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Aikri QCS2290: Aikri-22X-90AD-4
Aikri-22X-90AD-4 development kit is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 kit comprises Qualcomm® QCS2290-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and Bluetooth 5.0
- OS: Android 12, Kernel 4.19; Dimensions: 85mm x 54mm
Aikri-22X-90AD-4 development kit is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 kit comprises Qualcomm® QCS2290-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and Bluetooth 5.0
- OS: Android 12, Kernel 4.19; Dimensions: 85mm x 54mm
Aikri QCS2290: Aikri-22X-90AS-4
Aikri-22X-90AS-4 System-on-Module (SoM) is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0
- OS: Android 12; Dimensions: 58 mm x 39 mm
Aikri-22X-90AS-4 System-on-Module (SoM) is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0
- OS: Android 12; Dimensions: 58 mm x 39 mm
Aikri QCS405: Aikri-40X-5LD-1
The Aikri-40X-5LD-1 development kit comprises of the Qualcomm® QCS405 based SoM mounted on a carrier board, interfaced with a mezzanine board. All native interfaces that the QCS405 supports, such as GPIOs, USB 3.0, PCIe, HDMI, SDIO, I2S, UART, I2C, and SPI are made available on the development kit. The Aikri development kit with QCS405 helps kick-start and optimize your creation of complex, feature-rich smart-audio solutions such as Smart-speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc. within a short turnaround time.
KEY FEATURES:
- Qualcomm ® Adreno™ 306 GPU; 2x Qualcomm® Hexagon™ QDSP6 v66
- 1GB LPDDR3 and 8GB eMMC; WCN3999: 2x2 WLAN802.11 a/b/g/ac & Bluetooth® 5.0 wireless technology
- OS: Linux, Yocto Thud, Kernel 4.14; Dimensions: 85mm x 54mm
The Aikri-40X-5LD-1 development kit comprises of the Qualcomm® QCS405 based SoM mounted on a carrier board, interfaced with a mezzanine board. All native interfaces that the QCS405 supports, such as GPIOs, USB 3.0, PCIe, HDMI, SDIO, I2S, UART, I2C, and SPI are made available on the development kit. The Aikri development kit with QCS405 helps kick-start and optimize your creation of complex, feature-rich smart-audio solutions such as Smart-speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc. within a short turnaround time.
KEY FEATURES:
- Qualcomm ® Adreno™ 306 GPU; 2x Qualcomm® Hexagon™ QDSP6 v66
- 1GB LPDDR3 and 8GB eMMC; WCN3999: 2x2 WLAN802.11 a/b/g/ac & Bluetooth® 5.0 wireless technology
- OS: Linux, Yocto Thud, Kernel 4.14; Dimensions: 85mm x 54mm
Aikri QCS405: Aikri-40X-5LS-1
The Aikri-40X-5LS-1 System on Module (SoM) is powered by Qualcomm® QCS405 SoC, which is designed specifically for smart audio applications. The QCS405 supports features such as Multi-mic Qualcomm® Noise and Echo Cancellation that isolates noisy environments from voice, simultaneous multi-keyword detection to aid voice services. This production-ready SoM has a Yocto Linux BSP pre-loaded and helps manufacturers easily create complex, feature-rich, and voice-supported smart audio applications such as Smart speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc.
KEY FEATURES:
- Qualcomm® Adreno™ 306 GPU; 2 x Qualcomm® Hexagon™ QDSP6 v66
- 1GB LPDDR3 and 8GB eMMC; WCN3999: 2x2 WLAN802.11 a/b/g/ac & Bluetooth 5.0
- OS: Linux, Yocto Thud, Kernel 4.14; Dimensions: 65.42 mm X 57.82 mm
The Aikri-40X-5LS-1 System on Module (SoM) is powered by Qualcomm® QCS405 SoC, which is designed specifically for smart audio applications. The QCS405 supports features such as Multi-mic Qualcomm® Noise and Echo Cancellation that isolates noisy environments from voice, simultaneous multi-keyword detection to aid voice services. This production-ready SoM has a Yocto Linux BSP pre-loaded and helps manufacturers easily create complex, feature-rich, and voice-supported smart audio applications such as Smart speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc.
KEY FEATURES:
- Qualcomm® Adreno™ 306 GPU; 2 x Qualcomm® Hexagon™ QDSP6 v66
- 1GB LPDDR3 and 8GB eMMC; WCN3999: 2x2 WLAN802.11 a/b/g/ac & Bluetooth 5.0
- OS: Linux, Yocto Thud, Kernel 4.14; Dimensions: 65.42 mm X 57.82 mm
EIC-Q845-210
The Snapdragon® 845 Mobile Platform includes high performance camera and graphics features that are designed to capture advance color information. Qualcomm® Adreno™ 630 GPU and Qualcomm Spectra™ 280 ISP has enabled vivid graphics, crystal-clear audio and improved area awareness, making Snapdragon 845 Mobile Platform ideal for real-life experience solution. To support the ecosystem of technology companies and application providers looking to utilize these advanced features, eInfochips is offering a Hardware Development Kit (HDK) featuring the Snapdragon SDA845 processor. This development kit is designed to help OEMs and device makers in evaluating the processor and peripherals; an ideal starting point for creating high-performance mobile devices, software development and applications.
KEY FEATURES:
- The LCD display is an add-on accessory and not part of the standard kit
The Snapdragon® 845 Mobile Platform includes high performance camera and graphics features that are designed to capture advance color information. Qualcomm® Adreno™ 630 GPU and Qualcomm Spectra™ 280 ISP has enabled vivid graphics, crystal-clear audio and improved area awareness, making Snapdragon 845 Mobile Platform ideal for real-life experience solution. To support the ecosystem of technology companies and application providers looking to utilize these advanced features, eInfochips is offering a Hardware Development Kit (HDK) featuring the Snapdragon SDA845 processor. This development kit is designed to help OEMs and device makers in evaluating the processor and peripherals; an ideal starting point for creating high-performance mobile devices, software development and applications.
KEY FEATURES:
- The LCD display is an add-on accessory and not part of the standard kit
TobuFi
TobuFi is an advanced SOM (system on module) built using the cutting-edge Qualcomm® QCS405 chip and a high-end dual-band Wi-Fi 6 radio powered by Qualcomm® QCN9074 chipset. With an additional WiFi 6 radio, AI and DSP features integrated into the QCS405, TobuFi ensures reliable data transmission and efficient processing that are ideal for robotics and drone applications.Its secondary WiFi and BT radios provide additional versatility and flexibility for development. TobuFi’s interface-rich design offers straightforward integration, while high-end radio supports narrow channels,extended frequency range, and frequency shifting with non-standard center frequencies is ideal for long-range communication even in very noisy environments.
KEY FEATURES:
- Supports narrow channels (5 & 10 MHz) for long-distance communication.
- Qualcomm® QCS405 integrates AI and DSPs for enhanced performance and lower power use.
- Features high-capacity interfaces for audio, video, display, and more.
- WiFi 6: 2.4 & 5GHz
TobuFi is an advanced SOM (system on module) built using the cutting-edge Qualcomm® QCS405 chip and a high-end dual-band Wi-Fi 6 radio powered by Qualcomm® QCN9074 chipset. With an additional WiFi 6 radio, AI and DSP features integrated into the QCS405, TobuFi ensures reliable data transmission and efficient processing that are ideal for robotics and drone applications.Its secondary WiFi and BT radios provide additional versatility and flexibility for development. TobuFi’s interface-rich design offers straightforward integration, while high-end radio supports narrow channels,extended frequency range, and frequency shifting with non-standard center frequencies is ideal for long-range communication even in very noisy environments.
KEY FEATURES:
- Supports narrow channels (5 & 10 MHz) for long-distance communication.
- Qualcomm® QCS405 integrates AI and DSPs for enhanced performance and lower power use.
- Features high-capacity interfaces for audio, video, display, and more.
- WiFi 6: 2.4 & 5GHz
ROS610
The ROS610 DVK is built with SOM610 module which is based on Qualcomm® QCS610, which can support various input and output interface, which is suitable for various high-end consumer Robotics applications.
KEY FEATURES:
- . ROS610 DVK. ROS1 Melodic. ROS2 Foxy
The ROS610 DVK is built with SOM610 module which is based on Qualcomm® QCS610, which can support various input and output interface, which is suitable for various high-end consumer Robotics applications.
KEY FEATURES:
- . ROS610 DVK. ROS1 Melodic. ROS2 Foxy
QCS610 Development board
Versatile development kit based on Qualcomm® QCS610 SOC supporting MIPI DSI to HDMI/MIPI DSI to LVDS, DisplayPort to HDMI, MIPI CSI Samsung S5KGM1 12Mpixel(4K 30fps) camera module (Option), External I2S audio codec (ALC5633Q), USB 3.1, USB 2.0, 6-Axis sensor (BMI160), RGMII interface (KSZ9031 or KSZ9131), Micro SD connector for SD Card and GNSS antenna connector.
Versatile development kit based on Qualcomm® QCS610 SOC supporting MIPI DSI to HDMI/MIPI DSI to LVDS, DisplayPort to HDMI, MIPI CSI Samsung S5KGM1 12Mpixel(4K 30fps) camera module (Option), External I2S audio codec (ALC5633Q), USB 3.1, USB 2.0, 6-Axis sensor (BMI160), RGMII interface (KSZ9031 or KSZ9131), Micro SD connector for SD Card and GNSS antenna connector.
QCS610 SoM 4057
Featuring visual Intelligence platform based on Qualcomm® QCS610 SoC with Qualcomm® Kryo(TM) 460 Octa-core (x2 gold 2.2 GHz and x6 silver 1.8 GHz) CPU, Qualcomm® Hexagon(TM) DSP with dual Hexagon Vector eXtensions (HVX) 1.1 GHz and Qualcomm® Adreno(TM) 612 845 MHz GPU. Integrates a powerful image signal processor (ISP) and the Qualcomm® Artificial Intelligence (AI) Engine, along with a heterogeneous computing architecture. Supports 4K Ultra HD HEVC/VP9 video.
KEY FEATURES:
- Targeting various applications:AI cameraFace ID SystemVehicle top signageHandheld computing deviceNavigation systemVision computing
Featuring visual Intelligence platform based on Qualcomm® QCS610 SoC with Qualcomm® Kryo(TM) 460 Octa-core (x2 gold 2.2 GHz and x6 silver 1.8 GHz) CPU, Qualcomm® Hexagon(TM) DSP with dual Hexagon Vector eXtensions (HVX) 1.1 GHz and Qualcomm® Adreno(TM) 612 845 MHz GPU. Integrates a powerful image signal processor (ISP) and the Qualcomm® Artificial Intelligence (AI) Engine, along with a heterogeneous computing architecture. Supports 4K Ultra HD HEVC/VP9 video.
KEY FEATURES:
- Targeting various applications:AI cameraFace ID SystemVehicle top signageHandheld computing deviceNavigation systemVision computing
IPC610 Open Development Kit based on Qualcomm® QCS610 platform
Powered by the Qualcomm® QCS610 processor (Qualcomm® Vision Intelligence Platform), the IPC610 ODK produced by Altek Corporation is the perfect reference design for the AIoT camera. Combining the Qualcomm® Artificial Intelligence Engine with Altek’s industry expertise in imaging products, this is a best-in-class product for your edge computing needs.
Powered by the Qualcomm® QCS610 processor (Qualcomm® Vision Intelligence Platform), the IPC610 ODK produced by Altek Corporation is the perfect reference design for the AIoT camera. Combining the Qualcomm® Artificial Intelligence Engine with Altek’s industry expertise in imaging products, this is a best-in-class product for your edge computing needs.
Inforce 6701™ Micro System On Module (SOM)
A production ready micro SoM based on Qualcomm® SDA845 SoC that enables an optimized AI performance for a more responsive, power-efficient user-experience and capture of cinema-grade videos in UHD@60fps resolution. Optional SKUs support extended operating temperature range and EMI shielding for better RF noise protection, while also doubling up as a medium for heat spreading and dissipation to further improve performance.
KEY FEATURES:
- Onboard 802.11n/ac MU-MIMO Wi-Fi and BT/LE 5.x via Qualcomm®WCN3990; Enhanced audio via Qualcomm® WCD9340 codec
- Extended lifecycle; OEM engagement options for BTO and custom variants
- Android and Linux BSPs
A production ready micro SoM based on Qualcomm® SDA845 SoC that enables an optimized AI performance for a more responsive, power-efficient user-experience and capture of cinema-grade videos in UHD@60fps resolution. Optional SKUs support extended operating temperature range and EMI shielding for better RF noise protection, while also doubling up as a medium for heat spreading and dissipation to further improve performance.
KEY FEATURES:
- Onboard 802.11n/ac MU-MIMO Wi-Fi and BT/LE 5.x via Qualcomm®WCN3990; Enhanced audio via Qualcomm® WCD9340 codec
- Extended lifecycle; OEM engagement options for BTO and custom variants
- Android and Linux BSPs
Inforce 6701™ SOM Based Reference Design (Development Kit)
The Inforce SYS6701 reference platform for embedded designers couples the Inforce 6701 Micro SoM with a small but complete carrier board to bring out all native interfaces and compute power of the Qualcomm® SDA845 SoC. The easy-to-use platform enables a quick time to market of embedded and IOT products that are based on the SDA845 processor. Inforce’s custom camera modules with up to 4K encode capability are plug-n-play accessories.
KEY FEATURES:
- Qualcomm® AI Engine on-device AI processing deliver richer camera, voice, XR, and gaming experiences
- Simultaneous Concurrent Cameras with Graphics Rendering, Video Processing, and Visual Processing Subsystem
The Inforce SYS6701 reference platform for embedded designers couples the Inforce 6701 Micro SoM with a small but complete carrier board to bring out all native interfaces and compute power of the Qualcomm® SDA845 SoC. The easy-to-use platform enables a quick time to market of embedded and IOT products that are based on the SDA845 processor. Inforce’s custom camera modules with up to 4K encode capability are plug-n-play accessories.
KEY FEATURES:
- Qualcomm® AI Engine on-device AI processing deliver richer camera, voice, XR, and gaming experiences
- Simultaneous Concurrent Cameras with Graphics Rendering, Video Processing, and Visual Processing Subsystem
TurboX C404/C405 Development Kit
The TurboX C404/C405 development kit is designed based on Thundercomm's latest C404/C405 SOM which is intended for use as a smart audio platform. It supports far-field voice, keyword detection, multi-channel echo cancellation, beamforming, and a number of voice services such as Amazon Alexa Voice Services and Google Assistant. With on-device dual DSP, AI enhancement and rich connectivity, customers can develop complex, feature rich, voice-supported smart speaker products that get to market quickly.
The TurboX C404/C405 development kit is designed based on Thundercomm's latest C404/C405 SOM which is intended for use as a smart audio platform. It supports far-field voice, keyword detection, multi-channel echo cancellation, beamforming, and a number of voice services such as Amazon Alexa Voice Services and Google Assistant. With on-device dual DSP, AI enhancement and rich connectivity, customers can develop complex, feature rich, voice-supported smart speaker products that get to market quickly.
TurboX C610/C410 Open Kit
The TurboX C610/C410 SOM is an intelligent vision platform with powerful image processing and machine learning for smart camera and intelligent IoT devices. It’s powered by the Qualcomm® QCS610/QCS410 SoC (System-on-Chip), which is also known as Qualcomm® Vision Intelligence, platform providing a cost-effective solution to accelerate the product development and commercialization process. The C610/C410 SOM supports Linux and Android OS.
The TurboX C610/C410 SOM is an intelligent vision platform with powerful image processing and machine learning for smart camera and intelligent IoT devices. It’s powered by the Qualcomm® QCS610/QCS410 SoC (System-on-Chip), which is also known as Qualcomm® Vision Intelligence, platform providing a cost-effective solution to accelerate the product development and commercialization process. The C610/C410 SOM supports Linux and Android OS.
TurboX D845 SOM
Powerful pre-certified compute SOM featuring Qualcomm® SDA845 SoC is designed for faster processing of neural networks on-device. Supports AI, premium 4K@60fps in HDR, new security layers and both Android and Linux OS.
Powerful pre-certified compute SOM featuring Qualcomm® SDA845 SoC is designed for faster processing of neural networks on-device. Supports AI, premium 4K@60fps in HDR, new security layers and both Android and Linux OS.
TurboX™ D845 Development Kit
Featuring Qualcomm® SDA845 with support for 4K@60fps in HDR, multiple cameras, 4K Ultra HD display @60fps and Qualcomm® Secure Processing Unit (SPU). It is ideal for development of high-performance IoT devices, both Linux and Android.
Featuring Qualcomm® SDA845 with support for 4K@60fps in HDR, multiple cameras, 4K Ultra HD display @60fps and Qualcomm® Secure Processing Unit (SPU). It is ideal for development of high-performance IoT devices, both Linux and Android.
Qualcomm® Robotics RB3 Platform
The RB3 development kit supports the development of smart, power-efficient and cost-effective robots by combining high-performance heterogeneous computing. The kit includes:
1. DragonBoard™ 845c dev board featuring Qualcomm® SDA845 processor
2. Qualcomm® Robotics navigation mezzanine: time-of-flight, tracking, active and main camera
3. ICM-42688 6-Axis High Performance Motion Sensor, ICS-41351 Top Port Digital Microphone, and ICP-10101 Barometric Pressure Sensor
KEY FEATURES:
- Compliant with the 96Boards open hardware specification
The RB3 development kit supports the development of smart, power-efficient and cost-effective robots by combining high-performance heterogeneous computing. The kit includes:
1. DragonBoard™ 845c dev board featuring Qualcomm® SDA845 processor
2. Qualcomm® Robotics navigation mezzanine: time-of-flight, tracking, active and main camera
3. ICM-42688 6-Axis High Performance Motion Sensor, ICS-41351 Top Port Digital Microphone, and ICP-10101 Barometric Pressure Sensor
KEY FEATURES:
- Compliant with the 96Boards open hardware specification
TurboX AI Kit
TurboX™ AI Kit featuring the Qualcomm® SDA845 SoC is designed for on-device AI vision enabled development. This powerful platform helps developers and device manufactures port their AI algorithms and AI applications.
KEY FEATURES:
https://www.thundercomm.com/app_en/store/detail/1536844968290219
TurboX™ AI Kit featuring the Qualcomm® SDA845 SoC is designed for on-device AI vision enabled development. This powerful platform helps developers and device manufactures port their AI algorithms and AI applications.
KEY FEATURES:
https://www.thundercomm.com/app_en/store/detail/1536844968290219
Open-Q™ 9075IQ SOM
The Open-Q Qualcomm Dragonwing™ 9075IQ System-on-Module (SOM) solutions offer scalable, power-efficient, and robust computing capabilities for autonomous devices and next-generation Industry 4.0 designs. These advanced AI-powered SOMs enable a range of critical functionalities, including robust safety features for autonomous mobile robots with enhanced device robustness through fault-tolerant ECC memory support and a dedicated real-time subsystem.
The new SOM series facilitates the deployment of interactive industrial edge AI systems by integrating Large Language Model (LLM) support, achieving a generation rate of up to 22 tokens per second when running the LIama2 7B parameter model.
KEY FEATURES:
- Dragonwing IQ-9075 SoC
- Up to 36GB LPDDR5 SDRAM
- On-device AI Engine up to 100 INT-8 TOPS
- Support up to 16 concurrent cameras
- Multiple PCIe, USB, and CAN-FD interfaces
- 2.5Gbps Time Sensitive Ethernet (TSN)
- Dedicated real-time subsystem
- Qualcomm® Linux
The Open-Q Qualcomm Dragonwing™ 9075IQ System-on-Module (SOM) solutions offer scalable, power-efficient, and robust computing capabilities for autonomous devices and next-generation Industry 4.0 designs. These advanced AI-powered SOMs enable a range of critical functionalities, including robust safety features for autonomous mobile robots with enhanced device robustness through fault-tolerant ECC memory support and a dedicated real-time subsystem.
The new SOM series facilitates the deployment of interactive industrial edge AI systems by integrating Large Language Model (LLM) support, achieving a generation rate of up to 22 tokens per second when running the LIama2 7B parameter model.
KEY FEATURES:
- Dragonwing IQ-9075 SoC
- Up to 36GB LPDDR5 SDRAM
- On-device AI Engine up to 100 INT-8 TOPS
- Support up to 16 concurrent cameras
- Multiple PCIe, USB, and CAN-FD interfaces
- 2.5Gbps Time Sensitive Ethernet (TSN)
- Dedicated real-time subsystem
- Qualcomm® Linux
SNM983
MeiG SNM983 series module is based on the Qualcomm Kryo Gen 6 CPU with a maximum frequency of 2.36 GHz and a 5nm NON-POP process. With Qualcomm Adreno VPU 765, it supports UHD170 video enconding/UHD275 decoding, H.264/H.265. Adreno 663 GPU supports safe GPU compute, up to 840 MHz, OpenGL ES 3.2, Vulkan 1.2, and OpenCL 2.2. Integrated with Qualcomm neural network processing unit Qualcomm® Hexagon™ Tensor Processor, it supports HVX, HMX and models like ONNX, PyTorch, TensorFlow, CAFFE, and TensorFlow Lite, its computing power is up to 100 Tops.
SNM983 series module integrates rich functional interfaces, including DSI, DisplayPort, CSI, PCIe, SGMII, RGMII, UFS, USB, I2C, UART, and SPI interface, etc. Products can be widely used in AI BOX, video bar, VR camera, intelligent robots, intelligent information gathering equipment, live streaming terminals and other products.
KEY FEATURES:
- Kryo Gen 6 CPU with a max frequency of 2.36 GHz
- High AI computations~100 Tops
- Support 10*4K screen display
- Support 4*4-lane MIPI-CSI interfaces
- Support 2*USB 3.1 Gen2, 1*USB2.0
- Support SGMII/RGMII
MeiG SNM983 series module is based on the Qualcomm Kryo Gen 6 CPU with a maximum frequency of 2.36 GHz and a 5nm NON-POP process. With Qualcomm Adreno VPU 765, it supports UHD170 video enconding/UHD275 decoding, H.264/H.265. Adreno 663 GPU supports safe GPU compute, up to 840 MHz, OpenGL ES 3.2, Vulkan 1.2, and OpenCL 2.2. Integrated with Qualcomm neural network processing unit Qualcomm® Hexagon™ Tensor Processor, it supports HVX, HMX and models like ONNX, PyTorch, TensorFlow, CAFFE, and TensorFlow Lite, its computing power is up to 100 Tops.
SNM983 series module integrates rich functional interfaces, including DSI, DisplayPort, CSI, PCIe, SGMII, RGMII, UFS, USB, I2C, UART, and SPI interface, etc. Products can be widely used in AI BOX, video bar, VR camera, intelligent robots, intelligent information gathering equipment, live streaming terminals and other products.
KEY FEATURES:
- Kryo Gen 6 CPU with a max frequency of 2.36 GHz
- High AI computations~100 Tops
- Support 10*4K screen display
- Support 4*4-lane MIPI-CSI interfaces
- Support 2*USB 3.1 Gen2, 1*USB2.0
- Support SGMII/RGMII
AOM-6741
The AOM-6741 is a SMARC 2.2 full-size computer-on-module powered by the Qualcomm Dragonwing IQ-9075 processor. It features octa-core Kryo Gen6 CPUs and a 5th-generation VPU, delivering up to 100 TOPS of edge AI performance. The module supports 4 × 4-lane MIPI-CSI (D-PHY) and 4 × DisplayPort, making it ideal for vision intelligence applications. Ubuntu Pro is supported, providing up to 10 years of Expanded Security Maintenance for Ubuntu Classic LTS.
KEY FEATURES:
- Compact and high performance Edge AI Module, up to 100 TOPS AI computing
- Qualcomm ® DragonWing IQ9075 processor
- 1 x PCIe 3.0 x4, 1 x PCIe 3.0 x2, 2 x USB 3.2 Gen2, 3 x USB2.0, 4 x 4-Lane MIPI-CSI
- Supports Ubuntu 24.04 and Advantech Robotic Suite
The AOM-6741 is a SMARC 2.2 full-size computer-on-module powered by the Qualcomm Dragonwing IQ-9075 processor. It features octa-core Kryo Gen6 CPUs and a 5th-generation VPU, delivering up to 100 TOPS of edge AI performance. The module supports 4 × 4-lane MIPI-CSI (D-PHY) and 4 × DisplayPort, making it ideal for vision intelligence applications. Ubuntu Pro is supported, providing up to 10 years of Expanded Security Maintenance for Ubuntu Classic LTS.
KEY FEATURES:
- Compact and high performance Edge AI Module, up to 100 TOPS AI computing
- Qualcomm ® DragonWing IQ9075 processor
- 1 x PCIe 3.0 x4, 1 x PCIe 3.0 x2, 2 x USB 3.2 Gen2, 3 x USB2.0, 4 x 4-Lane MIPI-CSI
- Supports Ubuntu 24.04 and Advantech Robotic Suite
Thundercomm TurboX I8275 SOM
TurboX I8275 is built as an 82 mm x 50 mm SMARC mechanically compatible edge AI SOM family based on Qualcomm Dragonwing™ IQ8/QCS8275. It is structured to combine AI computing, multi-camera processing, 4K video acceleration, and high-speed expansion for machine vision, robotics and industrial IoT applications. The product family is planned to cover multiple I8275-AC and I8275-AA configurations for different performance and operating-temperature requirements. The initial release will use the I8275-AC configuration, engineered to provide up to 20 TOPS of AI performance, 16 GB LPDDR5X memory, and 128 GB UFS 3.1 storage. Planned I8275-AA variants are designed to extend the family to up to 40 TOPS. Initial I8275-AC SOM samples are targeted for late November to early December 2026, subject to PCB availability, board bring-up and validation.
KEY FEATURES:
- Multi-SKU roadmap covering I8275-AC and I8275-AA
- Up to 20 TOPS at launch, with up to 40 TOPS planned
- 16 GB LPDDR5X and 128 GB UFS 3.1
- Three 4-lane MIPI CSI camera interfaces
- MIPI DSI and DisplayPort 1.4 MST
- Accelerated 4K video encoding and decoding
- PCIe Gen4, USB 3.1/2.0 and Gigabit Ethernet
- External Wi-Fi, Bluetooth® wireless technology and 5G through carrier expansion
- 82 mm x 50 mm SMARC mechanically compatible form factor
- Qualcomm Linux support
TurboX I8275 is built as an 82 mm x 50 mm SMARC mechanically compatible edge AI SOM family based on Qualcomm Dragonwing™ IQ8/QCS8275. It is structured to combine AI computing, multi-camera processing, 4K video acceleration, and high-speed expansion for machine vision, robotics and industrial IoT applications. The product family is planned to cover multiple I8275-AC and I8275-AA configurations for different performance and operating-temperature requirements. The initial release will use the I8275-AC configuration, engineered to provide up to 20 TOPS of AI performance, 16 GB LPDDR5X memory, and 128 GB UFS 3.1 storage. Planned I8275-AA variants are designed to extend the family to up to 40 TOPS. Initial I8275-AC SOM samples are targeted for late November to early December 2026, subject to PCB availability, board bring-up and validation.
KEY FEATURES:
- Multi-SKU roadmap covering I8275-AC and I8275-AA
- Up to 20 TOPS at launch, with up to 40 TOPS planned
- 16 GB LPDDR5X and 128 GB UFS 3.1
- Three 4-lane MIPI CSI camera interfaces
- MIPI DSI and DisplayPort 1.4 MST
- Accelerated 4K video encoding and decoding
- PCIe Gen4, USB 3.1/2.0 and Gigabit Ethernet
- External Wi-Fi, Bluetooth® wireless technology and 5G through carrier expansion
- 82 mm x 50 mm SMARC mechanically compatible form factor
- Qualcomm Linux support
Open-Q™ 6490CS SMARC SOM Development Kit
The Open-Q™ 6490CS SMARC SOM Development Kit is a development platform built to support evaluation and prototyping for Lantronix's SMARC System on Module (SOM) product line. Powered by the Qualcomm Dragonwing™ QCS6490 chipset, the kit is engineered to support proof-of-concept development for computer-vision and multimedia applications. Designed around the standard SMARC form factor, the platform highlights the SOM's capabilities and provides access to interfaces for MIPI CSI cameras, displays, Ethernet, audio, and sensors. The kit serves as a starting point for product evaluation and a reference platform for hardware-integration projects.
KEY FEATURES:
- Up to 8GB LPDDR5 RAM + 64GB UFS
- Additional storage via SD card and NVME
- Multiple D-PHY MIPI camera & Display Ports
- Multiple high speed connectivity options
- Supports SMARC 2.2 SOM
- Android™ 13 and Qualcomm Linux
The Open-Q™ 6490CS SMARC SOM Development Kit is a development platform built to support evaluation and prototyping for Lantronix's SMARC System on Module (SOM) product line. Powered by the Qualcomm Dragonwing™ QCS6490 chipset, the kit is engineered to support proof-of-concept development for computer-vision and multimedia applications. Designed around the standard SMARC form factor, the platform highlights the SOM's capabilities and provides access to interfaces for MIPI CSI cameras, displays, Ethernet, audio, and sensors. The kit serves as a starting point for product evaluation and a reference platform for hardware-integration projects.
KEY FEATURES:
- Up to 8GB LPDDR5 RAM + 64GB UFS
- Additional storage via SD card and NVME
- Multiple D-PHY MIPI camera & Display Ports
- Multiple high speed connectivity options
- Supports SMARC 2.2 SOM
- Android™ 13 and Qualcomm Linux
Open-Q™ 6490CS SMARC SOM
The Open-Q™ 6490CS SMARC SOM is a compute module designed for edge AI and embedded applications such as industrial PCs, robotics, security cameras and video surveillance, retail self-checkout, and video telematics. Based on the Qualcomm Dragonwing™ QCS6490 SoC, the module is built to support AI and machine-learning workloads within a compact SMARC form factor. Built on 6 nm process technology, it supports on-device AI processing, edge computing, Wi‑Fi 6E connectivity, multiple camera interfaces, and up to 4K video encoding and decoding. The pin-compatible Open-Q™ 6490CS SMARC SOM is designed to support product scalability across multiple performance tiers while helping reduce integration effort.
KEY FEATURES:
- Up to 8GB LPDDR5 RAM + 64GB eMMC
- Support UFS and NVMe storage
- Android™ 13 and Qualcomm Linux
- On-device AI Engine up to 12.5 TOPS
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
- SMARC 2.2 form factor
The Open-Q™ 6490CS SMARC SOM is a compute module designed for edge AI and embedded applications such as industrial PCs, robotics, security cameras and video surveillance, retail self-checkout, and video telematics. Based on the Qualcomm Dragonwing™ QCS6490 SoC, the module is built to support AI and machine-learning workloads within a compact SMARC form factor. Built on 6 nm process technology, it supports on-device AI processing, edge computing, Wi‑Fi 6E connectivity, multiple camera interfaces, and up to 4K video encoding and decoding. The pin-compatible Open-Q™ 6490CS SMARC SOM is designed to support product scalability across multiple performance tiers while helping reduce integration effort.
KEY FEATURES:
- Up to 8GB LPDDR5 RAM + 64GB eMMC
- Support UFS and NVMe storage
- Android™ 13 and Qualcomm Linux
- On-device AI Engine up to 12.5 TOPS
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
- SMARC 2.2 form factor
Open-Q 6490CS SOM Development Kit
The Open-Q™ 6490 Development Kit is designed to facilitate easy evaluation and development. The kit includes many standard sockets, enabling customers to choose from a wide range of third-party accessories. The SOM utilizes Qualcomm Technologies’ heterogeneous computing expertise to offer a system-on-chip with multiple specialized processing cores for powerful AI processing, image and graphics processing, and audio processing.
KEY FEATURES:
- Standard M.2 sockets for evaluating Wi-Fi
- TAA/NDAA Compliant
- Android™ 13 and Qualcom Linux OSs
The Open-Q™ 6490 Development Kit is designed to facilitate easy evaluation and development. The kit includes many standard sockets, enabling customers to choose from a wide range of third-party accessories. The SOM utilizes Qualcomm Technologies’ heterogeneous computing expertise to offer a system-on-chip with multiple specialized processing cores for powerful AI processing, image and graphics processing, and audio processing.
KEY FEATURES:
- Standard M.2 sockets for evaluating Wi-Fi
- TAA/NDAA Compliant
- Android™ 13 and Qualcom Linux OSs
Open-Q 6490CS SOM
The Open-Q 6490CS provides flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as AI cameras, video collaboration, industrial handhelds, and video telematics. Based on Qualcomm Dragonwing™ QCS6490 processor, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution.
KEY FEATURES:
- Multiple MIPI camera and display ports
- Up to 8GB LPDDR5 RAM + 64GB eMMC
- Android™ 13 and Qualcomm Linux
- TAA/NDAA Compliant
The Open-Q 6490CS provides flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as AI cameras, video collaboration, industrial handhelds, and video telematics. Based on Qualcomm Dragonwing™ QCS6490 processor, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution.
KEY FEATURES:
- Multiple MIPI camera and display ports
- Up to 8GB LPDDR5 RAM + 64GB eMMC
- Android™ 13 and Qualcomm Linux
- TAA/NDAA Compliant
Open-Q 8550CS SoM
The Open-Q™ 8550CS offers a premium performance level of 55 TOPs, meeting the higher AI/ML requirements for extreme edge computing, including Edge devices, Edge servers and Edge AI boxes. Based on the Qualcomm Dragonwing™ QCS8550 processor, the Open-Q 8550CS offers several benefits: low power consumption with a 4nm process, powerful heterogeneous computing, an 8th-generation AI engine delivering up to 10x performance over the previous generation, enterprise-level connectivity with Wi-Fi 7 supporting up to 5.8Gbps, and best-in-class performance across compute processing, camera, AI, security, and audio.
KEY FEATURES:
- Up to 16GB LPDDR5 RAM + 128GB UFS Flash
- Android™ 13 and Linux Yocto Kirkstone
- On-device AI Engine with Qualcomm Hexagon™ Tensor Processor (HTP)
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
The Open-Q™ 8550CS offers a premium performance level of 55 TOPs, meeting the higher AI/ML requirements for extreme edge computing, including Edge devices, Edge servers and Edge AI boxes. Based on the Qualcomm Dragonwing™ QCS8550 processor, the Open-Q 8550CS offers several benefits: low power consumption with a 4nm process, powerful heterogeneous computing, an 8th-generation AI engine delivering up to 10x performance over the previous generation, enterprise-level connectivity with Wi-Fi 7 supporting up to 5.8Gbps, and best-in-class performance across compute processing, camera, AI, security, and audio.
KEY FEATURES:
- Up to 16GB LPDDR5 RAM + 128GB UFS Flash
- Android™ 13 and Linux Yocto Kirkstone
- On-device AI Engine with Qualcomm Hexagon™ Tensor Processor (HTP)
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
Open-Q 8550CS SoM Development Kit
The Open-Q™ 8550CS SOM Development Kit is designed to facilitate easy evaluation of the key features of the Qualcomm Dragonwing™ QCS8550 processor, such as the Low Power AI subsystem with a dedicated DSP and AI accelerator supporting always-on audio, sensors, contextual data streams, and an always-on camera. The kit supports the evaluation of C-PHY and D-PHY MIPI CSI and GMSL cameras, dual MIPI DSI, DisplayPort, audio, sensors, GNSS, Gigabit Ethernet and many more features.The development kit provides the ideal starting point for evaluating the Open-Q™ 8550CS SOM. The platform consists of Lantronix’s Open-Q™ 8550CS SOM, an open-frame carrier board exposing all the available I/O, and a range of accessories to fast-track your product development.
KEY FEATURES:
- Based on the Qualcomm Dragonwing QCS8550
- Android 13 and Yocto Linux Kirkstone
- Standard M.2 & MikroBUS sockets
The Open-Q™ 8550CS SOM Development Kit is designed to facilitate easy evaluation of the key features of the Qualcomm Dragonwing™ QCS8550 processor, such as the Low Power AI subsystem with a dedicated DSP and AI accelerator supporting always-on audio, sensors, contextual data streams, and an always-on camera. The kit supports the evaluation of C-PHY and D-PHY MIPI CSI and GMSL cameras, dual MIPI DSI, DisplayPort, audio, sensors, GNSS, Gigabit Ethernet and many more features.The development kit provides the ideal starting point for evaluating the Open-Q™ 8550CS SOM. The platform consists of Lantronix’s Open-Q™ 8550CS SOM, an open-frame carrier board exposing all the available I/O, and a range of accessories to fast-track your product development.
KEY FEATURES:
- Based on the Qualcomm Dragonwing QCS8550
- Android 13 and Yocto Linux Kirkstone
- Standard M.2 & MikroBUS sockets
Open-Q AL Development Kit (4290 & 2290 Series)
The Open-Q™ AL development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4290 and 2290 SIP families based on the Qualcomm® QCS4290 processor (Android).
KEY FEATURES:
- Development kit provides interfaces to evaluate camera and video
- Evaluate display on LCD & HDMI
- Supports many robotic features
The Open-Q™ AL development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4290 and 2290 SIP families based on the Qualcomm® QCS4290 processor (Android).
KEY FEATURES:
- Development kit provides interfaces to evaluate camera and video
- Evaluate display on LCD & HDMI
- Supports many robotic features
Open-Q 2290CS™ System-in-Package (SIP)
The Open-Q™ 2290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QCS2290, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.
KEY FEATURES:
- Entry-tier solution delivers greater performance, graphic, and camera capabilities
- Secure compute platform
- Improved power performance
The Open-Q™ 2290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QCS2290, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.
KEY FEATURES:
- Entry-tier solution delivers greater performance, graphic, and camera capabilities
- Secure compute platform
- Improved power performance
Open-Q 4290CS™ System-in-Package (SIP)
The Open-Q™ 4290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QCS4290 chipset utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4290 SIP creates the perfect computing core for a variety of edge AI video analytic applications.
KEY FEATURES:
- Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
- 3rd generation Qualcomm® AI Engine
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Multiple high speed connectivity options
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
The Open-Q™ 4290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QCS4290 chipset utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4290 SIP creates the perfect computing core for a variety of edge AI video analytic applications.
KEY FEATURES:
- Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
- 3rd generation Qualcomm® AI Engine
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Multiple high speed connectivity options
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
Open-Q™ 865 Development Kit
The Open-Q™ 865 Development Kit is a versatile, easy-to-use, exposed board platform, compatible with our production-ready Open-Q 865 family of SOMs. The development kit provides the ideal starting point for evaluating any of the compatible Open-Q 865 family of SOMs or developing next generation embedded and IoT devices. Compatible with the Open-Q 5165RB SOM and Open-Q 865XR SOM.
KEY FEATURES:
- • Compatible with the micro-sized (50x29mm) Open-Q 865 family of SOMs• Open-frame Mini-ITX Form-factor carrier board for evaluation and development• Wi-Fi and Bluetooth antennas on carrier board
The Open-Q™ 865 Development Kit is a versatile, easy-to-use, exposed board platform, compatible with our production-ready Open-Q 865 family of SOMs. The development kit provides the ideal starting point for evaluating any of the compatible Open-Q 865 family of SOMs or developing next generation embedded and IoT devices. Compatible with the Open-Q 5165RB SOM and Open-Q 865XR SOM.
KEY FEATURES:
- • Compatible with the micro-sized (50x29mm) Open-Q 865 family of SOMs• Open-frame Mini-ITX Form-factor carrier board for evaluation and development• Wi-Fi and Bluetooth antennas on carrier board
Open-Q™ 5165RB SOM
The Open-Q™ 5165RB SOM is an ultra-compact (50mm x 29mm) production-ready computing module based on the powerful Qualcomm® QRB5165 System-on-Chip. The QRB5165 utilizes Qualcomm Technologies heterogenous compute expertise to provide an SoC with multiple specialized processing cores such as the 5th gen Qualcomm® AI Engine, hardware video analytics engine, Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP. Coupled with the latest WiFi 6 connectivity and camera features.
KEY FEATURES:
- Qualcomm® QRB5165 chipset
- 8GB LPDDR5 RAM + 128GB UFS Flash
- Ubuntu 18.04 Linux
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Ultra-compact 50 x 29 mm form factor
The Open-Q™ 5165RB SOM is an ultra-compact (50mm x 29mm) production-ready computing module based on the powerful Qualcomm® QRB5165 System-on-Chip. The QRB5165 utilizes Qualcomm Technologies heterogenous compute expertise to provide an SoC with multiple specialized processing cores such as the 5th gen Qualcomm® AI Engine, hardware video analytics engine, Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP. Coupled with the latest WiFi 6 connectivity and camera features.
KEY FEATURES:
- Qualcomm® QRB5165 chipset
- 8GB LPDDR5 RAM + 128GB UFS Flash
- Ubuntu 18.04 Linux
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Ultra-compact 50 x 29 mm form factor
Open-Q™ 8250CS Module/SoM with Qualcomm® QCS8250
The Open-Q™ 8250CS production ready computing SOM delivered with Android™ 13 supports multiple concurrent decode+encode sessions, live tuning for cameras (not customer facing), 2A sync for 2 cameras, UVC/UAC source mode for video collaboration bars to function as a USB class device, low-latency MS codecs and MS Teams video extensions with a roadmap to include background blur and replacement, an AI director framework to track and zoom a camera onto the person speaking and QSAT for smooth zoom.
KEY FEATURES:
- Long life IIoT chipset
- 8GB LPDDR5 RAM + 128GB UFS Flash
- Android™ 13
- On-device AI Engine up to 15 TOPS
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
- Ultra-compact 50 x 29 mm form factor
The Open-Q™ 8250CS production ready computing SOM delivered with Android™ 13 supports multiple concurrent decode+encode sessions, live tuning for cameras (not customer facing), 2A sync for 2 cameras, UVC/UAC source mode for video collaboration bars to function as a USB class device, low-latency MS codecs and MS Teams video extensions with a roadmap to include background blur and replacement, an AI director framework to track and zoom a camera onto the person speaking and QSAT for smooth zoom.
KEY FEATURES:
- Long life IIoT chipset
- 8GB LPDDR5 RAM + 128GB UFS Flash
- Android™ 13
- On-device AI Engine up to 15 TOPS
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
- Ultra-compact 50 x 29 mm form factor
Open-Q™ 610 μSOM
Lantronix’s Open-Q™ 610 μSOM is an ultra-compact (50mm x 25mm) production-ready SOM based on the Qualcomm® QCS610 SOC, with built-in Qualcomm® Neural Processing Engine for on-device edge AI capabilities. Aimed at connected visual intelligence applications, with built-in image sensor processing such as staggered HDR, lens de-warp, dual camera stitching, and image de-fog, the 610 μSOM is the ideal platform for your next smart camera product. Full-featured companion development kit also available.
KEY FEATURES:
- SoC 11nm technology for high performance with low power
- On-device artificial intelligence & machine learning
- Native Ethernet interface for high speed connectivity
- Three camera ports for multi-camera systems
- Yocto Linux or Android 12 with connected camera SDK
- RTSP streaming support with GStreamer
- Multiple options for AI inference engines
Lantronix’s Open-Q™ 610 μSOM is an ultra-compact (50mm x 25mm) production-ready SOM based on the Qualcomm® QCS610 SOC, with built-in Qualcomm® Neural Processing Engine for on-device edge AI capabilities. Aimed at connected visual intelligence applications, with built-in image sensor processing such as staggered HDR, lens de-warp, dual camera stitching, and image de-fog, the 610 μSOM is the ideal platform for your next smart camera product. Full-featured companion development kit also available.
KEY FEATURES:
- SoC 11nm technology for high performance with low power
- On-device artificial intelligence & machine learning
- Native Ethernet interface for high speed connectivity
- Three camera ports for multi-camera systems
- Yocto Linux or Android 12 with connected camera SDK
- RTSP streaming support with GStreamer
- Multiple options for AI inference engines
Open-Q™ 2210 System in Package
The Open-Q™ 2200 Series SIPs are a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QRB2210 (Yocto Linux) processors, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth® wireless technology. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.
KEY FEATURES:
- Entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power
- Secure compute platform
- Extended Operating Temperature (-25C to 85C)
The Open-Q™ 2200 Series SIPs are a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QRB2210 (Yocto Linux) processors, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth® wireless technology. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.
KEY FEATURES:
- Entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power
- Secure compute platform
- Extended Operating Temperature (-25C to 85C)
Open-Q™ 4210 System in Package
The Open-Q™ 4210 Series SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QRB4210 (Yocto Linux) processors utilize Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4200 SIP creates the perfect computing core for a variety of edge AI video analytic applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.
KEY FEATURES:
- Compact SIP with Qualcomm® QRB4210 (Yocto Linux) processors, 8-core 2.0/1.8 GHz processor
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
The Open-Q™ 4210 Series SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QRB4210 (Yocto Linux) processors utilize Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4200 SIP creates the perfect computing core for a variety of edge AI video analytic applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.
KEY FEATURES:
- Compact SIP with Qualcomm® QRB4210 (Yocto Linux) processors, 8-core 2.0/1.8 GHz processor
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
Open Q RB Development Kit
The Open-Q™ RB development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4210 and 2210 SIPs based on the Qualcomm® QRB4210 and Qualcomm® QRB2210 (Yocto Linux) processors. Users can use the same development kit to evaluate or prototype with many SIP families from Lantronix.
KEY FEATURES:
- The development kit provides hardware interfaces to evaluate camera, video, display on LCD and HDMI, and connectivity capabilities
- Supports many robotic features
- User can expand the kit with compatible boards from 96Boards
The Open-Q™ RB development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4210 and 2210 SIPs based on the Qualcomm® QRB4210 and Qualcomm® QRB2210 (Yocto Linux) processors. Users can use the same development kit to evaluate or prototype with many SIP families from Lantronix.
KEY FEATURES:
- The development kit provides hardware interfaces to evaluate camera, video, display on LCD and HDMI, and connectivity capabilities
- Supports many robotic features
- User can expand the kit with compatible boards from 96Boards
Open-Q™ 610 μSOM Development Kit
The Open-Q™ 610 µSOM Development Kit is a versatile, easy-to-use, exposed board platform, powered by our ultra-compact, production-ready, Open-Q™ 610 µSOM. The µSOM is based on the Qualcomm® QCS610 SoC, with built-in Qualcomm® Neural Processing Engine for on-device edge AI capabilities and is aimed at visual intelligence applications.
KEY FEATURES:
- Powered by micro-sized (50x25mm) Open-Q 610 µSOM
- Open-frame Mini-ITX form-factor carrier board for evaluation and development
- Numerous I/O and connectivity options
- USB Type-C, USB Type-A, Gb Ethernet
The Open-Q™ 610 µSOM Development Kit is a versatile, easy-to-use, exposed board platform, powered by our ultra-compact, production-ready, Open-Q™ 610 µSOM. The µSOM is based on the Qualcomm® QCS610 SoC, with built-in Qualcomm® Neural Processing Engine for on-device edge AI capabilities and is aimed at visual intelligence applications.
KEY FEATURES:
- Powered by micro-sized (50x25mm) Open-Q 610 µSOM
- Open-frame Mini-ITX form-factor carrier board for evaluation and development
- Numerous I/O and connectivity options
- USB Type-C, USB Type-A, Gb Ethernet
Open-Q™ 845 µSOM (Micro System on Module)
Lantronix’s Open-Q™ 845 μSOM is an ultra-compact (50mm x 25mm) production-ready SOM based on the powerful Qualcomm® SDA845 SoC. With the 3rd-Gen Qualcomm® AI Platform, Qualcomm Spectra™ ISP, Qualcomm® Kryo™ Octa-core CPU, Qualcomm® Hexagon™ DSP, and the dedicated secure processor, the 845 μSOM is ideal for powering the most advanced robotics, drones, cameras, and embedded IoT devices.
KEY FEATURES:
- Qualcomm® SDA845 processor
- Built on 2nd-Gen 10nm LPP technology
- 4GB or 6GB LPDDR4X + 32GB or 64GB UFS
- 802.11ac 2x2 MU-MIMO Wi-Fi / BT 5.x
- Ultra-compact 50mm x 25mm
Lantronix’s Open-Q™ 845 μSOM is an ultra-compact (50mm x 25mm) production-ready SOM based on the powerful Qualcomm® SDA845 SoC. With the 3rd-Gen Qualcomm® AI Platform, Qualcomm Spectra™ ISP, Qualcomm® Kryo™ Octa-core CPU, Qualcomm® Hexagon™ DSP, and the dedicated secure processor, the 845 μSOM is ideal for powering the most advanced robotics, drones, cameras, and embedded IoT devices.
KEY FEATURES:
- Qualcomm® SDA845 processor
- Built on 2nd-Gen 10nm LPP technology
- 4GB or 6GB LPDDR4X + 32GB or 64GB UFS
- 802.11ac 2x2 MU-MIMO Wi-Fi / BT 5.x
- Ultra-compact 50mm x 25mm
Open-Q 845 µSOM Development Kit
Open-frame carrier board powered by ultra-compact, production-ready, Open-Q 845 μSOM based on Qualcomm® SDA845 SoC, with on-device AI and generous exposed I/Os. Ideal for advanced robotics, drones, cameras, and embedded IoT devices.
Open-frame carrier board powered by ultra-compact, production-ready, Open-Q 845 μSOM based on Qualcomm® SDA845 SoC, with on-device AI and generous exposed I/Os. Ideal for advanced robotics, drones, cameras, and embedded IoT devices.
Arduino UNO Q
Arduino UNO Q’s hybrid design makes it the ideal dual-brain platform for your next innovation. It combines a Linux® Debian-capable Qualcomm Dragonwing™ QRB2210 microprocessor with a real-time STM32U585 microcontroller (MCU). It’s Arduino, it’s a computer, it’s anything you want to build.
KEY FEATURES:
- AI in a blink: Unlock AI-powered vision and sound solutions that react to their environment in real time.Quick start apps: Jumpstart development with plenty of pre-built examples and templates available through Arduino App Lab.Designed to expand: Expandable with Qwiic connector for Modulino nodes, carriers and more.
Arduino UNO Q’s hybrid design makes it the ideal dual-brain platform for your next innovation. It combines a Linux® Debian-capable Qualcomm Dragonwing™ QRB2210 microprocessor with a real-time STM32U585 microcontroller (MCU). It’s Arduino, it’s a computer, it’s anything you want to build.
KEY FEATURES:
- AI in a blink: Unlock AI-powered vision and sound solutions that react to their environment in real time.Quick start apps: Jumpstart development with plenty of pre-built examples and templates available through Arduino App Lab.Designed to expand: Expandable with Qwiic connector for Modulino nodes, carriers and more.
Arduino®️ VENTUNO™ Q
The Arduino®️ VENTUNO™ Q is the edge AI computer that redefines what is possible at the edge, serving as the definitive powerhouse for AI and robotics applications.
At its core lies a revolutionary Dual-Brain architecture: the robust Qualcomm Dragonwing™ IQ-8275 delivers a massive up to 40 dense TOPS of AI compute for advanced computer vision and local LLMs, VLMs, gesture recognition and more, while the dedicated STM32H5 Microcontroller ensures the low-latency precision required for complex motor control and robotics.
Designed for a zero-friction start, the VENTUNO Q ensures you remain connected and ready to execute. It features integrated Wi-Fi® 6 connectivity for fast, reliable data transfer, alongside a suite of built-in connectors, including high-speed USB 3.0, HDMI, 2.5 Gb Ethernet, and expandable NVMe Gen.4 storage, eliminating the need for messy adapters.
Compatible with Arduino® UNO Shields and Carriers, Raspberry Pi Hat and Arduino Modulino Nodes for rapid prototyp and development.
KEY FEATURES:
- Dual-Brain Architecture — Powered by Qualcomm Dragonwing™ IQ8 NPU + STM32H5 MCU
- 40 Dense TOPS NPU for Edge AI — Run local LLMs, VLMs and more AI models on-device
- 16GB RAM + 64GB eMMC — Expandable with M.2 NVMe Gen.4 for memory-intensive AI workloads
- Universal Compatibility — supports Arduino UNO Shields, Carrier, Raspberry Pi Hats, and Modulin
- Production-Ready Connectivity — Wi-Fi 6, 2.5Gb Ethernet, CAN Bus, MIPI camera connector, USB 3.0
- Robotics Control — Support ROS 2, Deterministic, low-latency actuation via MCU
The Arduino®️ VENTUNO™ Q is the edge AI computer that redefines what is possible at the edge, serving as the definitive powerhouse for AI and robotics applications.
At its core lies a revolutionary Dual-Brain architecture: the robust Qualcomm Dragonwing™ IQ-8275 delivers a massive up to 40 dense TOPS of AI compute for advanced computer vision and local LLMs, VLMs, gesture recognition and more, while the dedicated STM32H5 Microcontroller ensures the low-latency precision required for complex motor control and robotics.
Designed for a zero-friction start, the VENTUNO Q ensures you remain connected and ready to execute. It features integrated Wi-Fi® 6 connectivity for fast, reliable data transfer, alongside a suite of built-in connectors, including high-speed USB 3.0, HDMI, 2.5 Gb Ethernet, and expandable NVMe Gen.4 storage, eliminating the need for messy adapters.
Compatible with Arduino® UNO Shields and Carriers, Raspberry Pi Hat and Arduino Modulino Nodes for rapid prototyp and development.
KEY FEATURES:
- Dual-Brain Architecture — Powered by Qualcomm Dragonwing™ IQ8 NPU + STM32H5 MCU
- 40 Dense TOPS NPU for Edge AI — Run local LLMs, VLMs and more AI models on-device
- 16GB RAM + 64GB eMMC — Expandable with M.2 NVMe Gen.4 for memory-intensive AI workloads
- Universal Compatibility — supports Arduino UNO Shields, Carrier, Raspberry Pi Hats, and Modulin
- Production-Ready Connectivity — Wi-Fi 6, 2.5Gb Ethernet, CAN Bus, MIPI camera connector, USB 3.0
- Robotics Control — Support ROS 2, Deterministic, low-latency actuation via MCU
Thundercomm TurboX I8275 Development Kit
TurboX I8275 Development Kit is an evaluation platform designed to accelerate development with the TurboX I8275 SOM family. The initial configuration integrates the I8275-AC SOM, providing up to 20 TOPS of AI performance for machine vision, robotics and industrial IoT evaluation. 2 3 The 120 mm x 100 mm carrier board provides HDMI and DisplayPort outputs, three MIPI CSI camera connectors, multiple USB interfaces, Gigabit Ethernet, M.2 Key M and Key E expansion, a 40-pin expansion connector and 12V power input. Qualcomm® Linux is supported for application development and system evaluation. 4 5 Initial development kit samples are targeted for late November to early December 2026, subject to PCB availability, board bring-up and validation.
KEY FEATURES:
- Initial configuration with the I8275-AC SOM
- Up to 40 TOPS of edge AI performance
- Three 22-pin MIPI CSI camera connectors
- HDMI output and DisplayPort 1.4
- Three USB 3.0 Type-A ports
- One USB 3.0 Type-C and one USB 2.0 Type-A port
- Gigabit Ethernet
- M.2 Key M and M.2 Key E expansion
- 40-pin expansion connector and PWM fan connector
- Qualcomm Linux support
- Compact 120 mm x 100 mm carrier board
TurboX I8275 Development Kit is an evaluation platform designed to accelerate development with the TurboX I8275 SOM family. The initial configuration integrates the I8275-AC SOM, providing up to 20 TOPS of AI performance for machine vision, robotics and industrial IoT evaluation. 2 3 The 120 mm x 100 mm carrier board provides HDMI and DisplayPort outputs, three MIPI CSI camera connectors, multiple USB interfaces, Gigabit Ethernet, M.2 Key M and Key E expansion, a 40-pin expansion connector and 12V power input. Qualcomm® Linux is supported for application development and system evaluation. 4 5 Initial development kit samples are targeted for late November to early December 2026, subject to PCB availability, board bring-up and validation.
KEY FEATURES:
- Initial configuration with the I8275-AC SOM
- Up to 40 TOPS of edge AI performance
- Three 22-pin MIPI CSI camera connectors
- HDMI output and DisplayPort 1.4
- Three USB 3.0 Type-A ports
- One USB 3.0 Type-C and one USB 2.0 Type-A port
- Gigabit Ethernet
- M.2 Key M and M.2 Key E expansion
- 40-pin expansion connector and PWM fan connector
- Qualcomm Linux support
- Compact 120 mm x 100 mm carrier board
EXMP-Q911
This collaboration centers on the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm Dragonwing™ IQ-9075 SoC featuring an 8-core Qualcomm® Kryo™ Gen 6 CPU and a Qualcomm® Adreno™ 663 GPU, enabling 100 TOPS dense or up to 200 TOPS sparse AI compute.
Under defined 30W test scenarios, the EXMP-Q911 achieves up to 10× higher AI inference FPS compared to similar modules when running the YOLOv10n object detection model across 10 concurrent video channels.
Designed for demanding edge workloads, the EXMP-Q911 integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, paired with a rich set of high-speed interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP 1.2, MIPI CSI-2, CAN FD, and more, providing exceptional connectivity and performance density for compact edge AI systems.
KEY FEATURES:
- Powered by : Dragonwing IQ-9075 SoC, compliant with COM-HPC Mini form factor
- Up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI computing power
- 36 GB onboard memory, 128 GB UFS 3.1 storage, 2 x 2.5G Ethernet and 2 x 4-lane MIPI CSI-2 interfaces
- -40°C to 85°C (Ta) operating temperature
This collaboration centers on the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm Dragonwing™ IQ-9075 SoC featuring an 8-core Qualcomm® Kryo™ Gen 6 CPU and a Qualcomm® Adreno™ 663 GPU, enabling 100 TOPS dense or up to 200 TOPS sparse AI compute.
Under defined 30W test scenarios, the EXMP-Q911 achieves up to 10× higher AI inference FPS compared to similar modules when running the YOLOv10n object detection model across 10 concurrent video channels.
Designed for demanding edge workloads, the EXMP-Q911 integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, paired with a rich set of high-speed interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP 1.2, MIPI CSI-2, CAN FD, and more, providing exceptional connectivity and performance density for compact edge AI systems.
KEY FEATURES:
- Powered by : Dragonwing IQ-9075 SoC, compliant with COM-HPC Mini form factor
- Up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI computing power
- 36 GB onboard memory, 128 GB UFS 3.1 storage, 2 x 2.5G Ethernet and 2 x 4-lane MIPI CSI-2 interfaces
- -40°C to 85°C (Ta) operating temperature
Quectel Pi H1 SBC (SG565D)
Quectel Pi H1 is a smart Single-Board Computer (SBC) based on the Qualcomm QCS6490 platform. It integrates a high-performance 64-bit octa-core processor delivering up to 12 TOPS of computing power, along with the Qualcomm Adreno™ 643L GPU. Supporting Yocto Linux, Debian, and Ubuntu operating systems, the product comes equipped with 8 GB of LPDDR4X memory and features a USB Type-C power interface, expandable with external eMMC or SSD storage. It offers dual-band Wi-Fi (2.4 & 5 GHz) compliant with IEEE 802.11a/ b/ g/ n/ ac and Bluetooth 5.0, while enabling dual-display output via DP and LCM or DP and Micro HDMI. Combining powerful performance with rich multimedia capabilities, the Quectel Pi H1 is designed to meet the demands of both industrial and consumer applications for high-speed connectivity, advanced multimedia, and robust computing power.
KEY FEATURES:
- Robust computing power: Up to 12 TOPS, well-suited for most algorithm prototyping & inference applic
- Feature-rich interfaces: USB, Micro HDMI, ADC, audio, Ethernet, camera, PCIe , antenna, etc.
- Dual displays: DP and LCM or DP and Micro HDMI.
- Wireless connectivity: Wi-Fi 5, 802.11a/ b/ g/ n/ ac, delivering enhanced wireless connectivity.
- Multiple operating systems: Yocto Linux/ Debian/ Ubuntu.
- Extended temperature range: For harsh outdoor & industrial use; and withstand ambient temperatures f
- Diverse application scenarios: Edge computing, robotics, industrial automation, multimedia terminals
- High-performance 64-bit octa-core processor, delivering up to 12 TOPS of computing power
- 1 x A78 @ 2.7 GHz + 3 x A78 @ 2.4 GHz + 4 x A55 @ 1.9 GHz
- 32 KB L1I cache, 32 KB L1D cache and 512 KB L2 cache
- Adreno 643L @ 812 MHz
- 8 GB LPDDR4X + 128 GB UFS
- Yocto Linux/ Debian/ Ubuntu*
Quectel Pi H1 is a smart Single-Board Computer (SBC) based on the Qualcomm QCS6490 platform. It integrates a high-performance 64-bit octa-core processor delivering up to 12 TOPS of computing power, along with the Qualcomm Adreno™ 643L GPU. Supporting Yocto Linux, Debian, and Ubuntu operating systems, the product comes equipped with 8 GB of LPDDR4X memory and features a USB Type-C power interface, expandable with external eMMC or SSD storage. It offers dual-band Wi-Fi (2.4 & 5 GHz) compliant with IEEE 802.11a/ b/ g/ n/ ac and Bluetooth 5.0, while enabling dual-display output via DP and LCM or DP and Micro HDMI. Combining powerful performance with rich multimedia capabilities, the Quectel Pi H1 is designed to meet the demands of both industrial and consumer applications for high-speed connectivity, advanced multimedia, and robust computing power.
KEY FEATURES:
- Robust computing power: Up to 12 TOPS, well-suited for most algorithm prototyping & inference applic
- Feature-rich interfaces: USB, Micro HDMI, ADC, audio, Ethernet, camera, PCIe , antenna, etc.
- Dual displays: DP and LCM or DP and Micro HDMI.
- Wireless connectivity: Wi-Fi 5, 802.11a/ b/ g/ n/ ac, delivering enhanced wireless connectivity.
- Multiple operating systems: Yocto Linux/ Debian/ Ubuntu.
- Extended temperature range: For harsh outdoor & industrial use; and withstand ambient temperatures f
- Diverse application scenarios: Edge computing, robotics, industrial automation, multimedia terminals
- High-performance 64-bit octa-core processor, delivering up to 12 TOPS of computing power
- 1 x A78 @ 2.7 GHz + 3 x A78 @ 2.4 GHz + 4 x A55 @ 1.9 GHz
- 32 KB L1I cache, 32 KB L1D cache and 512 KB L2 cache
- Adreno 643L @ 812 MHz
- 8 GB LPDDR4X + 128 GB UFS
- Yocto Linux/ Debian/ Ubuntu*
Atlantik Elektronik – QCS6490 Based Single Board Computer
Atlantik Elektronik offers direct access to compact single board computers (SBCs) based on the Qualcomm Dragonwing™ QCS6490.Targeting Edge AI, computer vision, robotics, smart cameras, industrial IoT, and education, we offer the Thundercomm Rubik Pi 3: a versatile, Raspberry Pi–style SBC suitable for both prototyping and deployment in industrial environments.Available Dragonwing QCS6490 based SBC:Thundercomm Rubik Pi 3 – compact 100 × 75 mm SBC with broad I/O and ecosystem compatibility, designed for seamless integration into embedded systemsThe Rubik Pi 3 is available directly from Atlantik Elektronik, with optional technical support, software configuration, and long-term logistics services.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
Atlantik Elektronik offers direct access to compact single board computers (SBCs) based on the Qualcomm Dragonwing™ QCS6490.Targeting Edge AI, computer vision, robotics, smart cameras, industrial IoT, and education, we offer the Thundercomm Rubik Pi 3: a versatile, Raspberry Pi–style SBC suitable for both prototyping and deployment in industrial environments.Available Dragonwing QCS6490 based SBC:Thundercomm Rubik Pi 3 – compact 100 × 75 mm SBC with broad I/O and ecosystem compatibility, designed for seamless integration into embedded systemsThe Rubik Pi 3 is available directly from Atlantik Elektronik, with optional technical support, software configuration, and long-term logistics services.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
Atlantik Elektronik – QCS6490 Development Kits
Atlantik Elektronik provides access to a curated selection of development kits from leading manufacturers including Qualcomm Technologies, Thundercomm, and Quectel, covering official reference platforms and commercial-grade evaluation systems.Targeting Edge AI, computer vision, robotics, smart cameras, and industrial IoT, these kits are ideal for rapid prototyping, performance evaluation, and design-in of next-generation embedded systems.Available Development Kits:Qualcomm Dragonwing™ RB3 Gen2 (Core and Vision Kits)Thundercomm C6490P Development KitThundercomm C6490 Development KitThundercomm Rubik Pi 3 (Single Board Computer)Quectel SG560D Development KitAll listed kits are available directly from Atlantik Elektronik, with optional services for integration support, BSP and driver assistance, software pre-configuration, and supply logistics.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
Atlantik Elektronik provides access to a curated selection of development kits from leading manufacturers including Qualcomm Technologies, Thundercomm, and Quectel, covering official reference platforms and commercial-grade evaluation systems.Targeting Edge AI, computer vision, robotics, smart cameras, and industrial IoT, these kits are ideal for rapid prototyping, performance evaluation, and design-in of next-generation embedded systems.Available Development Kits:Qualcomm Dragonwing™ RB3 Gen2 (Core and Vision Kits)Thundercomm C6490P Development KitThundercomm C6490 Development KitThundercomm Rubik Pi 3 (Single Board Computer)Quectel SG560D Development KitAll listed kits are available directly from Atlantik Elektronik, with optional services for integration support, BSP and driver assistance, software pre-configuration, and supply logistics.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
Atlantik Elektronik – QCS6490-Based System-on-Modules (SOMs)
Atlantik Elektronik offers direct access to a wide range of Qualcomm Dragonwing™ QCS6490/QCM6490-based System-on-Modules (SOMs) from leading manufacturers such as Thundercomm, Lantronix, Silex, Wireless Mobility, and Quectel.Designed for Edge AI, computer vision, industrial IoT, and robotics, these SOMs provide scalable, production-ready solutions for high-performance embedded applications. Whether for prototyping or full product rollout, we support integration with technical expertise and long-term supply services.Available Dragonwing QCS6490/QCM6490 based SOMs:Thundercomm C6490P / C6490Lantronix OpenQ 6490CS (NDAA and TAA compliant)Silex EP-200QWireless Mobility SUD500Quectel SG560DAll SOMs are available directly from Atlantik Elektronik, with optional support for evaluation, software adaptation, integration, and logistics.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
Atlantik Elektronik offers direct access to a wide range of Qualcomm Dragonwing™ QCS6490/QCM6490-based System-on-Modules (SOMs) from leading manufacturers such as Thundercomm, Lantronix, Silex, Wireless Mobility, and Quectel.Designed for Edge AI, computer vision, industrial IoT, and robotics, these SOMs provide scalable, production-ready solutions for high-performance embedded applications. Whether for prototyping or full product rollout, we support integration with technical expertise and long-term supply services.Available Dragonwing QCS6490/QCM6490 based SOMs:Thundercomm C6490P / C6490Lantronix OpenQ 6490CS (NDAA and TAA compliant)Silex EP-200QWireless Mobility SUD500Quectel SG560DAll SOMs are available directly from Atlantik Elektronik, with optional support for evaluation, software adaptation, integration, and logistics.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
SG882G-AP smart module
SG882G-AP is Quectel’s new generation of flagship Android/Linux smart module. Based on the Qualcomm® QCS8550 IoT chipset with built-in maximum octa-core high-performance CPU, GPU, DPU, VPU, DSP, and ISP. Featuring powerful performance and rich multimedia functions, it is ideal for both industrial and consumer applications requiring high computing power, edge computing and multimedia functions. A rich set of interfaces (such as LCM, Camera, touch panel, I2S, PCIe, UART, USB, I2C, SPI, etc.) extend the applicability of the module to a wide range of M2M applications, including video conference systems, live streaming devices, gaming, edge computing, robots, AR/ VR, intelligent retail, and smart safety.
KEY FEATURES:
- Android/Linux smart module, LGA package, 33 x 39 x 3.85mm. 12GB LPDDR5X + 256GB UFS, Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU. Qualcomm® Hexagon™ DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX). Qualcomm Spectra™ ISP. Adreno 8550 VPU & 1295 DPU. Neural processing unit, Security processing. Video encoder: 4K @ 120 fps; 8K @ 30 fps. Video decoder: 4K @ 240 fps; 8K @ 60fps. Computing power of up to 48 TOPS.
SG882G-AP is Quectel’s new generation of flagship Android/Linux smart module. Based on the Qualcomm® QCS8550 IoT chipset with built-in maximum octa-core high-performance CPU, GPU, DPU, VPU, DSP, and ISP. Featuring powerful performance and rich multimedia functions, it is ideal for both industrial and consumer applications requiring high computing power, edge computing and multimedia functions. A rich set of interfaces (such as LCM, Camera, touch panel, I2S, PCIe, UART, USB, I2C, SPI, etc.) extend the applicability of the module to a wide range of M2M applications, including video conference systems, live streaming devices, gaming, edge computing, robots, AR/ VR, intelligent retail, and smart safety.
KEY FEATURES:
- Android/Linux smart module, LGA package, 33 x 39 x 3.85mm. 12GB LPDDR5X + 256GB UFS, Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU. Qualcomm® Hexagon™ DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX). Qualcomm Spectra™ ISP. Adreno 8550 VPU & 1295 DPU. Neural processing unit, Security processing. Video encoder: 4K @ 120 fps; 8K @ 30 fps. Video decoder: 4K @ 240 fps; 8K @ 60fps. Computing power of up to 48 TOPS.
SE250B4
The SE250B4 series is Telit Cinterion’s second generation of smart modules with Android that supports LTE Cat 4, Wi-Fi and Bluetooth® connectivity, and an embedded GNSS receiver in one package.Powered by the Qualcomm® QCM2290 processor with built-in Qualcomm® Adreno™ 702 GPU, the SE250B4 module is ideal forindustrial and consumer applications requiring highdata rates, multimedia functions and edge computing capabilities.
KEY FEATURES:
- Android and Linux for easy application development
- Enhanced mobile rendering APIs for image and video applications via Adreno 702 GPU
The SE250B4 series is Telit Cinterion’s second generation of smart modules with Android that supports LTE Cat 4, Wi-Fi and Bluetooth® connectivity, and an embedded GNSS receiver in one package.Powered by the Qualcomm® QCM2290 processor with built-in Qualcomm® Adreno™ 702 GPU, the SE250B4 module is ideal forindustrial and consumer applications requiring highdata rates, multimedia functions and edge computing capabilities.
KEY FEATURES:
- Android and Linux for easy application development
- Enhanced mobile rendering APIs for image and video applications via Adreno 702 GPU
EXEC-Q911
The Innodisk EXEC-Q911 is a complete starter kit featuring a COM-HPC Mini Module and carrier board for immediate development and evaluation. The COM-HPC Mini Module leverages Qualcomm’s latest innovation—the Dragonwing™ IQ-9075 SoC—to deliver high AI computing performance with low power consumption. Combined with Innodisk’s comprehensive customization services and self-developed software toolkit, it provides customers with a fast, time-to-market solution to stay ahead in the edge AI era.
Innodisk leverages this innovation to develop the EXEC-Q911 starter kit, integrating a COM-HPC Mini Module and carrier board to deliver ready-to-use, high-performance, reliable, and scalable on-device AI computing with low power consumption at the edge.
KEY FEATURES:
- Ready-to-use starter kit with COM-HPC Mini Module and carrier board
- Up to 36 GB onboard memory and 128 GB UFS 3.1 storage
- Dual 2.5G Ethernet and dual 4-lane MIPI CSI-2 interfaces
- Industrial-grade design with operating temperature range from -40°C to 85°C (Ta)
- Long-term chipset longevity supported through 2038
The Innodisk EXEC-Q911 is a complete starter kit featuring a COM-HPC Mini Module and carrier board for immediate development and evaluation. The COM-HPC Mini Module leverages Qualcomm’s latest innovation—the Dragonwing™ IQ-9075 SoC—to deliver high AI computing performance with low power consumption. Combined with Innodisk’s comprehensive customization services and self-developed software toolkit, it provides customers with a fast, time-to-market solution to stay ahead in the edge AI era.
Innodisk leverages this innovation to develop the EXEC-Q911 starter kit, integrating a COM-HPC Mini Module and carrier board to deliver ready-to-use, high-performance, reliable, and scalable on-device AI computing with low power consumption at the edge.
KEY FEATURES:
- Ready-to-use starter kit with COM-HPC Mini Module and carrier board
- Up to 36 GB onboard memory and 128 GB UFS 3.1 storage
- Dual 2.5G Ethernet and dual 4-lane MIPI CSI-2 interfaces
- Industrial-grade design with operating temperature range from -40°C to 85°C (Ta)
- Long-term chipset longevity supported through 2038
QSM560DR
The QSM560DR is a high-performance 5G smart control panel from Quectel, built on the SG560D smart module and powered by 64-bit octa-core QCM6490/QCS6490 processors with Adreno 643 GPU, supporting both Ubuntu and Android operating systems. Designed for industrial and consumer applications, it supports 3GPP Release 15, 5G NSA/SA, 4G/3G fallback, Wi-Fi 6E, 2x2 MU-MIMO, and Bluetooth 5.2, making it suitable for high-speed data, edge computing, and multimedia tasks. The module supports 5G/LTE MIMO technology for optimized data transfer and features integrated multi-constellation GNSS (GPS, GLONASS, BDS, NavIC, Galileo, QZSS, SBAS) for precise positioning. With a rich set of interfaces including HDMI, eDP, Ethernet, USB, CAN, RS-232, and RS-485, it fits seamlessly into a wide range of edge computing use cases such as robotics, smart retail, industrial automation, and safety systems.
KEY FEATURES:
- Small form factor Single Board Computer
The QSM560DR is a high-performance 5G smart control panel from Quectel, built on the SG560D smart module and powered by 64-bit octa-core QCM6490/QCS6490 processors with Adreno 643 GPU, supporting both Ubuntu and Android operating systems. Designed for industrial and consumer applications, it supports 3GPP Release 15, 5G NSA/SA, 4G/3G fallback, Wi-Fi 6E, 2x2 MU-MIMO, and Bluetooth 5.2, making it suitable for high-speed data, edge computing, and multimedia tasks. The module supports 5G/LTE MIMO technology for optimized data transfer and features integrated multi-constellation GNSS (GPS, GLONASS, BDS, NavIC, Galileo, QZSS, SBAS) for precise positioning. With a rich set of interfaces including HDMI, eDP, Ethernet, USB, CAN, RS-232, and RS-485, it fits seamlessly into a wide range of edge computing use cases such as robotics, smart retail, industrial automation, and safety systems.
KEY FEATURES:
- Small form factor Single Board Computer
RUBIK Pi 3
RUBIK Pi 3, a lightweight development board based on Qualcomm® QCS6490 platform, is the first Pi built on Qualcomm® AI platforms for developers.RUBIK Pi 3 supports multiple operating systems such as Android / Linux / LU, with SDKs from Thundercomm to provide developers with better experience. With excellent AI performance at 12 TOPS, QCS6490 can be paired with Qualcomm® AI Hub for allowing developers to personally experience the impact of AI evolution.RUBIK Pi 3 boasts rich interfaces and functions with support of USB Type-A (1x 2.0, 2x 3.0), USB 3.1 Gen 1 Type-C with DP (4K@60), Camera, HDMI OUT (4K@30), 1000M Ethernet port, 40pin header connector, 3.5mm headphone jack, Wi-Fi 5, BT 5.2, M.2 M-key connector, Micro USB and RTC, etc., to meet diverse development needs. It also has designed interfaces and is compatible with a variety of Raspberry Pi peripheral accessories, which helps reduce implementation difficulty and cost for developers.
KEY FEATURES:
- First upstream version based on Qualcomm® QCS6490 platform for developers
- Compatible with Raspberry Pi accessories
- 12 Tops AI capability, Deploy 1.8B LLM
- C5430P/6490P/C8550 SOM are P2P compatible
- Minimalist design, affordable price
RUBIK Pi 3, a lightweight development board based on Qualcomm® QCS6490 platform, is the first Pi built on Qualcomm® AI platforms for developers.RUBIK Pi 3 supports multiple operating systems such as Android / Linux / LU, with SDKs from Thundercomm to provide developers with better experience. With excellent AI performance at 12 TOPS, QCS6490 can be paired with Qualcomm® AI Hub for allowing developers to personally experience the impact of AI evolution.RUBIK Pi 3 boasts rich interfaces and functions with support of USB Type-A (1x 2.0, 2x 3.0), USB 3.1 Gen 1 Type-C with DP (4K@60), Camera, HDMI OUT (4K@30), 1000M Ethernet port, 40pin header connector, 3.5mm headphone jack, Wi-Fi 5, BT 5.2, M.2 M-key connector, Micro USB and RTC, etc., to meet diverse development needs. It also has designed interfaces and is compatible with a variety of Raspberry Pi peripheral accessories, which helps reduce implementation difficulty and cost for developers.
KEY FEATURES:
- First upstream version based on Qualcomm® QCS6490 platform for developers
- Compatible with Raspberry Pi accessories
- 12 Tops AI capability, Deploy 1.8B LLM
- C5430P/6490P/C8550 SOM are P2P compatible
- Minimalist design, affordable price
TurboX C865C SOM
TurboX C865C SOM (System on Module) is a high-performance intelligent module based on Qualcomm® QCS8250 processor. It has integrated Android and the advanced 7nm Fin FET processor, a customized 64-bit Octa-core Qualcomm® Kryo™ 585 application processor.
TurboX C865C SOM supports wide-range Wi-Fi, Wi-Fi6 (Wi-Fi 802.11 a/b/g/n/ac/ax) . It supports one 4K@60FPS or two 4K@30FPS display, as well as multi-camera concurrency. It also integrates multiple audio and video input/output interfaces. TurboX C865C SOM provides a variety of GPIO, I2C, UART and SPI standard interfaces.
In addition, it supports four 4-lane MIPI-CSIs (D-PHY) and one 3-lane MIPI-CSI (C-PHY) together with SOM common standard protocol interfaces such as USB3.1, PCIE2.1/3.0 and I2S.
TurboX C865C SOM provides convenient and stable system solutions for IoT (Internet of Things) application. It can be embedded into devices including VR/AR, Robot, Smart Camera, AI devices, drones and medical devices.
KEY FEATURES:
- Qualcomm® Hexagon™ DSP with quad HVX
- Support one C-PHY Camera, up to 64MP sensor
- Long life cycle, up to 2028
- Support one 4K@60FPS or two 4K@30FPS display
- Wi-Fi 802.11a/b/g/n/ac/ax
TurboX C865C SOM (System on Module) is a high-performance intelligent module based on Qualcomm® QCS8250 processor. It has integrated Android and the advanced 7nm Fin FET processor, a customized 64-bit Octa-core Qualcomm® Kryo™ 585 application processor.
TurboX C865C SOM supports wide-range Wi-Fi, Wi-Fi6 (Wi-Fi 802.11 a/b/g/n/ac/ax) . It supports one 4K@60FPS or two 4K@30FPS display, as well as multi-camera concurrency. It also integrates multiple audio and video input/output interfaces. TurboX C865C SOM provides a variety of GPIO, I2C, UART and SPI standard interfaces.
In addition, it supports four 4-lane MIPI-CSIs (D-PHY) and one 3-lane MIPI-CSI (C-PHY) together with SOM common standard protocol interfaces such as USB3.1, PCIE2.1/3.0 and I2S.
TurboX C865C SOM provides convenient and stable system solutions for IoT (Internet of Things) application. It can be embedded into devices including VR/AR, Robot, Smart Camera, AI devices, drones and medical devices.
KEY FEATURES:
- Qualcomm® Hexagon™ DSP with quad HVX
- Support one C-PHY Camera, up to 64MP sensor
- Long life cycle, up to 2028
- Support one 4K@60FPS or two 4K@30FPS display
- Wi-Fi 802.11a/b/g/n/ac/ax
TurboX C865C Development Kit
Thundercomm TurboX C865C Development Kit is based on the TurboX C865C SOM that facilitates accelerated development of innovative, power-efficient, high computing robots and drones for enterprise, industrial, and professional service applications.
At the heart of the kit is the Qualcomm® QCS8250 processor. Customized for robotics applications, this processor offers powerful heterogeneous computing architecture that delivers 15 Tera Operations Per Second of compute. It also offers incredible ML (Machine Learning) accuracy, a powerful ISP (Image Signal Processor) with support for multi concurrent cameras, a dedicated computer vision engine for EVA (Enhanced Video Analytics), as well as the new HTA (Hexagon™ Tensor Accelerator). Its fifth-generation Qualcomm® AI Engine powers inferencing and accuracy with the dedicated HTA. With long life support to 2028.
KEY FEATURES:
- Advance Imaging capability
- On-device intelligence powered by Qualcomm Artificial Intelligence (AI) Engine
- Advanced connectivity
- Heterogenous computing with efficient power budgets
- Flexible design options for commercialization
- Advance Security
Thundercomm TurboX C865C Development Kit is based on the TurboX C865C SOM that facilitates accelerated development of innovative, power-efficient, high computing robots and drones for enterprise, industrial, and professional service applications.
At the heart of the kit is the Qualcomm® QCS8250 processor. Customized for robotics applications, this processor offers powerful heterogeneous computing architecture that delivers 15 Tera Operations Per Second of compute. It also offers incredible ML (Machine Learning) accuracy, a powerful ISP (Image Signal Processor) with support for multi concurrent cameras, a dedicated computer vision engine for EVA (Enhanced Video Analytics), as well as the new HTA (Hexagon™ Tensor Accelerator). Its fifth-generation Qualcomm® AI Engine powers inferencing and accuracy with the dedicated HTA. With long life support to 2028.
KEY FEATURES:
- Advance Imaging capability
- On-device intelligence powered by Qualcomm Artificial Intelligence (AI) Engine
- Advanced connectivity
- Heterogenous computing with efficient power budgets
- Flexible design options for commercialization
- Advance Security
TurboX C6490P SOM
TurboX C6490P System on Module (SOM) integrates a high-performance and power-efficient Qualcomm® 6nm QCS6490 SoC with strong computing power (12.5 TOPS). This SOM supports 4K@60FPS video decoding, 4K@30FPS video encoding, five MIPI CSI interfaces, and rich external interfaces (GPIO, UART, I2C, I3C, SPI, USB 3.1, PCIe). TurboX C6490P SOM is a high-performance IoT intelligent module that can be used in industrial handheld device, industrial tablet, service robot, industrial robot, and edge computing. Customers can use its hardware interfaces and software SDK for functional verification and rapid prototyping.
TurboX C6490P SOM is pin-to-pin compatible with the TurboX C8550 SOM, with a more compact design and smaller size. It forms a high-AI performance module series matrix with the C8550 SOM, accelerating customer product iteration cycles and saving secondary development costs.
KEY FEATURES:
- Excellent heat dissipation (non-pop)
- Superior computing capability (12.5 TOPS)
- Pin to Pin compatible with TurboX C5430P & C8550 SOM
- Five MIPI-CSIs, compatible to support two C-PHY camera
- Long life cycle: 2028
TurboX C6490P System on Module (SOM) integrates a high-performance and power-efficient Qualcomm® 6nm QCS6490 SoC with strong computing power (12.5 TOPS). This SOM supports 4K@60FPS video decoding, 4K@30FPS video encoding, five MIPI CSI interfaces, and rich external interfaces (GPIO, UART, I2C, I3C, SPI, USB 3.1, PCIe). TurboX C6490P SOM is a high-performance IoT intelligent module that can be used in industrial handheld device, industrial tablet, service robot, industrial robot, and edge computing. Customers can use its hardware interfaces and software SDK for functional verification and rapid prototyping.
TurboX C6490P SOM is pin-to-pin compatible with the TurboX C8550 SOM, with a more compact design and smaller size. It forms a high-AI performance module series matrix with the C8550 SOM, accelerating customer product iteration cycles and saving secondary development costs.
KEY FEATURES:
- Excellent heat dissipation (non-pop)
- Superior computing capability (12.5 TOPS)
- Pin to Pin compatible with TurboX C5430P & C8550 SOM
- Five MIPI-CSIs, compatible to support two C-PHY camera
- Long life cycle: 2028
TurboX C6490P Development Kit
TurboX C6490P development kit is a hardware and software development kit based on the C6490P smart module. It integrates a high-performance and power-efficient 6nm Qualcomm® QCS6490 SoC with strong computing power (12.5 TOPS). It has the ability of 4K@60FPS decode and 4K@30FPS encode. The C6490P DK provides a rich set of interfaces for customers to evaluate performance in different application scenarios, including 2 x 1000M RJ45 Ethernet ports, 7 x USB Type-A ports, HDMI IN, HDMI OUT, 3 x MIPI camera connectors, and 2 x GMSL camera connectors. The C6490P SOM is the best platform choice for IoT products with high AI performance requirements, such as industrial handheld devices, industrial tablets, service robots, industrial robots, and edge computing.
KEY FEATURES:
- Excellent Heat Dissipation (non-pop)
- Pin-to-pin compatible with TurboX C5430P/C8550 SOM
- Superior computing capability (12.5 TOPS)
- Long life cycle: 2028
TurboX C6490P development kit is a hardware and software development kit based on the C6490P smart module. It integrates a high-performance and power-efficient 6nm Qualcomm® QCS6490 SoC with strong computing power (12.5 TOPS). It has the ability of 4K@60FPS decode and 4K@30FPS encode. The C6490P DK provides a rich set of interfaces for customers to evaluate performance in different application scenarios, including 2 x 1000M RJ45 Ethernet ports, 7 x USB Type-A ports, HDMI IN, HDMI OUT, 3 x MIPI camera connectors, and 2 x GMSL camera connectors. The C6490P SOM is the best platform choice for IoT products with high AI performance requirements, such as industrial handheld devices, industrial tablets, service robots, industrial robots, and edge computing.
KEY FEATURES:
- Excellent Heat Dissipation (non-pop)
- Pin-to-pin compatible with TurboX C5430P/C8550 SOM
- Superior computing capability (12.5 TOPS)
- Long life cycle: 2028
TurboX C8550 Development Kit
Thundercomm TurboX C8550 Development Kit is a high performance Development Kit which is powered by next Gen Flagship Qualcomm® QCS8550 processor. It supports Android, featuring in advanced AI increases, huge camera and video advancements and evolved graphics capability. It is an ideal platform for IoT products require high computing power, advanced camera capability, and superior graphics performance.
TurboX C8550 Development Kit supports customers accelerate product development process and can be widely used in Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots (AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing and other application scenarios.
KEY FEATURES:
It can be used to develop Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots(AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing etc.
Thundercomm TurboX C8550 Development Kit is a high performance Development Kit which is powered by next Gen Flagship Qualcomm® QCS8550 processor. It supports Android, featuring in advanced AI increases, huge camera and video advancements and evolved graphics capability. It is an ideal platform for IoT products require high computing power, advanced camera capability, and superior graphics performance.
TurboX C8550 Development Kit supports customers accelerate product development process and can be widely used in Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots (AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing and other application scenarios.
KEY FEATURES:
It can be used to develop Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots(AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing etc.
5G Mezz package(Sub-6G only, Japan&Korea), Thundercomm T55M
With 5G mezzanine board and Thundercomm 5G NR module T55M-EA, offers the 5G NR Sub-6GHz connectivity in Asia on core kit or vision kit.
With 5G mezzanine board and Thundercomm 5G NR module T55M-EA, offers the 5G NR Sub-6GHz connectivity in Asia on core kit or vision kit.
