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IQ-9075 Evaluation Kit
The Dragonwing IQ-9075 EVK is a comprehensive evaluation platform to test the industrial-grade performance of the Dragonwing IQ-9075 processor for IoT solutions. The Dragonwing IQ-9075 EVK showcases the most common features of the Dragonwing IQ-9075 processor, which is optimized for industrial IoT and robotics applications involving heavy workloads in the most demanding environments like autonomous mobile robots (AMRs) and industrial machinery. The Dragonwing IQ-9075 EVK consists of a mainboard, supporting key interfaces, and optional expansion mezzanine boards to support additional features. It enables developers, OEMs, and ODMs to design and test their solutions powered by the industrial-grade Dragonwing IQ9075 processor integrated with standard interfaces and connectors, mezzanine expandability, and wireless connectivity. Test and prototype software development and hardware designs with less effort and cost to get your product to market faster.
The Dragonwing IQ-9075 EVK is a comprehensive evaluation platform to test the industrial-grade performance of the Dragonwing IQ-9075 processor for IoT solutions. The Dragonwing IQ-9075 EVK showcases the most common features of the Dragonwing IQ-9075 processor, which is optimized for industrial IoT and robotics applications involving heavy workloads in the most demanding environments like autonomous mobile robots (AMRs) and industrial machinery. The Dragonwing IQ-9075 EVK consists of a mainboard, supporting key interfaces, and optional expansion mezzanine boards to support additional features. It enables developers, OEMs, and ODMs to design and test their solutions powered by the industrial-grade Dragonwing IQ9075 processor integrated with standard interfaces and connectors, mezzanine expandability, and wireless connectivity. Test and prototype software development and hardware designs with less effort and cost to get your product to market faster.
EXMP-Q911
This collaboration centers on the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm Dragonwing™ IQ-9075 SoC featuring an 8-core Qualcomm® Kryo™ Gen 6 CPU and a Qualcomm® Adreno™ 663 GPU, enabling 100 TOPS dense or up to 200 TOPS sparse AI compute.
Under defined 30W test scenarios, the EXMP-Q911 achieves up to 10× higher AI inference FPS compared to similar modules when running the YOLOv10n object detection model across 10 concurrent video channels.
Designed for demanding edge workloads, the EXMP-Q911 integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, paired with a rich set of high-speed interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP 1.2, MIPI CSI-2, CAN FD, and more, providing exceptional connectivity and performance density for compact edge AI systems.
KEY FEATURES:
- Powered by : Dragonwing IQ-9075 SoC, compliant with COM-HPC Mini form factor
- Up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI computing power
- 36 GB onboard memory, 128 GB UFS 3.1 storage, 2 x 2.5G Ethernet and 2 x 4-lane MIPI CSI-2 interfaces
- -40°C to 85°C (Ta) operating temperature
This collaboration centers on the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm Dragonwing™ IQ-9075 SoC featuring an 8-core Qualcomm® Kryo™ Gen 6 CPU and a Qualcomm® Adreno™ 663 GPU, enabling 100 TOPS dense or up to 200 TOPS sparse AI compute.
Under defined 30W test scenarios, the EXMP-Q911 achieves up to 10× higher AI inference FPS compared to similar modules when running the YOLOv10n object detection model across 10 concurrent video channels.
Designed for demanding edge workloads, the EXMP-Q911 integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, paired with a rich set of high-speed interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP 1.2, MIPI CSI-2, CAN FD, and more, providing exceptional connectivity and performance density for compact edge AI systems.
KEY FEATURES:
- Powered by : Dragonwing IQ-9075 SoC, compliant with COM-HPC Mini form factor
- Up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI computing power
- 36 GB onboard memory, 128 GB UFS 3.1 storage, 2 x 2.5G Ethernet and 2 x 4-lane MIPI CSI-2 interfaces
- -40°C to 85°C (Ta) operating temperature
Chipset
EXEC-Q911
The Innodisk EXEC-Q911 is a complete starter kit featuring a COM-HPC Mini Module and carrier board for immediate development and evaluation. The COM-HPC Mini Module leverages Qualcomm’s latest innovation—the Dragonwing™ IQ-9075 SoC—to deliver high AI computing performance with low power consumption. Combined with Innodisk’s comprehensive customization services and self-developed software toolkit, it provides customers with a fast, time-to-market solution to stay ahead in the edge AI era.
Innodisk leverages this innovation to develop the EXEC-Q911 starter kit, integrating a COM-HPC Mini Module and carrier board to deliver ready-to-use, high-performance, reliable, and scalable on-device AI computing with low power consumption at the edge.
KEY FEATURES:
- Ready-to-use starter kit with COM-HPC Mini Module and carrier board
- Up to 36 GB onboard memory and 128 GB UFS 3.1 storage
- Dual 2.5G Ethernet and dual 4-lane MIPI CSI-2 interfaces
- Industrial-grade design with operating temperature range from -40°C to 85°C (Ta)
- Long-term chipset longevity supported through 2038
The Innodisk EXEC-Q911 is a complete starter kit featuring a COM-HPC Mini Module and carrier board for immediate development and evaluation. The COM-HPC Mini Module leverages Qualcomm’s latest innovation—the Dragonwing™ IQ-9075 SoC—to deliver high AI computing performance with low power consumption. Combined with Innodisk’s comprehensive customization services and self-developed software toolkit, it provides customers with a fast, time-to-market solution to stay ahead in the edge AI era.
Innodisk leverages this innovation to develop the EXEC-Q911 starter kit, integrating a COM-HPC Mini Module and carrier board to deliver ready-to-use, high-performance, reliable, and scalable on-device AI computing with low power consumption at the edge.
KEY FEATURES:
- Ready-to-use starter kit with COM-HPC Mini Module and carrier board
- Up to 36 GB onboard memory and 128 GB UFS 3.1 storage
- Dual 2.5G Ethernet and dual 4-lane MIPI CSI-2 interfaces
- Industrial-grade design with operating temperature range from -40°C to 85°C (Ta)
- Long-term chipset longevity supported through 2038
Chipset
SNM983
MeiG SNM983 series module is based on the Qualcomm Kryo Gen 6 CPU with a maximum frequency of 2.36 GHz and a 5nm NON-POP process. With Qualcomm Adreno VPU 765, it supports UHD170 video enconding/UHD275 decoding, H.264/H.265. Adreno 663 GPU supports safe GPU compute, up to 840 MHz, OpenGL ES 3.2, Vulkan 1.2, and OpenCL 2.2. Integrated with Qualcomm neural network processing unit Qualcomm® Hexagon™ Tensor Processor, it supports HVX, HMX and models like ONNX, PyTorch, TensorFlow, CAFFE, and TensorFlow Lite, its computing power is up to 100 Tops.
SNM983 series module integrates rich functional interfaces, including DSI, DisplayPort, CSI, PCIe, SGMII, RGMII, UFS, USB, I2C, UART, and SPI interface, etc. Products can be widely used in AI BOX, video bar, VR camera, intelligent robots, intelligent information gathering equipment, live streaming terminals and other products.
KEY FEATURES:
- Kryo Gen 6 CPU with a max frequency of 2.36 GHz
- High AI computations~100 Tops
- Support 10*4K screen display
- Support 4*4-lane MIPI-CSI interfaces
- Support 2*USB 3.1 Gen2, 1*USB2.0
- Support SGMII/RGMII
MeiG SNM983 series module is based on the Qualcomm Kryo Gen 6 CPU with a maximum frequency of 2.36 GHz and a 5nm NON-POP process. With Qualcomm Adreno VPU 765, it supports UHD170 video enconding/UHD275 decoding, H.264/H.265. Adreno 663 GPU supports safe GPU compute, up to 840 MHz, OpenGL ES 3.2, Vulkan 1.2, and OpenCL 2.2. Integrated with Qualcomm neural network processing unit Qualcomm® Hexagon™ Tensor Processor, it supports HVX, HMX and models like ONNX, PyTorch, TensorFlow, CAFFE, and TensorFlow Lite, its computing power is up to 100 Tops.
SNM983 series module integrates rich functional interfaces, including DSI, DisplayPort, CSI, PCIe, SGMII, RGMII, UFS, USB, I2C, UART, and SPI interface, etc. Products can be widely used in AI BOX, video bar, VR camera, intelligent robots, intelligent information gathering equipment, live streaming terminals and other products.
KEY FEATURES:
- Kryo Gen 6 CPU with a max frequency of 2.36 GHz
- High AI computations~100 Tops
- Support 10*4K screen display
- Support 4*4-lane MIPI-CSI interfaces
- Support 2*USB 3.1 Gen2, 1*USB2.0
- Support SGMII/RGMII
MT200 AI BOX
MeiG MT200 is an industrial-grade edge AI BOX that is compatible with various MeiG computing modules and the highest configuration version is SNM983 intelligent module. Based on the Qualcomm QCS9075 platform, the SNM983 utilizes a 5nm NON-POP process and integrates an 8‑core Kryo Gen 6 CPU (up to 2.36 GHz), an Adreno 663 GPU, and a Qualcomm Hexagon Tensor Processor, delivering up to approximately 100 TOPS of AI computing power. The product supports 4K multi‑screen output, concurrent multi‑camera inputs, and 8K ultra‑HD video encoding/decoding, while offering a rich set of industrial interfaces (CAN‑FD, PCIe, GPIO, etc.). It is widely used in intelligent robotics, industrial vision, IVI, and edge computing gateways.
MeiG MT200 is an industrial-grade edge AI BOX that is compatible with various MeiG computing modules and the highest configuration version is SNM983 intelligent module. Based on the Qualcomm QCS9075 platform, the SNM983 utilizes a 5nm NON-POP process and integrates an 8‑core Kryo Gen 6 CPU (up to 2.36 GHz), an Adreno 663 GPU, and a Qualcomm Hexagon Tensor Processor, delivering up to approximately 100 TOPS of AI computing power. The product supports 4K multi‑screen output, concurrent multi‑camera inputs, and 8K ultra‑HD video encoding/decoding, while offering a rich set of industrial interfaces (CAN‑FD, PCIe, GPIO, etc.). It is widely used in intelligent robotics, industrial vision, IVI, and edge computing gateways.
AOM-6741
The AOM-6741 is a SMARC 2.2 full-size computer-on-module powered by the Qualcomm Dragonwing IQ-9075 processor. It features octa-core Kryo Gen6 CPUs and a 5th-generation VPU, delivering up to 100 TOPS of edge AI performance. The module supports 4 × 4-lane MIPI-CSI (D-PHY) and 4 × DisplayPort, making it ideal for vision intelligence applications. Ubuntu Pro is supported, providing up to 10 years of Expanded Security Maintenance for Ubuntu Classic LTS.
KEY FEATURES:
- Compact and high performance Edge AI Module, up to 100 TOPS AI computing
- Qualcomm ® DragonWing IQ9075 processor
- 1 x PCIe 3.0 x4, 1 x PCIe 3.0 x2, 2 x USB 3.2 Gen2, 3 x USB2.0, 4 x 4-Lane MIPI-CSI
- Supports Ubuntu 24.04 and Advantech Robotic Suite
The AOM-6741 is a SMARC 2.2 full-size computer-on-module powered by the Qualcomm Dragonwing IQ-9075 processor. It features octa-core Kryo Gen6 CPUs and a 5th-generation VPU, delivering up to 100 TOPS of edge AI performance. The module supports 4 × 4-lane MIPI-CSI (D-PHY) and 4 × DisplayPort, making it ideal for vision intelligence applications. Ubuntu Pro is supported, providing up to 10 years of Expanded Security Maintenance for Ubuntu Classic LTS.
KEY FEATURES:
- Compact and high performance Edge AI Module, up to 100 TOPS AI computing
- Qualcomm ® DragonWing IQ9075 processor
- 1 x PCIe 3.0 x4, 1 x PCIe 3.0 x2, 2 x USB 3.2 Gen2, 3 x USB2.0, 4 x 4-Lane MIPI-CSI
- Supports Ubuntu 24.04 and Advantech Robotic Suite
Chipset
