---
markdown_generated_at: "2026-10-15"
title: "Data Center"
url: "https://www.qualcomm.com/data-center"
description: "Qualcomm Dragonfly redefines data center architecture for the agentic era. Up to 8× better tokens/watt vs. GPU with integrated CPU and AI accelerators."
canonicalUrl: "https://www.qualcomm.com/data-center"
---

# Data Center

![](https://s7d1.scene7.com/is/image/dmqualcommprod/dragonfly-hero-datacenter-desktop?fmt=webp-alpha&qlt=85)

Scalable acceleration for the AI era

The agentic era requires a fundamentally different data center architecture. Qualcomm Dragonfly™ products redefine data centers with industry-leading performance and power efficiency across CPU, AI accelerators and connectivity, together with custom silicon, enabling businesses to achieve sustained and scalable AI infrastructure growth.

[Contact sales](https://www.qualcomm.com/support/contact/forms/data-center)

## Industry-leading efficiency at rack scale

Memory bandwidth and energy are the AI inference infrastructure bottlenecks. Qualcomm Dragonfly™ solutions are engineered for leading bandwidth, tokens-per-watt, and tokens-per-dollar.

- Tokens / (second * watt): up to 8x better than GPU based systems<sup>1</sup>
- Memory bandwidth / watt: 6x higher than HBM based systems<sup>2</sup>
- Memory capacity / watt: 200x better than SRAM based systems<sup>3</sup>
- Performance / watt: >2x better than the latest server CPU systems<sup>4</sup>
- Effective memory bandwidth: 54x higher per card (AI300 with HBC Gen 2 vs AI200)

![](https://s7d1.scene7.com/is/image/dmqualcommprod/Data-Center-Hero-Illusrtation?fmt=webp-alpha&qlt=85)

## Explore our offerings

- **CPU**: Purpose-built server CPU for leading power efficiency, core density, and utilization.
- **AI Accelerators**: Rack-scale performance at leading tokens-per-watt and tokens-per-TCO.
- **Connectivity**: Rack-scale connectivity with proven optical and electrical DSPs.
- **Custom Silicon**: Tailored custom silicon solutions with cutting-edge IP to meet the specialized demand for next-gen data centers.

[Agentic CPU](https://www.qualcomm.com/#agenticcpu)

[AI Accelerators](https://www.qualcomm.com/#aiaccelerators)

[Connectivity](https://www.qualcomm.com/#connectivity)

[Custom Silicon](https://www.qualcomm.com/#customsilicon)

![](https://s7d1.scene7.com/is/image/dmqualcommprod/DC-Inference-BG?fmt=webp-alpha&qlt=85)

CPU

## Performance redefined. Efficiency reimagined.

The Qualcomm Dragonfly™ C1000 CPU is purpose-built for data centers and engineered for best-in-class power efficiency, performance elasticity, and rack density for agentic AI, general-purpose, and AI head node workloads. By optimizing for power, it enables high rack density and superior total cost of ownership.

[Learn more](https://www.qualcomm.com/data-center/products/qualcomm-dragonfly-c1000)

- 250+ core count chiplet design
- >2x better performance/watt<sup>4</sup>

AI Accelerators

## A generational leap in efficiency

Built for disaggregated AI inferencing, Qualcomm Dragonfly™ AI250 rack with Qualcomm® High Bandwidth Compute (HBC) Gen 1 provides 18x effective memory bandwidth compared to AI200, resulting in superior power efficiency and performance at industry-leading tokens-per-dollar.

[Learn more](https://www.qualcomm.com/data-center/expertise/ai-accelerators)

- Industry-leading 38.6 TB of memory per rack<sup>5</sup>
- Industry-leading 768 GB of memory per card<sup>5</sup>

![](https://s7d1.scene7.com/is/image/dmqualcommprod/AI250-Asset?$QC_Responsive$&fmt=png-alpha)

- Over 6.4 PB/s effective memory bandwidth per rack with HBC Gen 1
- Efficient 140 kW rack-level power consumption

## A multi-generational roadmap. An annual cadence.

### Qualcomm Dragonfly AI200

Rack‑scale AI inference platform focused on memory capacity and TCO.

[Learn more](https://www.qualcomm.com/data-center/products/qualcomm-dragonfly-ai200)

### Qualcomm Dragonfly AI250

A generational leap in efficiency and performance with HBC Gen 1.

[Learn more](https://www.qualcomm.com/data-center/products/qualcomm-dragonfly-ai250)

### Qualcomm Dragonfly AI300

3rd generation rack-scale AI inference platform, with increased bandwidth and deployment options.

[Learn more](https://www.qualcomm.com/data-center/products/qualcomm-dragonfly-ai300)

Connectivity

## Data movement at inference scale

High‑speed connectivity for the AI era, powered by advanced DSP technology optimized for PAM4 and Coherent‑lite. Built to drive 800G and 1.6T performance across optical modules, AOCs, and AECs.

[Learn more](https://www.qualcomm.com/data-center/expertise/connectivity)

![](https://s7d1.scene7.com/is/image/dmqualcommprod/Data-Center-Connectivity-desktop?fmt=webp-alpha&qlt=85)

- **Performance & scale**: High-performance retiming delivers rock-solid 800G/1.6T connectivity with uncompromised signal integrity across AI and cloud fabrics.
- **Advanced DSP technology**: Advanced DSP algorithms engineered to deliver best-in-class bit error rate (BER) performance with low power and low latency.
- **Diagnostic tools**: A powerful suite of diagnostic and monitoring tools designed to give complete visibility into link performance.

## PAM4 and Coherent-lite DSPs for optical transceivers

### Qualcomm Dragonfly O100

100G PAM4 optical DSP

[Learn more](https://www.qualcomm.com/data-center/products/qualcomm-dragonfly-o100)

### Qualcomm Dragonfly CU200

200G PAM4 optical DSP

[Learn more](https://www.qualcomm.com/data-center/products/qualcomm-dragonfly-o200)

### Qualcomm Dragonfly CO400

400G 16QAM Coherent-lite optical DSP

[Learn more](https://www.qualcomm.com/data-center/products/qualcomm-dragonfly-co400)

## PAM4 DSPs for active electrical cables

### Qualcomm Dragonfly CU100

100G PAM4 electrical DSP

[Learn more](https://www.qualcomm.com/data-center/products/qualcomm-dragonfly-cu100)

### Qualcomm Dragonfly CU200

200G PAM4 electrical DSP

[Learn more](https://www.qualcomm.com/data-center/products/qualcomm-dragonfly-cu200)

![](https://s7d1.scene7.com/is/image/dmqualcommprod/DC-Custom-Silicon?fmt=webp-alpha&qlt=85)

Custom Silicon

## Domain-optimized data center solutions

Overcome traditional hardware limitations with end-to-end custom silicon design. Leveraging advanced packaging, modular architectures, and leading-edge technology platforms, our approach delivers purpose-built silicon precisely engineered to maximize the performance of agentic AI while meeting the power and performance demands of modern AI workloads.

[Learn more](https://www.qualcomm.com/data-center/solutions/custom-silicon)

![](https://s7d1.scene7.com/is/image/dmqualcommprod/AIMS-BACKGROUND-DESKTOP?fmt=webp-alpha&qlt=85)

Qualcomm Dragonfly AI Infrastructure Management Suite

## Orchestrate and scale efficiency

The suite provides provisioning, monitoring, orchestration and fault handling across rack‑scale deployments. Together, hardware, connectivity and software form the foundation of a cohesive data center platform approach — one designed to scale with customers as AI workloads evolve.

[Learn more](https://www.qualcomm.com/data-center/solutions/ai-infrastructure-management-suite)

## More software tools

### Qualcomm® AI Inference Suite

A comprehensive set of ready-to-use AI applications, agents, tools, and libraries for developing and deploying AI inference on premises or via cloud deployments.

[Learn more](https://www.qualcomm.com/developer/software/qualcomm-ai-inference-suite)

### Qualcomm® Cloud AI SDK

Optimize trained deep learning models for high-performance inference on Qualcomm Dragonfly AI accelerators.

[Learn more](https://www.qualcomm.com/developer/software/cloud-ai-sdk)

## Contact Sales

We have an extensive technology portfolio designed to enable products across industries. Our sales team is ready to provide you with tailored assistance.

[Contact us](https://www.qualcomm.com/support/contact/forms/data-center)

![](https://s7d1.scene7.com/is/image/dmqualcommprod/Contact-Pattern?fmt=webp-alpha&qlt=85)

## Latest news

- Press Release
  [Qualcomm Statement on Trial Verdict Win](https://www.qualcomm.com/news/releases/2026/10/qualcomm-statement-on-trial-verdict-win)
  Oct 13, 2026
  [Company](https://www.qualcomm.com/news/releases?tags=Company)
- OnQ Blog
  [Reimagining Fixed Wireless Access: Qualcomm Dragonwing FWA Gen 6 Elite Platform](https://www.qualcomm.com/news/onq/2026/10/dragonwing-fwa-gen-6-fixed-wireless-access-platform)
  Oct 12, 2026 | 4 min read
  [Dragonwing](https://www.qualcomm.com/news/onq?tags=Dragonwing) [Fixed Wireless Access](https://www.qualcomm.com/news/onq?tags=Fixed%20Wireless%20Access) [5G](https://www.qualcomm.com/news/onq?tags=5G)
- OnQ Blog
  [How Qualcomm Dragonwing Security and Management is designed to help broadband operators turn intelligence into subscriber value](https://www.qualcomm.com/news/onq/2026/10/dragonwing-sam-broadband-intelligence)
  Oct 12, 2026 | 4 min read
  [Dragonwing](https://www.qualcomm.com/news/onq?tags=Dragonwing) [Broadband](https://www.qualcomm.com/news/onq?tags=Broadband) [Networking](https://www.qualcomm.com/news/onq?tags=Networking)
- OnQ Blog
  [How Qualcomm Dragonwing Point Access Series unlocks mmWave in emerging markets](https://www.qualcomm.com/news/onq/2026/10/qualcomm-dragonwing-point-access-series-mmwave-emerging-markets)
  Oct 12, 2026 | 5 min read
  [Dragonwing](https://www.qualcomm.com/news/onq?tags=Dragonwing) [Fixed Wireless Access](https://www.qualcomm.com/news/onq?tags=Fixed%20Wireless%20Access) [mmWave](https://www.qualcomm.com/news/onq?tags=mmWave)
- OnQ Blog
  [Your guide to the mobile experiences shaping what’s next at Snapdragon Summit 2026](https://www.qualcomm.com/news/onq/2026/09/mobile-experiences-snapdragon-summit-2026)
  Sep 24, 2026 | 5 min read
  [Snapdragon Summit](https://www.qualcomm.com/news/onq?tags=Snapdragon%20Summit) [Snapdragon Mobile Platform](https://www.qualcomm.com/news/onq?tags=Snapdragon%20Mobile%20Platform) [Mobile Games](https://www.qualcomm.com/news/onq?tags=Mobile%20Games)
- OnQ Blog
  [Agentic commerce: Enabling agents to understand, anticipate and act](https://www.qualcomm.com/news/onq/2026/09/agentic-commerce-ai-agents-mastercard)
  Sep 24, 2026 | 7 min read
  [Agentic AI](https://www.qualcomm.com/news/onq?tags=Agentic%20AI) [Personal AI](https://www.qualcomm.com/news/onq?tags=Personal%20AI) [On-Device AI](https://www.qualcomm.com/news/onq?tags=On-Device%20AI)
- OnQ Blog
  [Why hearables could become the most natural interface for Personal AI](https://www.qualcomm.com/news/onq/2026/09/personal-ai-hearables-snapdragon-sound)
  Sep 24, 2026 | 4 min read
  [Personal AI](https://www.qualcomm.com/news/onq?tags=Personal%20AI) [Snapdragon Sound](https://www.qualcomm.com/news/onq?tags=Snapdragon%20Sound) [Hearables](https://www.qualcomm.com/news/onq?tags=Hearables)
- Press Release
  [Qualcomm Announces Renewal of Global Patent License Agreement with Apple](https://www.qualcomm.com/news/releases/2026/09/qualcomm-announces-renewal-of-global-patent-license-agreement-wi)
  Sep 24, 2026
- OnQ Blog
  [Inside Snapdragon Summit 2026: Agentic AI PCs, Googlebooks and Linux are here](https://www.qualcomm.com/news/onq/2026/09/snapdragon-summit-agentic-ai-pcs-linux)
  Sep 23, 2026 | 7 min read
  [Snapdragon](https://www.qualcomm.com/news/onq?tags=Snapdragon) [AI PC](https://www.qualcomm.com/news/onq?tags=AI%20PC) [Agentic AI](https://www.qualcomm.com/news/onq?tags=Agentic%20AI)
- OnQ Blog
  [Left of the timeline: A new era of proactive healthcare through Personal AI](https://www.qualcomm.com/news/onq/2026/09/personal-ai-proactive-healthcare)
  Sep 23, 2026 | 4 min read
  [Personal AI](https://www.qualcomm.com/news/onq?tags=Personal%20AI) [Healthcare](https://www.qualcomm.com/news/onq?tags=Healthcare) [Wearables](https://www.qualcomm.com/news/onq?tags=Wearables)

<sup>1</sup> With Qualcomm HBC; Qualcomm estimates compared to contemporary GPU-based architectures on decode performance for select models.
<sup>2</sup> With Qualcomm HBC; Qualcomm estimates compared to competing published product specifications normalized at card-level.
<sup>3</sup> With Qualcomm HBC; Qualcomm estimates compared to competing published product specifications normalized at rack-level.
<sup>4</sup> With Qualcomm Dragonfly C1000 CPU; Qualcomm estimates compared to existing product benchmarks for server CPU competitive offerings based on specs.
<sup>5</sup> Compared to competing published product specifications normalized at card- and rack-level