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Kiteboard 8250 SOM
The Kiteboard 8250 System-on-Module (SOM) is a premier-tier, production-ready SOM built on the Qualcomm® Dragonwing™ QCS8250 SoC, designed to enable OEMs and ODMs to develop high-performance edge AI devices for multi-camera vision and intelligent IoT deployments. Combining powerful compute with advanced connectivity, the module supports real-time edge analytics and video processing for applications such as video telematics, industrial vision systems, AI-connected cameras, smart retail analytics, and healthcare edge devices
KEY FEATURES:
- SMARC Compatible with Customizable Carrier Board
- Optimized for multi-camera edge AI deployments
- Supports Multiple AI Models (e.g. YOLO, MobileNet, SAM-HQ, PatchCore)
- Compatible with SNPE, QAIRT and Edge Impulse
The Kiteboard 8250 System-on-Module (SOM) is a premier-tier, production-ready SOM built on the Qualcomm® Dragonwing™ QCS8250 SoC, designed to enable OEMs and ODMs to develop high-performance edge AI devices for multi-camera vision and intelligent IoT deployments. Combining powerful compute with advanced connectivity, the module supports real-time edge analytics and video processing for applications such as video telematics, industrial vision systems, AI-connected cameras, smart retail analytics, and healthcare edge devices
KEY FEATURES:
- SMARC Compatible with Customizable Carrier Board
- Optimized for multi-camera edge AI deployments
- Supports Multiple AI Models (e.g. YOLO, MobileNet, SAM-HQ, PatchCore)
- Compatible with SNPE, QAIRT and Edge Impulse
Carambola 3 DVK
The Carambola 3 DVK is a powerful development kit tailored for the Carambola3 (commercial version). With the Qualcomm® QCA4531 SoC at its core, this feature-rich kit provides a wide range of interfaces, including a 2.4 GHz antenna, LAN ports, USB sockets (type A and type C), as well as a reset button, and GPIO programmable button. The kit is designed to unleash the full potential of your projects.
KEY FEATURES:
- SW optionsThe embedded Linux framework FirmUx from 8devicesOpenWRT
The Carambola 3 DVK is a powerful development kit tailored for the Carambola3 (commercial version). With the Qualcomm® QCA4531 SoC at its core, this feature-rich kit provides a wide range of interfaces, including a 2.4 GHz antenna, LAN ports, USB sockets (type A and type C), as well as a reset button, and GPIO programmable button. The kit is designed to unleash the full potential of your projects.
KEY FEATURES:
- SW optionsThe embedded Linux framework FirmUx from 8devicesOpenWRT
Lima DVK
The Lima DVK from 8devices is a robust development kit designed specifically for the Lima system-on-module (SOM) devices. Powered by the Qualcomm® QCA4531 SoC, this feature-rich kit offers a diverse range of interfaces, including dual 100 Base-T Ethernet ports, USB Type-C socket (console + power), programmable buttons (S1 - GPIO connected, S2 - reset), integrated antennas, 2.45 mm pitch connector holes, and a MINI PCIe socket. Unlock the full potential of your Lima projects with this versatile and powerful development kit.
KEY FEATURES:
- The Lima SOM supports the embedded Linux framework FirmUx from 8devices, providing programmers with a flexible platform for developing a range of software applications. The software can be also built by using OpenWRT
The Lima DVK from 8devices is a robust development kit designed specifically for the Lima system-on-module (SOM) devices. Powered by the Qualcomm® QCA4531 SoC, this feature-rich kit offers a diverse range of interfaces, including dual 100 Base-T Ethernet ports, USB Type-C socket (console + power), programmable buttons (S1 - GPIO connected, S2 - reset), integrated antennas, 2.45 mm pitch connector holes, and a MINI PCIe socket. Unlock the full potential of your Lima projects with this versatile and powerful development kit.
KEY FEATURES:
- The Lima SOM supports the embedded Linux framework FirmUx from 8devices, providing programmers with a flexible platform for developing a range of software applications. The software can be also built by using OpenWRT
Lima
The Lima module is powered by the Qualcomm® QCA4531 SoC, which features a 650 MHz CPU and an 802.11N 2x2 (MIMO) radio. This module is available in two temperature ranges, commercial (Lima) and industrial (Lima-I), to meet a wide range of application needs. The Lima module is surface-mountable and enabled by the Linux operating system, with developers able to build their applications using OpenWRT. Additionally, Lima supports the embedded Linux framework FirmUx from 8devices. This combination of advanced hardware and versatile software makes the Lima module an ideal choice for Internet of Everything (IoE) applications.
KEY FEATURES:
- 32 MB Flash and 64 MB DDR2 RAM | 20 dBm Max output power | Max power consumption 3.1 W | USB 2.0 host | GPIO | Serial port | 2 x Ethernet (100 Base-T) | PCIe
The Lima module is powered by the Qualcomm® QCA4531 SoC, which features a 650 MHz CPU and an 802.11N 2x2 (MIMO) radio. This module is available in two temperature ranges, commercial (Lima) and industrial (Lima-I), to meet a wide range of application needs. The Lima module is surface-mountable and enabled by the Linux operating system, with developers able to build their applications using OpenWRT. Additionally, Lima supports the embedded Linux framework FirmUx from 8devices. This combination of advanced hardware and versatile software makes the Lima module an ideal choice for Internet of Everything (IoE) applications.
KEY FEATURES:
- 32 MB Flash and 64 MB DDR2 RAM | 20 dBm Max output power | Max power consumption 3.1 W | USB 2.0 host | GPIO | Serial port | 2 x Ethernet (100 Base-T) | PCIe
Carambola 3
It is a compact and powerful module that integrates a variety of features, including Wi-Fi as well as a range of other interfaces and peripherals. The module is designed to be applied in a wide range of embedded applications, including Internet of Things (IoT) devices, industrial automation systems, and smart home devices. The Qualcomm® QCA4531 chipset provides high performance and low power consumption. The Carambola3 SoM is designed to be easily integrated into a wide range of platforms and products, which reduces development time and costs.The module comes in two versions: commercial, operating at 0-65 °C (Carambola3), and Industrial, operating at -40-85 °C (Carambola3-I).
KEY FEATURES:
- OpenWrt | Linux OS | 3.3V power supply, 1.6W power consumption | 21dB max output power | Available interfaces: USB2.0 host, serial port, 2x Ethernet (100 Base-T), GPIO | U.FL connector | 32MB flash memory and 128 MB DDR2 RAM |
It is a compact and powerful module that integrates a variety of features, including Wi-Fi as well as a range of other interfaces and peripherals. The module is designed to be applied in a wide range of embedded applications, including Internet of Things (IoT) devices, industrial automation systems, and smart home devices. The Qualcomm® QCA4531 chipset provides high performance and low power consumption. The Carambola3 SoM is designed to be easily integrated into a wide range of platforms and products, which reduces development time and costs.The module comes in two versions: commercial, operating at 0-65 °C (Carambola3), and Industrial, operating at -40-85 °C (Carambola3-I).
KEY FEATURES:
- OpenWrt | Linux OS | 3.3V power supply, 1.6W power consumption | 21dB max output power | Available interfaces: USB2.0 host, serial port, 2x Ethernet (100 Base-T), GPIO | U.FL connector | 32MB flash memory and 128 MB DDR2 RAM |
VVDN QCS 8250 Development Kit
Our QCS 8250 development kit is a powerful compact solution for edge computing applications. The QCS 8250 development kit comprises of SOM (based on Qualcomm® QCS8250 IoT Octa-core SoC) and a carrier board designed and developed by VVDN. The SOM provides multiple standard interfaces such as UART, I2C, SPI, configurable GPIOs, CAN, and USB 3.1. It can support multiple cameras with six 4-lane MIPI CSI and two 4-lane MIPI DSIThe system is intended for kickstarting the development of applications that requires intelligent processing including connected cameras, video collaboration, retail self-checkout, AR/VR, health care, fleet management, digital signage, and other AI applications on the edge.
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Powerful processing cores
- Dedicated computer vision engine
- Android 10-based OS
Our QCS 8250 development kit is a powerful compact solution for edge computing applications. The QCS 8250 development kit comprises of SOM (based on Qualcomm® QCS8250 IoT Octa-core SoC) and a carrier board designed and developed by VVDN. The SOM provides multiple standard interfaces such as UART, I2C, SPI, configurable GPIOs, CAN, and USB 3.1. It can support multiple cameras with six 4-lane MIPI CSI and two 4-lane MIPI DSIThe system is intended for kickstarting the development of applications that requires intelligent processing including connected cameras, video collaboration, retail self-checkout, AR/VR, health care, fleet management, digital signage, and other AI applications on the edge.
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Powerful processing cores
- Dedicated computer vision engine
- Android 10-based OS
VVDN QCS8250 SoM
QCS8250 SoM designed, and developed by VVDN is based on Qualcomm Technologies next-gen processor, the Qualcomm® QCS8250. The SoM can be used in the development of applications that require intelligent processing including connected cameras, video collaboration, retail self-checkout, AR/VR, health care, fleet management, digital signage and other AI applications on the edge.
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Integrated Wi-Fi – (IEEE802.11 b/g/n/ac/ax 2.4/5Ghz) + BLE V5.1
- Supports multiple rich interfaces for camera, connectivity, and display
- Android 10 OS
- Ultra-compact form factor
QCS8250 SoM designed, and developed by VVDN is based on Qualcomm Technologies next-gen processor, the Qualcomm® QCS8250. The SoM can be used in the development of applications that require intelligent processing including connected cameras, video collaboration, retail self-checkout, AR/VR, health care, fleet management, digital signage and other AI applications on the edge.
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Integrated Wi-Fi – (IEEE802.11 b/g/n/ac/ax 2.4/5Ghz) + BLE V5.1
- Supports multiple rich interfaces for camera, connectivity, and display
- Android 10 OS
- Ultra-compact form factor
QSC8250 Video Conference Development Kit
QCS8250 Video Conference Development Kit comprises 1 Qualcomm® QCS8250 processor-based SoM, 1 carrier board, mic and 3 cameras
QCS8250 Video Conference Development Kit comprises 1 Qualcomm® QCS8250 processor-based SoM, 1 carrier board, mic and 3 cameras
QCS8250 Video Collaboration Reference Design by AmTRAN
All-in-one video conference room reference designIntegrated cameras, microphones, speaker and HDMI input/outputs in one deviceWall mountable or place on tabletopCollaboration application runs on the device, no need for a separate PC to host the application.Designed for medium to large rooms, 4.5 – 5.0-meter range.Intelligent AI based features for video and audio.Qualcomm® AI Suite for Video CollaborationAI based automatic ePTZ for group framing, person framing and speaker framing to make video meetings more engaging.AI based noise suppression to eliminate audio distractions.Intelligent Acoustic Echo CancelationExcellent double-talk performanceClear voice pickup up to 5 metersReduces meeting room reverberation.3-4 microphone array
KEY FEATURES:
- Based on powerful Qualcomm® QCS8250 processorAndroid T, kernel 5.15Memory 8GB, storage 32GB4K Ultra HD video calling, 4 Microphone Array, 5 Meters Pickup RangeTested for Teams and Zoom pre-certification
All-in-one video conference room reference designIntegrated cameras, microphones, speaker and HDMI input/outputs in one deviceWall mountable or place on tabletopCollaboration application runs on the device, no need for a separate PC to host the application.Designed for medium to large rooms, 4.5 – 5.0-meter range.Intelligent AI based features for video and audio.Qualcomm® AI Suite for Video CollaborationAI based automatic ePTZ for group framing, person framing and speaker framing to make video meetings more engaging.AI based noise suppression to eliminate audio distractions.Intelligent Acoustic Echo CancelationExcellent double-talk performanceClear voice pickup up to 5 metersReduces meeting room reverberation.3-4 microphone array
KEY FEATURES:
- Based on powerful Qualcomm® QCS8250 processorAndroid T, kernel 5.15Memory 8GB, storage 32GB4K Ultra HD video calling, 4 Microphone Array, 5 Meters Pickup RangeTested for Teams and Zoom pre-certification
Kiteboard ISQ8250
The ISQ8250 is a compute and connectivity system on module which enables OEMs, entrepreneurs and makers to build custom connected devices/appliances for vertical specific solutions that call for AI on the Edge. It is based on the Qualcomm QCS8250 SoC and enables OEMs & ODMs to build and commercialize feature rich intelligent devices at an accelerated time scale.
KEY FEATURES:
- Small form factor Sysyem-On-Module
The ISQ8250 is a compute and connectivity system on module which enables OEMs, entrepreneurs and makers to build custom connected devices/appliances for vertical specific solutions that call for AI on the Edge. It is based on the Qualcomm QCS8250 SoC and enables OEMs & ODMs to build and commercialize feature rich intelligent devices at an accelerated time scale.
KEY FEATURES:
- Small form factor Sysyem-On-Module
SP895BD-AP smart module
The SP895BD-AP is Quectel’s new generation of flagship Android smart module. Based on Qualcomm Techolongies’ IoT chipset CQ8750-S, with built-in incredible octa-core high-performance Qualcomm Oryon™ CPU, Qualcomm® Adreno™ 830 GPU, Adreno DPU, Adreno 8550 VPU, Qualcomm® Hexagon™ DSP, and Qualcomm Spectra™ ISP. Featuring powerful performance and rich multimedia functions, it is ideal for both industrial and consumer applications requiring high computing power, AI, and multimedia functions.A rich set of interfaces (such as LCM, camera, touch panel, I2S, PCIe, UART, USB, I2C, SPI, etc.) extend the applicability of the module to a wide range of M2M applications, including video conference systems, live streaming devices, gaming, edge computing, robots, AR/ VR, intelligent retail, smart safety, and more.
KEY FEATURES:
- Android 15/Linux smart module
- LGA package
- 33.0mm x 39.0mm x 3.85mm
- Operating temperature range of -30°C to +75°C
- Qualcomm Oryon CPU
- Adreno 830 GPU
- Hexagon DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX)
- Qualcomm Spectra ISP
- Adreno 8550 VPU
- Adreno DPU
- Neural processing unit
- Security processing
- Video encoder: 4K @ 120fps; 8K @ 30fps
- Video decoder: 4K @ 240fps; 8K @ 60fps
- Computing power of up to 80 TOPS
The SP895BD-AP is Quectel’s new generation of flagship Android smart module. Based on Qualcomm Techolongies’ IoT chipset CQ8750-S, with built-in incredible octa-core high-performance Qualcomm Oryon™ CPU, Qualcomm® Adreno™ 830 GPU, Adreno DPU, Adreno 8550 VPU, Qualcomm® Hexagon™ DSP, and Qualcomm Spectra™ ISP. Featuring powerful performance and rich multimedia functions, it is ideal for both industrial and consumer applications requiring high computing power, AI, and multimedia functions.A rich set of interfaces (such as LCM, camera, touch panel, I2S, PCIe, UART, USB, I2C, SPI, etc.) extend the applicability of the module to a wide range of M2M applications, including video conference systems, live streaming devices, gaming, edge computing, robots, AR/ VR, intelligent retail, smart safety, and more.
KEY FEATURES:
- Android 15/Linux smart module
- LGA package
- 33.0mm x 39.0mm x 3.85mm
- Operating temperature range of -30°C to +75°C
- Qualcomm Oryon CPU
- Adreno 830 GPU
- Hexagon DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX)
- Qualcomm Spectra ISP
- Adreno 8550 VPU
- Adreno DPU
- Neural processing unit
- Security processing
- Video encoder: 4K @ 120fps; 8K @ 30fps
- Video decoder: 4K @ 240fps; 8K @ 60fps
- Computing power of up to 80 TOPS
EH-WL501
EH-WL501 is a advanced module based on Qualcomm QCA4020 platform, support WiFi & ZigBee & Bluetooth.The EH-WL501 module provides a highly-integrated and flexible platform for developing and evaluating products and applications based on the QCA4020 SoC, it can be incorporated into OEM products to enable rapid deployment of Wi-Fi connected systems.The EH-WL501 module includes the following components:Dual-Band IEEE 802.11 a/b/g/n BLE 5.0 ZigBee 15.4Green Tx power saving modeFour-layer PCB designinterfaces: I2C, HSUART, UART, SPI, QSPI, SDIO 2.0, I2S, JTAGSecured boot and support
EH-WL501 is a advanced module based on Qualcomm QCA4020 platform, support WiFi & ZigBee & Bluetooth.The EH-WL501 module provides a highly-integrated and flexible platform for developing and evaluating products and applications based on the QCA4020 SoC, it can be incorporated into OEM products to enable rapid deployment of Wi-Fi connected systems.The EH-WL501 module includes the following components:Dual-Band IEEE 802.11 a/b/g/n BLE 5.0 ZigBee 15.4Green Tx power saving modeFour-layer PCB designinterfaces: I2C, HSUART, UART, SPI, QSPI, SDIO 2.0, I2S, JTAGSecured boot and support
EQM100-5
Powered by Qualcomm QCC711, EQM100-5 is a cutting-edge BLE module that combines multi-core processing capabilities, long-range BLE connectivity, and high-security features to cater to the demands of diverse IoT applications. Its compact size and on-chip memory of SRAM and RRAM (NVM) contribute to reduced costs and enhanced performance, making it an attractive choice for space-constrained IoT projects.EQM100-5 has undergone rigorous regulatory compliance testing and is certified with FCC, CE, IC, UKCA, RCM, MIC, KC, SRRC and environmentally compliant with RoHS and WEEE directives. It also holds Bluetooth SIG 5.3 certification, ensuring seamless interoperability with other Bluetooth devices.
KEY FEATURES:
- ARM M3@64MHz+ARM M0@64MHz+RISC-V@32MHz
- 128KB SRAM, 512KB NVM
- Bluetooth SIG 5.3
- TX Power: +6dBm, RX Sensitivity:-98dBm
- 26 I/O,QSPI,SPI,SPI,I2C,UART,SWD,PWM
Powered by Qualcomm QCC711, EQM100-5 is a cutting-edge BLE module that combines multi-core processing capabilities, long-range BLE connectivity, and high-security features to cater to the demands of diverse IoT applications. Its compact size and on-chip memory of SRAM and RRAM (NVM) contribute to reduced costs and enhanced performance, making it an attractive choice for space-constrained IoT projects.EQM100-5 has undergone rigorous regulatory compliance testing and is certified with FCC, CE, IC, UKCA, RCM, MIC, KC, SRRC and environmentally compliant with RoHS and WEEE directives. It also holds Bluetooth SIG 5.3 certification, ensuring seamless interoperability with other Bluetooth devices.
KEY FEATURES:
- ARM M3@64MHz+ARM M0@64MHz+RISC-V@32MHz
- 128KB SRAM, 512KB NVM
- Bluetooth SIG 5.3
- TX Power: +6dBm, RX Sensitivity:-98dBm
- 26 I/O,QSPI,SPI,SPI,I2C,UART,SWD,PWM
AIoT Camera
AIoT Camera product supports LTE Cat-M1: B2/4/12/13/25/26 (WNC IMQ5 Module), Micro-SIM (3FF) and Wi-Fi Dual Band 802.11 b/g/n WLA. Single Sensor support FOV: Horizontal 72°; Vertical 54° . Resolution: 320*240 (max). Non-rechargeable AAA battery*2. Product Dimensions : 103(L) * 73(W) * 25(T) mm. Compliance of Device Level: PTCRB (LTE version)/FCC/IC.
KEY FEATURES:
- Low power camera as sensor
- Pre-trained AI detection
- LTE Cat-M1 & Wi-Fi option available
AIoT Camera product supports LTE Cat-M1: B2/4/12/13/25/26 (WNC IMQ5 Module), Micro-SIM (3FF) and Wi-Fi Dual Band 802.11 b/g/n WLA. Single Sensor support FOV: Horizontal 72°; Vertical 54° . Resolution: 320*240 (max). Non-rechargeable AAA battery*2. Product Dimensions : 103(L) * 73(W) * 25(T) mm. Compliance of Device Level: PTCRB (LTE version)/FCC/IC.
KEY FEATURES:
- Low power camera as sensor
- Pre-trained AI detection
- LTE Cat-M1 & Wi-Fi option available
TurboX C8750 Development Kit
Thundercomm TurboX C8750 Development Kit is a high-performance Development Kit which is powered by next Gen Flagship Qualcomm® Snapdragon™ CQ8750s processor. It supports both Android and Linux operating systems. TurboX C8750 Development Kit supports Android, featuring powerful computing, extreme edge AI processing, and robust video and graphics. It is an ideal platform for IoT products that demand powerful computing, advanced imaging, and exceptional graphics rendering.TurboX C8750 Development Kit supports customers accelerate product development process and can be widely used in Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots (AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing and other application scenarios.
KEY FEATURES:
- 8th Gen AI Engine: Over 10x performance boost to previous gen
- Next Gen Oryon™ CPU:up to 1.5x over previous gen
- 3A+IQ upgrades;3 ISP, 3 x 48MP@30FPS HW sHDR, ASE
- Hypervisor enables multiple trusted VMs (TVMs)
- 3 times GPU performance improvement compared to the previous generation
- 4K240/8K60 decoding, 4K120/8K30 encoding AV1 decoder
Thundercomm TurboX C8750 Development Kit is a high-performance Development Kit which is powered by next Gen Flagship Qualcomm® Snapdragon™ CQ8750s processor. It supports both Android and Linux operating systems. TurboX C8750 Development Kit supports Android, featuring powerful computing, extreme edge AI processing, and robust video and graphics. It is an ideal platform for IoT products that demand powerful computing, advanced imaging, and exceptional graphics rendering.TurboX C8750 Development Kit supports customers accelerate product development process and can be widely used in Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots (AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing and other application scenarios.
KEY FEATURES:
- 8th Gen AI Engine: Over 10x performance boost to previous gen
- Next Gen Oryon™ CPU:up to 1.5x over previous gen
- 3A+IQ upgrades;3 ISP, 3 x 48MP@30FPS HW sHDR, ASE
- Hypervisor enables multiple trusted VMs (TVMs)
- 3 times GPU performance improvement compared to the previous generation
- 4K240/8K60 decoding, 4K120/8K30 encoding AV1 decoder
Aikri-82X-50AD-8
Aikri-82X-50D Development Kit is based on high-performance Qualcomm® QCS8250 processor. It integrates the advanced 7 nm Fin FET process, 64-bit Octa-Core Qualcomm® Kryo™ 585 application processor, Qualcomm® Hexagon™ DSP, Qualcomm® Adreno™ 650 GPU, Qualcomm Spectra™ 480 image signal processors, Sensor core, Secure processing unit and Neural processing unit. QCS8250 kit comprises SoM based on Qualcomm QCS8250 and a carrier board. It supports long-range Wi-Fi, Wi-Fi 6 (Wi-Fi 802.11 a/b/g/n/ac/ax) and Bluetooth 5.1. It supports multiple cameras with six 4-lane CSI input interfaces. In addition, it supports two 4-lane MIPI DSI.
Aikri-82X-50D Development Kit is based on high-performance Qualcomm® QCS8250 processor. It integrates the advanced 7 nm Fin FET process, 64-bit Octa-Core Qualcomm® Kryo™ 585 application processor, Qualcomm® Hexagon™ DSP, Qualcomm® Adreno™ 650 GPU, Qualcomm Spectra™ 480 image signal processors, Sensor core, Secure processing unit and Neural processing unit. QCS8250 kit comprises SoM based on Qualcomm QCS8250 and a carrier board. It supports long-range Wi-Fi, Wi-Fi 6 (Wi-Fi 802.11 a/b/g/n/ac/ax) and Bluetooth 5.1. It supports multiple cameras with six 4-lane CSI input interfaces. In addition, it supports two 4-lane MIPI DSI.
Aikri QCS8250: Aikri-82X-50AS-8
Aikri-82X-50S System-on-Module (SoM) is a high-performance module based on Qualcomm® QCS8250 processor. It integrates the advanced 7 nm Fin FET process, 64-bit Octa-Core Qualcomm® Kryo™ 585 application processors, Qualcomm® Hexagon™ DSP, Qualcomm® Adreno™ 650 GPU, Qualcomm Spectra™ 480 image signal processors, Sensor core, Secure processing unit and Neural processing unit. QCS8250 SoM supports long range Wi-Fi, Wi-Fi 6 (Wi-Fi 802.11 a/b/g/n/ac/ax) and Bluetooth 5.1. It supports multiple cameras with six 4-lane CSI input interfaces. In addition, it supports two 4-lane MIPI DSI. Moreover, it provides a variety of standard interfaces such as GPIO, I2C, UART, SPI, USB3.1, PCIE Gen 3.0, and I2S.
Aikri-82X-50S System-on-Module (SoM) is a high-performance module based on Qualcomm® QCS8250 processor. It integrates the advanced 7 nm Fin FET process, 64-bit Octa-Core Qualcomm® Kryo™ 585 application processors, Qualcomm® Hexagon™ DSP, Qualcomm® Adreno™ 650 GPU, Qualcomm Spectra™ 480 image signal processors, Sensor core, Secure processing unit and Neural processing unit. QCS8250 SoM supports long range Wi-Fi, Wi-Fi 6 (Wi-Fi 802.11 a/b/g/n/ac/ax) and Bluetooth 5.1. It supports multiple cameras with six 4-lane CSI input interfaces. In addition, it supports two 4-lane MIPI DSI. Moreover, it provides a variety of standard interfaces such as GPIO, I2C, UART, SPI, USB3.1, PCIE Gen 3.0, and I2S.
AIkri QCS8250: Aikri-82X-50D
Aikri-82X-50D development kit is based on high-performance Qualcomm® QCS8250 processor. It has Qualcomm Spectra™ 480 image signal processors, Sensor core, Qualcomm® Secure Processing Unit and Qualcomm® Neural Processing Unit. This kit comprises SoM based on QCS8250 and a carrier board. The kit comes with Android 10 support and is suitable for applications using high-resolution camera and intelligent processing including AR/VR, AI, Machine Vision, Collaboration and Advanced Analytics.
KEY FEATURES:
- Six 4-lane CSI; Two 4-lane MIPI DSI
- Wi-Fi 6, Bluetooth 5.1
- 170mm x 170mm
Aikri-82X-50D development kit is based on high-performance Qualcomm® QCS8250 processor. It has Qualcomm Spectra™ 480 image signal processors, Sensor core, Qualcomm® Secure Processing Unit and Qualcomm® Neural Processing Unit. This kit comprises SoM based on QCS8250 and a carrier board. The kit comes with Android 10 support and is suitable for applications using high-resolution camera and intelligent processing including AR/VR, AI, Machine Vision, Collaboration and Advanced Analytics.
KEY FEATURES:
- Six 4-lane CSI; Two 4-lane MIPI DSI
- Wi-Fi 6, Bluetooth 5.1
- 170mm x 170mm
AIkri QCS8250: Aikri-82X-50S
Aikri-82X-50S System-on-Module (SoM) is a high-performance module based on Qualcomm® QCS8250 processor. It supports Wi-Fi 6 and Bluetooth 5.1. It also supports multiple cameras with six 4-lane CSI input interfaces. In addition, it supports two 4-lane MIPI DSI. SoM based on QCS8250 is suitable for applications that need high-resolution camera and intelligent processing including AR/VR, AI, Machine Vision, Collaboration and Advanced Analytics.
KEY FEATURES:
- Dimension: 59.7mm x 32.2
- 6 x 4-lane CSIs (4-Lane each); D-PHY & C-PHY (supported by design)
- DisplayPort 1.4 data concurrency over USB 3.1 Type-C
Aikri-82X-50S System-on-Module (SoM) is a high-performance module based on Qualcomm® QCS8250 processor. It supports Wi-Fi 6 and Bluetooth 5.1. It also supports multiple cameras with six 4-lane CSI input interfaces. In addition, it supports two 4-lane MIPI DSI. SoM based on QCS8250 is suitable for applications that need high-resolution camera and intelligent processing including AR/VR, AI, Machine Vision, Collaboration and Advanced Analytics.
KEY FEATURES:
- Dimension: 59.7mm x 32.2
- 6 x 4-lane CSIs (4-Lane each); D-PHY & C-PHY (supported by design)
- DisplayPort 1.4 data concurrency over USB 3.1 Type-C
TurboX C865C SOM
TurboX C865C SOM (System on Module) is a high-performance intelligent module based on Qualcomm® QCS8250 processor. It has integrated Android and the advanced 7nm Fin FET processor, a customized 64-bit Octa-core Qualcomm® Kryo™ 585 application processor.
TurboX C865C SOM supports wide-range Wi-Fi, Wi-Fi6 (Wi-Fi 802.11 a/b/g/n/ac/ax) . It supports one 4K@60FPS or two 4K@30FPS display, as well as multi-camera concurrency. It also integrates multiple audio and video input/output interfaces. TurboX C865C SOM provides a variety of GPIO, I2C, UART and SPI standard interfaces.
In addition, it supports four 4-lane MIPI-CSIs (D-PHY) and one 3-lane MIPI-CSI (C-PHY) together with SOM common standard protocol interfaces such as USB3.1, PCIE2.1/3.0 and I2S.
TurboX C865C SOM provides convenient and stable system solutions for IoT (Internet of Things) application. It can be embedded into devices including VR/AR, Robot, Smart Camera, AI devices, drones and medical devices.
KEY FEATURES:
- Qualcomm® Hexagon™ DSP with quad HVX
- Support one C-PHY Camera, up to 64MP sensor
- Long life cycle, up to 2028
- Support one 4K@60FPS or two 4K@30FPS display
- Wi-Fi 802.11a/b/g/n/ac/ax
TurboX C865C SOM (System on Module) is a high-performance intelligent module based on Qualcomm® QCS8250 processor. It has integrated Android and the advanced 7nm Fin FET processor, a customized 64-bit Octa-core Qualcomm® Kryo™ 585 application processor.
TurboX C865C SOM supports wide-range Wi-Fi, Wi-Fi6 (Wi-Fi 802.11 a/b/g/n/ac/ax) . It supports one 4K@60FPS or two 4K@30FPS display, as well as multi-camera concurrency. It also integrates multiple audio and video input/output interfaces. TurboX C865C SOM provides a variety of GPIO, I2C, UART and SPI standard interfaces.
In addition, it supports four 4-lane MIPI-CSIs (D-PHY) and one 3-lane MIPI-CSI (C-PHY) together with SOM common standard protocol interfaces such as USB3.1, PCIE2.1/3.0 and I2S.
TurboX C865C SOM provides convenient and stable system solutions for IoT (Internet of Things) application. It can be embedded into devices including VR/AR, Robot, Smart Camera, AI devices, drones and medical devices.
KEY FEATURES:
- Qualcomm® Hexagon™ DSP with quad HVX
- Support one C-PHY Camera, up to 64MP sensor
- Long life cycle, up to 2028
- Support one 4K@60FPS or two 4K@30FPS display
- Wi-Fi 802.11a/b/g/n/ac/ax
