Find hardware, software and services to develop better Smartphone technology.

The Snapdragon® 8 Gen 2 Mobile Platform is an AI-focused connected-computing platform created by Qualcomm Technologies, Inc. Powered by the Snapdragon® SM8550P SoC, the HDK is built to support natural-language processing, including multi-language translation and transcription, AI-enhanced video capture, and direct voice-command functionality.

The eInfochips 865 hardware development kit (HDK) is based on Snapdragon® 865 processor (SM8250). The HDK offers intelligent on-device AI, 2-gigapixel-per-second camera speeds, and high-end graphics at low power consumption. This feature-rich Android 10 development platform is an ideal starting point for integration and innovation of connected devices. The main purpose of Snapdragon 865 HDK is to kick start development and testing of devices for original equipment manufacturers (OEMs), hardware/software vendors and developers for faster time to market. This HDK is an ideal platform to kick-start development of embedded devices for Gaming, AR/VR, infotainment, 4K cameras as well as automation solutions.

New generation of multi-mode Smart LTE Cat 6 modules based on the Qualcomm® SDM660 SoC with Android 9.0 OS is well suited for a wide range of industrial and consumer applications with high date-rate and multimedia requirements.

Quectel EG18 is a series of LTE Advanced category 18 modules optimized specifically for M2M and IoT applications such as business router, home gateway, STB, industrial laptop, and industrial PDA. Adopting the 3GPP Rel. 12 LTE technology, it delivers M2M-optimized speeds of 1.2Gbps downlink and 150Mbps uplink peak data rates. Designed in an LGA form factor, EG18 is compatible with Quectel Cat 6/12 modules EG06 and EG12, which will help customers to migrate between different categories.

Powered by Qualcomm Technologies' processors, supporting 4-lane USB, RJ45, RJ12, RJ11, Micro-USB and headset interfaces. Adopting structured light camera to support facial recognition and its adoption in financial payment. ESIM card function starts the new era of sim card, which is a convenient solution for unmanned supermarket, chain restaurants, convenient stores, etc by providing automatic check outs, online orders, membership management, auto closing and warehouse management.

MeiG Smart utilizes Qualcomm Technologies chipsets and narrow band modules to provide customized integrated smart system with narrowband and broadband network. The solution integrates DMR, PDT, TETRA and MPT narrowband private network 4G/3G/2G, WLAN broadband technology to provide end-to-end voice, data and video solution. It makes it possible for industrial customers to realize voice command, multi-media cluster, real-time data interaction and collaborative operation.

The Snapdragon® 8 Gen 3 Mobile Platform delivers premium-level performance across all mobile experiences. The Qualcomm® AI Engine was developed with on-device generative AI. Below are a few highlights of the HDK.

Cavli’s CQS325 is an LTE Cat 4 module with 2G fallback, featuring a Qualcomm® Kryo™ 265 CPU and Qualcomm® Adreno™ 610 GPU for enhanced graphics, power efficiency, and imaging. Available in multiple SKUs, it supports multi-constellation GNSS (GPS, BDS, GLONASS, Galileo, QZSS, SBAS), USB 3.1/2.0, Bluetooth® 5.0, dual-band Wi-Fi, and MIPI DSI for Full HD displays. Ideal for two-wheelers, e-mobility, telematics, fleet management, and POS terminals. An optional integrated eSIM provides global connectivity via the Cavli Hubble IoT Platform. Regional variants include EAJ (Eurasia/Japan), AN (Australia/NZ). NA (North America), IN (India), and WW (Worldwide) variants.

The Cavli CQS315 is an LTE Cat 4 Smart module with 2G fallback, designed for versatile IoT applications. Powered by an Octa-core Qualcomm® KryoTM 260 CPU architecture and an integrated Adreno 610 GPU, this smart module delivers enhanced graphics capabilities, high- quality imaging, and powerful compute performance. Available in multiple SKUs, each variant supports multi-constellation GNSS, including GPS, BDS, GLONASS, Galileo, QZSS, and SBAS. The CQS315 also offers robust connectivity options with USB 3.1/2.0, Bluetooth 5.0, and Dual-band Wi-Fi along with support for MIPI DSI interface capable of full HD resolution, making it ideal for applications such as two- wheelers, e-mobility, telematics, fleet management, and POS terminals. The module is available in multiple regional variants, including CQS325-EAJ for Eurasia and Japan, CQS325-AN for Australia & New Zealand, CQS325-NA for North America, CQS325- LA for Latin America, CQS325-IN for India, and CQS325-WW worldwide variant for global markets.

Product Description: Crystal Unit SMD 1.2x1.0 76.8MHz TST Part No.: TZ3770AAAI82

LTE to Wi-Fi conversion module utilizes Qualcomm® QCA9531, Qualcomm® QCA9887 and Qualcomm® MDM9607 chipset platforms.

LTE to Wi-Fi conversion module utilizes Qualcomm® QCA8337, Qualcomm® QCA9550 and Qualcomm® IMDM9607chipset platforms.

Crystal with thermistor for 5G chipsets.

LTE Cat.4 Module The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

LTE Cat.4 Module. SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

LTE Cat.4 Module. The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series(LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

LTE Cat.4 Module. The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series(LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

LTE Cat.4 Module. The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.