---
title: "Qualcomm Dragonfly™ C1000"
url: "https://www.qualcomm.com/data-center/products/qualcomm-dragonfly-c1000"
description: "Qualcomm Dragonfly C1000 CPU delivers power efficiency and scalable performance for AI head nodes and general-purpose data center workloads."
---

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Qualcomm Dragonfly™

# C1000

[Contact Sales](https://www.qualcomm.com/support/contact/forms/data-center)

![chip image](https://s7d1.scene7.com/is/image/dmqualcommprod/Dragonfly_C1000_Raster_RGB_Color?fmt=webp-alpha&qlt=85)

Our custom CPU designed for leadership performance and utilization for agentic, general-purpose, and AI head node workloads at best-in-class power efficiency and total cost of ownership

Qualcomm Dragonfly™ C1000 CPU brings a new class of performance and power efficiency to modern data centers with a scalable, chiplet-based architecture and best-in-class Qualcomm Oryon™ CPU server cores. Designed for agentic AI, general-purpose, and AI head node workloads, it delivers industry-leading power efficiency, performance elasticity, and rack density to maximize utilization and reduce total cost of ownership across large-scale deployments.¹

Product license agreement

## Use Cases 

- Agentic AI
- AI head node
- General-Purpose Compute

## Benefits

### High-Performance Compute
Data center optimized CPU powered by industry-leading Qualcomm Oryon CPU technology with advanced vector capabilities, enabling high-throughput compute for cloud, enterprise, and AI-driven workloads. ¹

### Best-in-class TCO
With leading power efficiency, core density, and utilization, our solutions are projected to deliver compelling performance per total cost of ownership (TCO) benefit.¹

### Leading Power Efficiency
By holistically designing to optimize power from SoC to system-level, our solutions are projected to deliver > 2x better performance per watt than the latest server CPU competitive offerings.²

### Flexible Deployment
Flexible configurations support a range of deployment models, from hyperscale cloud to enterprise data centers, enabling optimized performance for agentic, general-purpose computing, and AI head node.

### Efficient Scaling
250+ core count chiplet design scales performance efficiently across rack deployments with high core density and optimized power profiles, enabling improved rack utilization, rack density, and reduced infrastructure footprint.

### Optimized Memory Architecture
Memory subsystem delivers high bandwidth, enabling faster data movement for large-scale AI and memory-intensive workloads.¹

### Data Center Class RAS
Built with advanced reliability, availability, and serviceability (RAS) features, including ECC, fault isolation, and error recovery to enable resilient operation at scale.

¹Qualcomm estimates compared to competing published product specifications.

²Qualcomm Technologies estimate compared to existing product benchmarks for server CPU competitive offerings based on specs.

## Features

- Custom-designed Qualcomm Oryon™ CPU cores optimized for core performance and frequencies > 5 GHz to deliver superior performance for agentic workload deployed at scale
- Architected and designed for best throughput, responsiveness, and infrastructure utilization for critical data center usages and lowering CapEx & OpEx to deliver best-in-class performance per TCO leadership at scale¹
- 250+ core count chiplet design for exceptional throughput and scale while delivering exceptional per-core performance
- Memory sub-system built to deliver superior bandwidth, capacity, latency and power efficiency using leading-edge low-power memory technology specifically architected to address memory error resilience and field replacement needs of data centers¹
- Multi-chiplet architecture enabling modular integration with advanced packaging technologies for performance and IO scaling addressing general-purpose to AI CPUs in the data center domain
- >2TB/s of leading-edge PCIe Gen 7 connectivity, plus CXL connectivity, to support next-generation accelerators, high-speed networking & storage and memory disaggregation
- Support for both air and liquid cooling, enabling deployment across diverse data center environments with OCP ORv3 compliant racks and servers
- Confidential computing, server-class RAS, telemetry, and debug features

![](https://s7d1.scene7.com/is/image/dmqualcommprod/2000_?fmt=webp-alpha&qlt=85)

QUALCOMM DRAGONFLY AI INFRASTRUCTURE MANAGEMENT SUITE

## Orchestrate and scale efficiency

The suite provides provisioning, monitoring, orchestration and fault handling across rack‑scale deployments. Together, hardware, connectivity and software form the foundation of a cohesive data center platform approach — one designed to scale with customers as AI workloads evolve. 

[Learn more](https://www.qualcomm.com/data-center/solutions/ai-infrastructure-management-suite)