ-9075 EVK showcases the most common features of the Dragonwing IQ-9075 processor, which is optimized for industrial IoT and robotics applications involving heavy workloads in the most demanding environments like autonomous mobile robots (AMRs) and industrial machinery. The Dragonwing IQ-9075 EVK consists of a mainboard, supporting key interfaces, and optional expansion mezzanine boards to support additional features. It enables developers, OEMs, and ODMs to design and test their solutions powered by the industrial-grade Dragonwing IQ9075 processor integrated with standard interfaces and connectors, mezzanine expandability, and wireless connectivity. Test and prototype software development and hardware designs with less effort and cost to get your product to market faster.
EXMP-Q911
This collaboration centers on the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm Dragonwing™ IQ-9075 SoC featuring an 8-core Qualcomm® Kryo™ Gen 6 CPU and a Qualcomm® Adreno™ 663 GPU, enabling 100 TOPS dense or up to 200 TOPS sparse AI compute.
Under defined 30W test scenarios, the EXMP-Q911 achieves up to 10× higher AI inference FPS compared to similar modules when running the YOLOv10n object detection model across 10 concurrent video channels.
Designed for demanding edge workloads, the EXMP-Q911 integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, paired with a rich set of high-speed interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP 1.2, MIPI CSI-2, CAN FD, and more, providing exceptional connectivity and performance density for compact edge AI systems.
KEY FEATURES:
- Powered by : Dragonwing IQ-9075 SoC, compliant with COM-HPC Mini form factor
- Up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI computing power
- 36 GB onboard memory, 128 GB UFS 3.1 storage, 2 x 2.5G Ethernet and 2 x 4-lane MIPI CSI-2 interfaces
- -40°C to 85°C (Ta) operating temperature
This collaboration centers on the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm Dragonwing™ IQ-9075 SoC featuring an 8-core Qualcomm® Kryo™ Gen 6 CPU and a Qualcomm® Adreno™ 663 GPU, enabling 100 TOPS dense or up to 200 TOPS sparse AI compute.
Under defined 30W test scenarios, the EXMP-Q911 achieves up to 10× higher AI inference FPS compared to similar modules when running the YOLOv10n object detection model across 10 concurrent video channels.
Designed for demanding edge workloads, the EXMP-Q911 integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, paired with a rich set of high-speed interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP 1.2, MIPI CSI-2, CAN FD, and more, providing exceptional connectivity and performance density for compact edge AI systems.
KEY FEATURES:
- Powered by : Dragonwing IQ-9075 SoC, compliant with COM-HPC Mini form factor
- Up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI computing power
- 36 GB onboard memory, 128 GB UFS 3.1 storage, 2 x 2.5G Ethernet and 2 x 4-lane MIPI CSI-2 interfaces
- -40°C to 85°C (Ta) operating temperature
Chipset
AFE-A503
Powered by the Qualcomm® IQ9075M processor, the AFE-A503 is a robust robot control system delivering up to 100 TOPS of AI performance for Autonomous Mobile Robots (AMRs). It features dedicated AMR I/Os, including 4x GbE, 4x USB, 2x COM, 2x CAN FD, and 16-bit DIO. With three M.2 expansions and flexible sensor connectivity for LiDAR, IMUs, and optional GMSL cameras, it seamlessly integrates advanced navigation. Operating on Ubuntu 24.04 and the Advantech Robotic Suite, it ensures efficient, intelligent robotic automation.
KEY FEATURES:
- AMR AI control system up to 100 TOPS
- Dedicated I/Os for AMR: 4x GbE, 4xUSB, 2x CAN FD, 16-bit DIO
- 3x M.2 Expansions: 1x E-Key, 1x B-Key, 1x M-Key (support NVMe)
- Sensor connection for camera, LiDAR, IMU, and optional GMSL…etc
- Supports Ubuntu 24.04
- Supports Advantech Robotic Suite
Powered by the Qualcomm® IQ9075M processor, the AFE-A503 is a robust robot control system delivering up to 100 TOPS of AI performance for Autonomous Mobile Robots (AMRs). It features dedicated AMR I/Os, including 4x GbE, 4x USB, 2x COM, 2x CAN FD, and 16-bit DIO. With three M.2 expansions and flexible sensor connectivity for LiDAR, IMUs, and optional GMSL cameras, it seamlessly integrates advanced navigation. Operating on Ubuntu 24.04 and the Advantech Robotic Suite, it ensures efficient, intelligent robotic automation.
KEY FEATURES:
- AMR AI control system up to 100 TOPS
- Dedicated I/Os for AMR: 4x GbE, 4xUSB, 2x CAN FD, 16-bit DIO
- 3x M.2 Expansions: 1x E-Key, 1x B-Key, 1x M-Key (support NVMe)
- Sensor connection for camera, LiDAR, IMU, and optional GMSL…etc
- Supports Ubuntu 24.04
- Supports Advantech Robotic Suite
APEX-A100
Built on the latest Qualcomm Dragonwing™ IQ-9075 SoC, Innodisk’s APEX-A100 delivers high AI performance with low power consumption for edge deployments. Backed by Innodisk’s self-developed software toolkit and Qualcomm® AI Hub resources, it helps accelerate time to market across AGV, AMR, and edge VLM applications.
KEY FEATURES:
- Powered by Dragonwing IQ-9075 SoC
- Provides up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI performance
- Up to 36GB onboard memory and 128GB UFS 3.1 storage
- 2 x 2.5GbE | 2 x DP 1.2 | 3 x M.2 | 1 x COM | 1 x CAN FD
- Fanless design, operating from -40°C to 70°C (Ta)
- Built for AGV, AMR, and VLM applications at the edge
- Chipset longevity through 2038
Built on the latest Qualcomm Dragonwing™ IQ-9075 SoC, Innodisk’s APEX-A100 delivers high AI performance with low power consumption for edge deployments. Backed by Innodisk’s self-developed software toolkit and Qualcomm® AI Hub resources, it helps accelerate time to market across AGV, AMR, and edge VLM applications.
KEY FEATURES:
- Powered by Dragonwing IQ-9075 SoC
- Provides up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI performance
- Up to 36GB onboard memory and 128GB UFS 3.1 storage
- 2 x 2.5GbE | 2 x DP 1.2 | 3 x M.2 | 1 x COM | 1 x CAN FD
- Fanless design, operating from -40°C to 70°C (Ta)
- Built for AGV, AMR, and VLM applications at the edge
- Chipset longevity through 2038
Chipset
AIR-055
Compact and fanless AIR-055 powered by Qualcomm Dragonwing™ IQ9 delivers superior AI inference efficiency with significantly lower power consumption than comparable platforms. Ideal for edge AI applications including vision AI, AOI inspection, and smart networks. Features complete M.2 and I/O expansion, dual DisplayPort and dual HDMI outputs, and integrated Qualcomm® AI Hub and Advantech EdgeAI SDK for rapid deployment.
KEY FEATURES:
- Qualcomm Dragonwing IQ9 NPU Platform
- Fanless Thermal Design – Silent, maintenance-free operation with low noise level
- Complete M.2 Key M/E/B support with modular Wi-Fi, Bluetooth® technology, 5G, and dual-LAN with POE
- 2× DisplayPort and 2× HDMI outputs enabling diverse visual output configurations
- Extended Operating Range – Wide temperature support from -20°C to +55°C
- Integrated Qualcomm AI Hub, Edge Impulse, and Advantech EdgeAI SDK
Compact and fanless AIR-055 powered by Qualcomm Dragonwing™ IQ9 delivers superior AI inference efficiency with significantly lower power consumption than comparable platforms. Ideal for edge AI applications including vision AI, AOI inspection, and smart networks. Features complete M.2 and I/O expansion, dual DisplayPort and dual HDMI outputs, and integrated Qualcomm® AI Hub and Advantech EdgeAI SDK for rapid deployment.
KEY FEATURES:
- Qualcomm Dragonwing IQ9 NPU Platform
- Fanless Thermal Design – Silent, maintenance-free operation with low noise level
- Complete M.2 Key M/E/B support with modular Wi-Fi, Bluetooth® technology, 5G, and dual-LAN with POE
- 2× DisplayPort and 2× HDMI outputs enabling diverse visual output configurations
- Extended Operating Range – Wide temperature support from -20°C to +55°C
- Integrated Qualcomm AI Hub, Edge Impulse, and Advantech EdgeAI SDK
MT200
MeiG MT200 is an industrial-grade edge AI BOX featuring a modular architecture. The highest-configuration variant is equipped with the MeiG SNM983 intelligent module. SNM983 is based on the Qualcomm Dragonwing™ QCS9075 (IQ-9 Series) platform.
MeiG MT200 is an industrial-grade edge AI BOX featuring a modular architecture. The highest-configuration variant is equipped with the MeiG SNM983 intelligent module. SNM983 is based on the Qualcomm Dragonwing™ QCS9075 (IQ-9 Series) platform.
