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IQ-9075 Evaluation Kit
The Dragonwing IQ-9075 EVK is a comprehensive evaluation platform to test the industrial-grade performance of the Dragonwing IQ-9075 processor for IoT solutions. The Dragonwing IQ-9075 EVK showcases the most common features of the Dragonwing IQ-9075 processor, which is optimized for industrial IoT and robotics applications involving heavy workloads in the most demanding environments like autonomous mobile robots (AMRs) and industrial machinery. The Dragonwing IQ-9075 EVK consists of a mainboard, supporting key interfaces, and optional expansion mezzanine boards to support additional features. It enables developers, OEMs, and ODMs to design and test their solutions powered by the industrial-grade Dragonwing IQ9075 processor integrated with standard interfaces and connectors, mezzanine expandability, and wireless connectivity. Test and prototype software development and hardware designs with less effort and cost to get your product to market faster.
The Dragonwing IQ-9075 EVK is a comprehensive evaluation platform to test the industrial-grade performance of the Dragonwing IQ-9075 processor for IoT solutions. The Dragonwing IQ-9075 EVK showcases the most common features of the Dragonwing IQ-9075 processor, which is optimized for industrial IoT and robotics applications involving heavy workloads in the most demanding environments like autonomous mobile robots (AMRs) and industrial machinery. The Dragonwing IQ-9075 EVK consists of a mainboard, supporting key interfaces, and optional expansion mezzanine boards to support additional features. It enables developers, OEMs, and ODMs to design and test their solutions powered by the industrial-grade Dragonwing IQ9075 processor integrated with standard interfaces and connectors, mezzanine expandability, and wireless connectivity. Test and prototype software development and hardware designs with less effort and cost to get your product to market faster.
IQ-9075 EVK
The Dragonwing IQ-9075 EVK is a comprehensive evaluation platform to test the industrial-grade performance of the Dragonwing IQ-9075 processor for IoT solutions.
The Dragonwing IQ-9075 EVK is a comprehensive evaluation platform to test the industrial-grade performance of the Dragonwing IQ-9075 processor for IoT solutions.
APEX-A100
Built on the latest Qualcomm Dragonwing™ IQ-9075 SoC, Innodisk’s APEX-A100 delivers high AI performance with low power consumption for edge deployments. Backed by Innodisk’s self-developed software toolkit and Qualcomm® AI Hub resources, it helps accelerate time to market across AGV, AMR, and edge VLM applications.
KEY FEATURES:
- Powered by Dragonwing IQ-9075 SoC
- Provides up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI performance
- Up to 36GB onboard memory and 128GB UFS 3.1 storage
- 2 x 2.5GbE | 2 x DP 1.2 | 3 x M.2 | 1 x COM | 1 x CAN FD
- Fanless design, operating from -40°C to 70°C (Ta)
- Built for AGV, AMR, and VLM applications at the edge
- Chipset longevity through 2038
Built on the latest Qualcomm Dragonwing™ IQ-9075 SoC, Innodisk’s APEX-A100 delivers high AI performance with low power consumption for edge deployments. Backed by Innodisk’s self-developed software toolkit and Qualcomm® AI Hub resources, it helps accelerate time to market across AGV, AMR, and edge VLM applications.
KEY FEATURES:
- Powered by Dragonwing IQ-9075 SoC
- Provides up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI performance
- Up to 36GB onboard memory and 128GB UFS 3.1 storage
- 2 x 2.5GbE | 2 x DP 1.2 | 3 x M.2 | 1 x COM | 1 x CAN FD
- Fanless design, operating from -40°C to 70°C (Ta)
- Built for AGV, AMR, and VLM applications at the edge
- Chipset longevity through 2038
Chipset
FV08 EDGE BOX
Qualcomm Dragonwing™ IQ9-based computing box
KEY FEATURES:
- Dragonwing IQ9
- 100 TOPS
- Small size with rich I/O
Qualcomm Dragonwing™ IQ9-based computing box
KEY FEATURES:
- Dragonwing IQ9
- 100 TOPS
- Small size with rich I/O
Chipset
MT200
MeiG MT200 is an industrial-grade edge AI BOX featuring a modular architecture. The highest-configuration variant is equipped with the MeiG SNM983 intelligent module. SNM983 is based on the Qualcomm Dragonwing™ QCS9075 (IQ-9 Series) platform.
MeiG MT200 is an industrial-grade edge AI BOX featuring a modular architecture. The highest-configuration variant is equipped with the MeiG SNM983 intelligent module. SNM983 is based on the Qualcomm Dragonwing™ QCS9075 (IQ-9 Series) platform.
Open-Q™ 9075IQ SOM
The Open-Q Qualcomm Dragonwing™ 9075IQ System-on-Module (SOM) solutions offer scalable, power-efficient, and robust computing capabilities for autonomous devices and next-generation Industry 4.0 designs. These advanced AI-powered SOMs enable a range of critical functionalities, including robust safety features for autonomous mobile robots with enhanced device robustness through fault-tolerant ECC memory support and a dedicated real-time subsystem.
The new SOM series facilitates the deployment of interactive industrial edge AI systems by integrating Large Language Model (LLM) support, achieving a generation rate of up to 22 tokens per second when running the LIama2 7B parameter model.
KEY FEATURES:
- Dragonwing IQ-9075 SoC
- Up to 36GB LPDDR5 SDRAM
- On-device AI Engine up to 100 INT-8 TOPS
- Support up to 16 concurrent cameras
- Multiple PCIe, USB, and CAN-FD interfaces
- 2.5Gbps Time Sensitive Ethernet (TSN)
- Dedicated real-time subsystem
- Qualcomm® Linux
The Open-Q Qualcomm Dragonwing™ 9075IQ System-on-Module (SOM) solutions offer scalable, power-efficient, and robust computing capabilities for autonomous devices and next-generation Industry 4.0 designs. These advanced AI-powered SOMs enable a range of critical functionalities, including robust safety features for autonomous mobile robots with enhanced device robustness through fault-tolerant ECC memory support and a dedicated real-time subsystem.
The new SOM series facilitates the deployment of interactive industrial edge AI systems by integrating Large Language Model (LLM) support, achieving a generation rate of up to 22 tokens per second when running the LIama2 7B parameter model.
KEY FEATURES:
- Dragonwing IQ-9075 SoC
- Up to 36GB LPDDR5 SDRAM
- On-device AI Engine up to 100 INT-8 TOPS
- Support up to 16 concurrent cameras
- Multiple PCIe, USB, and CAN-FD interfaces
- 2.5Gbps Time Sensitive Ethernet (TSN)
- Dedicated real-time subsystem
- Qualcomm® Linux
Chipset
Tria Vision AI-KIT IQ9
Tria's Vision AI-KIT IQ9 features an industrial 3.5-inch SBC board fitted with Qualcomm Dragonwing™ IQ-9075 SIP module, that delivers power-efficient on-device Edge AI and compute, for high-performance, heavy workload industrial applications in extreme environments.
The Dragonwing IQ-9075 microprocessor domain (MD) has octa high-performance Kryo Gen6 cores, 100 TOPS of AI-acceleration, plus exceptional multimedia capabilities (up to 16 cameras, multiple displays, 4K170/4K275 enc/dec.). This SOC also features a real time subsystem (RTSS) with quad real-time cores @ 1.85 GHz and peripherals, for low-latency control applications.
Dragonwing™ IQ-9075 SIP resources include 36 GB LPDDR5 (3200MHz, 96bit wide DRAM with inline ECC) plus four PMM8650AU PMICs for efficient power management.
Vision AI-KIT IQ9 packs a wide range of connectivity interfaces, into a standard industrial 3.5-inch SBC form-factor, including 2x local MIPI CSI 4-lane camera inputs, 2x miniDP (4K) and 1x MIPI DSI display outputs, 6x USB ports (plus quad USB debug-bridge), 2x 2.5 GbE LAN interfaces, CAN, UART and GPIO interfaces. Add-on Wi-Fi/BT, cellular modem and NVME SSD storage options are supported via (key-E, key-B, key-M) M.2 slots. A mezzanine camera-adapter 120-pin connector enables the use of adapter boards for support of multiple concurrent remote cameras. Audio support includes stereo amplified outputs plus onboard PDM microphone.
KEY FEATURES:
- Qualcomm Dragonwing™ IQ-9075 Development Kit
- Industrial 3.5-inch SBC board
- Qualcomm Dragonwing™ IQ-9075 SIP module
- Kryo Gen6 cores
- 100 TOPS of AI-acceleration
- Up to 16 cameras
- Multiple display support
- 4K170/4K275 enc/dec.
- Real time subsystem (RTSS) with quad real-time cores @ 1.85 GHz and peripherals
- 36 GB LPDDR5 (3200MHz, 96bit wide DRAM with inline ECC)
- Four PMM8650AU PMICs
Tria's Vision AI-KIT IQ9 features an industrial 3.5-inch SBC board fitted with Qualcomm Dragonwing™ IQ-9075 SIP module, that delivers power-efficient on-device Edge AI and compute, for high-performance, heavy workload industrial applications in extreme environments.
The Dragonwing IQ-9075 microprocessor domain (MD) has octa high-performance Kryo Gen6 cores, 100 TOPS of AI-acceleration, plus exceptional multimedia capabilities (up to 16 cameras, multiple displays, 4K170/4K275 enc/dec.). This SOC also features a real time subsystem (RTSS) with quad real-time cores @ 1.85 GHz and peripherals, for low-latency control applications.
Dragonwing™ IQ-9075 SIP resources include 36 GB LPDDR5 (3200MHz, 96bit wide DRAM with inline ECC) plus four PMM8650AU PMICs for efficient power management.
Vision AI-KIT IQ9 packs a wide range of connectivity interfaces, into a standard industrial 3.5-inch SBC form-factor, including 2x local MIPI CSI 4-lane camera inputs, 2x miniDP (4K) and 1x MIPI DSI display outputs, 6x USB ports (plus quad USB debug-bridge), 2x 2.5 GbE LAN interfaces, CAN, UART and GPIO interfaces. Add-on Wi-Fi/BT, cellular modem and NVME SSD storage options are supported via (key-E, key-B, key-M) M.2 slots. A mezzanine camera-adapter 120-pin connector enables the use of adapter boards for support of multiple concurrent remote cameras. Audio support includes stereo amplified outputs plus onboard PDM microphone.
KEY FEATURES:
- Qualcomm Dragonwing™ IQ-9075 Development Kit
- Industrial 3.5-inch SBC board
- Qualcomm Dragonwing™ IQ-9075 SIP module
- Kryo Gen6 cores
- 100 TOPS of AI-acceleration
- Up to 16 cameras
- Multiple display support
- 4K170/4K275 enc/dec.
- Real time subsystem (RTSS) with quad real-time cores @ 1.85 GHz and peripherals
- 36 GB LPDDR5 (3200MHz, 96bit wide DRAM with inline ECC)
- Four PMM8650AU PMICs
