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Snapdragon 8 Gen 3 Mobile Hardware Development Kit -Development Board / Kit Qual
The Snapdragon® 8 Gen 3 Mobile Platform delivers premium-level performance across all mobile experiences. The Qualcomm® AI Engine was developed with on-device generative AI. Below are a few highlights of the HDK.

KEY FEATURES:

  • • Powered by the Snapdragon SM8650AB SoC• 1st Qualcomm AI Engine to support multi-modal generative models• World’s smartest AI-powered camera• Ultra smooth lag-free graphics• AI bots for next-level gaming• World’s 1st 5G modem with an AI Tensor accelerator
Snapdragon 8 Gen 2 Mobile Hardware Development Kit
The Snapdragon® 8 Gen 2 Mobile Platform is an AI marvel that defines a new premium standard for connected computing created by Qualcomm Technologies. Below are a few highlights of the HDK.Powered by the Snapdragon SM8550P SoCFaster natural language processing with multi-language translation and transcriptionAI cinematic video captureDirect voice command

KEY FEATURES:

  • AI bots for next-level gaming
  • Buildable BSP is offered with NRE | Andriod 13
AIRETOS E20 Class
Industrial-grade LGA Modules that offer a full implementation of Wi-Fi 6E (IEEE 802.11ax extended to include the 6Ghz channels), in a combo design with Bluetooth 5.2.The AIRETOS® E20 Class opens a new way to match application requirements with hardware and firmware feature options for Wi-Fi and Bluetooth interfaces. It comes with more channels, the complete 6Ghz ISM spectrum, smaller latency, and dual-band & dual-MAC / dual-mode capabilities across three bandsThe AIRETOS® E20 Class is a complete platform for use with the entire Qualcomm® QCA206x family of SoCs, along with options for handling Bluetooth signaling requirements in all possible combinations. Even more Qualcomm Technologies' SoCs are supported, like the Qualcomm® WCN685x family and the Qualcomm® QCA6898, for targeted design requirements.

KEY FEATURES:

  • Flexible configuration: ASIC Variant + choice of miniPCI, M2E or M2B carrier and BT5.2 via USB or UART.
  • Linux, Android and Windows drivers.
  • EVB and LGA CoB socket tools for access to all interfaces.
ByVOXMICRO LTD.
Chipset
CT1612
Crystal with thermistor for 5G chipsets.

KEY FEATURES:

  • 1612 size
  • 38.4/52/76.8MHz available
SIM7600SA-H
LTE Cat.4 Module The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverageAbundant software functions: FOTA, LBS, TLS, VoLTEAT commands of the SIM7600SA-H is compatible with the SIM7500/SIM7600 series modules
SIM7600G-H
LTE Cat.4 Module. SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600G-H is compatible with the SIM7500/SIM7600 series modules
SIM7600JC-H
LTE Cat.4 Module. The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series(LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600JC-H is compatible with the SIM7500/SIM7600 series modules
SIM7600V-H
LTE Cat.4 Module. The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series(LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600V-H is compatible with the SIM7500/SIM7600 series modules
SIM7600E-H
LTE Cat.4 Module. The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600E-H is compatible with the SIM7500/SIM7600 series modules
SIM7600A-H
LTE Cat.4 Module. The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360series (UMTS/HSPA+ modules), and SIM7600 series(LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

KEY FEATURES:

  • Suitable for LTE, UMTS and GSM networks with global coverage
  • Abundant software functions: FOTA, LBS, TLS, VoLTE
  • AT commands of the SIM7600A-H are compatible with the SIM7500/SIM7600 series modules
SIM8905A
Smart Module. SIMCom presents an ultra compact and reliable wireless module SIM8905 which is based on the Qualcomm® Snapdragon™ 210 processor (MSM8909) multiple-mode LTE platform. SIM8905 is a complete multi-band LTE-FDD/TDD/TD-SCDMA/DC-HSPA+/HSPA/UMTS/EVDO/EGDE/GPRS/GSM/GNSS smartmodule designed with very powerful processors, allowing customers to benefit from small dimensions and cost-effective product solutions with low power consumption in high-speed throughput.

KEY FEATURES:

  • Support charge management function, dual SIM card, double camera, 720@30fps video recording and playing
  • Support global multi network mode (LTE Cat 4)
  • Integrate GNSS function, supports rapid accurate positioning under different environment
SIM8905E
Smart Module. SIMCom presents an ultra compact and reliable wireless module SIM8905 which is based on the Qualcomm® Snapdragon™ 210 processor (MSM8909) multiple-mode LTE platform. SIM8905 is a complete multi-band LTE-FDD/TDD/TD-SCDMA/DC-HSPA+/HSPA/UMTS/EVDO/EGDE/GPRS/GSM/GNSS smart module designed with very powerful processors, allowing customers to benefit from small dimensions and cost-effective product solutions with low power consumption in high-speed throughput.

KEY FEATURES:

  • Supports charge management function, dual SIM card, double camera, 720@30fps video recording and playing
  • Supports global multi network mode (LTE Cat 4)
  • Integrates GNSS function, supports rapid accurate positioning under different environments
ATXX 5G Starter Kit
Start your next 5G product with ATXX! This starter kit includes: 1 x Quectel RM500Q module (based on the Qualcomm® Snapdragon™ X55 modem) and 4 x ATXX 5G PCB antennas Order number: ATXX-DY-2011150

KEY FEATURES:

  • One 5G Quectel modem module, RM500Q
  • Four ATXX PCB antennas, designed for use with the Quectel modem
4G module N720
N720 is an industrial grade LTE module that is developed on Qualcomm(r) MDM9607 platform and supports global network standards. As the smallest module of the same type, its dimensions are only 30 mm x 28 mm x 2.8 mm. With its industrial design and reliable performance, it is well applicable to AMR, in-vehicle computers, handheld POS, industrial routers, etc.

KEY FEATURES:

  • Support Cat 4 and Cat 1 and embedded rich network protocols
  • Precise positioning (GPS, BDS, GLONASS) to help customers to manage devices based on location
  • Industrial design, ultra-wide range of operating temperature -40 °C to +85°C
  • Supports Linux
Smart module N1
N1 is the leading industrial-grade smart 4G module that runs Android OS and supports all local network standards. It supports different audio codec and integrates high-performance graphic engine. N1 provides rich audio and video IO interfaces and GPIOs. It is well applicable to handheld devices, smart POS, in-vehicle computers, multimedia terminals, smart homes and more.

KEY FEATURES:

  • Based on Qualcomm(r) MSM8909 SOC for fast and stable connections
  • Dual-SIM ensures secure backup for data transmission 
  • Peripheral interfaces - OTG, camera, screen, capacitive touchpad, speaker, and TF card
BMI263
The ultra-low power BMI263 is Bosch Sensortec’s first IMU which is compliant with the latest I3C standard as defined by MIPI Alliance. This 6-axis sensor combines precise acceleration and angular rate measurement data with intelligent on-chip motion-triggered interrupt features.
BME680
The BME680 is the first gas sensor that integrates high-linearity and high-accuracy gas, pressure, humidity and temperature sensors. It is especially developed for mobile applications and wearables where size and low power consumption are critical requirements. The BME680 guarantees - depending on the specific operating mode - optimized consumption, long-term stability and high EMC robustness.
BMI160
The small, low power BMI160 is a low noise 16-bit IMU designed for mobile applications such as AR or indoor navigation, providing highly accurate sensor data and real-time sensor data. The low current consumption of BMI160 enables always-on applications in battery-driven devices. This sensor features a configurable on-chip interrupt engine which provides motion-based gesture recognition and context awareness as always-on background functions.
BMI270
The ultra-low power BMI270 is an IMU optimized for wearables providing precise acceleration, angular rate measurement and intelligent on-chip motion-triggered interrupt features. The 6-axis sensor combines a 16-bit tri-axial gyroscope and a 16-bit tri-axial accelerometer featuring Bosch’s automotive-proven gyroscope technology. BMI270 includes several functionalities such as an integrated plug-and-play step counter/detector for wrist-worn devices.
BMI260
The ultra-low power BMI260 is an IMU consisting of a 16-bit tri-axial gyroscope and a 16-bit tri-axial accelerometer combining precise acceleration, angular rate measurement and intelligent on-chip motion-triggered interrupt features. This next-generation IMU provides fast, exact inertial sensing in smartphones and HMI applications. It provides highly accurate step counting, motion detection and is pin-to-pin compatible with the BMI160.
Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Our leading-edge AI, high performance, low-power computing, and unrivaled connectivity deliver proven solutions that transform major industries. At Qualcomm, we are engineering human progress.

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