Our custom CPU designed for leadership performance and utilization for agentic, general-purpose, and AI head node workloads at best-in-class power efficiency and total cost of ownership
Qualcomm Dragonfly™ C1000 CPU brings a new class of performance and power efficiency to modern data centers with a scalable, chiplet-based architecture and best-in-class Qualcomm Oryon™ CPU server cores. Designed for agentic AI, general-purpose, and AI head node workloads, it delivers industry-leading power efficiency, performance elasticity, and rack density to maximize utilization and reduce total cost of ownership across large-scale deployments.1
Features
- Custom-designed Qualcomm OryonTM CPU cores optimized for core performance and frequencies > 5 GHz to deliver superior performance for agentic workload deployed at scale
- Architected and designed for best throughput, responsiveness, and infrastructure utilization for critical data center usages and lowering CapEx & OpEx to deliver best-in-class performance per TCO leadership at scale1
- 250+ core count chiplet design for exceptional throughput and scale while delivering exceptional per-core performance
- Memory sub-system built to deliver superior bandwidth, capacity, latency and power efficiency using leading-edge low-power memory technology specifically architected to address memory error resilience and field replacement needs of data centers1
- Multi-chiplet architecture enabling modular integration with advanced packaging technologies for performance and IO scaling addressing general-purpose to AI CPUs in the data center domain
- >2TB/s of leading-edge PCIe Gen 7 connectivity, plus CXL connectivity, to support next-generation accelerators, high-speed networking & storage and memory disaggregation
- Support for both air and liquid cooling, enabling deployment across diverse data center environments with OCP ORv3 compliant racks and servers
- Confidential computing, server-class RAS, telemetry, and debug features
