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IQ-2390

Industrial SoC for compact, cost-optimized systems that need compute, vision, AI, real-time networking, lifecycle readiness, and lifecycle longevity.

IQ2

Qualcomm Dragonwing™ IQ-2390 is a highly integrated, industrial-grade quad-core processor designed to accelerate the development of intelligent HMI, machine vision, control, and gateway systems. By combining application compute, vision, on-device AI, deterministic (TSN) networking, and a RISC-V MCU on a single long-lifecycle platform, IQ-2390 enables manufacturers to bring more intelligence to the edge while reducing system complexity, BOM cost, board area, power consumption, and software integration effort.

Support for Qualcomm Linux based on Yocto, Ubuntu, Android, and Zephyr RTOS, together with comprehensive BSPs, development tools, and documentation, helps shorten the path from evaluation to production.

Built for industrial deployments, IQ-2390 combines hardware-backed security, ECC memory protection, industrial-grade packaging, extended temperature operation, and 10-year product longevity to help minimize design risk and support reliable operation throughout the product lifecycle.

Together, the Dragonwing IQ-2390 and its commercial-grade counterpart, the Dragonwing Q-2390, extend intelligent edge computing across a variety of industries and industrial environments.

Product license agreement

Applications
 

Industrial HMI
Industrial Vision
Industrial Gateways
Industrial Edge AI
PLC and CNC
Industrial scanners and printers
Industrial Machine vision systems
Fire panels and HVAC controllers
Elevator panels
EV charging equipment
Energy storage systems and e-meters

Benefits

Integrate workloads to enable compact systems

  • Application processing, HMI graphics, AI inference, real-time control on one platform

Strengthen industrial reliability

  • Operating range: -30ºC to 115ºC 
  • High 0.8mm ball pitch design 
  • Hardware ECC for enhanced memory integrity 

Simplify system integration

  • 2x 1GbE with TSN for time-aware industrial automation
  • Integrated USB, PCIe, storage, and serial interfaces 
  • Multiple integrated I/O interfaces for design simplicity 

Accelerate product development

  • Multi-OS support for Android, Yocto Linux, Ubuntu, Zephyr 
  • BSPs, tools, evaluation hardware, documentation to move from prototype to production 
  • Ecosystem resources and software support for 10+ years of supply longevity 

Block Diagram

Specifications
CPU
Name
1x Arm® Cortex®-A78 Processor, 3x Arm® Cortex®-A55 Processor
Clock Speed
Up to 1.9 GHz
NPU
Name
Qualcomm® Hexagon™
Tera Operations Per Second
1.1 TOPS
GPU
Name
Qualcomm® Adreno™ 704
Clock Speed
1.1 GHz
Memory
Speed
1.8 GHz
Type
LPDDR4x
Bit Width
16-bit
Number of Channels
2
DSP
Name
Qualcomm® Hexagon™ V661
Clock Speed
1.1 GHz
  1. 2x HVX
  2. Type-C/Micro USB
  3. Type-C
  4. With TSN
  5. QUP_SE
  6. Via WCN3950/WCN398x)
  7. Subject to change without notice. Refer to the Product Longevity Program page for the latest information.

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EARLY ACCESS

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Apply to join the early access program for the Dragonwing IQ-2390 and Dragonwing Q-2390.

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