Active
Qualcomm Dragonfly™
C1000
Contact Sales
chip image

Our custom CPU designed for leadership performance and utilization for agentic, general-purpose, and AI head node workloads at best-in-class power efficiency and total cost of ownership

Qualcomm Dragonfly™ C1000 CPU brings a new class of performance and power efficiency to modern data centers with a scalable, chiplet-based architecture and best-in-class Qualcomm Oryon™ CPU server cores. Designed for agentic AI, general-purpose, and AI head node workloads, it delivers industry-leading power efficiency, performance elasticity, and rack density to maximize utilization and reduce total cost of ownership across large-scale deployments.1

Use Cases 

Agentic AI  icon
Agentic AI
AI head node icon
AI head node
General-Purpose Compute icon
General-Purpose Compute

Benefits

default icon alt text
High-Performance Compute
Data center optimized CPU powered by industry-leading Qualcomm Oryon CPU technology with advanced vector capabilities, enabling high-throughput compute for cloud, enterprise, and AI-driven workloads. 1
default icon alt text
Best-in-class TCO
With leading power efficiency, core density, and utilization, our solutions are projected to deliver compelling performance per total cost of ownership (TCO) benefit.1
default icon alt text
Leading Power Efficiency
By holistically designing to optimize power from SoC to system-level, our solutions are projected to deliver > 2x better performance per watt than the latest server CPU competitive offerings.2
default icon alt text
Flexible Deployment
Flexible configurations support a range of deployment models, from hyperscale cloud to enterprise data centers, enabling optimized performance for agentic, general-purpose computing, and AI head node.
default icon alt text
Efficient Scaling
250+ core count chiplet design scales performance efficiently across rack deployments with high core density and optimized power profiles, enabling improved rack utilization, rack density, and reduced infrastructure footprint.
default icon alt text
Optimized Memory Architecture
Memory subsystem delivers high bandwidth, enabling faster data movement for large-scale AI and memory-intensive workloads.1
default icon alt text
Data Center Class RAS
Built with advanced reliability, availability, and serviceability (RAS) features, including ECC, fault isolation, and error recovery to enable resilient operation at scale.

1Qualcomm estimates compared to competing published product specifications.

2Qualcomm Technologies estimate compared to existing product benchmarks for server CPU competitive offerings based on specs.

Features

  • Custom-designed Qualcomm OryonTM CPU cores optimized for core performance and frequencies > 5 GHz to deliver superior performance for agentic workload deployed at scale
  • Architected and designed for best throughput, responsiveness, and infrastructure utilization for critical data center usages and lowering CapEx & OpEx to deliver best-in-class performance per TCO leadership at scale1
  • 250+ core count chiplet design for exceptional throughput and scale while delivering exceptional per-core performance
  • Memory sub-system built to deliver superior bandwidth, capacity, latency and power efficiency using leading-edge low-power memory technology specifically architected to address memory error resilience and field replacement needs of data centers1
  • Multi-chiplet architecture enabling modular integration with advanced packaging technologies for performance and IO scaling addressing general-purpose to AI CPUs in the data center domain
  • >2TB/s of leading-edge PCIe Gen 7 connectivity, plus CXL connectivity, to support next-generation accelerators, high-speed networking & storage and memory disaggregation
  • Support for both air and liquid cooling, enabling deployment across diverse data center environments with OCP ORv3 compliant racks and servers
  • Confidential computing, server-class RAS, telemetry, and debug features

QUALCOMM DRAGONFLY AI INFRASTRUCTURE MANAGEMENT SUITE

Orchestrate and
scale efficiency

The suite provides provisioning, monitoring, orchestration and fault handling across rack‑scale deployments. Together, hardware, connectivity and software form the foundation of a cohesive data center platform approach — one designed to scale with customers as AI workloads evolve. 

Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Our leading-edge AI, high performance, low-power computing, and unrivaled connectivity deliver proven solutions that transform major industries. At Qualcomm, we are engineering human progress.

Stay connected

Get the latest Qualcomm and industry information delivered to your inbox.

Subscribe
Manage your subscription

© Qualcomm Technologies, Inc. and/or its affiliated companies.

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patented technologies are licensed by Qualcomm Incorporated.

Note: Certain services and materials may require you to accept additional terms and conditions before accessing or using those items.

References to "Qualcomm" may mean Qualcomm Incorporated, or subsidiaries or business units within the Qualcomm corporate structure, as applicable.

Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering, research and development functions, and substantially all of our products and services businesses, including our QCT semiconductor business.

Materials that are as of a specific date, including but not limited to press releases, presentations, blog posts and webcasts, may have been superseded by subsequent events or disclosures.

Nothing in these materials is an offer to sell or license any of the services or materials referenced herein.