---
title: "QCS5430"
url: "https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430"
description: "Built to support Wi-Fi 6E for premium connectivity, high-level performance, and edge-AI-powered camera capabilities with the option to upgrade features over-the-air via software now or later, according to your product needs."
---

# QCS5430

Active

Qualcomm Dragonwing™

**Buy Now**
**Save to Workspace**

On this page

- [Overview](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430/#overview)
- [Benefits](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430/#features)
- [Block Diagram](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430/#blockdiagram)
- [Specs](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430/#specs)
- [Product Comparison](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430/#comparison)
- [Featured Hardware](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430/#featuredhardwaresection)
- [Helpful Links](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430/#helpfullinks)

**Buy Now**

Designed for the most connected, high-performance, and AI-driven edge applications—delivering 5G connectivity, scalable performance, multi-camera support, and versatile I/O. Built-in flexibility allows you to enhance features over time through software updates, whenever your product roadmap demands it.

These next generation, premium software defined Systems-on-a-Chip (SoC)s deliver superior system performance, exceptional compute and best-in-class connectivity. The scalable performance of these SoCs is designed to deliver superior features and performance across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications. This includes support for Wi-Fi 6E for ubiquitous coverage, a unified software stack, powerful AI and expanded interfaces across ecosystems.

The&nb...

**Read More**

[Product license agreement](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430)

**Featured Documents**

- [Qualcomm QCS5430/QCM5430 Processors Product Brief (similar to QCS5430)](https://docs.qualcomm.com/bundle/publicresource/87-43681-1_REV_C_Qualcomm_QCS5430_QCM5430_Processors_Product_Brief.pdf)
- [Data Sheet](https://docs.qualcomm.com/bundle/publicresource/topics/80-23889-1/device-description.html?product=1601111740042863)

## Benefits

![default icon alt text](https://s7d1.scene7.com/is/image/dmqualcommprod/icn-check-circle-3)

**New Scalable Performance via Software-Defined SKU**
Customize performance or upgrade features via software now or later according to your IoT product needs. Select between pre-defined feature packs. This scalability allows customers to choose the support they need. Find full pre-defined feature packs in the product brief.

![default icon alt text](https://s7d1.scene7.com/is/image/dmqualcommprod/icn-check-circle-3)

**Premium connectivity at mid-tier**
Enjoy premium connectivity with this mid-tier processor for multi-gigabit speeds, massive capacity and ultra-low latency, Enterprise grade Wi-Fi 6 and Wi-Fi 6E (6 GHz) featuring Qualcomm® 4K QAM, 160MHz bandwidth, bi-directional Multi-User MIMO and advanced Dual Band Simultaneous functionality. Transforms connectivity experiences with multi-gigabit support.

![default icon alt text](https://s7d1.scene7.com/is/image/dmqualcommprod/icn-check-circle-3)

**AI-powered camera features**
Connect, upload, and process streams from multiple connected cameras using low power with advanced edge AI processing. The Qualcomm® AI Engine features a fused, scalable AI-accelerator architecture and brings the total performance up to 9 TOPS via software defined SKUs. On-device machine learning enables Edge computing use cases growing at an exponential scale.

![default icon alt text](https://s7d1.scene7.com/is/image/dmqualcommprod/icn-check-circle-3)

**Expanded interfaces and peripherals**
Many features supported to enable industrial and commercial IoT devices like: USB 3.1 Type-C with DisplayPort, USB2.0, 2xPCIe and discrete memory beyond LP4X/LP5 MCP.

![default icon alt text](https://s7d1.scene7.com/is/image/dmqualcommprod/icn-check-circle-3)

**Long lifecycle support for hardware and software**
Extended support for Yocto Embedded Linux, Windows 11 Enterprise IoT, Android and Ubuntu. OS upgrades, security updates and enterprise grade hardware cover a wider footprint of IoT devices and deployment configurations.

## Product Longevity Program

### Product Longevity Program

This product is a part of the Product Longevity Program for Qualcomm IoT Portfolio. These products are developed and engineered with product longevity and durability in mind, helping to bring stability to our customer product designs.

[Learn more about the program](https://www.qualcomm.com/products/product-longevity-program)

![test](https://s7d1.scene7.com/is/image/dmqualcommprod/product-longevity-program-icon-180x180?$QC_Responsive$&fmt=png-alpha)

## QCS5430 Block Diagram

![](https://www.qualcomm.com/content/dam/qcomm-martech/dm-assets/images/pdp/block_diagram/image/dragonwing-QCS6490-diagram-v2.svg)

## Specifications

QCS5430 is available via pre-defined feature packs. The scalable specs are CPU, GPU, Camera, and AI. Please find full details of various feature sets in the QCM5430/QCS5430 Product Brief. The specifications shown below show the capabilities available through the QCS5430 Feature Pack 1.

#### Qualcomm® Artificial Intelligence (AI) Engine

- GPU Name: Qualcomm® Adreno™ 642L
- CPU Name: Qualcomm® Kryo™ 670
- CPU Number of Cores: 6
- Qualcomm® Hexagon™ Processor Name: Qualcomm® Hexagon™ 770
- Qualcomm® Hexagon™ Processor Features: Fused AI Accelerator architecture
- Qualcomm® Sensing Hub Features: Dual-core AI processor
- Machine Learning: Audio ML DSP
- Tera Operations Per Second (TOPS): 3.5 TOPS[1](#footnote1)

#### CPU

- Name: Qualcomm® Kryo™ 670, Qualcomm® Kryo™ CPU
- Architecture: 64-bit
- Clock Speed: Up to 2.1 GHz
- Clock Speed (range): > 2.0 GHz

#### GPU

- Name: Qualcomm® Adreno™ 643L
- Clock Speed: Up to 812 GHz
- APIs: DirectX® FL 12, OpenGL® ES 3.2, Vulkan®, OpenCL™ 2.0

#### DSP

- Clock Speed: 1.4 GHz
- Qualcomm® Hexagon™ Processor Features: 4K HMX, 2 Qualcomm® Hexagon™ Vector eXtensions (HVX)

#### NFC

- Near Field Communications: Supported

1. INT8
2. 4K @ 30 fps
3. LPDD5
4. LPDD4x

**Show more**

## Compare Products

Note: to leverage the best experience for the product comparison table, please use the desktop to view content.

**Show All Filters** **Customize Columns**

5 of 5 total products

| Product | Buy Online | CPU Name | Number of Cores | Clock Speed | GPU Name | Clock Speed | DSP Name | Memory Speed | Memory Type | Wi-Fi Generation | Wi-Fi Standards | MIMO Configuration | Display Number of Concurrent Displays | Interface Type | Bluetooth Specification Version | Interfaces Supported Interfaces | Software Options Operating System | Longevity Program Longevity Period | Process Node |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|

**Qualcomm® Dragonwing™ Q2 Series**

| [QCS2290](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290) — Active | Buy Now | Qualcomm® Kryo™ | 4 | Up to 2.0 GHz | Qualcomm® Adreno™ 702 | 845 MHz | — | 1804 MHz¹ / 933 MHz² | LPDDR4x¹ / LPDDR3² | Wi-Fi 4, Wi-Fi 5 | 802.11a, 802.11b, 802.11g, 802.11n, 802.11ac (Show More) | 1x1 | 1 | — | Bluetooth® 5.0 | USB 3.1 | Android, Linux | — | 11 nm |

**Qualcomm® Dragonwing™ Q4 Series**

| [QCS4290](https://www.qualcomm.com/internet-of-things/products/q4-series/qcs4290) — Active | Buy Now | 8x Qualcomm® Kryo™ 260 | 8 | Up to 2 GHz | Qualcomm® Adreno™ 610 | — | Qualcomm® Hexagon™ Vector Processor | 933 MHz, 1866 MHz | LPDDR5x | Wi-Fi 5, Wi-Fi 4, Wi-Fi 6 (ready) (Show More) | 802.11a, 802.11b, 802.11ac, 802.11ax (ready), 802.11n, 802.11g (Show More) | 8x8 (ready), 1x1 | 1 | — | Bluetooth® 5.1 | USB-C | Linux, Android | — | 11 nm |

**Qualcomm® Dragonwing™ Q5 Series**

| [QCS5430](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430) — Active | Buy Now | Qualcomm® Kryo™ 670, Qualcomm® Kryo™ CPU (Show More) | 6 | Up to 2.1 GHz | Qualcomm® Adreno™ 643L | Up to 812 GHz | — | 3200 MHz / 2133 MHz | LPDDR4x, non-POP, LPDDR5 (Show More) | Wi-Fi 6, Wi-Fi 6E | 802.11ax | 1x1 | 2 | DisplayPort 1.4 Single-Stream Transport (SST), 2x PCIe, 1x 4-lane Display Serial Interface (DSI) (Show More) | Bluetooth® 5.2 | 1x USB 2.0, 1x DisplayPort / 2x PCIe, 1x eMMC, 1x USB 3.1 (Show More) | Windows, Ubuntu, Android, Linux (Show More) | 10 year(s) | 6 nm |

**Qualcomm® Dragonwing™ Q6 Series**

| [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) — Active | Buy Now | Qualcomm® Kryo™ 670 | 8 | Up to 2.7 GHz | Qualcomm® Adreno™ 643 | Up to 812 MHz | Qualcomm® Hexagon™ | 3200 MHz | LPDDR5 | Wi-Fi 6E | 802.11b, 802.11ac, 802.11g, 802.11n, 802.11ax (Show More) | 2x2 | 2 | 1x DisplayPort 1.4 Single-Stream Transport (SST), 1x 4-lane Display Serial Interface (DSI), 2x PCIe (Show More) | Bluetooth® 5.2 | 169x GPIO, 21x QUP | Ubuntu, Windows, Android, Linux (Show More) | 15 year(s) | 6 nm |

**Qualcomm® Dragonwing™ Q8 Series**

| [QCS8250](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8250) — Active | Buy Now | Qualcomm® Kryo™ 585 | 8 | Up to 2.85 GHz | Qualcomm® Adreno™ 650 | — | Qualcomm® Hexagon™ V66Q | 2750 MHz | LPDDR5 | Wi-Fi 4, Wi-Fi 6 | 802.11ax, 802.11be | 2x2, 8x8 | 3 | 2x 4-lane Display Serial Interface (DSI), DisplayPort (Show More) | Bluetooth® 5.1, Bluetooth® 5.3 | — | Android | 15 year(s) | 4 nm, 7 nm |

1. LPDDR4x @ 1804 MHz; 2 x 16 bit
2. LPDDR3 @ 933 MHz; 1 x 32 bit

### Select the capabilities you need with the RB3 Gen 2 Lite feature set options

**FP1**
Comes pre-loaded on the RB3 Gen 2 Lite Development Kits. Good for retail point of sale, ECR, panels, and Kiosks.

**FP2**
Provides increased CPU capabilities. Mid-tier option for Industrial handhelds and dash cameras.

**FP2.5**
Mid- to high-Tier option for AI/Edge box, Surveillance, Robotics, and Drone controller use cases.

**FP3**
Highest AI capabilities for premium performance. Ideal for AI/Edge box, Surveillance, Robotics, and Drone controller use cases with increased AI needs.

[View all Feature Pack specs](https://docs.qualcomm.com/nav/home?product=1601111740042863#feature-packs)
[Learn how to obtain and install an evaluation license key](https://dragonwingdocs.qualcomm.com/System/Security/install-or-upgrade-the-soft-sku-feature-packs)

## Featured Hardware

Start developing for robotics and
IoT applications with the Qualcomm Dragonwing™ RB3 Gen 2 Lite Development Kit.

[Learn more](https://www.qualcomm.com/developer/hardware/rb3-gen-2-development-kit)
[Purchase a kit](https://www.qualcomm.com/developer/hardware/rb3-gen-2-development-kit/hardware)

### Helpful Links

#### Contact Sales

Qualcomm has an extensive technology portfolio designed to enable products across industries. Our sales team is ready to provide you with tailored assistance.

[Contact sales](https://www.qualcomm.com/support/contact/forms/iot-contact-sales)

#### Stay ahead of the curve

Receive the latest updates, exclusive offers, and valuable insights delivered through the Qualcomm® newsletter straight to your inbox

[Sign up](https://assets.qualcomm.com/iot-connection-newsletter-sign-up.html)

#### Forums

Visit Qualcomm Support forums to ask questions, access resources, learn quick tips, and more. Expand your knowledge by interacting with others in the developer community.

[Visit forums](https://mysupport.qualcomm.com/supportforums/s/topic/0TO4V0000001XKzWAM/hardware-solutions)