---
title: "Engineering the next era of purpose-built silicon"
url: "https://www.qualcomm.com/data-center/solutions/custom-silicon"
description: "Qualcomm custom silicon for data centers: DTCO, 2.5D/3.5D packaging, co-packaged optics, 224G/448G SerDes, and 100M+ units shipped at scale."
---

# Engineering the next era of purpose-built silicon

Custom Silicon

As hyperscalers demand bespoke solutions tailored to their unique workloads, Qualcomm Technologies delivers custom SoCs engineered with cutting‑edge IP, multi‑chip packaging, and advanced process technologies—unlocking AI acceleration and cost efficiency at scale.

[Contact sales](https://www.qualcomm.com/support/contact/forms/data-center)

## Customer-centric processes, engineered from spec to silicon

Our end-to-end capabilities and proven delivery at scale reduce risk and accelerate time-to-market. We provide flexible engagement models that enable customers to move from concept to production-ready solutions—enabling efficiency, predictability, and performance.

![](https://s7d1.scene7.com/is/image/dmqualcommprod/CustomSilicon-Diagram-Updated?fmt=webp-alpha&qlt=85)

## Custom silicon leadership — proven at scale

### Deep SoC expertise

Proven track record delivering silicon at massive scale across high-performance compute and high-speed connectivity.

### Operational Excellence

A track record of designing and integrating silicon at massive scale, delivering reliability and execution excellence.

### Advanced technology nodes

Leading-edge node, advanced packaging, interconnect, and memory co-optimization expertise—driving optimal PPA for data center.

### High-volume production at industry scale

Multiple SoCs achieving 100M+ units shipped demonstrating yield optimization and supply chain maturity.

## A portfolio of end-to-end capabilities

### Advanced technology platform

Our advanced technology platform incorporates Design Technology Co‑Optimization (DTCO) at leading nodes, enabling earlier technology adoption, improved manufacturability, and higher yield. Built on proven methodologies and foundational IP, it includes industry-leading blocks across I/O, memory, and compute.

### Architecture platform

Reference Architecture platform combines custom compute, intelligent on chip networking, and high performance I/O subsystems—enabling AI compute, electrical I/O, and optical chiplets through ultra high speed interconnects 224G/448G and PCIe Gen7/8.

### Packaging platform

Our flexible packaging portfolio unifies complex multi-die systems, including standard packaging, advanced 2.5D and 3.5D integration, Co-Packaged Copper and Co‑Packaged Optics, delivering optimized power efficiency, signal integrity, and density.

### High-speed SerDes interconnects

### Die-to-die interconnect

### Memory IP

### 3rd-party ecosystem

## Contact Sales

We have an extensive technology portfolio designed to enable products across industries. Our sales team is ready to provide you with tailored assistance.

[Contact us](https://www.qualcomm.com/support/contact/forms/data-center)

![](https://s7d1.scene7.com/is/image/dmqualcommprod/Contact-Pattern?fmt=webp-alpha&qlt=85)