Find hardware, software and services to develop better audio technology.

A low pin count & low power memory to support the Qualcomm® S7 Sound Platform Audio SoCs (Qualcomm® QCC7226), when external RAM is required. A wide range of option from QSPI SDR (6 signal pin), QSPI DDR (7 signal pin) up to OPI (11 signal pin), available as WLCSP smallest footprint or SOP8/USON8/BGA24, all ultra low power and ready for high volume wearable application.

Atlantik Elektronik provides direct access to the Qualcomm Dragonwing™ QCS6490—an advanced, high-performance SoC built for demanding edge applications in AI, vision, and industrial systems.We support customers from early evaluation through integration and production, offering the Dragonwing QCS6490 as a standalone SoC as well as through ready-to-use modules, boards, and edge systems.Dragonwing QCS6490 SoC – high-performance edge AI processor with 8-core CPU, GPU, and 12.5 TOPS NPU, built for intelligent vision, robotics, and industrial IoT applications.The Dragonwing QCS6490 and its ecosystem are available directly from Atlantik Elektronik, including hardware access, design-in support, software integration, and logistics services.

Atlantik Elektronik provides access to production-ready AI computing systems based on the Qualcomm Dragonwing™ QCS6490 platform. These compact, industrial-grade solutions are designed for edge deployment in sectors such as manufacturing, retail, transportation, and smart city infrastructure.Focused on intelligent video processing, sensor fusion, AI inference, and robust industrial connectivity, these systems are ideal for real-world field use with demanding performance and reliability requirements.Available Dragonwing QCS6490 based Edge AI Systems:Thundercomm EB3G2 Edge AI Station – fanless, high-performance edge computing system for applications such as digital signage, smart manufacturing, surveillance, and computer vision analyticsDragonwing QCS6490 based Edge AI systems are available directly from Atlantik Elektronik, with optional support for system evaluation, integration, and deployment.

The SECO Modular Vision based on Qualcomm Dragonwing™  QCS6490 is a a ready-to-deploy HMI platform designed for next-generation industrial automation. Available in both 10.1-inch and 15.6-inch versions, it combines advanced computer vision, voice command processing, and intuitive user interaction in a single device, enabling smarter and more efficient factory operations.

The Arduino®️ VENTUNO™ Q is the edge AI computer that redefines what is possible at the edge, serving as the definitive powerhouse for AI and robotics applications. At its core lies a revolutionary Dual-Brain architecture: the robust Qualcomm Dragonwing™ IQ-8275 delivers a massive up to 40 dense TOPS of AI compute for advanced computer vision and local LLMs, VLMs, gesture recognition and more, while the dedicated STM32H5 Microcontroller ensures the low-latency precision required for complex motor control and robotics. Designed for a zero-friction start, the VENTUNO Q ensures you remain connected and ready to execute. It features integrated Wi-Fi® 6 connectivity for fast, reliable data transfer, alongside a suite of built-in connectors, including high-speed USB 3.0, HDMI, 2.5 Gb Ethernet, and expandable NVMe Gen.4 storage, eliminating the need for messy adapters. Compatible with Arduino® UNO Shields and Carriers, Raspberry Pi Hat and Arduino Modulino Nodes for rapid prototyp and development.

Arduino UNO Q’s hybrid design makes it the ideal dual-brain platform for your next innovation. It combines a Linux® Debian-capable Qualcomm Dragonwing™ QRB2210 microprocessor with a real-time STM32U585 microcontroller (MCU). It’s Arduino, it’s a computer, it’s anything you want to build.

The Open-Q™ 5165N SOM is a LGA (54mm x 45mm) production-ready computing module based on the powerful Qualcomm Dragonwing™ QRB5165N System-on-Chip. The QRB5165N utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores such as the 5th generation AI Engine, hardware video analytics engine, Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP. Supporting Wi-Fi 6 connectivity (external), advanced camera features, and high-speed interfaces, the 5165N SOM creates the perfect computing core for a variety of leading-edge robotics applications. Along with the companion development kit, advanced robotics-focused OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring the highest AI processing performance in low-power embedded situations.

Open-Q™ 8550CS µSOM is the compact SOM variant in Lantronix’s Open-Q 8550 product series. Powered by Qualcomm’s Dragonwing™ QCS8550, it delivers premium performance with 48 INT8 TOPs and 12 FP16 TOPs, meeting the advanced AI/ML requirements of extreme edge computing. Its compact size and low power draw make it ideal for drone integration. For gimbal camera systems, it can operate without Wi-Fi or Ethernet at the hardware level, simplifying design and reducing weight. With its cost-effectiveness, compact footprint, and broad support for AI models and multimodal capabilities including AI context sharing across camera, audio, and sensors, the Open-Q 8550CS µSOM is a compelling choice for modern video surveillance and low-cost, compact video conferencing devices.

The Open-Q™ 6490 Development Kit is designed to facilitate easy evaluation and development. The kit includes many standard sockets, enabling customers to choose from a wide range of third-party accessories. The SOM utilizes Qualcomm Technologies’ heterogeneous computing expertise to offer a system-on-chip with multiple specialized processing cores for powerful AI processing, image and graphics processing, and audio processing.

The Open-Q 6490CS provides flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as AI cameras, video collaboration, industrial handhelds, and video telematics. Based on Qualcomm Dragonwing™ QCS6490 processor, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution.

The Open-Q™ 2200 Series SIPs are a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QRB2210 (Yocto Linux) processors, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth® wireless technology. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.

ASPM is a hardware DSP module in two iterations, either the Qualcomm® QCC7226/QCC5229 SoC ICs, which includes a main DSP for audio use cases with low power consumption. The multicore compute architecture with dedicated low latency audio and AI accelerators includes dual-mode Bluetooth® wireless technology and integrated QSPI flash memory. Alango’s Sound Processing Module (ASPM) serves two flexible roles in audio device development. It can be embedded directly as a pre-built sound processing solution in mass-market devices, allowing manufacturers to add advanced audio features without the need for custom sound engineering. Alternatively, ASPM can function as a cost-effective development platform/tool tailored for Qualcomm® S7/S5 applications, offering developers a ready-to-use hardware and software environment to create and test audio processing features. This versatility supports both rapid product deployment and in-depth prototyping for custom sound solutions. The Alango Sound Processing Module (ASPM) supports Bluetooth® Low Energy, Bluetooth® Low Energy Audio, and Auracast™, offering robust connectivity options for modern audio applications. Bluetooth Low Energy provides efficient power consumption and is ideal for device-to-device communication, especially for wearable and portable devices. Bluetooth Low Energy Audio builds on this by enabling high-quality, low-latency audio streaming, making it ideal for voice, music, and gaming applications. With Auracast™, ASPM adds the ability to broadcast audio to an unlimited number of nearby receivers, which is useful for public and shared spaces where multiple users can access the same audio stream simultaneously. This comprehensive support makes ASPM well-suited for next-generation audio devices focused on seamless, high-quality user experiences. A list of the main technologies that can run on the ASPM is as follows: Adaptive Dual Microphone and Multi-Microphone Array: Uses multiple microphones to focus on a sound source and reduce background noise. Analyzes microphone signals to determine direction and improve sound quality. Noise Suppression: Processes audio signals by dividing them into frequency sub-bands and estimating noise levels. It then attenuates noise while preserving speech quality, effectively suppressing both stationary and transient noises. Echo Cancellation: Employs an adaptive filtering algorithm that adjusts itself to minimize echoes, even during double talk. Additionally, it includes a feature that automatically monitors the echo cancellation's effectiveness and suppresses any remaining echoes that are not obscured by the desired sound. Acoustic Feedback Reduction: Employs sub-band adaptive filters to estimate and reduce echoes between the speaker and microphone to prevent feedback oscillations. Adaptive Wind Noise Reduction: Sub-band processing technology ensures that only the problematic frequency bands containing wind noise are suppressed, preserving the quality of the original signal. Automatic Gain and Volume Control: Automatically adjusts the signal gain to ensure optimal voice levels, regardless of the ambient noise. It increases gain for weak voices and reduces it for strong ones, preventing noise amplification during speech pauses. Multichannel Dynamic Range Compression: Modifies the dynamic range of audio signals by compressing or expanding the difference between the loudest and quietest sounds, allowing for a more balanced and consistent listening experience ensuring that both loud and soft sounds are audible and comfortable. Intelligent Speech Mixer: Combines multiple signals from microphones of a multi-point/multi-zone voice communication system into a single enhanced signal. It does this intelligently to preserve the signal to noise ratio. Music Enhancement: Improves perceptual audio quality by dynamically adjusting the stereo image, frequency response, and bass levels to compensate for the limitations a given device. This results in a natural and undistorted sound experience. Speech Recognition Enhancement: Improves speech recognition performance in voice-controlled multimedia devices. It is a front-end solution that performs audio signal pre-processing prior to the Automatic Speech Recognition (ASR) and Key Word Recognition (KWR) engines.

The Open-Q Qualcomm Dragonwing™ 9075IQ System-on-Module (SOM) solutions offer scalable, power-efficient, and robust computing capabilities for autonomous devices and next-generation Industry 4.0 designs. These advanced AI-powered SOMs enable a range of critical functionalities, including robust safety features for autonomous mobile robots with enhanced device robustness through fault-tolerant ECC memory support and a dedicated real-time subsystem. The new SOM series facilitates the deployment of interactive industrial edge AI systems by integrating Large Language Model (LLM) support, achieving a generation rate of up to 22 tokens per second when running the LIama2 7B parameter model.

SECO SOM-SMARC-Dragonwing-IQ8 is a compact, industrial-grade SMARC System-on-Module powered by the Qualcomm® Dragonwing™ IQ8 platform, designed to accelerate the transition from AI prototyping to scalable edge deployment. Combining high-performance AI processing with robust industrial features, it enables low-latency on-device inference for industrial automation, robotics, smart surveillance, and smart infrastructure applications.

Tria's Vision AI-KIT IQ9 features an industrial 3.5-inch SBC board fitted with Qualcomm Dragonwing™ IQ-9075 SIP module, that delivers power-efficient on-device Edge AI and compute, for high-performance, heavy workload industrial applications in extreme environments. The Dragonwing IQ-9075 microprocessor domain (MD) has octa high-performance Kryo Gen6 cores, 100 TOPS of AI-acceleration, plus exceptional multimedia capabilities (up to 16 cameras, multiple displays, 4K170/4K275 enc/dec.). This SOC also features a real time subsystem (RTSS) with quad real-time cores @ 1.85 GHz and peripherals, for low-latency control applications. Dragonwing™ IQ-9075 SIP resources include 36 GB LPDDR5 (3200MHz, 96bit wide DRAM with inline ECC) plus four PMM8650AU PMICs for efficient power management. Vision AI-KIT IQ9 packs a wide range of connectivity interfaces, into a standard industrial 3.5-inch SBC form-factor, including 2x local MIPI CSI 4-lane camera inputs, 2x miniDP (4K) and 1x MIPI DSI display outputs, 6x USB ports (plus quad USB debug-bridge), 2x 2.5 GbE LAN interfaces, CAN, UART and GPIO interfaces. Add-on Wi-Fi/BT, cellular modem and NVME SSD storage options are supported via (key-E, key-B, key-M) M.2 slots. A mezzanine camera-adapter 120-pin connector enables the use of adapter boards for support of multiple concurrent remote cameras. Audio support includes stereo amplified outputs plus onboard PDM microphone.

IDC777 is the evaluation and development board for the IDC777 module. This board contains the IDC777 (LE Audio (Auracast and Unicast), Classic Bluetooth (A2DP Source and Sink, HFP, AGHFP, PBAP, HID and MAP) and BLE Data. So it is also used as a simple test board when you are testing your LE Audio or Classic Bluetooth Products.

IDC777 is a fully integrated Dual Mode LE Audio and Classic Audio Bluetooth module. IDC777 offers both LE Audio (LC3 Codec Auracast and Unicast) and Bluetooth Classic (aptX, aptX-HD, apt-X Lossless, Snapdragon Sound). IDC777 offers best in class performance in every single aspect of Bluetooth. IDC777 is based on the latest generation Bluetooth 6.0 Qualcomm Audio chip. IDC777 is easy to supply and offers a long life. DC777 offers a high level UART command interface (AudioAgent) that provides full control of all profiles such as UniCast and Auracast for LE Audio (LC3 Codec) and HFP, HSP or HFP-AG (HandsFree Voice), A2DP Source and Sink and AVRCP (Music Streaming), PBAP (Phone Book Access Profile) and MAP (Message Access Profile) for Classic. IDC777 connects to Android and iOS Apps using Bluetooth Low Energy, the Serial Protocol Profile (SPP) or HID (Over Classic, USB or BLE GATT). The module can act as receiver of Audio but also as a Transmitter. IDC777 can be a Central or Peripheral BLE device. In Peripheral mode, it the users can create their own BLE profiles.

The CAM570 is a PTZ conferencing camera, with premium-grade features that enable users to deliver in-person meeting experiences to remote participants. The CAM570 features a 4K dual-lens camera with 36X total zoom and an AI lens with 95-degree FOV. AVer’s beamforming technology guides the PTZ camera to focus on the most relevant activity in a meeting, meanwhile eliminating unnecessary audio with mouth and human voice detection. The CAM570 includes three pairs of built-in voice sensors with beamforming technology and two 4K lenses to track speakers up to 10 meters away. The CAM570 is Zoom and Microsoft Teams certified and works seamlessly with Google Meet and other video conferencing platforms.

Elevate your video conferencing experience with the VB350, the premium version of all-in-one solutions. Boasting a sleek, streamlined design, dual 4K lenses for crystal-clear visuals, seamless lens switching, enhanced audio technology, and effortless setup, it's the perfect choice for transforming your mid-to-large conference rooms into premium audio and video hubs. Make the leap to next-level video meetings with the VB350 and unlock a new era of meeting equity, productivity, and engagement.

NileCAM130M_CUQRB5 is a 13MP GMSL 2 camera based on a 1/3.2 inch AR1335 CMOS image sensor with advanced 1.1μm pixel BSI technology from onsemi™.This ensures excellent image quality in both visible & near-IR regions. This multi-camera solution connects up to 4 cameras to Qualcomm® Robotics RB5 Development Kit.Also, this 13MP camera has an M12 lens holder, allowing customers to use the lens of their choice.