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KEY FEATURES:
- Quad core Arm Cortex-A78 up to 2.7GHz
- And Quad core Arm Cortex-A55 @ 1.95GHz
- Adreno 643 GPU @ 812MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 12(15) TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- Display up to FHD+144Hz
- Video up to 4k30(E)/4K60(D)
- 5xUSB 2.0, 2x USB 3.1
- 2x PCIe Gen3 x1, 1x PCIe Gen3 x2
- 1x MIPI-DSI or LVDS
- 1x DP 1.4 (2 lane) + 1x eDP/DP
- 4x MIPI-CSI Camera Interface
- WLAN/BT Wireless Module (option)
- 2x Gigabit Ethernet
- 2x I2S Audio Interface
- 4x UART, 2x SPI, 2x CAN2.0-FD
- 5x I²C
- HW Key manager and ECC, Secure boot, Crypto engines, etc.
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
KEY FEATURES:
- Quad core Arm Cortex-A78 up to 2.7GHz
- And Quad core Arm Cortex-A55 @ 1.95GHz
- Adreno 643 GPU @ 812MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 12(15) TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- Display up to FHD+144Hz
- Video up to 4k30(E)/4K60(D)
- 5xUSB 2.0, 2x USB 3.1
- 2x PCIe Gen3 x1, 1x PCIe Gen3 x2
- 1x MIPI-DSI or LVDS
- 1x DP 1.4 (2 lane) + 1x eDP/DP
- 4x MIPI-CSI Camera Interface
- WLAN/BT Wireless Module (option)
- 2x Gigabit Ethernet
- 2x I2S Audio Interface
- 4x UART, 2x SPI, 2x CAN2.0-FD
- 5x I²C
- HW Key manager and ECC, Secure boot, Crypto engines, etc.
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
KEY FEATURES:
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
- Dual core Arm Cortex-A78 up to 2.1GHz
- Adreno 642L GPU @ 315MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 3.5 TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- 4x MIPI-CSI Camera Interface
- Video up to 4k30(E)/4K30(D)
- 5xUSB 2.0, 2x USB 3.1
- 1x MIPI-DSI or LVDS
KEY FEATURES:
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
- Dual core Arm Cortex-A78 up to 2.1GHz
- Adreno 642L GPU @ 315MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 3.5 TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- 4x MIPI-CSI Camera Interface
- Video up to 4k30(E)/4K30(D)
- 5xUSB 2.0, 2x USB 3.1
- 1x MIPI-DSI or LVDS
KEY FEATURES:
- Robust computing power: Up to 12 TOPS, well-suited for most algorithm prototyping & inference applic
- Feature-rich interfaces: USB, Micro HDMI, ADC, audio, Ethernet, camera, PCIe , antenna, etc.
- Dual displays: DP and LCM or DP and Micro HDMI.
- Wireless connectivity: Wi-Fi 5, 802.11a/ b/ g/ n/ ac, delivering enhanced wireless connectivity.
- Multiple operating systems: Yocto Linux/ Debian/ Ubuntu.
- Extended temperature range: For harsh outdoor & industrial use; and withstand ambient temperatures f
- Diverse application scenarios: Edge computing, robotics, industrial automation, multimedia terminals
- High-performance 64-bit octa-core processor, delivering up to 12 TOPS of computing power
- 1 x A78 @ 2.7 GHz + 3 x A78 @ 2.4 GHz + 4 x A55 @ 1.9 GHz
- 32 KB L1I cache, 32 KB L1D cache and 512 KB L2 cache
- Adreno 643L @ 812 MHz
- 8 GB LPDDR4X + 128 GB UFS
- Yocto Linux/ Debian/ Ubuntu*
KEY FEATURES:
- Robust computing power: Up to 12 TOPS, well-suited for most algorithm prototyping & inference applic
- Feature-rich interfaces: USB, Micro HDMI, ADC, audio, Ethernet, camera, PCIe , antenna, etc.
- Dual displays: DP and LCM or DP and Micro HDMI.
- Wireless connectivity: Wi-Fi 5, 802.11a/ b/ g/ n/ ac, delivering enhanced wireless connectivity.
- Multiple operating systems: Yocto Linux/ Debian/ Ubuntu.
- Extended temperature range: For harsh outdoor & industrial use; and withstand ambient temperatures f
- Diverse application scenarios: Edge computing, robotics, industrial automation, multimedia terminals
- High-performance 64-bit octa-core processor, delivering up to 12 TOPS of computing power
- 1 x A78 @ 2.7 GHz + 3 x A78 @ 2.4 GHz + 4 x A55 @ 1.9 GHz
- 32 KB L1I cache, 32 KB L1D cache and 512 KB L2 cache
- Adreno 643L @ 812 MHz
- 8 GB LPDDR4X + 128 GB UFS
- Yocto Linux/ Debian/ Ubuntu*
KEY FEATURES:
- Ultra small form factor
- Integrated with Digital FM Technology
- Reference design for offroad vehicle telematics
- Reference design for field diagnostics device
- Reference design for two-wheeler device cluster
- Integrated LTE Cat 4 modem with Dual SIM (DSDS) support
- Azure/AWS cloud orchestration for device provisioning and management
KEY FEATURES:
- Ultra small form factor
- Integrated with Digital FM Technology
- Reference design for offroad vehicle telematics
- Reference design for field diagnostics device
- Reference design for two-wheeler device cluster
- Integrated LTE Cat 4 modem with Dual SIM (DSDS) support
- Azure/AWS cloud orchestration for device provisioning and management
KEY FEATURES:
- AI in a blink: Unlock AI-powered vision and sound solutions that react to their environment in real time.Quick start apps: Jumpstart development with plenty of pre-built examples and templates available through Arduino App Lab.Designed to expand: Expandable with Qwiic connector for Modulino nodes, carriers and more.
KEY FEATURES:
- AI in a blink: Unlock AI-powered vision and sound solutions that react to their environment in real time.Quick start apps: Jumpstart development with plenty of pre-built examples and templates available through Arduino App Lab.Designed to expand: Expandable with Qwiic connector for Modulino nodes, carriers and more.
KEY FEATURES:
- Production-ready system on module
- Expanded interfaces for industrial use cases
- Long-term support expected through July 2036 with the Critical Link Product Longevity Program
KEY FEATURES:
- Production-ready system on module
- Expanded interfaces for industrial use cases
- Long-term support expected through July 2036 with the Critical Link Product Longevity Program
KEY FEATURES:
- High Performance Qualcomm® 6nm QCS6490 SoC
- 8G / 128GB uMCP
- AI Performance: Up to 12 TOPS
- Five 4-lane MIPI-CSIs; 3x ISP@22MP, 2x IFE lite
- Support Wi-Fi 6E / BT, and GPS
- Supports Android, Linux, Ubuntu, Windows 11 IoT Enterprise
KEY FEATURES:
- High Performance Qualcomm® 6nm QCS6490 SoC
- 8G / 128GB uMCP
- AI Performance: Up to 12 TOPS
- Five 4-lane MIPI-CSIs; 3x ISP@22MP, 2x IFE lite
- Support Wi-Fi 6E / BT, and GPS
- Supports Android, Linux, Ubuntu, Windows 11 IoT Enterprise
KEY FEATURES:
- Full-featured development kit for Critical Link's QCS6490 and QCS5430-based system on modules
- MitySOM system on modules are production-ready industrial solutions, designed for long term availability and performance
- Developers have access to dev board design files to jump start their own baseboard design, as well as lifetime access to Critical Link's wiki-based support as well as our US-based engineering support team
KEY FEATURES:
- Full-featured development kit for Critical Link's QCS6490 and QCS5430-based system on modules
- MitySOM system on modules are production-ready industrial solutions, designed for long term availability and performance
- Developers have access to dev board design files to jump start their own baseboard design, as well as lifetime access to Critical Link's wiki-based support as well as our US-based engineering support team
KEY FEATURES:
- SagireEdge AI 600 SOM & open chassis carrier board powered by the Qualcomm Dragonwing™ QCS6490 SoCPreloaded with a Ubuntu Linux O/S
KEY FEATURES:
- SagireEdge AI 600 SOM & open chassis carrier board powered by the Qualcomm Dragonwing™ QCS6490 SoCPreloaded with a Ubuntu Linux O/S
KEY FEATURES:
- KIMQ 8550 boasts powerful processing with an 6 Core Kyro CPU, its AI core supports 48 TOPS(INT8) for enhanced AI/ML/LLM, supported unbutu/Adroid/Linux. Connectivity options include USB ports, PCIe, MIPI, CSI... All in compact size 40x47x5.3mm design. It compatibility with KIMQ 6490 and 5430
KEY FEATURES:
- KIMQ 8550 boasts powerful processing with an 6 Core Kyro CPU, its AI core supports 48 TOPS(INT8) for enhanced AI/ML/LLM, supported unbutu/Adroid/Linux. Connectivity options include USB ports, PCIe, MIPI, CSI... All in compact size 40x47x5.3mm design. It compatibility with KIMQ 6490 and 5430
KEY FEATURES:
- High AI processing performance of 12 TOPS, supports up to 8 Full HD cameras. Equipped with 4 USB-A 3.0 port, 1 USB-Type port, 1 SD card slot, and 1 Ethernet port (1 Gbps). 4G connectivity supported (optional). Compatible with multiple OS: Android, Ubuntu, and Linux.
KEY FEATURES:
- High AI processing performance of 12 TOPS, supports up to 8 Full HD cameras. Equipped with 4 USB-A 3.0 port, 1 USB-Type port, 1 SD card slot, and 1 Ethernet port (1 Gbps). 4G connectivity supported (optional). Compatible with multiple OS: Android, Ubuntu, and Linux.
KEY FEATURES:
- Ultra-compact size 40x47mm. Modular design with plug-and-play pins. Decodes video at 250 FPS FHD, AI processing at 12 TOPS. No maintenance, high stability. Supports AI model conversion & optimization. AI Hub with KIMQ-compatible models.
KEY FEATURES:
- Ultra-compact size 40x47mm. Modular design with plug-and-play pins. Decodes video at 250 FPS FHD, AI processing at 12 TOPS. No maintenance, high stability. Supports AI model conversion & optimization. AI Hub with KIMQ-compatible models.
KEY FEATURES:
- 8GB RAM/128GB UFS Flash in a µMCP packageExtensive range of I/O, including Ethernet, USB3.1, Wi-Fi 6E and BT 5.2, MIPI-CSI, eDP, CAN, and PCIe Extended temperature range
KEY FEATURES:
- 8GB RAM/128GB UFS Flash in a µMCP packageExtensive range of I/O, including Ethernet, USB3.1, Wi-Fi 6E and BT 5.2, MIPI-CSI, eDP, CAN, and PCIe Extended temperature range
KEY FEATURES:
- Ultra-compact AI computer, 40x47mm size. Modular design with plug-and-play pins. Decodes video at 250FPS FHD, AI processing at 3.5 TOPS. No maintenance, high stability. Supports AI model conversion & optimization. AI Hub with KIMQ-compatible models.
KEY FEATURES:
- Ultra-compact AI computer, 40x47mm size. Modular design with plug-and-play pins. Decodes video at 250FPS FHD, AI processing at 3.5 TOPS. No maintenance, high stability. Supports AI model conversion & optimization. AI Hub with KIMQ-compatible models.
KEY FEATURES:
- Dual-OS: Android + Linux running concurrently to serve Android and Linux use-cases with reduced hardware footprint
- High performance: 12 TOPS dedicate NPU for AI and also strong CPU and GPU
- Extremely rich peripheral interfaces: USB*8, UART*8, CAN, RS485, mini-PCIE
KEY FEATURES:
- Dual-OS: Android + Linux running concurrently to serve Android and Linux use-cases with reduced hardware footprint
- High performance: 12 TOPS dedicate NPU for AI and also strong CPU and GPU
- Extremely rich peripheral interfaces: USB*8, UART*8, CAN, RS485, mini-PCIE
KEY FEATURES:
- M.2 NGFF Key-E, M.2 NGFF Key-B
- Wi-Fi 802.11a/b/g/n + Bluetooth 5.2 BR/EDR/LE
- Gigabit Ethernet with RJ-45 connector
KEY FEATURES:
- M.2 NGFF Key-E, M.2 NGFF Key-B
- Wi-Fi 802.11a/b/g/n + Bluetooth 5.2 BR/EDR/LE
- Gigabit Ethernet with RJ-45 connector
KEY FEATURES:
- QCM/QCS6490 Ref Design to build your product upon
- Key design and build experiences with multiple Qualcomm® Chipsets
KEY FEATURES:
- QCM/QCS6490 Ref Design to build your product upon
- Key design and build experiences with multiple Qualcomm® Chipsets
KEY FEATURES:
- Complete Ref Design to build your product upon
- Prototype Licenses covered.
- Key Design and build experiences with multiple Qualcomm® Chipsets
KEY FEATURES:
- Complete Ref Design to build your product upon
- Prototype Licenses covered.
- Key Design and build experiences with multiple Qualcomm® Chipsets
KEY FEATURES:
- 8 x 4-lane MIPI CSI interface for cameras, max 20 x cameras
- 2 x 4-lane DSI, with touch I/F
- Full connectivity: USB3.1 gen2 10Gbps (DP+data) Type-C, 2 x 4-Lane PCIe (1xGen3, 1xGen4), 2 x SDC (4-bits)
KEY FEATURES:
- 8 x 4-lane MIPI CSI interface for cameras, max 20 x cameras
- 2 x 4-lane DSI, with touch I/F
- Full connectivity: USB3.1 gen2 10Gbps (DP+data) Type-C, 2 x 4-Lane PCIe (1xGen3, 1xGen4), 2 x SDC (4-bits)
KEY FEATURES:
It can be used to develop Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots(AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing etc.
KEY FEATURES:
It can be used to develop Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots(AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing etc.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- Dual Camera: Front and Cabin Sensors
- Memory: LPDDR5 (4GB), eMMC (128GB)
- Connectivity: 5G, WiFi, BT 5.2, GPS
- Display: 3" Display
- Video Out (MIPI DSI), Resolution 480 x 854
- Interfaces: USB Type C/3.1
- Storage: Micro SD card
KEY FEATURES:
- Dual Camera: Front and Cabin Sensors
- Memory: LPDDR5 (4GB), eMMC (128GB)
- Connectivity: 5G, WiFi, BT 5.2, GPS
- Display: 3" Display
- Video Out (MIPI DSI), Resolution 480 x 854
- Interfaces: USB Type C/3.1
- Storage: Micro SD card
KEY FEATURES:
- Android/Linux smart module, LGA package, 33 x 39 x 3.85mm. 12GB LPDDR5X + 256GB UFS, Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU. Qualcomm® Hexagon™ DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX). Qualcomm Spectra™ ISP. Adreno 8550 VPU & 1295 DPU. Neural processing unit, Security processing. Video encoder: 4K @ 120 fps; 8K @ 30 fps. Video decoder: 4K @ 240 fps; 8K @ 60fps. Computing power of up to 48 TOPS.
KEY FEATURES:
- Android/Linux smart module, LGA package, 33 x 39 x 3.85mm. 12GB LPDDR5X + 256GB UFS, Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU. Qualcomm® Hexagon™ DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX). Qualcomm Spectra™ ISP. Adreno 8550 VPU & 1295 DPU. Neural processing unit, Security processing. Video encoder: 4K @ 120 fps; 8K @ 30 fps. Video decoder: 4K @ 240 fps; 8K @ 60fps. Computing power of up to 48 TOPS.
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x and 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 172 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x and 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 172 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Linux Kernel 5.15; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Linux Kernel 5.15; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x and 128GB UFS 3.1; OS: Linux Kernel 5.15; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x and 128GB UFS 3.1; OS: Linux Kernel 5.15; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x and 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x and 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x and 128GB UFS 3.1; OS: Linux Kernerl 5.15; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x and 128GB UFS 3.1; OS: Linux Kernerl 5.15; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Linux Kernel5.15; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Linux Kernel5.15; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x; 128GB UFS 3.1; OS: Linux,Kernel5.15; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x; 128GB UFS 3.1; OS: Linux,Kernel5.15; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x; 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x; 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x; 128GB UFS 3.1; OS: Linux,Kernel5.15; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x; 128GB UFS 3.1; OS: Linux,Kernel5.15; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x and 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x and 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ GPU, Adreno VPU, Adreno DPU and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- 8GB LPDDR5 and 128GB UFS; OS: Linux
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ GPU, Adreno VPU, Adreno DPU and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- 8GB LPDDR5 and 128GB UFS; OS: Linux
KEY FEATURES:
- Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, 633 VPU, 1075 DPU and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- 8GB LPDDR5 and 128GB UFS; OS: Android 13.0
KEY FEATURES:
- Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, 633 VPU, 1075 DPU and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- 8GB LPDDR5 and 128GB UFS; OS: Android 13.0
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x and 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x and 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU, and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- Running on Android 13
KEY FEATURES:
- Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU, and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- Running on Android 13
KEY FEATURES:
- Services to enable RAW, Bayer, or YUV sensors; ToF sensors
- Integration with all necessary camera firmware components; Camera firmware upgrades on-field; ONVIF compliance
- HDR enabling and improvement; Camera sensor tuning
KEY FEATURES:
- Services to enable RAW, Bayer, or YUV sensors; ToF sensors
- Integration with all necessary camera firmware components; Camera firmware upgrades on-field; ONVIF compliance
- HDR enabling and improvement; Camera sensor tuning
KEY FEATURES:
- Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU; Qualcomm Spectra™ 340T ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Linux, Yocto Dunfell; Dimensions: 85mm x 54mm
KEY FEATURES:
- Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU; Qualcomm Spectra™ 340T ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Linux, Yocto Dunfell; Dimensions: 85mm x 54mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0
- OS: Linux, Yocto Dunfell, Kernel 5.4; Dimensions: 85mm x 54mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0
- OS: Linux, Yocto Dunfell, Kernel 5.4; Dimensions: 85mm x 54mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and Bluetooth 5.0
- OS: Android 12, Kernel 4.19; Dimensions: 85mm x 54mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and Bluetooth 5.0
- OS: Android 12, Kernel 4.19; Dimensions: 85mm x 54mm
KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Android 12; Dimensions: 85mm x 54mm
KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Android 12; Dimensions: 85mm x 54mm
KEY FEATURES:
- Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra 340T ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Linux, Yocto Dunfell; Dimensions: 85mm x 54mm
KEY FEATURES:
- Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra 340T ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Linux, Yocto Dunfell; Dimensions: 85mm x 54mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT 5.0
- OS: Linux, Yocto Dunfell; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT 5.0
- OS: Linux, Yocto Dunfell; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0
- OS: Android 12; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0
- OS: Android 12; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT 5.1
- OS: Android 12; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT 5.1
- OS: Android 12; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra 340T ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1x1 802.11a/b/g/n/ac and BT 5.1
- OS: Linux, Yocto Dunfell; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- Qualcomm® Kyro™ 260, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra 340T ISP
- 3GB LPDDR4x and 32GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1x1 802.11a/b/g/n/ac and BT 5.1
- OS: Linux, Yocto Dunfell; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- M.2 key-M + E, Gig Eth RJ45, 2x USB 3.1, 2x USB 2.0, 1x USB-C OTG
- miniDP + MIPI-DSI, 4L and 2L MIPI-CSI, Audio Codec,
- 40-Pin Pi-HAT header, 4-pin CAN header, 10-pin Test IO header
KEY FEATURES:
- M.2 key-M + E, Gig Eth RJ45, 2x USB 3.1, 2x USB 2.0, 1x USB-C OTG
- miniDP + MIPI-DSI, 4L and 2L MIPI-CSI, Audio Codec,
- 40-Pin Pi-HAT header, 4-pin CAN header, 10-pin Test IO header
KEY FEATURES:
- Heatspreader
- 12V power supply and cable kit included for immediate operation of the Starterkit
- DP graphics output
- LVDS graphics output
- Getting Started manual
- Optional TFT kits available
KEY FEATURES:
- Heatspreader
- 12V power supply and cable kit included for immediate operation of the Starterkit
- DP graphics output
- LVDS graphics output
- Getting Started manual
- Optional TFT kits available
KEY FEATURES:
- Qualcomm 8-core KryoTM processor with max core frequency of 3.2 GHz
- High AI computations~48@int8 Tops
- Android 13/Yocto Linux 5.15
- Support PCIe
- Support 8K@30fps video encode or 8K@60fps decode
KEY FEATURES:
- Qualcomm 8-core KryoTM processor with max core frequency of 3.2 GHz
- High AI computations~48@int8 Tops
- Android 13/Yocto Linux 5.15
- Support PCIe
- Support 8K@30fps video encode or 8K@60fps decode
KEY FEATURES:
- Small form factor Single Board Computer
KEY FEATURES:
- Small form factor Single Board Computer
KEY FEATURES:
- Ultra-small form factor
KEY FEATURES:
- Ultra-small form factor
KEY FEATURES:
- Reference design for biometric authentication and access control
- Support for facial recognition
- Integrated Dual-NFC for use of Government IDs such as Passports and National IDs
KEY FEATURES:
- Reference design for biometric authentication and access control
- Support for facial recognition
- Integrated Dual-NFC for use of Government IDs such as Passports and National IDs
KEY FEATURES:
- First upstream version based on Qualcomm® QCS6490 platform for developers
- Compatible with Raspberry Pi accessories
- 12 Tops AI capability, Deploy 1.8B LLM
- C5430P/6490P/C8550 SOM are P2P compatible
- Minimalist design, affordable price
KEY FEATURES:
- First upstream version based on Qualcomm® QCS6490 platform for developers
- Compatible with Raspberry Pi accessories
- 12 Tops AI capability, Deploy 1.8B LLM
- C5430P/6490P/C8550 SOM are P2P compatible
- Minimalist design, affordable price
