The Dragonwing IQ-9075 EVK is a comprehensive evaluation platform to test the industrial-grade performance of the Dragonwing IQ-9075 processor for IoT solutions. The Dragonwing IQ-9075 EVK showcases the most common features of the Dragonwing IQ-9075 processor, which is optimized for industrial IoT and robotics applications involving heavy workloads in the most demanding environments like autonomous mobile robots (AMRs) and industrial machinery. The Dragonwing IQ-9075 EVK consists of a mainboard, supporting key interfaces, and optional expansion mezzanine boards to support additional features. It enables developers, OEMs, and ODMs to design and test their solutions powered by the industrial-grade Dragonwing IQ9075 processor integrated with standard interfaces and connectors, mezzanine expandability, and wireless connectivity. Test and prototype software development and hardware designs with less effort and cost to get your product to market faster.

The Open-Q Qualcomm Dragonwing™ 9075IQ System-on-Module (SOM) solutions offer scalable, power-efficient, and robust computing capabilities for autonomous devices and next-generation Industry 4.0 designs. These advanced AI-powered SOMs enable a range of critical functionalities, including robust safety features for autonomous mobile robots with enhanced device robustness through fault-tolerant ECC memory support and a dedicated real-time subsystem. The new SOM series facilitates the deployment of interactive industrial edge AI systems by integrating Large Language Model (LLM) support, achieving a generation rate of up to 22 tokens per second when running the LIama2 7B parameter model.

Tria's Vision AI-KIT IQ9 features an industrial 3.5-inch SBC board fitted with Qualcomm Dragonwing™ IQ-9075 SIP module, that delivers power-efficient on-device Edge AI and compute, for high-performance, heavy workload industrial applications in extreme environments. The Dragonwing IQ-9075 microprocessor domain (MD) has octa high-performance Kryo Gen6 cores, 100 TOPS of AI-acceleration, plus exceptional multimedia capabilities (up to 16 cameras, multiple displays, 4K170/4K275 enc/dec.). This SOC also features a real time subsystem (RTSS) with quad real-time cores @ 1.85 GHz and peripherals, for low-latency control applications. Dragonwing™ IQ-9075 SIP resources include 36 GB LPDDR5 (3200MHz, 96bit wide DRAM with inline ECC) plus four PMM8650AU PMICs for efficient power management. Vision AI-KIT IQ9 packs a wide range of connectivity interfaces, into a standard industrial 3.5-inch SBC form-factor, including 2x local MIPI CSI 4-lane camera inputs, 2x miniDP (4K) and 1x MIPI DSI display outputs, 6x USB ports (plus quad USB debug-bridge), 2x 2.5 GbE LAN interfaces, CAN, UART and GPIO interfaces. Add-on Wi-Fi/BT, cellular modem and NVME SSD storage options are supported via (key-E, key-B, key-M) M.2 slots. A mezzanine camera-adapter 120-pin connector enables the use of adapter boards for support of multiple concurrent remote cameras. Audio support includes stereo amplified outputs plus onboard PDM microphone.

This collaboration centers on the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm Dragonwing™ IQ-9075 SoC featuring an 8-core Qualcomm® Kryo™ Gen 6 CPU and a Qualcomm® Adreno™ 663 GPU, enabling 100 TOPS dense or up to 200 TOPS sparse AI compute. Under defined 30W test scenarios, the EXMP-Q911 achieves up to 10× higher AI inference FPS compared to similar modules when running the YOLOv10n object detection model across 10 concurrent video channels. Designed for demanding edge workloads, the EXMP-Q911 integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, paired with a rich set of high-speed interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP 1.2, MIPI CSI-2, CAN FD, and more, providing exceptional connectivity and performance density for compact edge AI systems.

The Innodisk EXEC-Q911 is a complete starter kit featuring a COM-HPC Mini Module and carrier board for immediate development and evaluation. The COM-HPC Mini Module leverages Qualcomm’s latest innovation—the Dragonwing™ IQ-9075 SoC—to deliver high AI computing performance with low power consumption. Combined with Innodisk’s comprehensive customization services and self-developed software toolkit, it provides customers with a fast, time-to-market solution to stay ahead in the edge AI era. Innodisk leverages this innovation to develop the EXEC-Q911 starter kit, integrating a COM-HPC Mini Module and carrier board to deliver ready-to-use, high-performance, reliable, and scalable on-device AI computing with low power consumption at the edge.

MeiG SNM983 series module is based on the Qualcomm Kryo Gen 6 CPU with a maximum frequency of 2.36 GHz and a 5nm NON-POP process. With Qualcomm Adreno VPU 765, it supports UHD170 video enconding/UHD275 decoding, H.264/H.265. Adreno 663 GPU supports safe GPU compute, up to 840 MHz, OpenGL ES 3.2, Vulkan 1.2, and OpenCL 2.2. Integrated with Qualcomm neural network processing unit Qualcomm® Hexagon™ Tensor Processor, it supports HVX, HMX and models like ONNX, PyTorch, TensorFlow, CAFFE, and TensorFlow Lite, its computing power is up to 100 Tops. SNM983 series module integrates rich functional interfaces, including DSI, DisplayPort, CSI, PCIe, SGMII, RGMII, UFS, USB, I2C, UART, and SPI interface, etc. Products can be widely used in AI BOX, video bar, VR camera, intelligent robots, intelligent information gathering equipment, live streaming terminals and other products.