FastConnect
Qualcomm® FastConnect™ 8800 Mobile Connectivity System
FastConnect8800

Next‑generation Wi‑Fi 8, Bluetooth® High Data Throughput (HDT)¹, Ultra Wideband (UWB), and Thread mobile connectivity system for the fastest peak speeds² ⁴, up to 3× longer gigabit range³, and seamless proximity experiences.

FastConnect 8800 is designed to bring unmatched speeds and range for the agentic AI era. It integrates Wi-Fi 8, Bluetooth® High Data Throughput (HDT)1, UWB, and Thread in a single-chip 4x4 offering on a leading-edge 6 nm process node. FastConnect 8800 is packed with premium innovation, building on an advanced implementation of Proximity AI with Wi-Fi Ranging, UWB, and Bluetooth Channel Sounding to enable users to efficiently find, connect, and interact with nearby devices like earbuds, smart tags, or other mobile devices.

FastConnect...

1Based on a working draft of a potential Bluetooth Specification subject to change.

2Peak speed refers to maximum physical layer (PHY) rate.

3Provided 4x4 system architecture, 320MHz, RF FEMs, and Wi-Fi 8 ELR. Testing in internal labs through iperf at 1 Gbps compared to previous generation.

4As of 2 March 2026.

 

Product license agreement
Featured ResourcesFastConnect 8800 Webinar
Qualcomm FastConnect 8800 Mobile Connectivity System Product Brief

Benefits

default icon alt text
Fastest Mobile Wi‑Fi Speeds⁴
FastConnect 8800 is redesigned to a 4x4 radio configuration, delivering double-digit throughput for the agentic AI era. With peak speeds up to 11.6 Gbps2, FastConnect 8800 doubles the speeds compared to the previous generation.
default icon alt text
Longer Wi-Fi Range
FastConnect 8800 enables up to 3x longer gigabit range of your connected experiences through the 4x4 architecture, all new RF FEMs, and Wi-Fi 8 features like Extended Long Range (ELR).3
default icon alt text
Next-Gen, Most Integrated Mobile Connectivity System
FastConnect 8800 packs four technologies, including the latest in Wi-Fi, Bluetooth, UWB, and Thread. Stay connected and smoothly connect across devices thanks to these technologies.
default icon alt text
Most Advanced Proximity Stack
FastConnect 8800 offers all-new Proximity AI experiences, working across Wi-Fi Ranging, Bluetooth Channel Sounding, and UWB to find your devices. By delivering direction and distance and now leveraging GPS, you can easily locate your lost devices.

1Based on a working draft of a potential Bluetooth Specification subject to change.

2Peak speed refers to maximum physical layer (PHY) rate.

3Provided 4x4 system architecture, 320MHz, RF FEMs, and Wi-Fi 8 ELR. Testing in internal labs through iperf at 1 Gbps compared to previous generation.

4As of 2 March 2026.

 

Features

  • 4x4 architecture for fastest mobile connectivity speeds up to 11.6 Gbps1
  • Up to 3x farther gigabit range thanks to 4x4 architecture, RF FEMs, and Wi-Fi 8 features
  • Most integrated mobile connectivity system with Wi-Fi, Bluetooth, UWB, and Thread
  • Wi-Fi 8 with advanced features like Extended Long Range (ELR)
  • Bluetooth® High Data Throughput (HDT)1 Channel Sounding put with support for Bluetooth on high bands
  • UWB, including NBA-MMS and RADAR
  • Support for Snapdragon Sound™ Technology Suite, Bluetooth® High Data Throughput (HDT), and Qualcomm XPAN
  • Proximity AI for direction and distance across the globe

1Peak speed refers to maximum physical layer (PHY) rate

 

Specifications
Wi-Fi
Wi-Fi/Bluetooth System
Qualcomm® FastConnect™ 8800
Peak Speed
11.6 Gbps1
Generation
Wi-Fi 8, Wi-Fi 7, Wi-Fi 6E, Wi-Fi 6
Standards
IEEE 802.11bn, 802.11be, 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11a, 802.11b
Spectral Bands
6 GHz, 5 GHz, 2.4 GHz
Channels
Up to 320 MHz
Peak QAM
4K QAM
Features
High Band Simultaneous (HBS) Multi-Link, MU-MIMO (UL/DL), OFDMA (UL/DL), Target Wake Time (TWT), Passpoint, Wi-Fi Aware R3, Wi-Fi Location, Wi-Fi Optimized Connectivity, Wi-Fi QoS Management, TDLS, Miracast, Voice-Enterprise, Qualcomm® XPAN technology
Bluetooth
Features
Bluetooth® High Data Throughput (HDT)
UWB
Standards
IEEE 802.15.4z, Fine Ranging (FiRa), Car Connectivity Consortium (CCC), CSA Aliro 1.0
Audio
Qualcomm® aptX™ audio technology support
Qualcomm® aptX™ Audio, Qualcomm® aptX™ Lossless, Qualcomm® aptX™ Adaptive, Qualcomm® aptX™ Voice
Audio Processing Technologies
Snapdragon Sound™ technology, LE Audio, Low latency Gaming mode with Voice back-channel, Spatial Audio
Other Audio Capturing Technologies
Stereo Recording
Process Node and Technology
Process Node
6 nm
  1. Peak speed refers to maximum physical layer (PHY) rate.
Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Our leading-edge AI, high performance, low-power computing, and unrivaled connectivity deliver proven solutions that transform major industries. At Qualcomm, we are engineering human progress.

Stay connected

Get the latest Qualcomm and industry information delivered to your inbox.

Subscribe
Manage your subscription
Also of Interest

© Qualcomm Technologies, Inc. and/or its affiliated companies.

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patented technologies are licensed by Qualcomm Incorporated.

Note: Certain services and materials may require you to accept additional terms and conditions before accessing or using those items.

References to "Qualcomm" may mean Qualcomm Incorporated, or subsidiaries or business units within the Qualcomm corporate structure, as applicable.

Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering, research and development functions, and substantially all of our products and services businesses, including our QCT semiconductor business.

Materials that are as of a specific date, including but not limited to press releases, presentations, blog posts and webcasts, may have been superseded by subsequent events or disclosures.

Nothing in these materials is an offer to sell or license any of the services or materials referenced herein.