258 products
Sort
Categories

Filter by:

MC023CG-SY
MC023CG-SY
ByXIMEA
Astra 2
Astra 2
ByORBBEC
Atlantik Elektronik – QCS6490 System-on-Chip (SoC)
Atlantik Elektronik provides direct access to the Qualcomm Dragonwing™ QCS6490—an advanced, high-performance SoC built for demanding edge applications in AI, vision, and industrial systems.We support customers from early evaluation through integration and production, offering the Dragonwing QCS6490 as a standalone SoC as well as through ready-to-use modules, boards, and edge systems.Dragonwing QCS6490 SoC – high-performance edge AI processor with 8-core CPU, GPU, and 12.5 TOPS NPU, built for intelligent vision, robotics, and industrial IoT applications.The Dragonwing QCS6490 and its ecosystem are available directly from Atlantik Elektronik, including hardware access, design-in support, software integration, and logistics services.
Atlantik Elektronik – QCS6490-Based Edge AI Systems
Atlantik Elektronik provides access to production-ready AI computing systems based on the Qualcomm Dragonwing™ QCS6490 platform. These compact, industrial-grade solutions are designed for edge deployment in sectors such as manufacturing, retail, transportation, and smart city infrastructure.Focused on intelligent video processing, sensor fusion, AI inference, and robust industrial connectivity, these systems are ideal for real-world field use with demanding performance and reliability requirements.Available Dragonwing QCS6490 based Edge AI Systems:Thundercomm EB3G2 Edge AI Station – fanless, high-performance edge computing system for applications such as digital signage, smart manufacturing, surveillance, and computer vision analyticsDragonwing QCS6490 based Edge AI systems are available directly from Atlantik Elektronik, with optional support for system evaluation, integration, and deployment.
SECO Modular Vision 10.1 QCS6490
The SECO Modular Vision based on Qualcomm Dragonwing™  QCS6490 is a a ready-to-deploy HMI platform designed for next-generation industrial automation. Available in both 10.1-inch and 15.6-inch versions, it combines advanced computer vision, voice command processing, and intuitive user interaction in a single device, enabling smarter and more efficient factory operations.
Qualcomm® RB3 Gen 2 Development Kit (Core Kit)
The Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide

KEY FEATURES:

Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
ByQUALCOMM
Chipset
Type Development Board / Kit
Arduino UNO Q
Arduino UNO Q’s hybrid design makes it the ideal dual-brain platform for your next innovation. It combines a Linux® Debian-capable Qualcomm Dragonwing™ QRB2210 microprocessor with a real-time STM32U585 microcontroller (MCU). It’s Arduino, it’s a computer, it’s anything you want to build.

KEY FEATURES:

  • AI in a blink: Unlock AI-powered vision and sound solutions that react to their environment in real time.Quick start apps: Jumpstart development with plenty of pre-built examples and templates available through Arduino App Lab.Designed to expand: Expandable with Qwiic connector for Modulino nodes, carriers and more.
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit)
The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.

KEY FEATURES:

Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
ByQUALCOMM
Chipset
Type Development Board / Kit
Qualcomm® RB3 Gen 2 Development Kit (Lite)
IoT development kit designed for high-performance compute, accessibility, and flexible and customizable features. The Qualcomm® RB3 Gen 2 Lite Development Kit gives developers a valuable combination of impressive performance and customizable features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation. The Qualcomm RB3 Gen 2 Lite is based on the Qualcomm Dragonwing™ processor. This processor’s scalable performance is designed to deliver superior features and performance across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications. This includes support for Wi-Fi 6E for ubiquitous coverage, a unified software stack, powerful AI, and expanded interfaces across ecosystems. - Key Features: Based on the Qualcomm Dragonwing™ QCS5430 processor. Support for Wi-Fi 6E for ubiquitous coverage. Across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications.

KEY FEATURES:

Based on the Qualcomm Dragonwing™ QCS5430 processor. Support for Wi-Fi 6E for ubiquitous coverage. Across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications.
ByQUALCOMM
Chipset
Type Development Board / Kit
Open-Q™ 8550CS μSOM
Open-Q™ 8550CS µSOM is the compact SOM variant in Lantronix’s Open-Q 8550 product series. Powered by Qualcomm’s Dragonwing™ QCS8550, it delivers premium performance with 48 INT8 TOPs and 12 FP16 TOPs, meeting the advanced AI/ML requirements of extreme edge computing. Its compact size and low power draw make it ideal for drone integration. For gimbal camera systems, it can operate without Wi-Fi or Ethernet at the hardware level, simplifying design and reducing weight. With its cost-effectiveness, compact footprint, and broad support for AI models and multimodal capabilities including AI context sharing across camera, audio, and sensors, the Open-Q 8550CS µSOM is a compelling choice for modern video surveillance and low-cost, compact video conferencing devices.

KEY FEATURES:

  • Up to 12GB LPDDR5x RAM + 256GB UFS Flash
  • Android™ 13 and Linux Yocto Kirkstone
  • On-device AI Engine with Qualcomm® Hexagon™ Tensor Processor (HTP)
  • Dedicated Computer Vision Engine
  • Multiple MIPI camera and display ports
  • Multiple high speed connectivity options
Open-Q 6490CS SOM Development Kit
The Open-Q™ 6490 Development Kit is designed to facilitate easy evaluation and development. The kit includes many standard sockets, enabling customers to choose from a wide range of third-party accessories. The SOM utilizes Qualcomm Technologies’ heterogeneous computing expertise to offer a system-on-chip with multiple specialized processing cores for powerful AI processing, image and graphics processing, and audio processing.

KEY FEATURES:

  • Standard M.2 sockets for evaluating Wi-Fi
  • TAA/NDAA Compliant
  • Android™ 13 and Qualcom Linux OSs
Open-Q 6490CS SOM
The Open-Q 6490CS provides flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as AI cameras, video collaboration, industrial handhelds, and video telematics. Based on Qualcomm Dragonwing™ QCS6490 processor, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution.

KEY FEATURES:

  • Multiple MIPI camera and display ports
  • Up to 8GB LPDDR5 RAM + 64GB eMMC
  • Android™ 13 and Qualcomm Linux
  • TAA/NDAA Compliant
Open-Q™ 2210 System in Package
The Open-Q™ 2200 Series SIPs are a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QRB2210 (Yocto Linux) processors, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth® wireless technology. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.

KEY FEATURES:

  • Entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power
  • Secure compute platform
  • Extended Operating Temperature (-25C to 85C)
Open-Q 8550CS SoM
The Open-Q™ 8550CS offers a premium performance level of 55 TOPs, meeting the higher AI/ML requirements for extreme edge computing, including Edge devices, Edge servers and Edge AI boxes. Based on the Qualcomm Dragonwing™ QCS8550 processor, the Open-Q 8550CS offers several benefits: low power consumption with a 4nm process, powerful heterogeneous computing, an 8th-generation AI engine delivering up to 10x performance over the previous generation, enterprise-level connectivity with Wi-Fi 7 supporting up to 5.8Gbps, and best-in-class performance across compute processing, camera, AI, security, and audio.

KEY FEATURES:

  • Up to 16GB LPDDR5 RAM + 128GB UFS Flash
  • Android™ 13 and Linux Yocto Kirkstone
  • On-device AI Engine with Qualcomm Hexagon™ Tensor Processor (HTP)
  • Dedicated Computer Vision Engine
  • Multiple MIPI camera and display ports
  • Multiple high speed connectivity options
Open-Q 2290CS™ System-in-Package (SIP)
The Open-Q™ 2290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QCS2290, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.

KEY FEATURES:

  • Entry-tier solution delivers greater performance, graphic, and camera capabilities
  • Secure compute platform
  • Improved power performance
Open-Q 4290CS™ System-in-Package (SIP)
The Open-Q™ 4290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QCS4290 chipset utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4290 SIP creates the perfect computing core for a variety of edge AI video analytic applications.

KEY FEATURES:

  • Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
  • 3rd generation Qualcomm® AI Engine
  • Vivid graphics with Qualcomm® Adreno™ 610 GPU
  • Multiple high speed connectivity options
  • Up to 6GB LPDDR4 and 256GB eMMC
  • Long term support with extended life hardware and software support through 2027
Open-Q 8550CS SoM Development Kit
The Open-Q™ 8550CS SOM Development Kit is designed to facilitate easy evaluation of the key features of the Qualcomm Dragonwing™ QCS8550 processor, such as the Low Power AI subsystem with a dedicated DSP and AI accelerator supporting always-on audio, sensors, contextual data streams, and an always-on camera. The kit supports the evaluation of C-PHY and D-PHY MIPI CSI and GMSL cameras, dual MIPI DSI, DisplayPort, audio, sensors, GNSS, Gigabit Ethernet and many more features.The development kit provides the ideal starting point for evaluating the Open-Q™ 8550CS SOM. The platform consists of Lantronix’s Open-Q™ 8550CS SOM, an open-frame carrier board exposing all the available I/O, and a range of accessories to fast-track your product development.

KEY FEATURES:

  • Based on the Qualcomm Dragonwing QCS8550
  • Android 13 and Yocto Linux Kirkstone
  • Standard M.2 & MikroBUS sockets
Open-Q AL Development Kit (4290 & 2290 Series)
The Open-Q™ AL development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4290 and 2290 SIP families based on the Qualcomm® QCS4290 processor (Android).

KEY FEATURES:

  • Development kit provides interfaces to evaluate camera and video
  • Evaluate display on LCD & HDMI
  • Supports many robotic features
Open-Q™ 4210 System in Package
The Open-Q™ 4210 Series SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QRB4210 (Yocto Linux) processors utilize Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4200 SIP creates the perfect computing core for a variety of edge AI video analytic applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.

KEY FEATURES:

  • Compact SIP with Qualcomm® QRB4210 (Yocto Linux) processors, 8-core 2.0/1.8 GHz processor
  • Vivid graphics with Qualcomm® Adreno™ 610 GPU
  • Up to 6GB LPDDR4 and 256GB eMMC
  • Long term support with extended life hardware and software support through 2027
Open Q RB Development Kit
The Open-Q™ RB development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4210 and 2210 SIPs based on the Qualcomm® QRB4210 and Qualcomm® QRB2210 (Yocto Linux) processors. Users can use the same development kit to evaluate or prototype with many SIP families from Lantronix.

KEY FEATURES:

  • The development kit provides hardware interfaces to evaluate camera, video, display on LCD and HDMI, and connectivity capabilities
  • Supports many robotic features
  • User can expand the kit with compatible boards from 96Boards