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Open-Q 4290CS™ System-in-Package (SIP)
The Open-Q™ 4290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QCS4290 chipset utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4290 SIP creates the perfect computing core for a variety of edge AI video analytic applications.
KEY FEATURES:
- Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
- 3rd generation Qualcomm® AI Engine
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Multiple high speed connectivity options
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
The Open-Q™ 4290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QCS4290 chipset utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4290 SIP creates the perfect computing core for a variety of edge AI video analytic applications.
KEY FEATURES:
- Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
- 3rd generation Qualcomm® AI Engine
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Multiple high speed connectivity options
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
Chipset
Open-Q 2290CS™ System-in-Package (SIP)
The Open-Q™ 2290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QCS2290, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.
KEY FEATURES:
- Entry-tier solution delivers greater performance, graphic, and camera capabilities
- Secure compute platform
- Improved power performance
The Open-Q™ 2290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QCS2290, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.
KEY FEATURES:
- Entry-tier solution delivers greater performance, graphic, and camera capabilities
- Secure compute platform
- Improved power performance
Chipset
Open-Q™ 8250CS Module/SoM with Qualcomm® QCS8250
The Open-Q™ 8250CS production ready computing SOM delivered with Android™ 13 supports multiple concurrent decode+encode sessions, live tuning for cameras (not customer facing), 2A sync for 2 cameras, UVC/UAC source mode for video collaboration bars to function as a USB class device, low-latency MS codecs and MS Teams video extensions with a roadmap to include background blur and replacement, an AI director framework to track and zoom a camera onto the person speaking and QSAT for smooth zoom.
KEY FEATURES:
- Long life IIoT chipset
- 8GB LPDDR5 RAM + 128GB UFS Flash
- Android™ 13
- On-device AI Engine up to 15 TOPS
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
- Ultra-compact 50 x 29 mm form factor
The Open-Q™ 8250CS production ready computing SOM delivered with Android™ 13 supports multiple concurrent decode+encode sessions, live tuning for cameras (not customer facing), 2A sync for 2 cameras, UVC/UAC source mode for video collaboration bars to function as a USB class device, low-latency MS codecs and MS Teams video extensions with a roadmap to include background blur and replacement, an AI director framework to track and zoom a camera onto the person speaking and QSAT for smooth zoom.
KEY FEATURES:
- Long life IIoT chipset
- 8GB LPDDR5 RAM + 128GB UFS Flash
- Android™ 13
- On-device AI Engine up to 15 TOPS
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
- Ultra-compact 50 x 29 mm form factor
Chipset
Open-Q AL Development Kit (4290 & 2290 Series)
The Open-Q™ AL development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4290 and 2290 SIP families based on the Qualcomm® QCS4290 processor (Android).
KEY FEATURES:
- Development kit provides interfaces to evaluate camera and video
- Evaluate display on LCD & HDMI
- Supports many robotic features
The Open-Q™ AL development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4290 and 2290 SIP families based on the Qualcomm® QCS4290 processor (Android).
KEY FEATURES:
- Development kit provides interfaces to evaluate camera and video
- Evaluate display on LCD & HDMI
- Supports many robotic features
Open-Q™ 610 μSOM
Lantronix’s Open-Q™ 610 μSOM is an ultra-compact (50mm x 25mm) production-ready SOM based on the Qualcomm® QCS610 SOC, with built-in Qualcomm® Neural Processing Engine for on-device edge AI capabilities. Aimed at connected visual intelligence applications, with built-in image sensor processing such as staggered HDR, lens de-warp, dual camera stitching, and image de-fog, the 610 μSOM is the ideal platform for your next smart camera product. Full-featured companion development kit also available.
KEY FEATURES:
- SoC 11nm technology for high performance with low power
- On-device artificial intelligence & machine learning
- Native Ethernet interface for high speed connectivity
- Three camera ports for multi-camera systems
- Yocto Linux or Android 12 with connected camera SDK
- RTSP streaming support with GStreamer
- Multiple options for AI inference engines
Lantronix’s Open-Q™ 610 μSOM is an ultra-compact (50mm x 25mm) production-ready SOM based on the Qualcomm® QCS610 SOC, with built-in Qualcomm® Neural Processing Engine for on-device edge AI capabilities. Aimed at connected visual intelligence applications, with built-in image sensor processing such as staggered HDR, lens de-warp, dual camera stitching, and image de-fog, the 610 μSOM is the ideal platform for your next smart camera product. Full-featured companion development kit also available.
KEY FEATURES:
- SoC 11nm technology for high performance with low power
- On-device artificial intelligence & machine learning
- Native Ethernet interface for high speed connectivity
- Three camera ports for multi-camera systems
- Yocto Linux or Android 12 with connected camera SDK
- RTSP streaming support with GStreamer
- Multiple options for AI inference engines
Chipset
Open-Q 6490CS SOM Development Kit
The Open-Q™ 6490 Development Kit is designed to facilitate easy evaluation and development. The kit includes many standard sockets, enabling customers to choose from a wide range of third-party accessories. The SOM utilizes Qualcomm Technologies’ heterogeneous computing expertise to offer a system-on-chip with multiple specialized processing cores for powerful AI processing, image and graphics processing, and audio processing.
KEY FEATURES:
- Standard M.2 sockets for evaluating Wi-Fi
- TAA/NDAA Compliant
- Android™ 13 and Qualcom Linux OSs
The Open-Q™ 6490 Development Kit is designed to facilitate easy evaluation and development. The kit includes many standard sockets, enabling customers to choose from a wide range of third-party accessories. The SOM utilizes Qualcomm Technologies’ heterogeneous computing expertise to offer a system-on-chip with multiple specialized processing cores for powerful AI processing, image and graphics processing, and audio processing.
KEY FEATURES:
- Standard M.2 sockets for evaluating Wi-Fi
- TAA/NDAA Compliant
- Android™ 13 and Qualcom Linux OSs
Chipset
Open-Q 6490CS SOM
The Open-Q 6490CS provides flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as AI cameras, video collaboration, industrial handhelds, and video telematics. Based on Qualcomm Dragonwing™ QCS6490 processor, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution.
KEY FEATURES:
- Multiple MIPI camera and display ports
- Up to 8GB LPDDR5 RAM + 64GB eMMC
- Android™ 13 and Qualcomm Linux
- TAA/NDAA Compliant
The Open-Q 6490CS provides flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as AI cameras, video collaboration, industrial handhelds, and video telematics. Based on Qualcomm Dragonwing™ QCS6490 processor, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution.
KEY FEATURES:
- Multiple MIPI camera and display ports
- Up to 8GB LPDDR5 RAM + 64GB eMMC
- Android™ 13 and Qualcomm Linux
- TAA/NDAA Compliant
Chipset
5G Industrial IoT / Ruggedized Handhelds (QCM6490 Reference Design)
Accelerate Your IoT Development with QCM6490 Reference Design. QCM6490 Reference Design offer, featuring: Planning Workshop: Collaborate with us to define project objectives, requirements, and timelines with QCM6490. Reference Design: Leverage our pre-developed design to save $1M in NRE fees. Maximize Your Benefits by partnering with us, you'll accelerate the development and innovation.
We can design chip on board design with any Qualcomm's X (thin modem) or QCM line of 5G chipsets, do all pre-certification testing (FCC, CE, against carrier requirements) and help with the carrier certification process as needed.
Contact us to learn more about our IoT Solutions on the Qualcomm platform and kickstart your project. Let's work together to bring your vision to life. Contact Vesa Korkala ([email protected])
KEY FEATURES:
- QCM/QCS6490 Ref Design to build your product upon
- Key design and build experiences with multiple Qualcomm® Chipsets
Accelerate Your IoT Development with QCM6490 Reference Design. QCM6490 Reference Design offer, featuring: Planning Workshop: Collaborate with us to define project objectives, requirements, and timelines with QCM6490. Reference Design: Leverage our pre-developed design to save $1M in NRE fees. Maximize Your Benefits by partnering with us, you'll accelerate the development and innovation.
We can design chip on board design with any Qualcomm's X (thin modem) or QCM line of 5G chipsets, do all pre-certification testing (FCC, CE, against carrier requirements) and help with the carrier certification process as needed.
Contact us to learn more about our IoT Solutions on the Qualcomm platform and kickstart your project. Let's work together to bring your vision to life. Contact Vesa Korkala ([email protected])
KEY FEATURES:
- QCM/QCS6490 Ref Design to build your product upon
- Key design and build experiences with multiple Qualcomm® Chipsets
QCM6490 Reference Design
GET YOUR IOT PROJECT GOING!We offer the Sigma Connectivity/ Qualcomm® QCM6490 IoT Kickstarter, which includes the following:Planning Workshop:In this workshop, we will collaborate with you to establish clear objectives, define requirements, and create a realistic timeline for your project.QCM6490 Reference Design:As part of this offer, you can leverage the QCM6490 reference design. By using this design, you can save significant costs, as there will be no prototyping licensing fees involved. This translates to potential savings of up to $1M or more.By taking advantage of our expertise and the resources provided through Sigma Connectivity’ and Qualcomm Technologies' IoT Kick Starter Offer, you can accelerate the development of your 5G IoT solutions and maximize the benefits of digital transformation.
KEY FEATURES:
- Complete Ref Design to build your product upon
- Prototype Licenses covered.
- Key Design and build experiences with multiple Qualcomm® Chipsets
GET YOUR IOT PROJECT GOING!We offer the Sigma Connectivity/ Qualcomm® QCM6490 IoT Kickstarter, which includes the following:Planning Workshop:In this workshop, we will collaborate with you to establish clear objectives, define requirements, and create a realistic timeline for your project.QCM6490 Reference Design:As part of this offer, you can leverage the QCM6490 reference design. By using this design, you can save significant costs, as there will be no prototyping licensing fees involved. This translates to potential savings of up to $1M or more.By taking advantage of our expertise and the resources provided through Sigma Connectivity’ and Qualcomm Technologies' IoT Kick Starter Offer, you can accelerate the development of your 5G IoT solutions and maximize the benefits of digital transformation.
KEY FEATURES:
- Complete Ref Design to build your product upon
- Prototype Licenses covered.
- Key Design and build experiences with multiple Qualcomm® Chipsets
VVDN QCS 410 SOM
VVVDN QCS 410 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.
KEY FEATURES:
- High-performance IoT System-on-Chip (SoC)
- Compact SOM size
- Advanced ISP, machine learning, sensor processing, and voice control
VVVDN QCS 410 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.
KEY FEATURES:
- High-performance IoT System-on-Chip (SoC)
- Compact SOM size
- Advanced ISP, machine learning, sensor processing, and voice control
VVDN QCS 610 SOM
VVVDN QCS 610 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.
KEY FEATURES:
- Compact SOM Size
- High-performance IoT System-on-Chip (SoC)
VVVDN QCS 610 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.
KEY FEATURES:
- Compact SOM Size
- High-performance IoT System-on-Chip (SoC)
Development Kit based on QCS610
This development kit is based on powerful Qualcomm® QCS610 SoC along with a carrier board developed by VVDN. The system is intended for connecting camera intelligence applications such as 180° dual-camera stitching, advanced tracking algorithms, video conferencing, etc. The development system can be used for intelligent video analytics applications including smart surveillance, retail, traffic, dashcams, robotics, automotive and more.
KEY FEATURES:
- Rich I/O Peripherals including USB3.0, USB2.0, MIPI CSI(x3), HDMI, etc
- Multiple connectivity solutions such as Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0
- Compact SOM size
This development kit is based on powerful Qualcomm® QCS610 SoC along with a carrier board developed by VVDN. The system is intended for connecting camera intelligence applications such as 180° dual-camera stitching, advanced tracking algorithms, video conferencing, etc. The development system can be used for intelligent video analytics applications including smart surveillance, retail, traffic, dashcams, robotics, automotive and more.
KEY FEATURES:
- Rich I/O Peripherals including USB3.0, USB2.0, MIPI CSI(x3), HDMI, etc
- Multiple connectivity solutions such as Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0
- Compact SOM size
VVDN-QCS2290 SOM
VVDN-QCS220 SOM, designed and developed by VVDN is based on the Qualcomm® QCS2290 platform. It comes with integrated Wi-Fi: IEEE 802.11 a/b/g/n/ac, Bluetooth 5.0, and FM via Qualcomm® WCN3950 chipset. The SOM supports rich I/O interfaces including MIPI-CSI, MIPI-DSI, USB, SD card, GPIO, JTAG, to connect LCD panels, and camera modules, for the development of vision intelligent IoT applications.The system on module offers tight system integration and optimization for superior performance and power management features make it the best to facilitate a cost-effective and efficient embedded system application including two-wheelers digital instrument cluster, body-worn camera, connected camera, digital signage, control panels/industrial panels, retail PoS, video doorbells, etc.
VVDN-QCS220 SOM, designed and developed by VVDN is based on the Qualcomm® QCS2290 platform. It comes with integrated Wi-Fi: IEEE 802.11 a/b/g/n/ac, Bluetooth 5.0, and FM via Qualcomm® WCN3950 chipset. The SOM supports rich I/O interfaces including MIPI-CSI, MIPI-DSI, USB, SD card, GPIO, JTAG, to connect LCD panels, and camera modules, for the development of vision intelligent IoT applications.The system on module offers tight system integration and optimization for superior performance and power management features make it the best to facilitate a cost-effective and efficient embedded system application including two-wheelers digital instrument cluster, body-worn camera, connected camera, digital signage, control panels/industrial panels, retail PoS, video doorbells, etc.
VVDN-QCS6490 SOM
VVDN is designing, and developing SOM based on Qualcomm® QCS6490 SoC. The SOM supports rich interfaces for connectivity including Wi-Fi 6 (802.11ax) & Bluetooth 5.2 ® technology and other rich peripherals including 5X4 lane MIPI CSI for cameras, 4 lane MIPI DSI for display, USB3.1, USB 2.0, etc.The SOM provides rich hardware interfaces and software SDKs for building quick prototypes and validation. It is ideal for developing various industrial and commercial IoT applications including Digital Signage, Retail, Smart Warehousing, Service robots, Rugged Handheld, etc.
VVDN is designing, and developing SOM based on Qualcomm® QCS6490 SoC. The SOM supports rich interfaces for connectivity including Wi-Fi 6 (802.11ax) & Bluetooth 5.2 ® technology and other rich peripherals including 5X4 lane MIPI CSI for cameras, 4 lane MIPI DSI for display, USB3.1, USB 2.0, etc.The SOM provides rich hardware interfaces and software SDKs for building quick prototypes and validation. It is ideal for developing various industrial and commercial IoT applications including Digital Signage, Retail, Smart Warehousing, Service robots, Rugged Handheld, etc.
VVDN QCS8250 SoM
QCS8250 SoM designed, and developed by VVDN is based on Qualcomm Technologies next-gen processor, the Qualcomm® QCS8250. The SoM can be used in the development of applications that require intelligent processing including connected cameras, video collaboration, retail self-checkout, AR/VR, health care, fleet management, digital signage and other AI applications on the edge.
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Integrated Wi-Fi – (IEEE802.11 b/g/n/ac/ax 2.4/5Ghz) + BLE V5.1
- Supports multiple rich interfaces for camera, connectivity, and display
- Android 10 OS
- Ultra-compact form factor
QCS8250 SoM designed, and developed by VVDN is based on Qualcomm Technologies next-gen processor, the Qualcomm® QCS8250. The SoM can be used in the development of applications that require intelligent processing including connected cameras, video collaboration, retail self-checkout, AR/VR, health care, fleet management, digital signage and other AI applications on the edge.
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Integrated Wi-Fi – (IEEE802.11 b/g/n/ac/ax 2.4/5Ghz) + BLE V5.1
- Supports multiple rich interfaces for camera, connectivity, and display
- Android 10 OS
- Ultra-compact form factor
VVDN QCS 8250 Development Kit
Our QCS 8250 development kit is a powerful compact solution for edge computing applications. The QCS 8250 development kit comprises of SOM (based on Qualcomm® QCS8250 IoT Octa-core SoC) and a carrier board designed and developed by VVDN. The SOM provides multiple standard interfaces such as UART, I2C, SPI, configurable GPIOs, CAN, and USB 3.1. It can support multiple cameras with six 4-lane MIPI CSI and two 4-lane MIPI DSIThe system is intended for kickstarting the development of applications that requires intelligent processing including connected cameras, video collaboration, retail self-checkout, AR/VR, health care, fleet management, digital signage, and other AI applications on the edge.
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Powerful processing cores
- Dedicated computer vision engine
- Android 10-based OS
Our QCS 8250 development kit is a powerful compact solution for edge computing applications. The QCS 8250 development kit comprises of SOM (based on Qualcomm® QCS8250 IoT Octa-core SoC) and a carrier board designed and developed by VVDN. The SOM provides multiple standard interfaces such as UART, I2C, SPI, configurable GPIOs, CAN, and USB 3.1. It can support multiple cameras with six 4-lane MIPI CSI and two 4-lane MIPI DSIThe system is intended for kickstarting the development of applications that requires intelligent processing including connected cameras, video collaboration, retail self-checkout, AR/VR, health care, fleet management, digital signage, and other AI applications on the edge.
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Powerful processing cores
- Dedicated computer vision engine
- Android 10-based OS
QSC8250 Video Conference Development Kit
QCS8250 Video Conference Development Kit comprises 1 Qualcomm® QCS8250 processor-based SoM, 1 carrier board, mic and 3 cameras
QCS8250 Video Conference Development Kit comprises 1 Qualcomm® QCS8250 processor-based SoM, 1 carrier board, mic and 3 cameras
Chipset
QCS8250 Video Collaboration Reference Design by AmTRAN
All-in-one video conference room reference designIntegrated cameras, microphones, speaker and HDMI input/outputs in one deviceWall mountable or place on tabletopCollaboration application runs on the device, no need for a separate PC to host the application.Designed for medium to large rooms, 4.5 – 5.0-meter range.Intelligent AI based features for video and audio.Qualcomm® AI Suite for Video CollaborationAI based automatic ePTZ for group framing, person framing and speaker framing to make video meetings more engaging.AI based noise suppression to eliminate audio distractions.Intelligent Acoustic Echo CancelationExcellent double-talk performanceClear voice pickup up to 5 metersReduces meeting room reverberation.3-4 microphone array
KEY FEATURES:
- Based on powerful Qualcomm® QCS8250 processorAndroid T, kernel 5.15Memory 8GB, storage 32GB4K Ultra HD video calling, 4 Microphone Array, 5 Meters Pickup RangeTested for Teams and Zoom pre-certification
All-in-one video conference room reference designIntegrated cameras, microphones, speaker and HDMI input/outputs in one deviceWall mountable or place on tabletopCollaboration application runs on the device, no need for a separate PC to host the application.Designed for medium to large rooms, 4.5 – 5.0-meter range.Intelligent AI based features for video and audio.Qualcomm® AI Suite for Video CollaborationAI based automatic ePTZ for group framing, person framing and speaker framing to make video meetings more engaging.AI based noise suppression to eliminate audio distractions.Intelligent Acoustic Echo CancelationExcellent double-talk performanceClear voice pickup up to 5 metersReduces meeting room reverberation.3-4 microphone array
KEY FEATURES:
- Based on powerful Qualcomm® QCS8250 processorAndroid T, kernel 5.15Memory 8GB, storage 32GB4K Ultra HD video calling, 4 Microphone Array, 5 Meters Pickup RangeTested for Teams and Zoom pre-certification
Chipset
Atlantik Elektronik – QCS6490 System-on-Chip (SoC)
Atlantik Elektronik provides direct access to the Qualcomm Dragonwing™ QCS6490—an advanced, high-performance SoC built for demanding edge applications in AI, vision, and industrial systems.We support customers from early evaluation through integration and production, offering the Dragonwing QCS6490 as a standalone SoC as well as through ready-to-use modules, boards, and edge systems.Dragonwing QCS6490 SoC – high-performance edge AI processor with 8-core CPU, GPU, and 12.5 TOPS NPU, built for intelligent vision, robotics, and industrial IoT applications.The Dragonwing QCS6490 and its ecosystem are available directly from Atlantik Elektronik, including hardware access, design-in support, software integration, and logistics services.
Atlantik Elektronik provides direct access to the Qualcomm Dragonwing™ QCS6490—an advanced, high-performance SoC built for demanding edge applications in AI, vision, and industrial systems.We support customers from early evaluation through integration and production, offering the Dragonwing QCS6490 as a standalone SoC as well as through ready-to-use modules, boards, and edge systems.Dragonwing QCS6490 SoC – high-performance edge AI processor with 8-core CPU, GPU, and 12.5 TOPS NPU, built for intelligent vision, robotics, and industrial IoT applications.The Dragonwing QCS6490 and its ecosystem are available directly from Atlantik Elektronik, including hardware access, design-in support, software integration, and logistics services.
Chipset
Atlantik Elektronik – QCS6490 Based Single Board Computer
Atlantik Elektronik offers direct access to compact single board computers (SBCs) based on the Qualcomm Dragonwing™ QCS6490.Targeting Edge AI, computer vision, robotics, smart cameras, industrial IoT, and education, we offer the Thundercomm Rubik Pi 3: a versatile, Raspberry Pi–style SBC suitable for both prototyping and deployment in industrial environments.Available Dragonwing QCS6490 based SBC:Thundercomm Rubik Pi 3 – compact 100 × 75 mm SBC with broad I/O and ecosystem compatibility, designed for seamless integration into embedded systemsThe Rubik Pi 3 is available directly from Atlantik Elektronik, with optional technical support, software configuration, and long-term logistics services.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
Atlantik Elektronik offers direct access to compact single board computers (SBCs) based on the Qualcomm Dragonwing™ QCS6490.Targeting Edge AI, computer vision, robotics, smart cameras, industrial IoT, and education, we offer the Thundercomm Rubik Pi 3: a versatile, Raspberry Pi–style SBC suitable for both prototyping and deployment in industrial environments.Available Dragonwing QCS6490 based SBC:Thundercomm Rubik Pi 3 – compact 100 × 75 mm SBC with broad I/O and ecosystem compatibility, designed for seamless integration into embedded systemsThe Rubik Pi 3 is available directly from Atlantik Elektronik, with optional technical support, software configuration, and long-term logistics services.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
Chipset
