Find hardware, software and services to develop better audio technology.

Tiny (21mm x 17mm) low-power dynamic mesh module for rapid prototyping of mesh-enabled products. Multi-channel, multi-node relay of video, voice, and data with highly secure AES-256 encryption implemented in the DSP. A self-healing dynamic mesh protocol with auto-search and connect with group members, while dynamically optimizing the RF links between nodes in real-time. Wideband voice with virtually unlimited users per channel with 5 simultaneous talkers. Video relay to extend the reach for robots and drones, adding hundreds of meters per hop. Provision to mix streams and to relay device control data across the mesh network. For details see: https://elaratek.com/wp-content/uploads/2026/08/Mesh_Module-2026.pdf

TurboX I8275 Development Kit is an evaluation platform designed to accelerate development with the TurboX I8275 SOM family. The initial configuration integrates the I8275-AC SOM, providing up to 20 TOPS of AI performance for machine vision, robotics and industrial IoT evaluation. 2 3 The 120 mm x 100 mm carrier board provides HDMI and DisplayPort outputs, three MIPI CSI camera connectors, multiple USB interfaces, Gigabit Ethernet, M.2 Key M and Key E expansion, a 40-pin expansion connector and 12V power input. Qualcomm® Linux is supported for application development and system evaluation. 4 5 Initial development kit samples are targeted for late November to early December 2026, subject to PCB availability, board bring-up and validation.

SECO SOM-COMe-CT6-Dragonwing-IQ9 is a compact, high-performance COM Express Type 6 System-on-Module powered by the Qualcomm Dragonwing™ IQ9 platform, designed for demanding industrial Edge AI applications. Combining on-device AI acceleration, advanced multimedia capabilities and industrial-grade reliability, it supports low-latency inference and vision-intensive workloads for robotics, AMR/AGV, machine vision, intelligent HMI and industrial automation systems.

The TRIA SM2S-QCS6490 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS6490 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS6490 integrates Qualcomm® Kryo™ 670 CPU which contains up to eight cores: four Arm® Cortex®-A78 cores, four Arm® Cortex®-A55 cores, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K60 and many different display connictities (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with upto 12 TOPS at low power and massive camera support with 4 MIPI-CSI inputs.

The MSC SM2S-QCS5430 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS5430 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS5430 integrates Qualcomm® Kryo™ 670 CPU which contains up to six cores, Qualcomm® Adreno™ 642L GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K30 and many different display connectivity (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with up to 3.5 TOPS at low power and massive camera support with 4 MIPI-CSI inputs

This collaboration centers on the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm Dragonwing™ IQ-9075 SoC featuring an 8-core Qualcomm® Kryo™ Gen 6 CPU and a Qualcomm® Adreno™ 663 GPU, enabling 100 TOPS dense or up to 200 TOPS sparse AI compute. Under defined 30W test scenarios, the EXMP-Q911 achieves up to 10× higher AI inference FPS compared to similar modules when running the YOLOv10n object detection model across 10 concurrent video channels. Designed for demanding edge workloads, the EXMP-Q911 integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, paired with a rich set of high-speed interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP 1.2, MIPI CSI-2, CAN FD, and more, providing exceptional connectivity and performance density for compact edge AI systems.

The BTM395 Bluetooth module features the Qualcomm® QCC3095 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz) technology. It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth speaker, headsets, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

The BTM581 Bluetooth module features the Qualcomm® QCC5181 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz). It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth earbuds, headsets, and USB Dongle applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

The BTM383 Bluetooth module features the Qualcomm® QCC3083 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz). It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth speaker applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

The BTM384 Bluetooth module features the Qualcomm® QCC3084 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz) technology. It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth headset applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

Quectel Pi H1 is a smart Single-Board Computer (SBC) based on the Qualcomm QCS6490 platform. It integrates a high-performance 64-bit octa-core processor delivering up to 12 TOPS of computing power, along with the Qualcomm Adreno™ 643L GPU. Supporting Yocto Linux, Debian, and Ubuntu operating systems, the product comes equipped with 8 GB of LPDDR4X memory and features a USB Type-C power interface, expandable with external eMMC or SSD storage. It offers dual-band Wi-Fi (2.4 & 5 GHz) compliant with IEEE 802.11a/ b/ g/ n/ ac and Bluetooth 5.0, while enabling dual-display output via DP and LCM or DP and Micro HDMI. Combining powerful performance with rich multimedia capabilities, the Quectel Pi H1 is designed to meet the demands of both industrial and consumer applications for high-speed connectivity, advanced multimedia, and robust computing power.

The Kiteboard 8250 System-on-Module (SOM) is a premier-tier, production-ready SOM built on the Qualcomm® Dragonwing™ QCS8250 SoC, designed to enable OEMs and ODMs to develop high-performance edge AI devices for multi-camera vision and intelligent IoT deployments. Combining powerful compute with advanced connectivity, the module supports real-time edge analytics and video processing for applications such as video telematics, industrial vision systems, AI-connected cameras, smart retail analytics, and healthcare edge devices

The Kiteboard 5165 is a high-compute, production-ready System-on-Module (SoM) based on the Qualcomm® Dragonwing™ QRB5165 SoC, designed to enable OEMs and robotics developers to build intelligent autonomous machines and AI-powered edge systems. Optimized for real-time perception, navigation, and multi-sensor processing, the module supports advanced robotics and autonomy workloads for applications such as autonomous delivery vehicles, industrial AMRs and AGVs, commercial and enterprise drones, industrial robotics, and defense and professional service robots.

The Kiteboard 2290 is a cost-efficient, production-ready System-on-Module (SOM) based on the Qualcomm® Dragonwing™ QCS2290 SoC. Designed in an ultra-small form factor with integrated compute and connectivity, it enables OEMs, entrepreneurs, and device makers to build custom connected devices for vertical-specific solutions. Available in both Wi-Fi only and LTE variants, the Kiteboard 2290 is optimized for cost-efficient, feature-rich IoT deployments and enables OEMs and ODMs to rapidly develop and commercialize smart devices such as industrial handhelds, retail POS systems, connected cameras, and asset-tracking solutions while accelerating time-to-market.

Arduino UNO Q’s hybrid design makes it the ideal dual-brain platform for your next innovation. It combines a Linux® Debian-capable Qualcomm Dragonwing™ QRB2210 microprocessor with a real-time STM32U585 microcontroller (MCU). It’s Arduino, it’s a computer, it’s anything you want to build.

The MitySOM-QC6490 / 5430 is a system on module family featuring a Qualcomm Dragonwing™ QCS6490 or Dragonwing QCS5430 processor with on-board power supplies, an LPDDR5 RAM memory subsystem, and a UFS configuration memory. Specifications: Dragonwing QCS6490 or Dragonwing QCS5430 SoC Processor. - Memory: 8 GB LPDDR5, 256GB Flash. - Power: 5-12Vdc Input, generated on board. - Interfaces: 2x PCIe Gen 3 (1x 1 lane, 1x 2), 5x MIPI x4 input + DSI output, USB 3.1 Gen 2, USB 2.0. - Mechanical: 45mm x 45mm (1.77″ x 1.77″).

COREXOM R6490WGQ SOM – Powered by the Qualcomm® QCS6490 SoC, the R6490WGQ SOM features the Qualcomm® Kryo™ 670 CPU and a fused AI-accelerator in the Qualcomm® Hexagon™ processor, offering exceptional computational power with energy efficiency. It supports up to five MIPI CSI interfaces, triple ISPs, 4K@60FPS video decoding, and 4K@30FPS encoding. With a wide range of external interfaces like GPIO, UART, I2C, SPI, DSI, USB 3.1, and PCIe, plus integrated GPS and Wi-Fi 6E/Bluetooth, it’s ideal for complex IoT applications.Supporting Android, Ubuntu, Linux, and Windows 11 IoT Enterprise, this SOM is designed to reduce design complexity and speed up time to market. It’s perfect for rugged handhelds, tablets, POS, kiosks, AI Box, AI cameras, robotics, and HMI, enabling developers to efficiently bring innovative products to market.

The CRI R405LQ Long Range WiFi Module is a WiFi 6 connectivity solution designed for long-range communication on both the 2.4GHz and 5GHz frequency bands. Ideal for applications requiring reliable wireless communication over extended distances (>10Km), such as robotics, drones, and IoT deployments, the R405LQ ensures robust performance in demanding environments.This module seamlessly integrates with host controllers via USB interfaces and functions similarly to an external WiFi network module. It supports the USB RNDIS (Remote Network Driver Interface Specification) standard, providing straightforward and reliable module interface control.

The MRD5165 SOM (System on Module) integrates advanced AI-ML and IoT technologies within a compact form-factor, powering the next generation of high-compute, low-power smart robots, intelligent machines, autonomous devices, and drones across consumer, enterprise, defense, and industrial sectors. These devices can seamlessly connect over 5G networks.The MRD5165 SOM based on Qualcomm® QRB5165 features a robust heterogeneous computing architecture, complemented by the cutting-edge 5th generation Qualcomm® AI Engine, delivering an impressive 15 Trillion Operations Per Second (TOPS) of AI performance. This computational power efficiently handles complex AI and deep learning workloads, along with on-device edge inferencing, making it exceptionally well-suited for autonomous drone and robotics applications. 

MRD5165 Eagle Kit is an Advanced drone controller built around Qualcomm® QRB5165 SoC and Cube Pilot’s Cube Orange+ FCU. MRD5165 Eagle kit delivers high-performance & high-accuracy AI/ML inferencing technology to facilitate accelerated development of innovative, power-efficient, Edge-computing platform for robots, aerial vehicles, industrial PC, and applications. Kit supports various wireless connectivity for real-time communication including 802.11n/ac with option to connect 5G and 802.11 ax.Eagle Kit, is a high-compute, AI-enabled, low-power processor with 8GB LPDDR5 PoP memory, 128GB UFS storage for video analytics applications. It includes various peripheral connections such as 6 MIPI CSI cameras, an HDMI Camera, USB 3.0 ports, a Micro USB port for debugging, and a Gigabit Ethernet port for wired connectivity.