---
title: "Development Hardware"
url: "https://www.qualcomm.com/internet-of-things/industries/smart-homes/hardware"
---

# Development Hardware

Your fastest path to development. Start prototyping with tested hardware kits, boards, SOMs and reference designs.

- All Products
- Development Kits
- Evaluation Boards
- Reference Design Platforms
- Single-Board Computers
- System-on-Modules

96 products

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## All hardware
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### [Aikri QCS8550: Aikri-85X-50LD-16-W](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1VQo0000058z0DMAQ)
The Aikri 8550 dev kit is based on Aikri System on Module powered by the Qualcomm® QCS8550 platform. The dev kit is an ideal choice to kick-start development of a wide range of performance heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming.

KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Linux Kernel 5.15; Dimensions: 160 x 75 mm

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: Development Kits
Buy Now

### [Aikri QCS8550: Aikri-85X-50LD-8-4](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1VQo0000058zeXMAQ)
The Aikri 8550 smart camera dev kit is based on Aikri System on Module powered by the Qualcomm® QCS8550 platform. The dev kit is an ideal choice to kick-start development of a wide range of performance heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming. The Aikri 8550 SoM, with multiple camera and display interfaces provides concurrent processing capabilities of multiple video streams up to 4K120 decode/encode to enable smart camera use-cases on this dev kit.

KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x and 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 172 x 75 mm

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: System-on-Modules
Buy Now

### [Aikri QCS8550: Aikri-85X-50AD-16-W](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1VQo0000058ylhMAA)
The Aikri 8550 dev kit is based on Aikri System on Module powered by the Qualcomm® QCS8550 platform. The dev kit is an ideal choice to kick-start development of a wide range of performance heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming.

KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 160 x 75 mm

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: Development Kits
Buy Now

### [Aikri QCS8550: Aikri-85X-50LD-8](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1VQo0000058y5lMAA)
The Aikri 8550 dev kit is based on Aikri System on Module powered by the Qualcomm® QCS8550 platform. The dev kit is an ideal choice to kick-start development of a wide range of performance heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming.

KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x and 128GB UFS 3.1; OS: Linux Kernerl 5.15; Dimensions: 160 x 75 mm

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: Development Kits
Buy Now

### [Aikri QCS8550: Aikri-85X-50LD-16](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1VQo0000058yNVMAY)
The Aikri 8550 dev kit is based on Aikri System on Module powered by the Qualcomm® QCS8550 platform. The dev kit is an ideal choice to kick-start development of a wide range of performance heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming.

KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x and 128GB UFS 3.1; OS: Linux Kernel 5.15; Dimensions: 160 x 75 mm

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: Development Kits
Buy Now

### [Aikri QCS8550: Aikri-85X-50AD-16](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1VQo0000058yaPMAQ)
The Aikri 8550 dev kit is based on Aikri System on Module powered by the Qualcomm® QCS8550 platform. The dev kit is an ideal choice to kick-start development of a wide range of performance heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming.

KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x and 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 160 x 75 mm

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: Development Kits
Buy Now

### [Aikri QCS8550: Aikri-85X-50AS-16-W](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1VQo0000058sLKMAY)
eInfochips Aikri 8550 SoM is powered by the Qualcomm® QCS8550 processor, a 4nm processor with superior performance, powerful computing, and extreme edge AI processing. The Aikri 8550 SoM is the best fit for designing heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming.

KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 40.27 x 33.41mm LGA

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: System-on-Modules
Buy Now

### [Aikri QCS8550: Aikri-85X-50LS-16-W](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1VQo0000058tcLMAQ)
eInfochips Aikri 8550 SoM is powered by the Qualcomm® QCS8550 processor, a 4nm processor with superior performance, powerful computing, and extreme edge AI processing. The Aikri 8550 SoM is the best fit for designing heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming.

KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Linux Kernel5.15; Dimensions: 40.27 x 33.41mm LGA

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: System-on-Modules
Buy Now

### [Aikri QCS8550: Aikri-85X-50LS-8](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1VQo0000058soLMAQ)
eInfochips Aikri 8550 SoM is powered by the Qualcomm® QCS8550 processor, a 4nm processor with superior performance, powerful computing, and extreme edge AI processing. The Aikri 8550 SoM is the best fit for designing heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming.

KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x; 128GB UFS 3.1; OS: Linux,Kernel5.15; Dimensions: 40.27 x 33.41mm LGA

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: System-on-Modules
Buy Now

### [Aikri QCS8550: Aikri-85X-50AS-16](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1VQo00000583AlMAI)
eInfochips Aikri 8550 SoM is powered by the Qualcomm® QCS8550 processor, a 4nm processor with superior performance, powerful computing, and extreme edge AI processing. The Aikri 8550 SoM is the best fit for designing heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming.

KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x; 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 40.27 x 33.41mm LGA

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: System-on-Modules
Buy Now

### [Aikri QCS8550: Aikri-85X-50LS-16](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1VQo0000057qQVMAY)
eInfochips Aikri 8550 SoM is powered by the Qualcomm® QCS8550 processor, a 4nm processor with superior performance, powerful computing, and extreme edge AI processing. The Aikri 8550 SoM is the best fit for designing heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming.

KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x; 128GB UFS 3.1; OS: Linux,Kernel5.15; Dimensions: 40.27 x 33.41mm LGA

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: System-on-Modules
Buy Now

### [Aikri QCS6490: Aikri-64X-90LS-8](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X00000BFbQYUA1)
eInfochips Aikri 6490 SoM is powered by the Qualcomm® QCS6490 processor, a 6nm processor with superior performance, power efficiency and powerful computing. The Aikri 6490 SoM is the best fit for designing Transportation & Logistics, Smart Warehousing, Retail, Manufacturing, Healthcare, and Ecommerce solutions including ruggedized handhelds and tablets, kiosks, industrial scanners, point of sale systems and human machine interface systems.

KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ GPU, Adreno VPU, Adreno DPU and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- 8GB LPDDR5 and 128GB UFS; OS: Linux

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490)
Type: System-on-Modules
Buy Now

### [Aikri QCS8550: Aikri-85X-50AD-8](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X00000BFbQdUAL)
The Aikri 8550 dev kit is based on Aikri System on Module powered by the Qualcomm® QCS8550 platform. The dev kit is an ideal choice to kick-start development of a wide range of performance heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming.

KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x and 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 160 x 75 mm

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: Development Kits
Buy Now

### [Aikri QCS6490: Aikri-64X-90AS-8](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X00000BFbQTUA1)
eInfochips Aikri 6490 SoM is powered by the Qualcomm® QCS6490 processor, a 6nm processor with superior performance, power efficiency and powerful computing. The Aikri 6490 SoM is the best fit for designing Transportation & Logistics, Smart Warehousing, Retail, Manufacturing, Healthcare, and Ecommerce solutions including ruggedized handhelds and tablets, kiosks, industrial scanners, point of sale systems and human machine interface systems.

KEY FEATURES:
- Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, 633 VPU, 1075 DPU and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- 8GB LPDDR5 and 128GB UFS; OS: Android 13.0

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490)
Type: System-on-Modules
Buy Now

### [Aikri QCS8550: Aikri-85X-50AS-8](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X00000BFbQPUA1)
eInfochips Aikri 8550 SoM is powered by the Qualcomm® QCS8550 processor, a 4nm processor with superior performance, powerful computing, and extreme edge AI processing. The Aikri 8550 SoM is the best fit for designing heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming.

KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x and 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 40.27 x 33.41mm LGA

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: System-on-Modules
Buy Now

### [Aikri QCS6490: Aikri-64X-90AD-8-1](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X00000BFbQOUA1)
The Aikri 6490 video collaboration dev kit is based on the Aikri System on Module powered by the Qualcomm® QCS6490 platform. The dev kit is an ideal choice to kick-start development of Transportation & Logistics, Smart Warehousing, Retail, Manufacturing, Healthcare, and Ecommerce solutions including ruggedized handhelds and tablets, kiosks, industrial scanners, point of sale systems and human machine interface systems.

KEY FEATURES:
- Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU, and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- Running on Android 13

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490)
Type: Development Kits
Buy Now

### [Aikri QRB4210 Display Kit: Aikri-42X-10LD-3-1](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X00000BFbQJUA1)
Aikri-42X-10LD-3-1, Aikri 4210 display development kit , comprises of Aikri 4210 SoM based on Qualcomm® QRB4210, a carrier board, and a mezzanine board. The Aikri 4210 display dev kit can also be completely powered from battery power. It is an ideal choice to kick-start the development of industrial handhelds, smart cameras, robotics, security panels, digital signage, and healthcare solutions.

KEY FEATURES:
- Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU; Qualcomm Spectra™ 340T ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Linux, Yocto Dunfell; Dimensions: 85mm x 54mm

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QRB4210](https://www.qualcomm.com/internet-of-things/products/q4-series/qrb4210)
Type: Development Kits
Buy Now

### [Camera Reference Designs](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X00000BFRoFUAX)
eInfochips has vast experience and in-depth expertise in designing and delivering camera solutions across a wide range of Qualcomm Technologies processors, to cater to applications such as Connected cameras, Video analytics, Security, and Surveillance. Our reference designs for smart camera solutions are ready-to-use, cost-effective, versatile, and an excellent choice for original equipment manufacturers (OEMs) to kick-start prototype development of their next-generation cameras. We also provide a software framework that allows you to configure your underlying camera sensors.Our reference designs include cameras with 360° field of view (FoV), multiple high-resolution concurrent streaming and capture capabilities, and stereoscopic vision. We provide enhanced support services.

KEY FEATURES:
- Services to enable RAW, Bayer, or YUV sensors; ToF sensors
- Integration with all necessary camera firmware components; Camera firmware upgrades on-field; ONVIF compliance
- HDR enabling and improvement; Camera sensor tuning

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS610,](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs610) [QRB4210](https://www.qualcomm.com/internet-of-things/products/q4-series/qrb4210)
Type: Reference Design Platforms

### [Aikri QRB2210: Aikri-22X-10LD-3](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000009KXd4UAG)
Aikri-22X-10LD-3 development kit is based on Qualcomm® QRB2210 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QRB2210 kit comprises Qualcomm® QRB2210-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0
- OS: Linux, Yocto Dunfell, Kernel 5.4; Dimensions: 85mm x 54mm

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QRB2210](https://www.qualcomm.com/internet-of-things/products/q2-series/qrb2210)
Type: Development Kits
Buy Now

### [Aikri QCS4290: Aikri-42X-90AD-4](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000009KXcuUAG)
Aikri-42X-90AD-4 development kit is based on Qualcomm® QCS4290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its three 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS4290 kit comprises Qualcomm® QCS4290-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Android 12; Dimensions: 85mm x 54mm

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS4290](https://www.qualcomm.com/internet-of-things/products/q4-series/qcs4290)
Type: Development Kits
Buy Now

### [Aikri QCS2290: Aikri-22X-90AD-4](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000009KXczUAG)
Aikri-22X-90AD-4 development kit is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 kit comprises Qualcomm® QCS2290-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and Bluetooth 5.0
- OS: Android 12, Kernel 4.19; Dimensions: 85mm x 54mm

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS2290](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290)
Type: Development Kits
Buy Now

### [Aikri QRB4210: Aikri-42X-10LD-3](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000009KXcpUAG)
Aikri-42X-10LD-3 development kit is based on Qualcomm® QRB4210 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its three 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QRB4210 kit comprises Qualcomm® QRB4210-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

KEY FEATURES:
- Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra 340T ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Linux, Yocto Dunfell; Dimensions: 85mm x 54mm

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QRB4210](https://www.qualcomm.com/internet-of-things/products/q4-series/qrb4210)
Type: Development Kits
Buy Now

### [Aikri QRB2210: Aikri-22X-10LS-3](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000009KXcfUAG)
Aikri-22X-10LS-3 System-on-Module (SoM) is based on Qualcomm® QRB2210 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QRB2210 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT 5.0
- OS: Linux, Yocto Dunfell; Dimensions: 58 mm x 39 mm

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QRB2210](https://www.qualcomm.com/internet-of-things/products/q2-series/qrb2210)
Type: System-on-Modules
Buy Now

### [Aikri QCS2290: Aikri-22X-90AS-4](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000009KXcaUAG)
Aikri-22X-90AS-4 System-on-Module (SoM) is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0
- OS: Android 12; Dimensions: 58 mm x 39 mm

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS2290](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290)
Type: System-on-Modules
Buy Now

### [Aikri QCS4290: Aikri-42X-90AS-4](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000009KXcVUAW)
Aikri-42X-90AS-4 System-on-Module (SoM) is based on Qualcomm® QCS4290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its three 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS4290 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT 5.1
- OS: Android 12; Dimensions: 58 mm x 39 mm

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QCS4290](https://www.qualcomm.com/internet-of-things/products/q4-series/qcs4290)
Type: System-on-Modules
Buy Now

### [Aikri QRB4210: Aikri-42X-10LS-3](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000009KXcQUAW)
Aikri-42X-10LS-3 System-on-Module (SoM) is based on Qualcomm® QRB4210 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its three 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QRB4210 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

KEY FEATURES:
- Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra 340T ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1x1 802.11a/b/g/n/ac and BT 5.1
- OS: Linux, Yocto Dunfell; Dimensions: 58 mm x 39 mm

By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc)
Chipset: [QRB4210](https://www.qualcomm.com/internet-of-things/products/q4-series/qrb4210)
Type: System-on-Modules
Buy Now

### [Open-Q 6490CS SOM](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc.id-a1VQo00000DrMPVMA3)
Overview | Specifications

The Open-Q 6490CS provides flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as AI cameras, video collaboration, industrial handhelds, and video telematics. Based on Qualcomm Dragonwing™ QCS6490 processor, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution.

KEY FEATURES:
- Multiple MIPI camera and display ports
- Up to 8GB LPDDR5 RAM + 64GB eMMC
- Android™ 13 and Qualcomm Linux
- TAA/NDAA Compliant

By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc)
Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490)
Type: System-on-Modules
Buy Now

### [Open-Q 8550CS SoM](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc.id-a1VQo00000Ctq0fMAB)
Overview | Specifications

The Open-Q™ 8550CS offers a premium performance level of 55 TOPs, meeting the higher AI/ML requirements for extreme edge computing, including Edge devices, Edge servers and Edge AI boxes. Based on the Qualcomm Dragonwing™ QCS8550 processor, the Open-Q 8550CS offers several benefits: low power consumption with a 4nm process, powerful heterogeneous computing, an 8th-generation AI engine delivering up to 10x performance over the previous generation, enterprise-level connectivity with Wi-Fi 7 supporting up to 5.8Gbps, and best-in-class performance across compute processing, camera, AI, security, and audio.

KEY FEATURES:
- Up to 16GB LPDDR5 RAM + 128GB UFS Flash
- Android™ 13 and Linux Yocto Kirkstone
- On-device AI Engine with Qualcomm Hexagon™ Tensor Processor (HTP)
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options

By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: System-on-Modules

### [Open-Q 6490CS SOM Development Kit](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc.id-a1VQo00000Dqrf6MAB)
Overview | Specifications

The Open-Q™ 6490 Development Kit is designed to facilitate easy evaluation and development. The kit includes many standard sockets, enabling customers to choose from a wide range of third-party accessories. The SOM utilizes Qualcomm Technologies’ heterogeneous computing expertise to offer a system-on-chip with multiple specialized processing cores for powerful AI processing, image and graphics processing, and audio processing.

KEY FEATURES:
- Standard M.2 sockets for evaluating Wi-Fi
- TAA/NDAA Compliant
- Android™ 13 and Qualcom Linux OSs

By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc)
Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490)
Type: Development Kits

### [Open-Q 8550CS SoM Development Kit](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc.id-a1VQo00000CtoriMAB)
The Open-Q™ 8550CS SOM Development Kit is designed to facilitate easy evaluation of the key features of the Qualcomm Dragonwing™ QCS8550 processor, such as the Low Power AI subsystem with a dedicated DSP and AI accelerator supporting always-on audio, sensors, contextual data streams, and an always-on camera. The kit supports the evaluation of C-PHY and D-PHY MIPI CSI and GMSL cameras, dual MIPI DSI, DisplayPort, audio, sensors, GNSS, Gigabit Ethernet and many more features.The development kit provides the ideal starting point for evaluating the Open-Q™ 8550CS SOM. The platform consists of Lantronix’s Open-Q™ 8550CS SOM, an open-frame carrier board exposing all the available I/O, and a range of accessories to fast-track your product development.

KEY FEATURES:
- Based on the Qualcomm Dragonwing QCS8550
- Android 13 and Yocto Linux Kirkstone
- Standard M.2 & MikroBUS sockets

By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: Development Kits
Buy Now

### [Open-Q AL Development Kit (4290 & 2290 Series)](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc.id-a1V8X000008Pp4nUAC)
The Open-Q™ AL development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4290 and 2290 SIP families based on the Qualcomm® QCS4290 processor (Android).

KEY FEATURES:
- Development kit provides interfaces to evaluate camera and video
- Evaluate display on LCD & HDMI
- Supports many robotic features

By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc)
Chipset: [QCS4290,](https://www.qualcomm.com/internet-of-things/products/q4-series/qcs4290) [QCS2290](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290)
Type: Development Kits

### [Open-Q 2290CS™ System-in-Package (SIP)](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc.id-a1V8X000008Pp3zUAC)
Overview | Specifications

The Open-Q™ 2290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QCS2290, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.

KEY FEATURES:
- Entry-tier solution delivers greater performance, graphic, and camera capabilities
- Secure compute platform
- Improved power performance

By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc)
Chipset: [QCS2290](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290)
Type: System-on-Modules

### [Open-Q 4290CS™ System-in-Package (SIP)](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc.id-a1V8X000008PozOUAS)
Overview | Specifications

The Open-Q™ 4290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QCS4290 chipset utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4290 SIP creates the perfect computing core for a variety of edge AI video analytic applications.

KEY FEATURES:
- Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
- 3rd generation Qualcomm® AI Engine
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Multiple high speed connectivity options
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027

By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc)
Chipset: [QCS4290](https://www.qualcomm.com/internet-of-things/products/q4-series/qcs4290)
Type: System-on-Modules

### [Open-Q™ 4210 System in Package](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc.id-a1V8X000006N1xrUAC)
Overview | Specifications

The Open-Q™ 4210 Series SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QRB4210 (Yocto Linux) processors utilize Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4200 SIP creates the perfect computing core for a variety of edge AI video analytic applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.

KEY FEATURES:
- Compact SIP with Qualcomm® QRB4210 (Yocto Linux) processors, 8-core 2.0/1.8 GHz processor
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027

By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc)
Chipset: [QRB4210](https://www.qualcomm.com/internet-of-things/products/q4-series/qrb4210)
Type: System-on-Modules

### [Open-Q™ 2210 System in Package](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc.id-a1V8X000006N1xwUAC)
Overview | Specifications

The Open-Q™ 2200 Series SIPs are a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QRB2210 (Yocto Linux) processors, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth® wireless technology. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.

KEY FEATURES:
- Entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power
- Secure compute platform
- Extended Operating Temperature (-25C to 85C)

By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc)
Chipset: [QRB2210](https://www.qualcomm.com/internet-of-things/products/q2-series/qrb2210)
Type: System-on-Modules
Buy Now

### [Open Q RB Development Kit](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc.id-a1V8X000006N1hPUAS)
The Open-Q™ RB development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4210 and 2210 SIPs based on the Qualcomm® QRB4210 and Qualcomm® QRB2210 (Yocto Linux) processors. Users can use the same development kit to evaluate or prototype with many SIP families from Lantronix.

KEY FEATURES:
- The development kit provides hardware interfaces to evaluate camera, video, display on LCD and HDMI, and connectivity capabilities
- Supports many robotic features
- User can expand the kit with compatible boards from 96Boards

By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc)
Chipset: [QRB2210,](https://www.qualcomm.com/internet-of-things/products/q2-series/qrb2210) [QRB4210](https://www.qualcomm.com/internet-of-things/products/q4-series/qrb4210)
Type: Development Kits

### [Arduino UNO Q](https://www.qualcomm.com/support/partner/member-directory/member.arduino-srl.id-a1VQo00000UK8o9MAD)
Overview | Specifications

Arduino UNO Q’s hybrid design makes it the ideal dual-brain platform for your next innovation. It combines a Linux® Debian-capable Qualcomm Dragonwing™ QRB2210 microprocessor with a real-time STM32U585 microcontroller (MCU). It’s Arduino, it’s a computer, it’s anything you want to build.

KEY FEATURES:
- AI in a blink: Unlock AI-powered vision and sound solutions that react to their environment in real time.Quick start apps: Jumpstart development with plenty of pre-built examples and templates available through Arduino App Lab.Designed to expand: Expandable with Qwiic connector for Modulino nodes, carriers and more.

By [ARDUINO S.R.L.](https://www.qualcomm.com/support/partner/member-directory/member.arduino-srl)
Chipset: [QRB2210](https://www.qualcomm.com/internet-of-things/products/q2-series/qrb2210)
Type: Development Kits
Buy Now

### [Qualcomm® RB3 Gen 2 Development Kit (Lite)](https://www.qualcomm.com/developer/hardware/rb3-gen-2-development-kit)
IoT development kit designed for high-performance compute, accessibility, and flexible and customizable features. The Qualcomm® RB3 Gen 2 Lite Development Kit gives developers a valuable combination of impressive performance and customizable features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation. The Qualcomm RB3 Gen 2 Lite is based on the Qualcomm Dragonwing™ processor. This processor’s scalable performance is designed to deliver superior features and performance across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications. This includes support for Wi-Fi 6E for ubiquitous coverage, a unified software stack, powerful AI, and expanded interfaces across ecosystems. - Key Features: Based on the Qualcomm Dragonwing™ QCS5430 processor. Support for Wi-Fi 6E for ubiquitous coverage. Across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications.

KEY FEATURES:
- Based on the Qualcomm Dragonwing™ QCS5430 processor. Support for Wi-Fi 6E for ubiquitous coverage. Across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications.

By QUALCOMM
Chipset: [QCS5430](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430)
Type: Development Kits
Buy Now

### [TRIA SM2S-QCS6490](https://www.qualcomm.com/support/partner/member-directory/member.tria.id-a1VQo000001OIG9MAO)
Overview | Specifications

The TRIA SM2S-QCS6490 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS6490 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS6490 integrates Qualcomm® Kryo™ 670 CPU which contains up to eight cores: four Arm® Cortex®-A78 cores, four Arm® Cortex®-A55 cores, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K60 and many different display connictities (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with upto 12 TOPS at low power and massive camera support with 4 MIPI-CSI inputs.

KEY FEATURES:
- Quad core Arm Cortex-A78 up to 2.7GHz
- And Quad core Arm Cortex-A55 @ 1.95GHz
- Adreno 643 GPU @ 812MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 12(15) TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- Display up to FHD+144Hz
- Video up to 4k30(E)/4K60(D)
- 5xUSB 2.0, 2x USB 3.1
- 2x PCIe Gen3 x1, 1x PCIe Gen3 x2
- 1x MIPI-DSI or LVDS
- 1x DP 1.4 (2 lane) + 1x eDP/DP
- 4x MIPI-CSI Camera Interface
- WLAN/BT Wireless Module (option)
- 2x Gigabit Ethernet
- 2x I2S Audio Interface
- 4x UART, 2x SPI, 2x CAN2.0-FD
- 5x I²C
- HW Key manager and ECC, Secure boot, Crypto engines, etc.
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)

By [TRIA](https://www.qualcomm.com/support/partner/member-directory/member.tria)
Chipset: [QCS6490,](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) [QCS5430](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430)
Type: Single-Board Computers
Buy Now

### [TRIA SM2S-QCS5430](https://www.qualcomm.com/support/partner/member-directory/member.tria.id-a1VQo000001OIHlMAO)
Overview | Specifications

The MSC SM2S-QCS5430 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS5430 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS5430 integrates Qualcomm® Kryo™ 670 CPU which contains up to six cores, Qualcomm® Adreno™ 642L GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K30 and many different display connectivity (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with up to 3.5 TOPS at low power and massive camera support with 4 MIPI-CSI inputs

KEY FEATURES:
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
- Dual core Arm Cortex-A78 up to 2.1GHz
- Adreno 642L GPU @ 315MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 3.5 TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- 4x MIPI-CSI Camera Interface
- Video up to 4k30(E)/4K30(D)
- 5xUSB 2.0, 2x USB 3.1
- 1x MIPI-DSI or LVDS

By [TRIA](https://www.qualcomm.com/support/partner/member-directory/member.tria)
Chipset: [QCS6490,](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) [QCM5430](https://www.qualcomm.com/developer/software/android-on-dragonwing)
Type: Single-Board Computers
Buy Now

### [Kiteboard 2290 SOM](https://www.qualcomm.com/support/partner/member-directory/member.innominds-software-inc.id-a1VJx00000fM85mMAC)
Overview | Specifications

The Kiteboard 2290 is a cost-efficient, production-ready System-on-Module (SOM) based on the Qualcomm® Dragonwing™ QCS2290 SoC. Designed in an ultra-small form factor with integrated compute and connectivity, it enables OEMs, entrepreneurs, and device makers to build custom connected devices for vertical-specific solutions. Available in both Wi-Fi only and LTE variants, the Kiteboard 2290 is optimized for cost-efficient, feature-rich IoT deployments and enables OEMs and ODMs to rapidly develop and commercialize smart devices such as industrial handhelds, retail POS systems, connected cameras, and asset-tracking solutions while accelerating time-to-market.

KEY FEATURES:
- Ultra small form factor
- Integrated with Digital FM Technology
- Reference design for offroad vehicle telematics
- Reference design for field diagnostics device
- Reference design for two-wheeler device cluster
- Integrated LTE Cat 4 modem with Dual SIM (DSDS) support
- Azure/AWS cloud orchestration for device provisioning and management

By [INNOMINDS SOFTWARE, INC.](https://www.qualcomm.com/support/partner/member-directory/member.innominds-software-inc)
Chipset: [QCM2290,](https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290) [QCS2290,](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290) [QRB2210](https://www.qualcomm.com/internet-of-things/products/q2-series/qrb2210)
Type: System-on-Modules

### [Quectel Pi H1 SBC (SG565D)](https://www.qualcomm.com/support/partner/member-directory/member.quectel-wireless-solutions-co-ltd.id-a1VJx00000dohbBMAQ)
Overview | Specifications

Quectel Pi H1 is a smart Single-Board Computer (SBC) based on the Qualcomm QCS6490 platform. It integrates a high-performance 64-bit octa-core processor delivering up to 12 TOPS of computing power, along with the Qualcomm Adreno™ 643L GPU. Supporting Yocto Linux, Debian, and Ubuntu operating systems, the product comes equipped with 8 GB of LPDDR4X memory and features a USB Type-C power interface, expandable with external eMMC or SSD storage. It offers dual-band Wi-Fi (2.4 & 5 GHz) compliant with IEEE 802.11a/ b/ g/ n/ ac and Bluetooth 5.0, while enabling dual-display output via DP and LCM or DP and Micro HDMI. Combining powerful performance with rich multimedia capabilities, the Quectel Pi H1 is designed to meet the demands of both industrial and consumer applications for high-speed connectivity, advanced multimedia, and robust computing power.

KEY FEATURES:
- Robust computing power: Up to 12 TOPS, well-suited for most algorithm prototyping & inference applic
- Feature-rich interfaces: USB, Micro HDMI, ADC, audio, Ethernet, camera, PCIe , antenna, etc.
- Dual displays: DP and LCM or DP and Micro HDMI.
- Wireless connectivity: Wi-Fi 5, 802.11a/ b/ g/ n/ ac, delivering enhanced wireless connectivity.
- Multiple operating systems: Yocto Linux/ Debian/ Ubuntu.
- Extended temperature range: For harsh outdoor & industrial use; and withstand ambient temperatures f
- Diverse application scenarios: Edge computing, robotics, industrial automation, multimedia terminals
- High-performance 64-bit octa-core processor, delivering up to 12 TOPS of computing power
- 1 x A78 @ 2.7 GHz + 3 x A78 @ 2.4 GHz + 4 x A55 @ 1.9 GHz
- 32 KB L1I cache, 32 KB L1D cache and 512 KB L2 cache
- Adreno 643L @ 812 MHz
- 8 GB LPDDR4X + 128 GB UFS
- Yocto Linux/ Debian/ Ubuntu*

By [QUECTEL WIRELESS SOLUTIONS CO., LTD.](https://www.qualcomm.com/support/partner/member-directory/member.quectel-wireless-solutions-co-ltd)
Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490)
Type: Single-Board Computers

### [SagireEdge™ AI 600 Development Kit](https://www.qualcomm.com/support/partner/member-directory/member.sagire-ai-inc.id-a1VQo000004K9uUMAS)
The SagireEdge™ AI 600 Development Kit (DK) is an open-frame platform that combines the production ready SagireEdge™ AI 600 SOM with a SMARC complaint carrier board providing numerous expansion options to support development and testing of peripherals and applications.​

KEY FEATURES:
- SagireEdge AI 600 SOM & open chassis carrier board powered by the Qualcomm Dragonwing™ QCS6490 SoCPreloaded with a Ubuntu Linux O/S

By [SAGIRE AI INC.](https://www.qualcomm.com/support/partner/member-directory/member.sagire-ai-inc)
Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490)
Type: Development Kits

### [SagireEdge™ AI 600 System On Module](https://www.qualcomm.com/support/partner/member-directory/member.sagire-ai-inc.id-a1VQo000004K8H2MAK)
The SagireEdge™ AI 600 SOM is an industrial grade production ready module based upon Qualcomm Dragonwing™ QCS6490 System on Chip (SoC). It enables low power, compute intensive camera and Edge AI Applications with up to 12 TOPS.The Smart Mobility ARChitecture (SMARC) compliant form factor is designed to enable digital transformation optimized at the edge for size, weight, power and cost sensitive applications. The standardized format of the SMARC SOM facilitates fast development and enables new designs to be quickly created, resulting in significantly reduced time to market.

KEY FEATURES:
- 8GB RAM/128GB UFS Flash in a µMCP packageExtensive range of I/O, including Ethernet, USB3.1, Wi-Fi 6E and BT 5.2, MIPI-CSI, eDP, CAN, and PCIe Extended temperature range

By [SAGIRE AI INC.](https://www.qualcomm.com/support/partner/member-directory/member.sagire-ai-inc)
Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490)
Type: System-on-Modules

### [KIMQ 8550](https://www.qualcomm.com/support/partner/member-directory/member.hsptek-joint-stock-company.id-a1VQo000002dzNRMAY)
The KIMQ 8550, on Qualcomm® QCS8550, features an 8-core Qualcomm® Kryo™ CPU (4 Gold cores at 2.1 GHz, 4 Silver cores at 1.9 GHz), an AI Core achieving 48 TOPs (INT8), and a GPU delivering 12 TOPs (FP16) for efficient processing of AI applications. It supports Ubuntu 20.04, Android 13, up to 128GB memory, and offers various connectivity options: 2x Soundwire, 4x Dmic, 1x USB 3.1, 1x USB 2.0, 3x USB 3.0, 2x PCIe Gen3, SDIO, LAN Ethernet 2.5Gbps, and 3 MIPI CSI 4-lane cameras. Operating in temperatures from -25°C to 85°C, it is ideal for automation, healthcare, and smart city applications with its robust connectivity, durability, and advanced AI capabilities.

KEY FEATURES:
- KIMQ 8550 boasts powerful processing with an 6 Core Kyro CPU, its AI core supports 48 TOPS(INT8) for enhanced AI/ML/LLM, supported unbutu/Adroid/Linux. Connectivity options include USB ports, PCIe, MIPI, CSI... All in compact size 40x47x5.3mm design. It compatibility with KIMQ 6490 and 5430

By [HSPTEK JOINT STOCK COMPANY](https://www.qualcomm.com/support/partner/member-directory/member.hsptek-joint-stock-company)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: System-on-Modules
Buy Now

### [KIMQ 5430](https://www.qualcomm.com/support/partner/member-directory/member.hsptek-joint-stock-company.id-a1VQo000002RfPJMA0)
KIMQ 5430 is designed and developed by HSPTEK on the Qualcomm® QCS5430 with a 6nm manufacturing process, with high performance, energy saving and strong computing power (3.5 TOPs). This SOM supports 4K@60FPS video decoding, 4K@30FPS video encoding, three MIPI CSI interfaces, and supports diverse external interfaces (GPIO, UART, I2C, I3C, SPI, USB 3.0).KIMQ 5430 helps customers accelerate product development and can be used in handheld and tablet devices, industrial scanners, dash cams, drones. Besides, with powerful AI processing capabilities at the edge, KIMQ 5430 is developed for products such as AI Camera, AI Box, and other AI processing devices at the edge….

KEY FEATURES:
- Ultra-compact AI computer, 40x47mm size. Modular design with plug-and-play pins. Decodes video at 250FPS FHD, AI processing at 3.5 TOPS. No maintenance, high stability. Supports AI model conversion & optimization. AI Hub with KIMQ-compatible models.

By [HSPTEK JOINT STOCK COMPANY](https://www.qualcomm.com/support/partner/member-directory/member.hsptek-joint-stock-company)
Chipset: [QCS5430](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430)
Type: System-on-Modules
Buy Now

### [KIMQ 6490](https://www.qualcomm.com/support/partner/member-directory/member.hsptek-joint-stock-company.id-a1VQo000002ReufMAC)
KIMQ 6490 is designed and developed by HSPTEK on the Snapdragon® SoC (QCS6490) platform with a 6nm manufacturing process, with high performance, energy saving and strong computing power (12 TOPs). This SOM supports 4K@60FPS video decoding, 4K@30FPS video encoding, three MIPI CSI interfaces, and supports diverse external interfaces (GPIO, UART, I2C, I3C, SPI, USB 3.0).KIMQ 6490 supports customers in accelerating the product development process and is applied in many fields such as specialized handheld devices, tablets, and payment devices. Besides, with powerful AI processing capabilities at the edge, KIMQ 6490 is developed for products such as AI Camera, AI Box, and other AI processing devices at the edge….

KEY FEATURES:
- Ultra-compact size 40x47mm. Modular design with plug-and-play pins. Decodes video at 250 FPS FHD, AI processing at 12 TOPS. No maintenance, high stability. Supports AI model conversion & optimization. AI Hub with KIMQ-compatible models.

By [HSPTEK JOINT STOCK COMPANY](https://www.qualcomm.com/support/partner/member-directory/member.hsptek-joint-stock-company)
Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490)
Type: System-on-Modules
Buy Now

### [MitySOM-QC6490/5430 Development Kit](https://www.qualcomm.com/support/partner/member-directory/member.critical-link-llc.id-a1VQo00000TCCpVMAX)
The MitySOM-QC6490/5430 Development Kit supports Critical Link’s Qualcomm Dragonwing QCS6490 and QCS5430-based system on modules.Each Dev Kit comes complete with all the connectivity needed in any application well suited for the MitySOM-QC6490/5430, including an on-board UART to Micro-USB Port, dual USB 2.0 Host Ports, one 3.1 USB Type-C with Display Port, one 1.4 Display Port connector, five MIPI camera interface ports, one 8-bit eMMC up to 64GB and one 3.5mm 4-conductor audio interface. The kit also includes an E-key M.2 connector, a 2 channel PCIe port, and two 34-pin 0.1” headers with direct connections to the QCS6490/5430 processor supporting GPIO, SPI, I2C, SoundWire, I2S and Slimbus peripherals.Additional details can be found at https://www.criticallink.com/product/mitysom-qc6490-5430-development-kit/

KEY FEATURES:
- Full-featured development kit for Critical Link's QCS6490 and QCS5430-based system on modules
- MitySOM system on modules are production-ready industrial solutions, designed for long term availability and performance
- Developers have access to dev board design files to jump start their own baseboard design, as well as lifetime access to Critical Link's wiki-based support as well as our US-based engineering support team

By [CRITICAL LINK LLC](https://www.qualcomm.com/support/partner/member-directory/member.critical-link-llc)
Chipset: [QCS6490,](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) [QCS5430](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430)
Type: Development Kits

### [MitySOM-QC6490 / 5430](https://www.qualcomm.com/support/partner/member-directory/member.critical-link-llc.id-a1VQo00000TC2esMAD)
The MitySOM-QC6490 / 5430 is a system on module family featuring a Qualcomm Dragonwing™ QCS6490 or Dragonwing QCS5430 processor with on-board power supplies, an LPDDR5 RAM memory subsystem, and a UFS configuration memory. Specifications: Dragonwing QCS6490 or Dragonwing QCS5430 SoC Processor. - Memory: 8 GB LPDDR5, 256GB Flash. - Power: 5-12Vdc Input, generated on board. - Interfaces: 2x PCIe Gen 3 (1x 1 lane, 1x 2), 5x MIPI x4 input + DSI output, USB 3.1 Gen 2, USB 2.0. - Mechanical: 45mm x 45mm (1.77″ x 1.77″).

KEY FEATURES:
- Production-ready system on module
- Expanded interfaces for industrial use cases
- Long-term support expected through July 2036 with the Critical Link Product Longevity Program

By [CRITICAL LINK LLC](https://www.qualcomm.com/support/partner/member-directory/member.critical-link-llc)
Chipset: [QCS6490,](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) [QCS5430](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430)
Type: System-on-Modules

### [COREXOM R6490WGQ SOM](https://www.qualcomm.com/support/partner/member-directory/member.coretronic-reality-inc.id-a1VQo000001LfvdMAC)
COREXOM R6490WGQ SOM – Powered by the Qualcomm® QCS6490 SoC, the R6490WGQ SOM features the Qualcomm® Kryo™ 670 CPU and a fused AI-accelerator in the Qualcomm® Hexagon™ processor, offering exceptional computational power with energy efficiency. It supports up to five MIPI CSI interfaces, triple ISPs, 4K@60FPS video decoding, and 4K@30FPS encoding. With a wide range of external interfaces like GPIO, UART, I2C, SPI, DSI, USB 3.1, and PCIe, plus integrated GPS and Wi-Fi 6E/Bluetooth, it’s ideal for complex IoT applications.Supporting Android, Ubuntu, Linux, and Windows 11 IoT Enterprise, this SOM is designed to reduce design complexity and speed up time to market. It’s perfect for rugged handhelds, tablets, POS, kiosks, AI Box, AI cameras, robotics, and HMI, enabling developers to efficiently bring innovative products to market.

KEY FEATURES:
- High Performance Qualcomm® 6nm QCS6490 SoC
- 8G / 128GB uMCP
- AI Performance: Up to 12 TOPS
- Five 4-lane MIPI-CSIs; 3x ISP@22MP, 2x IFE lite
- Support Wi-Fi 6E / BT, and GPS
- Supports Android, Linux, Ubuntu, Windows 11 IoT Enterprise

By [CORETRONIC REALITY INC.](https://www.qualcomm.com/support/partner/member-directory/member.coretronic-reality-inc)
Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490)
Type: System-on-Modules

### [AGC6490 Robot Board](https://www.qualcomm.com/support/partner/member-directory/member.chengdu-aplux-intelligence-technology-ltd.id-a1V8X000006PEozUAG)
AGC6490 is a Single-SoC Multi-Purpose high-performance board based on the Qualcomm Dragonwing™ QCM/QCS6490 SoC, specifically designed for robots. lt features an 8-core CPU, boast of 12 TOPS computing power by dedicated NPU, powerful intelligent edge capabilities, includes various peripheral connectors like USB*8, UART*8, and fully meets the robot multi-sensor sensing and control module access requirements, and equipped with industrial connectors, suitable for outdoor scenarios. It offers flexible operating system choices, with the standard configuration being Android+Linux dual-system integration for parallel operation, while also capable of independently running Android or Linux operating systems. It can be applied to various high-performance and high-computing power robot scenarios, including indoor and outdoor delivery robots, service robots, cleaning robots, smart lawnmowers, and more.

KEY FEATURES:
- Dual-OS: Android + Linux running concurrently to serve Android and Linux use-cases with reduced hardware footprint
- High performance: 12 TOPS dedicate NPU for AI and also strong CPU and GPU
- Extremely rich peripheral interfaces: USB*8, UART*8, CAN, RS485, mini-PCIE

By [CHENGDU APLUX INTELLIGENCE TECHNOLOGY, LTD.](https://www.qualcomm.com/support/partner/member-directory/member.chengdu-aplux-intelligence-technology-ltd)
Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490)
Type: Development Kits

### [IMDT QCS8550 SOM](https://www.qualcomm.com/support/partner/member-directory/member.imdt-ltd.id-a1VQo00000H4xSkMAJ)
The IMDT QCS8550 SOM, powered by the Qualcomm Dragonwing™ QCS8550 processor, is a production-ready module. Measuring just 37 x 30 x 4mm. The IMDT QCS8550 SOM provides superior computing power, advanced Edge AI processing, and crystal-clear video and graphics, making it ideal for performance intensive AIoT applications. It supports 8 x 4-lane MIPI CSI connections, enabling attachment of up to 20 cameras, and in addition - the full module provides customizable options such as onboard Wi-Fi/Bluetooth, various memory and storage capacities, and PHY configurations, allowing users to tailor the system to their specific needs.Qualcomm® Kryo™ central processing unitQualcomm® Adreno™ GPU8th-generation Qualcomm® AI Engine

KEY FEATURES:
- 8 x 4-lane MIPI CSI interface for cameras, max 20 x cameras
- 2 x 4-lane DSI, with touch I/F
- Full connectivity: USB3.1 gen2 10Gbps (DP+data) Type-C, 2 x 4-Lane PCIe (1xGen3, 1xGen4), 2 x SDC (4-bits)

By [IMDT LTD](https://www.qualcomm.com/support/partner/member-directory/member.imdt-ltd)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: System-on-Modules

### [IMDT QCS8550 SBC and EVK](https://www.qualcomm.com/support/partner/member-directory/member.imdt-ltd.id-a1VQo00000H5LA5MAN)
The IMDT QCS8550 SBC redefines versatility and performance in compact system design, transforming the IMDT QCS8550 SOM into a fully featured solution tailored for demanding applications like robotics, drones, and smart city deployments.Designed to maximize the potential of the Qualcomm® Dragonwing™ QCS8550 processor, this SBC packs impressive performance with up to 55 TOPs for AI and machine learning tasks together with high-efficiency power management, support for up to 20 cameras, advanced AI and GPU capabilities, and robust connectivity options – all in a small, energy-efficient form factor.EVK available8x4-lane MIPI CSI interface for camerasM.2 NGFF Key-E, M.2 NGFF Key-B2x4-lane DSI, with touch I/F6-DOF IMU,3-Axis magnetometerDimensions: (WxLxH): 125 x 81 x 20 mm

KEY FEATURES:
- M.2 NGFF Key-E, M.2 NGFF Key-B
- Wi-Fi 802.11a/b/g/n + Bluetooth 5.2 BR/EDR/LE
- Gigabit Ethernet with RJ-45 connector

By [IMDT LTD](https://www.qualcomm.com/support/partner/member-directory/member.imdt-ltd)
Chipset: [QCS8550](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8550)
Type: Single-Board Computers

### [5G Industrial IoT / Ruggedized Handhelds  (QCM6490 Reference Design)](https://www.qualcomm.com/support/partner/member-directory/member.sigma-connectivity.id-a1V8X000007pX4nUAE)
Accelerate Your IoT Development with QCM6490 Reference Design. QCM6490 Reference Design offer, featuring: Planning Workshop: Collaborate with us to define project objectives, requirements, and timelines with QCM6490. Reference Design: Leverage our pre-developed design to save $1M in NRE fees. Maximize Your Benefits by partnering with us, you'll accelerate the development and innovation.

We can design chip on board design with any Qualcomm's X (thin modem) or QCM line of 5G chipsets, do all pre-certification testing (FCC, CE, against carrier requirements) and help with the carrier certification process as needed.

Contact us to learn more about our IoT Solutions on the Qualcomm platform and kickstart your project. Let's work together to bring your vision to life. Contact Vesa Korkala (Vesa.Korkala@sigmaconnectivity.com)

KEY FEATURES:
- QCM/QCS6490 Ref Design to build your product upon
- Key design and build experiences with multiple Qualcomm® Chipsets

By [SIGMA CONNECTIVITY](https://www.qualcomm.com/support/partner/member-directory/member.sigma-connectivity)
Chipset: [QCM6490,](https://www.qualcomm.com/internet-of-things/products/q6-series/qcm6490) [QCS6490,](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) [QCM5430](https://www.qualcomm.com/developer/software/android-on-dragonwing)...
Type: Reference Design Platforms

### [QCM6490 Reference Design](https://www.qualcomm.com/support/partner/member-directory/member.sigma-connectivity.id-a1V8X000006NDwUUAW)
GET YOUR IOT PROJECT GOING!We offer the Sigma Connectivity/ Qualcomm® QCM6490 IoT Kickstarter, which includes the following:Planning Workshop:In this workshop, we will collaborate with you to establish clear objectives, define requirements, and create a realistic timeline for your project.QCM6490 Reference Design:As part of this offer, you can leverage the QCM6490 reference design. By using this design, you can save significant costs, as there will be no prototyping licensing fees involved. This translates to potential savings of up to $1M or more.By taking advantage of our expertise and the resources provided through Sigma Connectivity’ and Qualcomm Technologies' IoT Kick Starter Offer, you can accelerate the development of your 5G IoT solutions and maximize the benefits of digital transformation.

KEY FEATURES:
- Complete Ref Design to build your product upon
- Prototype Licenses covered.
- Key Design and build experiences with multiple Qualcomm® Chipsets

By [SIGMA CONNECTIVITY](https://www.qualcomm.com/support/partner/member-directory/member.sigma-connectivity)
Chipset: [QCM6490,](https://www.qualcomm.com/internet-of-things/products/q6-series/qcm6490) [QCS6490,](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) [QCM5430](https://www.qualcomm.com/developer/software/android-on-dragonwing)...
Type: Reference Design Platforms

### [VVDN-QCS6490 SOM](https://www.qualcomm.com/support/partner/member-directory/member.vvdn-technologies-private-limited.id-a1V8X000006NBvoUAG)
VVDN is designing, and developing SOM based on Qualcomm® QCS6490 SoC. The SOM supports rich interfaces for connectivity including Wi-Fi 6 (802.11ax) & Bluetooth 5.2 ® technology and other rich peripherals including 5X4 lane MIPI CSI for cameras, 4 lane MIPI DSI for display, USB3.1, USB 2.0, etc.The SOM provides rich hardware interfaces and software SDKs for building quick prototypes and validation. It is ideal for developing various industrial and commercial IoT applications including Digital Signage, Retail, Smart Warehousing, Service robots, Rugged Handheld, etc.

By [VVDN TECHNOLOGIES PRIVATE LIMITED](https://www.qualcomm.com/support/partner/member-directory/member.vvdn-technologies-private-limited)
Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490)
Type: System-on-Modules

### [VVDN-QCS2290 SOM](https://www.qualcomm.com/support/partner/member-directory/member.vvdn-technologies-private-limited.id-a1V8X000006NBvjUAG)
VVDN-QCS220 SOM, designed and developed by VVDN is based on the Qualcomm® QCS2290 platform. It comes with integrated Wi-Fi: IEEE 802.11 a/b/g/n/ac, Bluetooth 5.0, and FM via Qualcomm® WCN3950 chipset. The SOM supports rich I/O interfaces including MIPI-CSI, MIPI-DSI, USB, SD card, GPIO, JTAG, to connect LCD panels, and camera modules, for the development of vision intelligent IoT applications.The system on module offers tight system integration and optimization for superior performance and power management features make it the best to facilitate a cost-effective and efficient embedded system application including two-wheelers digital instrument cluster, body-worn camera, connected camera, digital signage, control panels/industrial panels, retail PoS, video doorbells, etc.

By [VVDN TECHNOLOGIES PRIVATE LIMITED](https://www.qualcomm.com/support/partner/member-directory/member.vvdn-technologies-private-limited)
Chipset: [QCS2290](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290)
Type: System-on-Modules

### [Atlantik Elektronik – QCS6490 Based Single Board Computer](https://www.qualcomm.com/support/partner/member-directory/member.atlantik-elektronik-gmbh.id-a1VQo00000RgBynMAF)
Atlantik Elektronik offers direct access to compact single board computers (SBCs) based on the Qualcomm Dragonwing™ QCS6490.Targeting Edge AI, computer vision, robotics, smart cameras, industrial IoT, and education, we offer the Thundercomm Rubik Pi 3: a versatile, Raspberry Pi–style SBC suitable for both prototyping and deployment in industrial environments.Available Dragonwing QCS6490 based SBC:Thundercomm Rubik Pi 3 – compact 100 × 75 mm SBC with broad I/O and ecosystem compatibility, designed for seamless integration into embedded systemsThe Rubik Pi 3 is available directly from Atlantik Elektronik, with optional technical support, software configuration, and long-term logistics services.

KEY FEATURES:
- Our Services: One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project. Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering. Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.

By [ATLANTIK ELEKTRONIK GMBH](https://www.qualcomm.com/support/partner/member-directory/member.atlantik-elektronik-gmbh)
Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490)
Type: Single-Board Computers

### [Atlantik Elektronik – QCS6490 Development Kits](https://www.qualcomm.com/support/partner/member-directory/member.atlantik-elektronik-gmbh.id-a1VQo00000Rg8WHMAZ)
Atlantik Elektronik provides access to a curated selection of development kits from leading manufacturers including Qualcomm Technologies, Thundercomm, and Quectel, covering official reference platforms and commercial-grade evaluation systems.Targeting Edge AI, computer vision, robotics, smart cameras, and industrial IoT, these kits are ideal for rapid prototyping, performance evaluation, and design-in of next-generation embedded systems.Available Development Kits:Qualcomm Dragonwing™ RB3 Gen2 (Core and Vision Kits)Thundercomm C6490P Development KitThundercomm C6490 Development KitThundercomm Rubik Pi 3 (Single Board Computer)Quectel SG560D Development KitAll listed kits are available directly from Atlantik Elektronik, with optional services for integration support, BSP and driver assistance, software pre-configuration, and supply logistics.

KEY FEATURES:
- Our Services: One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project. Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering. Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.

By [ATLANTIK ELEKTRONIK GMBH](https://www.qualcomm.com/support/partner/member-directory/member.atlantik-elektronik-gmbh)
Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490)
Type: Development Kits