5 results
5G Industrial IoT / Ruggedized Handhelds (QCM6490 Reference Design)
Accelerate Your IoT Development with QCM6490 Reference Design. QCM6490 Reference Design offer, featuring: Planning Workshop: Collaborate with us to define project objectives, requirements, and timelines with QCM6490. Reference Design: Leverage our pre-developed design to save $1M in NRE fees. Maximize Your Benefits by partnering with us, you'll accelerate the development and innovation. We can design chip on board design with any Qualcomm's X (thin modem) or QCM line of 5G chipsets, do all pre-certification testing (FCC, CE, against carrier requirements) and help with the carrier certification process as needed. Contact us to learn more about our IoT Solutions on the Qualcomm platform and kickstart your project. Let's work together to bring your vision to life. Contact Vesa Korkala (Vesa.Korkala@sigmaconnectivity.com)

KEY FEATURES:

  • QCM/QCS6490 Ref Design to build your product upon
  • Key design and build experiences with multiple Qualcomm® Chipsets
QCM6490 Reference Design
GET YOUR IOT PROJECT GOING!We offer the Sigma Connectivity/ Qualcomm® QCM6490 IoT Kickstarter, which includes the following:Planning Workshop:In this workshop, we will collaborate with you to establish clear objectives, define requirements, and create a realistic timeline for your project.QCM6490 Reference Design:As part of this offer, you can leverage the QCM6490 reference design. By using this design, you can save significant costs, as there will be no prototyping licensing fees involved. This translates to potential savings of up to $1M or more.By taking advantage of our expertise and the resources provided through Sigma Connectivity’ and Qualcomm Technologies' IoT Kick Starter Offer, you can accelerate the development of your 5G IoT solutions and maximize the benefits of digital transformation.

KEY FEATURES:

  • Complete Ref Design to build your product upon
  • Prototype Licenses covered.
  • Key Design and build experiences with multiple Qualcomm® Chipsets
QSM560DR
The QSM560DR is a high-performance 5G smart control panel from Quectel, built on the SG560D smart module and powered by 64-bit octa-core QCM6490/QCS6490 processors with Adreno 643 GPU, supporting both Ubuntu and Android operating systems. Designed for industrial and consumer applications, it supports 3GPP Release 15, 5G NSA/SA, 4G/3G fallback, Wi-Fi 6E, 2x2 MU-MIMO, and Bluetooth 5.2, making it suitable for high-speed data, edge computing, and multimedia tasks. The module supports 5G/LTE MIMO technology for optimized data transfer and features integrated multi-constellation GNSS (GPS, GLONASS, BDS, NavIC, Galileo, QZSS, SBAS) for precise positioning. With a rich set of interfaces including HDMI, eDP, Ethernet, USB, CAN, RS-232, and RS-485, it fits seamlessly into a wide range of edge computing use cases such as robotics, smart retail, industrial automation, and safety systems.

KEY FEATURES:

  • Small form factor Single Board Computer
Smart 5G EVB kit for SG520B, SG560D series
Applicable modules: SG520B series, SG560D series.  USB interfaces. (U)SIM card interfaces. SD card interface. Camera interfaces. NFC + SPI/I2S interface. LCM interfaces. Touch panel interfaces. UART interface. Debug interface. Status LED.

KEY FEATURES:

  • Please refer to the full user guide containing detailed information on the Smart 5G EVB Kit, an assistant tool to develop applications, test basic functionalities of modules. Link above takes you to the product page for full information. 
5G SG560D Smart Module Series
SG560D series is Quectel’s new generation of multi-mode 5G smart module with built-in Android 12 or Android 13 OS. Based on the Qualcomm® QCM6490|QCS6490 high-performance 64-bit octa-core processors with built in Qualcomm® Adreno™ 643 GPU, ideal for industrial & consumer applications requiring high data rates & multimedia functions. SG560D series is available in 4 variants: SG560D-CE, SG560D-EM, SG560D-WF and SG560D-NA. It also supports 3GPP Rel-15 specification, both 5G NSA/SA modes with 4G/ 3G fallback. Wi-Fi 6E & DBS, IEEE 802.11a/ b/ g/ n/ ac/ ax, Wi-Fi 2 × 2 MU-MIMO & Bluetooth® 5.2. Combining high-speed wireless connectivity with embedded multi-constellation & high sensitivity GNSS (GPS, GLONASS, BDS, NavIC, Galileo, QZSS and SBAS) receiver for positioning.

KEY FEATURES:

  • Applications including smart gateway, CPE, MiFi, MID, PND, POS, router, multimedia terminal, smart phone, digital signage, industrial PDA.