QCS5430
Active
Qualcomm Dragonwing™
QCS5430
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Q5

Designed for the most connected, high-performance, and AI-driven edge applications—delivering 5G connectivity, scalable performance, multi-camera support, and versatile I/O. Built-in flexibility allows you to enhance features over time through software updates, whenever your product roadmap demands it.

These next generation, premium software defined Systems-on-a-Chip (SoC)s deliver superior system performance, exceptional compute and best-in-class connectivity. The scalable performance of these SoCs is designed to deliver superior features and performance across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications. This includes support for Wi-Fi 6E for ubiquitous coverage, a unified software stack, powerful AI and expanded interfaces across ecosystems.

 

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Product license agreement
Featured DocumentsProduct Brief
Data Sheet

Benefits

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New Scalable Performance via Software-Defined SKU
Customize performance or upgrade features via software now or later according to your IoT product needs. Select between pre-defined feature packs. This scalability allows customers to choose the support they need. Find full pre-defined feature packs in the product brief.
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Premium connectivity at mid-tier
Enjoy premium connectivity with this mid-tier processor for multi-gigabit speeds, massive capacity and ultra-low latency, Enterprise grade Wi-Fi 6 and Wi-Fi 6E (6 GHz) featuring Qualcomm® 4K QAM, 160MHz bandwidth, bi-directional Multi-User MIMO and advanced Dual Band Simultaneous functionality. Transforms connectivity experiences with multi-gigabit support.
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AI-powered camera features
Connect, upload, and process streams from multiple connected cameras using low power with advanced edge AI processing. The Qualcomm® AI Engine features a fused, scalable AI-accelerator architecture and brings the total performance up to 9 TOPS via software defined SKUs. On-device machine learning enables Edge computing use cases growing at an exponential scale.
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Expanded interfaces and peripherals
Many features supported to enable industrial and commercial IoT devices like: USB 3.1 Type-C with DisplayPort, USB2.0, 2xPCIe and discrete memory beyond LP4X/LP5 MCP.
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Long lifecycle support for hardware and software
Extended support for Yocto Embedded Linux, Windows 11 Enterprise IoT, Android and Ubuntu. OS upgrades, security updates and enterprise grade hardware cover a wider footprint of IoT devices and deployment configurations.

Product Longevity Program

Product Longevity Program

This product is a part of the Product Longevity Program for Qualcomm IoT Portfolio. These products are developed and engineered with product longevity and durability in mind, helping to bring stability to our customer product designs.

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Diagram

Product Specs

QCS5430 is available via pre-defined feature packs. The scalable specs are CPU, GPU, Camera, and AI. Please find full details of various feature sets in the QCM5430/QCS5430 Product Brief. The specifications shown below show the capabilities available through the QCS5430 Feature Pack 1.

Qualcomm® Artificial Intelligence (AI) Engine
GPU Name
Qualcomm® Adreno™ 642L
CPU Name
Qualcomm® Kryo™ 670
CPU Number of Cores
6
Qualcomm® Hexagon™ Processor Name
Qualcomm® Hexagon™ 770
Qualcomm® Hexagon™ Processor Features
Fused AI Accelerator architecture
Qualcomm® Sensing Hub Features
Dual-core AI processor
Machine Learning
Audio ML DSP
Tera Operations Per Second (TOPS)
3.5 TOPS1
CPU
Name
Qualcomm® Kryo™ 670, Qualcomm® Kryo™ CPU
Architecture
64-bit
Clock Speed
Up to 2.1 GHz
Clock Speed (range)
> 2.0 GHz
GPU
Name
Qualcomm® Adreno™ 643L
Clock Speed
Up to 812 GHz
APIs
DirectX® FL 12, OpenGL® ES 3.2, Vulkan®, OpenCL™ 2.0
DSP
Clock Speed
1.4 GHz
Qualcomm® Hexagon™ Processor Features
4K HMX, 2 Qualcomm® Hexagon™ Vector eXtensions (HVX)
NFC
Near Field Communications
Supported
  1. INT8
  2. 4K @ 30 fps
  3. LPDD5
  4. LPDD4x

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5 of 5 total products

Product

CPU

Name

Number of Cores

Clock Speed

GPU

Name

Clock Speed

DSP

Name

Memory

Speed

Type

Wi-Fi

Generation

Standards

MIMO Configuration

Bluetooth

Specification Version

Display

Number of Concurrent Displays

Interface Type

Interfaces

Supported Interfaces

Software Options

Operating System

Longevity Program

Longevity Period

Process Node and Technology

Process Node

Qualcomm® Dragonwing™ Q2 Series

QCS2290
Active

Qualcomm® Kryo™ CPU

4

Up to 2 GHz

Qualcomm® Adreno™ 702

845 GHz

—

1804 MHz1


933 MHz2

LPDDR4x1


LPDDR32

Wi-Fi 4
Wi-Fi 5

802.11ac
802.11a
802.11b
802.11g
802.11n

1x1

Bluetooth® 5.0

1

—

USB 3.1

Android
Linux

—

4 nm

Qualcomm® Dragonwing™ Q4 Series

QCS4290
Active

8x Qualcomm® Kryo™ 260

8

Up to 2 GHz

Qualcomm® Adreno™ 610

—

Qualcomm® Hexagon™ Vector Processor

933 MHz
1866 MHz

LPDDR5x

Wi-Fi 5
Wi-Fi 4
Wi-Fi 6 (ready)

802.11a
802.11b
802.11ac
802.11ax (ready)
802.11n
802.11g

8x8 (ready)
1x1

Bluetooth® 5.1

1

—

USB-C

Linux
Android

7 year(s)

11 nm

Qualcomm® Dragonwing™ Q5 Series

QCS5430
Active

Qualcomm® Kryo™ 670
Qualcomm® Kryo™ CPU

6

Up to 2.1 GHz

Qualcomm® Adreno™ 643L

Up to 812 GHz

—

3200 MHz


2133 MHz

LPDDR4x
non-POP
LPDDR5

Wi-Fi 6
Wi-Fi 6E

802.11ax

1x1

Bluetooth® 5.2

2

DisplayPort 1.4 Single-Stream Transport (SST)
2x PCIe
1x 4-lane Display Serial Interface (DSI)

1x USB 2.0
1x DisplayPort


2x PCIe
1x eMMC
1x USB 3.1

Windows
Ubuntu
Android
Linux

10 year(s)

6 nm

Qualcomm® Dragonwing™ Q6 Series

QCS6490
Active

Qualcomm® Kryo™ 670

8

Up to 2.7 GHz

Qualcomm® Adreno™ 643

Up to 812 MHz

Qualcomm® Hexagon™

3200 MHz

LPDDR5

Wi-Fi 6E

802.11b
802.11ac
802.11g
802.11n
802.11ax

2x2

Bluetooth® 5.2

2

1x DisplayPort 1.4 Single-Stream Transport (SST)
1x 4-lane Display Serial Interface (DSI)
2x PCIe

169x GPIO
21x QUP

Ubuntu
Windows
Android
Linux

15 year(s)

6 nm

Qualcomm® Dragonwing™ Q8 Series

QCS8250
Active

Qualcomm® Kryo™ 585

8

Up to 2.85 GHz

Qualcomm® Adreno™ 650

—

Qualcomm® Hexagon™ V66Q

2750 MHz

LPDDR5

Wi-Fi 4
Wi-Fi 6

802.11ax
802.11be

2x2
8x8

Bluetooth® 5.1
Bluetooth® 5.3

3

2x 4-lane Display Serial Interface (DSI)
DisplayPort

—

Android

15 year(s)

4 nm
7 nm

  1. LPDDR4x @ 1804 MHz; 2 x 16 bit
  2. LPDDR3 @ 933 MHz; 1 x 32 bit

Select the capabilities you need with the RB3 Gen 2 Lite feature set options

FP1

Comes pre-loaded on the RB3 Gen 2 Lite Development Kits. Good for retail point of sale, ECR, panels, and Kiosks.

FP2

Provides increased CPU capabilities. Mid-tier option for Industrial handhelds and dash cameras.

FP2.5

Mid- to high-Tier option for AI/Edge box, Surveillance, Robotics, and Drone controller use cases.

FP3

Highest AI capabilities for premium performance. Ideal for AI/Edge box, Surveillance, Robotics, and Drone controller use cases with increased AI needs.


Featured Hardware

Start developing for robotics and
IoT applications with the Qualcomm Dragonwing™ RB3 Gen 2 Lite Development Kit.

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