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VVDN-QCM2290 SOM
VVDN-QCM2290 SOM, designed and developed by VVDN is based on the Qualcomm® QCM2290 platform.The SOM comes with integrated Wi-Fi: IEEE 802.11 a/b/g/n/ac, Bluetooth 5.0, and FM via Qualcomm® WCN3950 chipset along with GNSS and Cellular Connectivity by Qualcomm® WTR3925 chip and supports rich I/O interfaces including MIPI-CSI, MIPI-DSI, USB, SD card, GPIO, JTAG, etc.The system on module offers tight system integration and optimization for superior performance and power management features make it the best to facilitate a cost-effective and efficient embedded system application including two-wheelers digital instrument cluster, body-worn camera, connected camera, digital signage, control panels/industrial panels, retail PoS, video doorbells, and dash camera, etc.
SE250B4
The SE250B4 series is Telit Cinterion’s second generation of smart modules with Android that supports LTE Cat 4, Wi-Fi and Bluetooth® connectivity, and an embedded GNSS receiver in one package.Powered by the Qualcomm® QCM2290 processor with built-in Qualcomm® Adreno™ 702 GPU, the SE250B4 module is ideal forindustrial and consumer applications requiring highdata rates, multimedia functions and edge computing capabilities.

KEY FEATURES:

  • Android and Linux for easy application development
  • Enhanced mobile rendering APIs for image and video applications via Adreno 702 GPU
Kiteboard ISQ2290
The ISQ2290 is an ultra-small form factor, compute and connectivity system on module which enables OEMs, entrepreneurs and makers to build custom connected devices/appliances for vertical specific solutions. It is based on the Qualcomm QCS/QCM2290 and is available in both Wi-Fi only & LTE variants. It enables OEMs & ODMs to build and commercialize feature rich, low cost connected devices at an accelerated time scale.

KEY FEATURES:

  • Ultra-small form factor
TurboX CM2290/C2290 Dev Kit
TurboX CM2290/C2290 dev kit supports the development of smart POS, video doorbell, security panel, household cleaning robotics, dash cameras, handheld PAD, etc. It can support both Android and Linux OS. Its rich hardware interfaces and software SDK can help customers validate the function and build the prototype quickly.

KEY FEATURES:

  • Main IO board: supports multiple interfaces to connect LCD panels, camera modules, SD cards, SIM cards, and USB devices etc.
  • Interposer board: can support multiple RF antenna ports
  • Camera with FPC (OV13B10)
TurboX CM2290/C2290 SOM
TurboX CM2290/C2290 SOM brings high-value features to entry-tier devices. Delivering greater performance, higher graphics capabilities, better quality images, and improved power performance. The form factor of the module is 35mm*35mm (C2290) and 51mm*35mm (CM2290) LGA package which can fit into devices such as retail point-of-sale (POS), industrial handheld, tracking & camera applications and more.

KEY FEATURES:

  • Discrete memory: easy to change memory configuration
  • Video: 1080p @30fps encode/decode
  • Dual ISPs