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Qualcomm® RB3 Gen 2 Development Kit (Core Kit)
The Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guideThe Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guideFEATURED
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit)
The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.Qualcomm® RB3 Gen 2 Development Kit (Core Kit)
The Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guideThe Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guideQualcomm® RB3 Gen 2 Development Kit (Vision Kit)
The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.TRIA SM2S-QCS6490
The TRIA SM2S-QCS6490 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS6490 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS6490 integrates Qualcomm® Kryo™ 670 CPU which contains up to eight cores: four Arm® Cortex®-A78 cores, four Arm® Cortex®-A55 cores, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K60 and many different display connictities (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with upto 12 TOPS at low power and massive camera support with 4 MIPI-CSI inputs.
KEY FEATURES:
- Quad core Arm Cortex-A78 up to 2.7GHz
- And Quad core Arm Cortex-A55 @ 1.95GHz
- Adreno 643 GPU @ 812MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 12(15) TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- Display up to FHD+144Hz
- Video up to 4k30(E)/4K60(D)
- 5xUSB 2.0, 2x USB 3.1
- 2x PCIe Gen3 x1, 1x PCIe Gen3 x2
- 1x MIPI-DSI or LVDS
- 1x DP 1.4 (2 lane) + 1x eDP/DP
- 4x MIPI-CSI Camera Interface
- WLAN/BT Wireless Module (option)
- 2x Gigabit Ethernet
- 2x I2S Audio Interface
- 4x UART, 2x SPI, 2x CAN2.0-FD
- 5x I²C
- HW Key manager and ECC, Secure boot, Crypto engines, etc.
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
The TRIA SM2S-QCS6490 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS6490 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS6490 integrates Qualcomm® Kryo™ 670 CPU which contains up to eight cores: four Arm® Cortex®-A78 cores, four Arm® Cortex®-A55 cores, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K60 and many different display connictities (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with upto 12 TOPS at low power and massive camera support with 4 MIPI-CSI inputs.
KEY FEATURES:
- Quad core Arm Cortex-A78 up to 2.7GHz
- And Quad core Arm Cortex-A55 @ 1.95GHz
- Adreno 643 GPU @ 812MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 12(15) TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- Display up to FHD+144Hz
- Video up to 4k30(E)/4K60(D)
- 5xUSB 2.0, 2x USB 3.1
- 2x PCIe Gen3 x1, 1x PCIe Gen3 x2
- 1x MIPI-DSI or LVDS
- 1x DP 1.4 (2 lane) + 1x eDP/DP
- 4x MIPI-CSI Camera Interface
- WLAN/BT Wireless Module (option)
- 2x Gigabit Ethernet
- 2x I2S Audio Interface
- 4x UART, 2x SPI, 2x CAN2.0-FD
- 5x I²C
- HW Key manager and ECC, Secure boot, Crypto engines, etc.
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
TRIA SM2S-QCS5430
The MSC SM2S-QCS5430 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS5430 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS5430 integrates Qualcomm® Kryo™ 670 CPU which contains up to six cores, Qualcomm® Adreno™ 642L GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K30 and many different display connectivity (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with up to 3.5 TOPS at low power and massive camera support with 4 MIPI-CSI inputs
KEY FEATURES:
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
- Dual core Arm Cortex-A78 up to 2.1GHz
- Adreno 642L GPU @ 315MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 3.5 TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- 4x MIPI-CSI Camera Interface
- Video up to 4k30(E)/4K30(D)
- 5xUSB 2.0, 2x USB 3.1
- 1x MIPI-DSI or LVDS
The MSC SM2S-QCS5430 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS5430 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS5430 integrates Qualcomm® Kryo™ 670 CPU which contains up to six cores, Qualcomm® Adreno™ 642L GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K30 and many different display connectivity (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with up to 3.5 TOPS at low power and massive camera support with 4 MIPI-CSI inputs
KEY FEATURES:
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
- Dual core Arm Cortex-A78 up to 2.1GHz
- Adreno 642L GPU @ 315MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 3.5 TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- 4x MIPI-CSI Camera Interface
- Video up to 4k30(E)/4K30(D)
- 5xUSB 2.0, 2x USB 3.1
- 1x MIPI-DSI or LVDS
Blink360 Camera for Video Conference
Blink360 Camera for Video Conference is 4-camera video conferencing hardware, which supports 360° panoramic image with Auto framing and Speaker focus mode. Track every face and follows every speaker. Easy to join meeting rooms such as Teams, Zoom, Lark, Tencent Meeting, DingTalk etc, and adapt to different meeting rooms by connecting with Meeting controller pad, Laptop, Display, Video/Sound bar w/ or w/o switch.
Blink360 Camera for Video Conference is 4-camera video conferencing hardware, which supports 360° panoramic image with Auto framing and Speaker focus mode. Track every face and follows every speaker. Easy to join meeting rooms such as Teams, Zoom, Lark, Tencent Meeting, DingTalk etc, and adapt to different meeting rooms by connecting with Meeting controller pad, Laptop, Display, Video/Sound bar w/ or w/o switch.
