Custom Silicon
Engineering the next era of purpose-built silicon
As hyperscalers demand bespoke solutions tailored to their unique workloads, Qualcomm Technologies delivers custom SoCs engineered with cutting‑edge IP, multi‑chip packaging, and advanced process technologies—unlocking AI acceleration and cost efficiency at scale.
Customer-centric processes, engineered from spec to silicon
Our end-to-end capabilities and proven delivery at scale reduce risk and accelerate time-to-market. We provide flexible engagement models that enable customers to move from concept to production-ready solutions—enabling efficiency, predictability, and performance.
Custom silicon leadership — proven at scale
Deep SoC expertise
Proven track record delivering silicon at massive scale across high-performance compute and high-speed connectivity.
Operational Excellence
A track record of designing and integrating silicon at massive scale, delivering reliability and execution excellence.
Advanced technology nodes
Leading-edge node, advanced packaging, interconnect, and memory co-optimization expertise—driving optimal PPA for data center.
High-volume production at industry scale
Multiple SoCs achieving 100M+ units shipped demonstrating yield optimization and supply chain maturity.
A portfolio of end-to-end capabilities
Advanced technology platform
Our advanced technology platform incorporates Design Technology Co‑Optimization (DTCO) at leading nodes, enabling earlier technology adoption, improved manufacturability, and higher yield. Built on proven methodologies and foundational IP, it includes industry-leading blocks across I/O, memory, and compute.
Architecture platform
Reference Architecture platform combines custom compute, intelligent on chip networking, and high performance I/O subsystems—enabling AI compute, electrical I/O, and optical chiplets through ultra high speed interconnects 224G/448G and PCIe Gen7/8.
Packaging platform
Our flexible packaging portfolio unifies complex multi-die systems, including standard packaging, advanced 2.5D and 3.5D integration, Co-Packaged Copper and Co‑Packaged Optics, delivering optimized power efficiency, signal integrity, and density.
High-speed SerDes interconnects
Die-to-die interconnect
Memory IP
3rd-party ecosystem
Contact Sales
We have an extensive technology portfolio designed to enable products across industries. Our sales team is ready to provide you with tailored assistance.
