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EIC-Q865-210
The eInfochips 865 hardware development kit (HDK) is based on Snapdragon® 865 processor (SM8250). The HDK offers intelligent on-device AI, 2-gigapixel-per-second camera speeds, and high-end graphics at low power consumption. This feature-rich Android 10 development platform is an ideal starting point for integration and innovation of connected devices. The main purpose of Snapdragon 865 HDK is to kick start development and testing of devices for original equipment manufacturers (OEMs), hardware/software vendors and developers for faster time to market. This HDK is an ideal platform to kick-start development of embedded devices for Gaming, AR/VR, infotainment, 4K cameras as well as automation solutions.

KEY FEATURES:

  • Features Snapdragon Elite Gaming™ Features, Sensing Hub, Artificial Intelligence Engine, Adaptive Audio and Audio Technologies
Chipset
Type Development Kits
Crystal Resonator
Product Description: Crystal Unit SMD 1.2x1.0 76.8MHz TST Part No.: TZ3770AAAI82

KEY FEATURES:

  •  Excellent Reliability Performance with good Frequency Perturbation and Stability over temperature
  • Ultra Miniature Package with Surface Mount Hermetic Package
  • Moisture Sensitivity Level (MSL): Level-1
Chipset
Type Reference Design Platforms
NL02-A
LTE to Wi-Fi conversion module utilizes Qualcomm® QCA9531, Qualcomm® QCA9887 and Qualcomm® MDM9607 chipset platforms.
NL03-A
LTE to Wi-Fi conversion module utilizes Qualcomm® QCA8337, Qualcomm® QCA9550 and Qualcomm® IMDM9607chipset platforms.
Chipset
QCA8337,QCA9550,MDM9607
Type System-on-Modules
CT1612
Crystal with thermistor for 5G chipsets.

KEY FEATURES:

  • 1612 size
  • 38.4/52/76.8MHz available
Type Reference Design Platforms
SIM7600SA-H
LTE Cat.4 Module The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverageAbundant software functions: FOTA, LBS, TLS, VoLTEAT commands of the SIM7600SA-H is compatible with the SIM7500/SIM7600 series modules
SIM7600G-H
LTE Cat.4 Module. SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600G-H is compatible with the SIM7500/SIM7600 series modules
SIM7600JC-H
LTE Cat.4 Module. The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series(LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600JC-H is compatible with the SIM7500/SIM7600 series modules
SIM7600V-H
LTE Cat.4 Module. The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series(LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600V-H is compatible with the SIM7500/SIM7600 series modules
SIM7600E-H
LTE Cat.4 Module. The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600E-H is compatible with the SIM7500/SIM7600 series modules
SIM7600A-H
LTE Cat.4 Module. The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360series (UMTS/HSPA+ modules), and SIM7600 series(LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600A-H are compatible with the SIM7500/SIM7600 series modules
SIM8905A
Smart Module. SIMCom presents an ultra compact and reliable wireless module SIM8905 which is based on the Qualcomm® Snapdragon™ 210 processor (MSM8909) multiple-mode LTE platform. SIM8905 is a complete multi-band LTE-FDD/TDD/TD-SCDMA/DC-HSPA+/HSPA/UMTS/EVDO/EGDE/GPRS/GSM/GNSS smartmodule designed with very powerful processors, allowing customers to benefit from small dimensions and cost-effective product solutions with low power consumption in high-speed throughput.

KEY FEATURES:

  • Support charge management function, dual SIM card, double camera, 720@30fps video recording and playing
  • Support global multi network mode (LTE Cat 4)
  • Integrate GNSS function, supports rapid accurate positioning under different environment
Chipset
Type System-on-Modules
SIM8905E
Smart Module. SIMCom presents an ultra compact and reliable wireless module SIM8905 which is based on the Qualcomm® Snapdragon™ 210 processor (MSM8909) multiple-mode LTE platform. SIM8905 is a complete multi-band LTE-FDD/TDD/TD-SCDMA/DC-HSPA+/HSPA/UMTS/EVDO/EGDE/GPRS/GSM/GNSS smart module designed with very powerful processors, allowing customers to benefit from small dimensions and cost-effective product solutions with low power consumption in high-speed throughput.

KEY FEATURES:

  • Supports charge management function, dual SIM card, double camera, 720@30fps video recording and playing
  • Supports global multi network mode (LTE Cat 4)
  • Integrates GNSS function, supports rapid accurate positioning under different environments
Chipset
Type System-on-Modules
ATXX 5G Starter Kit
Start your next 5G product with ATXX! This starter kit includes: 1 x Quectel RM500Q module (based on the Qualcomm® Snapdragon™ X55 modem) and 4 x ATXX 5G PCB antennas Order number: ATXX-DY-2011150

KEY FEATURES:

  • One 5G Quectel modem module, RM500Q
  • Four ATXX PCB antennas, designed for use with the Quectel modem
Chipset
Type Evaluation Boards
Smart module N1
N1 is the leading industrial-grade smart 4G module that runs Android OS and supports all local network standards. It supports different audio codec and integrates high-performance graphic engine. N1 provides rich audio and video IO interfaces and GPIOs. It is well applicable to handheld devices, smart POS, in-vehicle computers, multimedia terminals, smart homes and more.

KEY FEATURES:

  • Based on Qualcomm(r) MSM8909 SOC for fast and stable connections
  • Dual-SIM ensures secure backup for data transmission 
  • Peripheral interfaces - OTG, camera, screen, capacitive touchpad, speaker, and TF card
Chipset
Type System-on-Modules
4G module N720
N720 is an industrial grade LTE module that is developed on Qualcomm(r) MDM9607 platform and supports global network standards. As the smallest module of the same type, its dimensions are only 30 mm x 28 mm x 2.8 mm. With its industrial design and reliable performance, it is well applicable to AMR, in-vehicle computers, handheld POS, industrial routers, etc.

KEY FEATURES:

  • Support Cat 4 and Cat 1 and embedded rich network protocols
  • Precise positioning (GPS, BDS, GLONASS) to help customers to manage devices based on location
  • Industrial design, ultra-wide range of operating temperature -40 °C to +85°C
  • Supports Linux
Chipset
Type System-on-Modules
BME680
The BME680 is the first gas sensor that integrates high-linearity and high-accuracy gas, pressure, humidity and temperature sensors. It is especially developed for mobile applications and wearables where size and low power consumption are critical requirements. The BME680 guarantees - depending on the specific operating mode - optimized consumption, long-term stability and high EMC robustness.
EM7690
Offering global LTE connectivity with approvals from multiple NAM, EMEA, and APAC carriers, the EM7690, based on the Qualcomm® Snapdragon™ X55 modem system, provides an easy upgrade path to next-generation cellular technologies and global access to LTE-Advanced Pro high speed cellular networks. Supporting USB 3.1 and PCIe gen 3 single lane interfaces, this Cat-20 embedded module is ideal for a wide range of industrial M2M and mobile computing solutions.

KEY FEATURES:

  • Up to 2Gbps downlink and 211Mbps uplink speeds
  • 3GPP Rel-15 compliant
  • Automatic 3G fallback network
  • Integrated GNSS receiver (GPS, GLONASS, BeiDou, and Galileo satellite systems supported)
Chipset
Type System-on-Modules
EM9190
Offering global 5G connectivity, the EM9190 is designed in an M.2 form factor and is compatible with Sierra Wireless's EM7690 4G LTE-A Pro module to help facilitate the migration and differentiation between 4G LTE and 5G. This 5G NR Sub-6 GHz and mmWave embedded module is applicable to a wide range of IoT applications such as industrial routers, home gateways, industrial and consumer laptops, rugged tablet PCs, video surveillance and digital signage.

KEY FEATURES:

  • Up to 5.5Gbps downlink and 3Gbps uplink speeds
  • 3GPP Rel-15 compliant
  • Automatic 4G and 3G fallback networks
  • Integrated GNSS receiver (GPS, GLONASS, BeiDou, and Galileo satellite systems supported)
Chipset
Type System-on-Modules
EM9191
Offering global 5G connectivity, the EM9191 is designed in an M.2 form factor and is compatible with Sierra Wireless's EM9190 module for a simple upgrade path to mmWave, as well as the EM7690 module to help facilitate the migration and differentiation between 4G LTE and 5G. This 5G NR Sub-6 GHz embedded module is applicable to a wide range of IoT applications such as industrial routers, home gateways, industrial and consumer laptops, rugged tablet PCs, video surveillance and digital signage.

KEY FEATURES:

  • Up to 4.5Gbps downlink and 660Mbps uplink speeds
  • 3GPP Rel-15 compliant
  • Automatic 4G and 3G fallback networks
  • Integrated GNSS receiver (GPS, GLONASS, BeiDou and Galileo satellite systems supported)
Chipset
Type System-on-Modules

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