6 results

Filter by:

Kiteboard 2290 SOM
The Kiteboard 2290 is a cost-efficient, production-ready System-on-Module (SOM) based on the Qualcomm® Dragonwing™ QCS2290 SoC. Designed in an ultra-small form factor with integrated compute and connectivity, it enables OEMs, entrepreneurs, and device makers to build custom connected devices for vertical-specific solutions. Available in both Wi-Fi only and LTE variants, the Kiteboard 2290 is optimized for cost-efficient, feature-rich IoT deployments and enables OEMs and ODMs to rapidly develop and commercialize smart devices such as industrial handhelds, retail POS systems, connected cameras, and asset-tracking solutions while accelerating time-to-market.

KEY FEATURES:

  • Ultra small form factor
  • Integrated with Digital FM Technology
  • Reference design for offroad vehicle telematics
  • Reference design for field diagnostics device
  • Reference design for two-wheeler device cluster
  • Integrated LTE Cat 4 modem with Dual SIM (DSDS) support
  • Azure/AWS cloud orchestration for device provisioning and management
Arduino UNO Q
Arduino UNO Q’s hybrid design makes it the ideal dual-brain platform for your next innovation. It combines a Linux® Debian-capable Qualcomm Dragonwing™ QRB2210 microprocessor with a real-time STM32U585 microcontroller (MCU). It’s Arduino, it’s a computer, it’s anything you want to build.

KEY FEATURES:

  • AI in a blink: Unlock AI-powered vision and sound solutions that react to their environment in real time.Quick start apps: Jumpstart development with plenty of pre-built examples and templates available through Arduino App Lab.Designed to expand: Expandable with Qwiic connector for Modulino nodes, carriers and more.
Chipset
Type Development Kits
Aikri QRB2210: Aikri-22X-10LD-3
Aikri-22X-10LD-3 development kit is based on Qualcomm® QRB2210 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QRB2210 kit comprises Qualcomm® QRB2210-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras. 

KEY FEATURES:

  • 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
  • 3GB LPDDR4x and 32GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0
  • OS: Linux, Yocto Dunfell, Kernel 5.4; Dimensions: 85mm x 54mm
Chipset
Type Development Kits
Aikri QRB2210: Aikri-22X-10LS-3
Aikri-22X-10LS-3 System-on-Module (SoM) is based on Qualcomm® QRB2210 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QRB2210 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

KEY FEATURES:

  • 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
  • 3GB LPDDR4x and 32GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT 5.0
  • OS: Linux, Yocto Dunfell; Dimensions: 58 mm x 39 mm
Chipset
Type System-on-Modules
Open-Q™ 2210 System in Package
The Open-Q™ 2200 Series SIPs are a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QRB2210 (Yocto Linux) processors, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth® wireless technology. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.

KEY FEATURES:

  • Entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power
  • Secure compute platform
  • Extended Operating Temperature (-25C to 85C)
Chipset
Type System-on-Modules