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KEY FEATURES:
- Entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power
- Secure compute platform
- Extended Operating Temperature (-25C to 85C)
KEY FEATURES:
- Entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power
- Secure compute platform
- Extended Operating Temperature (-25C to 85C)
KEY FEATURES:
- The development kit provides hardware interfaces to evaluate camera, video, display on LCD and HDMI, and connectivity capabilities
- Supports many robotic features
- User can expand the kit with compatible boards from 96Boards
KEY FEATURES:
- The development kit provides hardware interfaces to evaluate camera, video, display on LCD and HDMI, and connectivity capabilities
- Supports many robotic features
- User can expand the kit with compatible boards from 96Boards
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0
- OS: Linux, Yocto Dunfell, Kernel 5.4; Dimensions: 85mm x 54mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0
- OS: Linux, Yocto Dunfell, Kernel 5.4; Dimensions: 85mm x 54mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT 5.0
- OS: Linux, Yocto Dunfell; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT 5.0
- OS: Linux, Yocto Dunfell; Dimensions: 58 mm x 39 mm
Dream up and deploy a new generation of everyday robotics and IoT products for the masses without sacrificing features or performance.
The Qualcomm® Robotics RB1 Platform integrates high-level features, AI solutions, and powerful performance in a unified, cost-effective solution giving OEMs, ODMs, and developers the flexibility to design and create a generation of high-performance everyday robotics and IoT products. The Qualcomm Robotics RB1 combines heterogeneous compute and AI focused performance, communications technologies, and new levels of cost-effectiveness and accessibility for the industry. The platform is optimized for smaller devices and lower power consumption.
This extends to their built-in support for machine vision; support for up to two cameras, providing onboard intelligence to meld this data with other high-fidelity sensors from TDK for applications such as autonomous navigation.
KEY FEATURES:
- Dedicated DSP shared between sensor core and low-power audio subsystem
- Dual-channel non-PoP high-speed memory
Dream up and deploy a new generation of everyday robotics and IoT products for the masses without sacrificing features or performance.
The Qualcomm® Robotics RB1 Platform integrates high-level features, AI solutions, and powerful performance in a unified, cost-effective solution giving OEMs, ODMs, and developers the flexibility to design and create a generation of high-performance everyday robotics and IoT products. The Qualcomm Robotics RB1 combines heterogeneous compute and AI focused performance, communications technologies, and new levels of cost-effectiveness and accessibility for the industry. The platform is optimized for smaller devices and lower power consumption.
This extends to their built-in support for machine vision; support for up to two cameras, providing onboard intelligence to meld this data with other high-fidelity sensors from TDK for applications such as autonomous navigation.
KEY FEATURES:
- Dedicated DSP shared between sensor core and low-power audio subsystem
- Dual-channel non-PoP high-speed memory
