44 results
Filter
44 results
Categories
Filter by:
FEATURED
Qualcomm® RB3 Gen 2 Development Kit (Core Kit)
The Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
KEY FEATURES:
- Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
The Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
KEY FEATURES:
- Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
FEATURED
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit)
The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
KEY FEATURES:
- Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
KEY FEATURES:
- Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
Qualcomm® RB3 Gen 2 Development Kit (Core Kit)
The Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
KEY FEATURES:
- Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
The Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
KEY FEATURES:
- Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit)
The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
KEY FEATURES:
- Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
KEY FEATURES:
- Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
Open-Q™ 6490CS SMARC SOM Development Kit
The Open-Q™ 6490CS SMARC SOM Development Kit is a development platform built to support evaluation and prototyping for Lantronix's SMARC System on Module (SOM) product line. Powered by the Qualcomm Dragonwing™ QCS6490 chipset, the kit is engineered to support proof-of-concept development for computer-vision and multimedia applications. Designed around the standard SMARC form factor, the platform highlights the SOM's capabilities and provides access to interfaces for MIPI CSI cameras, displays, Ethernet, audio, and sensors. The kit serves as a starting point for product evaluation and a reference platform for hardware-integration projects.
KEY FEATURES:
- Up to 8GB LPDDR5 RAM + 64GB UFS
- Additional storage via SD card and NVME
- Multiple D-PHY MIPI camera & Display Ports
- Multiple high speed connectivity options
- Supports SMARC 2.2 SOM
- Android™ 13 and Qualcomm Linux
The Open-Q™ 6490CS SMARC SOM Development Kit is a development platform built to support evaluation and prototyping for Lantronix's SMARC System on Module (SOM) product line. Powered by the Qualcomm Dragonwing™ QCS6490 chipset, the kit is engineered to support proof-of-concept development for computer-vision and multimedia applications. Designed around the standard SMARC form factor, the platform highlights the SOM's capabilities and provides access to interfaces for MIPI CSI cameras, displays, Ethernet, audio, and sensors. The kit serves as a starting point for product evaluation and a reference platform for hardware-integration projects.
KEY FEATURES:
- Up to 8GB LPDDR5 RAM + 64GB UFS
- Additional storage via SD card and NVME
- Multiple D-PHY MIPI camera & Display Ports
- Multiple high speed connectivity options
- Supports SMARC 2.2 SOM
- Android™ 13 and Qualcomm Linux
Open-Q™ 6490CS SMARC SOM
The Open-Q™ 6490CS SMARC SOM is a compute module designed for edge AI and embedded applications such as industrial PCs, robotics, security cameras and video surveillance, retail self-checkout, and video telematics. Based on the Qualcomm Dragonwing™ QCS6490 SoC, the module is built to support AI and machine-learning workloads within a compact SMARC form factor. Built on 6 nm process technology, it supports on-device AI processing, edge computing, Wi‑Fi 6E connectivity, multiple camera interfaces, and up to 4K video encoding and decoding. The pin-compatible Open-Q™ 6490CS SMARC SOM is designed to support product scalability across multiple performance tiers while helping reduce integration effort.
KEY FEATURES:
- Up to 8GB LPDDR5 RAM + 64GB eMMC
- Support UFS and NVMe storage
- Android™ 13 and Qualcomm Linux
- On-device AI Engine up to 12.5 TOPS
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
- SMARC 2.2 form factor
The Open-Q™ 6490CS SMARC SOM is a compute module designed for edge AI and embedded applications such as industrial PCs, robotics, security cameras and video surveillance, retail self-checkout, and video telematics. Based on the Qualcomm Dragonwing™ QCS6490 SoC, the module is built to support AI and machine-learning workloads within a compact SMARC form factor. Built on 6 nm process technology, it supports on-device AI processing, edge computing, Wi‑Fi 6E connectivity, multiple camera interfaces, and up to 4K video encoding and decoding. The pin-compatible Open-Q™ 6490CS SMARC SOM is designed to support product scalability across multiple performance tiers while helping reduce integration effort.
KEY FEATURES:
- Up to 8GB LPDDR5 RAM + 64GB eMMC
- Support UFS and NVMe storage
- Android™ 13 and Qualcomm Linux
- On-device AI Engine up to 12.5 TOPS
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
- SMARC 2.2 form factor
Open-Q 6490CS SOM
The Open-Q 6490CS provides flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as AI cameras, video collaboration, industrial handhelds, and video telematics. Based on Qualcomm Dragonwing™ QCS6490 processor, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution.
KEY FEATURES:
- Multiple MIPI camera and display ports
- Up to 8GB LPDDR5 RAM + 64GB eMMC
- Android™ 13 and Qualcomm Linux
- TAA/NDAA Compliant
The Open-Q 6490CS provides flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as AI cameras, video collaboration, industrial handhelds, and video telematics. Based on Qualcomm Dragonwing™ QCS6490 processor, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution.
KEY FEATURES:
- Multiple MIPI camera and display ports
- Up to 8GB LPDDR5 RAM + 64GB eMMC
- Android™ 13 and Qualcomm Linux
- TAA/NDAA Compliant
Open-Q 6490CS SOM Development Kit
The Open-Q™ 6490 Development Kit is designed to facilitate easy evaluation and development. The kit includes many standard sockets, enabling customers to choose from a wide range of third-party accessories. The SOM utilizes Qualcomm Technologies’ heterogeneous computing expertise to offer a system-on-chip with multiple specialized processing cores for powerful AI processing, image and graphics processing, and audio processing.
KEY FEATURES:
- Standard M.2 sockets for evaluating Wi-Fi
- TAA/NDAA Compliant
- Android™ 13 and Qualcom Linux OSs
The Open-Q™ 6490 Development Kit is designed to facilitate easy evaluation and development. The kit includes many standard sockets, enabling customers to choose from a wide range of third-party accessories. The SOM utilizes Qualcomm Technologies’ heterogeneous computing expertise to offer a system-on-chip with multiple specialized processing cores for powerful AI processing, image and graphics processing, and audio processing.
KEY FEATURES:
- Standard M.2 sockets for evaluating Wi-Fi
- TAA/NDAA Compliant
- Android™ 13 and Qualcom Linux OSs
Quectel Pi H1 SBC (SG565D)
Quectel Pi H1 is a smart Single-Board Computer (SBC) based on the Qualcomm QCS6490 platform. It integrates a high-performance 64-bit octa-core processor delivering up to 12 TOPS of computing power, along with the Qualcomm Adreno™ 643L GPU. Supporting Yocto Linux, Debian, and Ubuntu operating systems, the product comes equipped with 8 GB of LPDDR4X memory and features a USB Type-C power interface, expandable with external eMMC or SSD storage. It offers dual-band Wi-Fi (2.4 & 5 GHz) compliant with IEEE 802.11a/ b/ g/ n/ ac and Bluetooth 5.0, while enabling dual-display output via DP and LCM or DP and Micro HDMI. Combining powerful performance with rich multimedia capabilities, the Quectel Pi H1 is designed to meet the demands of both industrial and consumer applications for high-speed connectivity, advanced multimedia, and robust computing power.
KEY FEATURES:
- Robust computing power: Up to 12 TOPS, well-suited for most algorithm prototyping & inference applic
- Feature-rich interfaces: USB, Micro HDMI, ADC, audio, Ethernet, camera, PCIe , antenna, etc.
- Dual displays: DP and LCM or DP and Micro HDMI.
- Wireless connectivity: Wi-Fi 5, 802.11a/ b/ g/ n/ ac, delivering enhanced wireless connectivity.
- Multiple operating systems: Yocto Linux/ Debian/ Ubuntu.
- Extended temperature range: For harsh outdoor & industrial use; and withstand ambient temperatures f
- Diverse application scenarios: Edge computing, robotics, industrial automation, multimedia terminals
- High-performance 64-bit octa-core processor, delivering up to 12 TOPS of computing power
- 1 x A78 @ 2.7 GHz + 3 x A78 @ 2.4 GHz + 4 x A55 @ 1.9 GHz
- 32 KB L1I cache, 32 KB L1D cache and 512 KB L2 cache
- Adreno 643L @ 812 MHz
- 8 GB LPDDR4X + 128 GB UFS
- Yocto Linux/ Debian/ Ubuntu*
Quectel Pi H1 is a smart Single-Board Computer (SBC) based on the Qualcomm QCS6490 platform. It integrates a high-performance 64-bit octa-core processor delivering up to 12 TOPS of computing power, along with the Qualcomm Adreno™ 643L GPU. Supporting Yocto Linux, Debian, and Ubuntu operating systems, the product comes equipped with 8 GB of LPDDR4X memory and features a USB Type-C power interface, expandable with external eMMC or SSD storage. It offers dual-band Wi-Fi (2.4 & 5 GHz) compliant with IEEE 802.11a/ b/ g/ n/ ac and Bluetooth 5.0, while enabling dual-display output via DP and LCM or DP and Micro HDMI. Combining powerful performance with rich multimedia capabilities, the Quectel Pi H1 is designed to meet the demands of both industrial and consumer applications for high-speed connectivity, advanced multimedia, and robust computing power.
KEY FEATURES:
- Robust computing power: Up to 12 TOPS, well-suited for most algorithm prototyping & inference applic
- Feature-rich interfaces: USB, Micro HDMI, ADC, audio, Ethernet, camera, PCIe , antenna, etc.
- Dual displays: DP and LCM or DP and Micro HDMI.
- Wireless connectivity: Wi-Fi 5, 802.11a/ b/ g/ n/ ac, delivering enhanced wireless connectivity.
- Multiple operating systems: Yocto Linux/ Debian/ Ubuntu.
- Extended temperature range: For harsh outdoor & industrial use; and withstand ambient temperatures f
- Diverse application scenarios: Edge computing, robotics, industrial automation, multimedia terminals
- High-performance 64-bit octa-core processor, delivering up to 12 TOPS of computing power
- 1 x A78 @ 2.7 GHz + 3 x A78 @ 2.4 GHz + 4 x A55 @ 1.9 GHz
- 32 KB L1I cache, 32 KB L1D cache and 512 KB L2 cache
- Adreno 643L @ 812 MHz
- 8 GB LPDDR4X + 128 GB UFS
- Yocto Linux/ Debian/ Ubuntu*
