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Qualcomm® RB3 Gen 2 Development Kit (Vision Kit)
The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.FEATURED
Qualcomm® RB3 Gen 2 Development Kit (Core Kit)
The Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guideThe Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guideQualcomm® RB3 Gen 2 Development Kit (Vision Kit)
The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.Qualcomm® RB3 Gen 2 Development Kit (Core Kit)
The Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guideThe Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guideQCS-6490-3-PSP1287-MT-00-0-AA
QCS6490 (300-0-AA), PSP1287, CPU 1X2.7G,3X2.4G,4X1.95G;16GB DDR;GPU 812M;ADSP L2CC+TCM 2MB;LPI 1MB;ELITEG;SEC-CAM-DSP;APPS;IND IOT, KODIAK (1.0.1), TSMC
QCS6490 (300-0-AA), PSP1287, CPU 1X2.7G,3X2.4G,4X1.95G;16GB DDR;GPU 812M;ADSP L2CC+TCM 2MB;LPI 1MB;ELITEG;SEC-CAM-DSP;APPS;IND IOT, KODIAK (1.0.1), TSMC
ByQualcomm
Chipset
Open-Q 6490CS SOM Development Kit
The Open-Q™ 6490 Development Kit is designed to facilitate easy evaluation and development. The kit includes many standard sockets, enabling customers to choose from a wide range of third-party accessories. The SOM utilizes Qualcomm Technologies’ heterogeneous computing expertise to offer a system-on-chip with multiple specialized processing cores for powerful AI processing, image and graphics processing, and audio processing.
KEY FEATURES:
- Standard M.2 sockets for evaluating Wi-Fi
- TAA/NDAA Compliant
- Android™ 13 and Qualcom Linux OSs
The Open-Q™ 6490 Development Kit is designed to facilitate easy evaluation and development. The kit includes many standard sockets, enabling customers to choose from a wide range of third-party accessories. The SOM utilizes Qualcomm Technologies’ heterogeneous computing expertise to offer a system-on-chip with multiple specialized processing cores for powerful AI processing, image and graphics processing, and audio processing.
KEY FEATURES:
- Standard M.2 sockets for evaluating Wi-Fi
- TAA/NDAA Compliant
- Android™ 13 and Qualcom Linux OSs
Chipset
Open-Q 6490CS SOM
The Open-Q 6490CS provides flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as AI cameras, video collaboration, industrial handhelds, and video telematics. Based on Qualcomm Dragonwing™ QCS6490 processor, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution.
KEY FEATURES:
- Multiple MIPI camera and display ports
- Up to 8GB LPDDR5 RAM + 64GB eMMC
- Android™ 13 and Qualcomm Linux
- TAA/NDAA Compliant
The Open-Q 6490CS provides flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as AI cameras, video collaboration, industrial handhelds, and video telematics. Based on Qualcomm Dragonwing™ QCS6490 processor, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution.
KEY FEATURES:
- Multiple MIPI camera and display ports
- Up to 8GB LPDDR5 RAM + 64GB eMMC
- Android™ 13 and Qualcomm Linux
- TAA/NDAA Compliant
Chipset
5G Industrial IoT / Ruggedized Handhelds (QCM6490 Reference Design)
Accelerate Your IoT Development with QCM6490 Reference Design. QCM6490 Reference Design offer, featuring: Planning Workshop: Collaborate with us to define project objectives, requirements, and timelines with QCM6490. Reference Design: Leverage our pre-developed design to save $1M in NRE fees. Maximize Your Benefits by partnering with us, you'll accelerate the development and innovation.
We can design chip on board design with any Qualcomm's X (thin modem) or QCM line of 5G chipsets, do all pre-certification testing (FCC, CE, against carrier requirements) and help with the carrier certification process as needed.
Contact us to learn more about our IoT Solutions on the Qualcomm platform and kickstart your project. Let's work together to bring your vision to life. Contact Vesa Korkala ([email protected])
KEY FEATURES:
- QCM/QCS6490 Ref Design to build your product upon
- Key design and build experiences with multiple Qualcomm® Chipsets
Accelerate Your IoT Development with QCM6490 Reference Design. QCM6490 Reference Design offer, featuring: Planning Workshop: Collaborate with us to define project objectives, requirements, and timelines with QCM6490. Reference Design: Leverage our pre-developed design to save $1M in NRE fees. Maximize Your Benefits by partnering with us, you'll accelerate the development and innovation.
We can design chip on board design with any Qualcomm's X (thin modem) or QCM line of 5G chipsets, do all pre-certification testing (FCC, CE, against carrier requirements) and help with the carrier certification process as needed.
Contact us to learn more about our IoT Solutions on the Qualcomm platform and kickstart your project. Let's work together to bring your vision to life. Contact Vesa Korkala ([email protected])
KEY FEATURES:
- QCM/QCS6490 Ref Design to build your product upon
- Key design and build experiences with multiple Qualcomm® Chipsets
QCM6490 Reference Design
GET YOUR IOT PROJECT GOING!We offer the Sigma Connectivity/ Qualcomm® QCM6490 IoT Kickstarter, which includes the following:Planning Workshop:In this workshop, we will collaborate with you to establish clear objectives, define requirements, and create a realistic timeline for your project.QCM6490 Reference Design:As part of this offer, you can leverage the QCM6490 reference design. By using this design, you can save significant costs, as there will be no prototyping licensing fees involved. This translates to potential savings of up to $1M or more.By taking advantage of our expertise and the resources provided through Sigma Connectivity’ and Qualcomm Technologies' IoT Kick Starter Offer, you can accelerate the development of your 5G IoT solutions and maximize the benefits of digital transformation.
KEY FEATURES:
- Complete Ref Design to build your product upon
- Prototype Licenses covered.
- Key Design and build experiences with multiple Qualcomm® Chipsets
GET YOUR IOT PROJECT GOING!We offer the Sigma Connectivity/ Qualcomm® QCM6490 IoT Kickstarter, which includes the following:Planning Workshop:In this workshop, we will collaborate with you to establish clear objectives, define requirements, and create a realistic timeline for your project.QCM6490 Reference Design:As part of this offer, you can leverage the QCM6490 reference design. By using this design, you can save significant costs, as there will be no prototyping licensing fees involved. This translates to potential savings of up to $1M or more.By taking advantage of our expertise and the resources provided through Sigma Connectivity’ and Qualcomm Technologies' IoT Kick Starter Offer, you can accelerate the development of your 5G IoT solutions and maximize the benefits of digital transformation.
KEY FEATURES:
- Complete Ref Design to build your product upon
- Prototype Licenses covered.
- Key Design and build experiences with multiple Qualcomm® Chipsets
VVDN-QCS6490 SOM
VVDN is designing, and developing SOM based on Qualcomm® QCS6490 SoC. The SOM supports rich interfaces for connectivity including Wi-Fi 6 (802.11ax) & Bluetooth 5.2 ® technology and other rich peripherals including 5X4 lane MIPI CSI for cameras, 4 lane MIPI DSI for display, USB3.1, USB 2.0, etc.The SOM provides rich hardware interfaces and software SDKs for building quick prototypes and validation. It is ideal for developing various industrial and commercial IoT applications including Digital Signage, Retail, Smart Warehousing, Service robots, Rugged Handheld, etc.
VVDN is designing, and developing SOM based on Qualcomm® QCS6490 SoC. The SOM supports rich interfaces for connectivity including Wi-Fi 6 (802.11ax) & Bluetooth 5.2 ® technology and other rich peripherals including 5X4 lane MIPI CSI for cameras, 4 lane MIPI DSI for display, USB3.1, USB 2.0, etc.The SOM provides rich hardware interfaces and software SDKs for building quick prototypes and validation. It is ideal for developing various industrial and commercial IoT applications including Digital Signage, Retail, Smart Warehousing, Service robots, Rugged Handheld, etc.
