--- title: "Development Hardware" url: "https://www.qualcomm.com/internet-of-things/industries/retail/hardware" --- # Development Hardware Your fastest path to development. Start prototyping with tested hardware kits, boards, SOMs and reference designs. IMAGE_URL: https://s7d1.scene7.com/is/image/dmqualcommprod/dark-abstract-bg?fmt=webp-alpha&qlt=85 ## All Products - All Products - Development Kits - Evaluation Boards - Reference Design Platforms - Single-Board Computers - System-on-Modules 90 products ### Categories - All hardware - Qualcomm hardware - Third-party hardware ### Filter by: **Chip Products:** QCM2290, QCM4290, QCM5430, QCM6125, QCM6490, More **Company:** Advantech Co., Ltd., Altek Corporation, AmTRAN Technology Co., Ltd., Atlantik Elektronik GmbH, Chengdu APLUX Intelligence Technology, Ltd., More **Operating System:** Android, Android 13, Linux, Qualcomm Linux 1.5, Ubuntu, More **Application:** AI box, AR device, Body Worn Camera, Dash Camera, Desktop PC, More **Industry:** Aerospace, Agriculture, Automotive, Consumer Electronics, Education, More **Region:** Africa, Americas, Asia, Europe, Oceania --- ### qSmartAI20_CUQ610 - 2MP Qualcomm® Edge AI Vision Kit with multi-camera support qSmartAI20_CUQ610 is a ready-to-deploy AI vision kit based on the Qualcomm® QCS610 processor with powerful AI processing capabilities. This Qualcomm vision kit comprises e-con's Sony IMX462 based Full HD MIPI CSI-2 camera module.This AI vision kit has a small form factor and can perform all image processing and analytics indigenously without the connectivity or power of the cloud. In addition, this is a multi-camera solution enabling an extended field of view for applications that need to cover a large area or scene. e-con Systems provides all the necessary customization services for this vision AI development kit including the camera, carrier board, and software. KEY FEATURES: - AI Vision Kit based on Qualcomm® QCS610/410 SoC * - Full HD ultra low light camera based on Sony Starvis IMX462 sensor - Multi-camera support (Supports upto 3 cameras) - Qualcomm neural processing SDK for AI By [E-CON SYSTEMS INC.](https://www.qualcomm.com/support/partner/member-directory/member.econ-systems-inc) Chipset: [QCS610](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs610) Type: Development Kits [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.econ-systems-inc.id-a1V8X000009KMz3UAG) ### AIkri QCS610: Aikri-X10-6D-4 Aikri-X10-6D-4 development kit is based on the powerful Qualcomm® QCS610 octa-core processor. The kit comprises a SoM based on Qualcomm QCS610 and a carrier board. It comes with a pre-built Linux BSP that can help in early prototyping and parallel software development. It is an ideal platform for Enterprise Security Cameras, IP Cameras, Body Cam, Audio/Video Collaboration, Home/Industrial Automation, Tele-diagnostics, Smart Display, Videoconferencing & Industrial IoT solutions. KEY FEATURES: - 4GB LPDDR4x, 16GB eMMC 5.1; Video up to 4K30 - Wi-Fi, Bluetooth, Ethernet - Pre-built Linux By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc) Chipset: [QCS610](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs610) Type: Development Kits [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X00000BFbQnUAL) ### Aikri QCS6490: Aikri-64X-90LS-8 eInfochips Aikri 6490 SoM is powered by the Qualcomm® QCS6490 processor, a 6nm processor with superior performance, power efficiency and powerful computing. The Aikri 6490 SoM is the best fit for designing Transportation & Logistics, Smart Warehousing, Retail, Manufacturing, Healthcare, and Ecommerce solutions including ruggedized handhelds and tablets, kiosks, industrial scanners, point of sale systems and human machine interface systems. KEY FEATURES: - Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ GPU, Adreno VPU, Adreno DPU and Qualcomm® Hexagon™ DSP with dual HVX - Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine - 8GB LPDDR5 and 128GB UFS; OS: Linux By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) Type: System-on-Modules [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X00000BFbQYUA1) ### Aikri QCS6490: Aikri-64X-90AS-8 eInfochips Aikri 6490 SoM is powered by the Qualcomm® QCS6490 processor, a 6nm processor with superior performance, power efficiency and powerful computing. The Aikri 6490 SoM is the best fit for designing Transportation & Logistics, Smart Warehousing, Retail, Manufacturing, Healthcare, and Ecommerce solutions including ruggedized handhelds and tablets, kiosks, industrial scanners, point of sale systems and human machine interface systems. KEY FEATURES: - Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, 633 VPU, 1075 DPU and Qualcomm® Hexagon™ DSP with dual HVX - Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine - 8GB LPDDR5 and 128GB UFS; OS: Android 13.0 By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) Type: System-on-Modules [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X00000BFbQTUA1) ### Aikri QCS6490: Aikri-64X-90AD-8-1 The Aikri 6490 video collaboration dev kit is based on the Aikri System on Module powered by the Qualcomm® QCS6490 platform. The dev kit is an ideal choice to kick-start development of Transportation & Logistics, Smart Warehousing, Retail, Manufacturing, Healthcare, and Ecommerce solutions including ruggedized handhelds and tablets, kiosks, industrial scanners, point of sale systems and human machine interface systems. KEY FEATURES: - Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU, and Qualcomm® Hexagon™ DSP with dual HVX - Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine - Running on Android 13 By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) Type: Development Kits [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X00000BFbQOUA1) ### Camera Reference Designs eInfochips has vast experience and in-depth expertise in designing and delivering camera solutions across a wide range of Qualcomm Technologies processors, to cater to applications such as Connected cameras, Video analytics, Security, and Surveillance. Our reference designs for smart camera solutions are ready-to-use, cost-effective, versatile, and an excellent choice for original equipment manufacturers (OEMs) to kick-start prototype development of their next-generation cameras. We also provide a software framework that allows you to configure your underlying camera sensors.Our reference designs include cameras with 360° field of view (FoV), multiple high-resolution concurrent streaming and capture capabilities, and stereoscopic vision. We provide enhanced support services. KEY FEATURES: - Services to enable RAW, Bayer, or YUV sensors; ToF sensors - Integration with all necessary camera firmware components; Camera firmware upgrades on-field; ONVIF compliance - HDR enabling and improvement; Camera sensor tuning By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc) Chipset: [QCS610](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs610), [QRB4210](https://www.qualcomm.com/internet-of-things/products/q4-series/qrb4210) Type: Reference Design Platforms ### Aikri QCS4290: Aikri-42X-90AD-4 Aikri-42X-90AD-4 development kit is based on Qualcomm® QCS4290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its three 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS4290 kit comprises Qualcomm® QCS4290-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras. KEY FEATURES: - Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP - 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1 - OS: Android 12; Dimensions: 85mm x 54mm By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc) Chipset: [QCS4290](https://www.qualcomm.com/internet-of-things/products/q4-series/qcs4290) Type: Development Kits [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000009KXcuUAG) ### Aikri QCS2290: Aikri-22X-90AD-4 Aikri-22X-90AD-4 development kit is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 kit comprises Qualcomm® QCS2290-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras. KEY FEATURES: - 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP - 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and Bluetooth 5.0 - OS: Android 12, Kernel 4.19; Dimensions: 85mm x 54mm By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc) Chipset: [QCS2290](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290) Type: Development Kits [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000009KXczUAG) ### Aikri QCS2290: Aikri-22X-90AS-4 Aikri-22X-90AS-4 System-on-Module (SoM) is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras. KEY FEATURES: - 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP - 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0 - OS: Android 12; Dimensions: 58 mm x 39 mm By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc) Chipset: [QCS2290](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290) Type: System-on-Modules [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000009KXcaUAG) ### Aikri QCS4290: Aikri-42X-90AS-4 Aikri-42X-90AS-4 System-on-Module (SoM) is based on Qualcomm® QCS4290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its three 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS4290 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras. KEY FEATURES: - Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP - 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT 5.1 - OS: Android 12; Dimensions: 58 mm x 39 mm By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc) Chipset: [QCS4290](https://www.qualcomm.com/internet-of-things/products/q4-series/qcs4290) Type: System-on-Modules [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000009KXcVUAW) ### Aikri-82X-50AD-8 Aikri-82X-50D Development Kit is based on high-performance Qualcomm® QCS8250 processor. It integrates the advanced 7 nm Fin FET process, 64-bit Octa-Core Qualcomm® Kryo™ 585 application processor, Qualcomm® Hexagon™ DSP, Qualcomm® Adreno™ 650 GPU, Qualcomm Spectra™ 480 image signal processors, Sensor core, Secure processing unit and Neural processing unit. QCS8250 kit comprises SoM based on Qualcomm QCS8250 and a carrier board. It supports long-range Wi-Fi, Wi-Fi 6 (Wi-Fi 802.11 a/b/g/n/ac/ax) and Bluetooth 5.1. It supports multiple cameras with six 4-lane CSI input interfaces. In addition, it supports two 4-lane MIPI DSI. By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc) Chipset: [QCS8250](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8250) Type: Development Kits [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000006PETSUA4) ### Aikri QCS8250: Aikri-82X-50AS-8 Aikri-82X-50S System-on-Module (SoM) is a high-performance module based on Qualcomm® QCS8250 processor. It integrates the advanced 7 nm Fin FET process, 64-bit Octa-Core Qualcomm® Kryo™ 585 application processors, Qualcomm® Hexagon™ DSP, Qualcomm® Adreno™ 650 GPU, Qualcomm Spectra™ 480 image signal processors, Sensor core, Secure processing unit and Neural processing unit. QCS8250 SoM supports long range Wi-Fi, Wi-Fi 6 (Wi-Fi 802.11 a/b/g/n/ac/ax) and Bluetooth 5.1. It supports multiple cameras with six 4-lane CSI input interfaces. In addition, it supports two 4-lane MIPI DSI. Moreover, it provides a variety of standard interfaces such as GPIO, I2C, UART, SPI, USB3.1, PCIE Gen 3.0, and I2S. By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc) Chipset: [QCS8250](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8250) Type: System-on-Modules [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000006PET8UAO) ### AIkri QCS610: Aikri-X10-6S-4 Aikri-X10-6S-4 System-on-Module is based on Qualcomm® QCS610 processor. Multi-core processing and advanced video codec offers high-resolution video capture at low power. The module offers tight system integration and optimization for superior performance and power efficiency. It enables multiple connectivity solutions with integrated Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0 solution. eInfochips also offers a development kit for benchmarking and PoC development. KEY FEATURES: - 4GB LPDDR4x, 16GB eMMC 5.1 - Pin and software compatible with Qualcomm® QCS410 processor - Supports Linux By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc) Chipset: [QCS610](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs610) Type: System-on-Modules [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000006N0SYUA0) ### AIkri QCS410: Aikri-X10-4S Aikri-X10-4S System-on-Module is based on the powerful Qualcomm® QCS410 processor. It offers multiple connectivity solutions with integrated Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0. The module enables tight system integration and optimization for superior performance and power efficiency. eInfochips also offers a development kit as part of the eInfochips' product line based on the QCS410 for benchmarking and PoC development. KEY FEATURES: - Pin compatible and software compatible with Qualcomm® QCS610 - 4GB LPDDR4x and 16GB eMMC 5.1 - Supports Linux By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc) Chipset: [QCS410](https://www.qualcomm.com/internet-of-things/products/q4-series/qcs410) Type: System-on-Modules [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000006MzS3UAK) ### AIkri QCS410: Aikri-X10-4D Aikri-X10-4D development kit is based on powerful Qualcomm® QCS410 quad-core processor. The kit comprises a SoM based on QCS410 and a carrier board. It comes with a pre-built Linux BSP that can help in early prototyping and parallel software development. It is an ideal platform for Enterprise Security Cameras, IP Cameras, Body Cam, Audio/Video Collaboration, Home/Industrial Automation, Tele-diagnostics, Smart Display, Videoconferencing & Industrial IoT solutions. KEY FEATURES: - 4GB LPDDR4x, 16GB eMMC 5.1; Video up to 4K30 - Wi-Fi 802.11ac, BT 5.0, Ethernet/RGMII - Pre-built Linux By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc) Chipset: [QCS410](https://www.qualcomm.com/internet-of-things/products/q4-series/qcs410) Type: Development Kits [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000006MzRwUAK) ### AIkri QCS8250: Aikri-82X-50D Aikri-82X-50D development kit is based on high-performance Qualcomm® QCS8250 processor. It has Qualcomm Spectra™ 480 image signal processors, Sensor core, Qualcomm® Secure Processing Unit and Qualcomm® Neural Processing Unit. This kit comprises SoM based on QCS8250 and a carrier board. The kit comes with Android 10 support and is suitable for applications using high-resolution camera and intelligent processing including AR/VR, AI, Machine Vision, Collaboration and Advanced Analytics. KEY FEATURES: - Six 4-lane CSI; Two 4-lane MIPI DSI - Wi-Fi 6, Bluetooth 5.1 - 170mm x 170mm By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc) Chipset: [QCS8250](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8250) Type: Development Kits [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000006MzRvUAK) ### AIkri QCS8250: Aikri-82X-50S Aikri-82X-50S System-on-Module (SoM) is a high-performance module based on Qualcomm® QCS8250 processor. It supports Wi-Fi 6 and Bluetooth 5.1. It also supports multiple cameras with six 4-lane CSI input interfaces. In addition, it supports two 4-lane MIPI DSI. SoM based on QCS8250 is suitable for applications that need high-resolution camera and intelligent processing including AR/VR, AI, Machine Vision, Collaboration and Advanced Analytics. KEY FEATURES: - Dimension: 59.7mm x 32.2 - 6 x 4-lane CSIs (4-Lane each); D-PHY & C-PHY (supported by design) - DisplayPort 1.4 data concurrency over USB 3.1 Type-C By [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc) Chipset: [QCS8250](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8250) Type: System-on-Modules [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.einfochips-inc.id-a1V8X000006MzRuUAK) ### Open-Q 6490CS SOM Overview | Specifications The Open-Q 6490CS provides flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as AI cameras, video collaboration, industrial handhelds, and video telematics. Based on Qualcomm Dragonwing™ QCS6490 processor, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution. KEY FEATURES: - Multiple MIPI camera and display ports - Up to 8GB LPDDR5 RAM + 64GB eMMC - Android™ 13 and Qualcomm Linux - TAA/NDAA Compliant By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) Type: System-on-Modules [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc.id-a1VQo00000DrMPVMA3) ### Open-Q 6490CS SOM Development Kit Overview | Specifications The Open-Q™ 6490 Development Kit is designed to facilitate easy evaluation and development. The kit includes many standard sockets, enabling customers to choose from a wide range of third-party accessories. The SOM utilizes Qualcomm Technologies' heterogeneous computing expertise to offer a system-on-chip with multiple specialized processing cores for powerful AI processing, image and graphics processing, and audio processing. KEY FEATURES: - Standard M.2 sockets for evaluating Wi-Fi - TAA/NDAA Compliant - Android™ 13 and Qualcom Linux OSs By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) Type: Development Kits ### Open-Q AL Development Kit (4290 & 2290 Series) The Open-Q™ AL development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4290 and 2290 SIP families based on the Qualcomm® QCS4290 processor (Android). KEY FEATURES: - Development kit provides interfaces to evaluate camera and video - Evaluate display on LCD & HDMI - Supports many robotic features By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc) Chipset: [QCS4290](https://www.qualcomm.com/internet-of-things/products/q4-series/qcs4290), [QCS2290](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290) Type: Development Kits ### Open-Q 2290CS™ System-in-Package (SIP) Overview | Specifications The Open-Q™ 2290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QCS2290, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications. KEY FEATURES: - Entry-tier solution delivers greater performance, graphic, and camera capabilities - Secure compute platform - Improved power performance By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc) Chipset: [QCS2290](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290) Type: System-on-Modules ### Open-Q 4290CS™ System-in-Package (SIP) Overview | Specifications The Open-Q™ 4290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QCS4290 chipset utilizes Qualcomm Technologies' heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4290 SIP creates the perfect computing core for a variety of edge AI video analytic applications. KEY FEATURES: - Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor - 3rd generation Qualcomm® AI Engine - Vivid graphics with Qualcomm® Adreno™ 610 GPU - Multiple high speed connectivity options - Up to 6GB LPDDR4 and 256GB eMMC - Long term support with extended life hardware and software support through 2027 By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc) Chipset: [QCS4290](https://www.qualcomm.com/internet-of-things/products/q4-series/qcs4290) Type: System-on-Modules ### Open-Q™ 8250CS Module/SoM with Qualcomm® QCS8250 Overview | Specifications The Open-Q™ 8250CS production ready computing SOM delivered with Android™ 13 supports multiple concurrent decode+encode sessions, live tuning for cameras (not customer facing), 2A sync for 2 cameras, UVC/UAC source mode for video collaboration bars to function as a USB class device, low-latency MS codecs and MS Teams video extensions with a roadmap to include background blur and replacement, an AI director framework to track and zoom a camera onto the person speaking and QSAT for smooth zoom. KEY FEATURES: - Long life IIoT chipset - 8GB LPDDR5 RAM + 128GB UFS Flash - Android™ 13 - On-device AI Engine up to 15 TOPS - Dedicated Computer Vision Engine - Multiple MIPI camera and display ports - Multiple high speed connectivity options - Ultra-compact 50 x 29 mm form factor By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc) Chipset: [QCS8250](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8250) Type: System-on-Modules ### Open-Q™ 610 μSOM Overview | Specifications Lantronix's Open-Q™ 610 μSOM is an ultra-compact (50mm x 25mm) production-ready SOM based on the Qualcomm® QCS610 SOC, with built-in Qualcomm® Neural Processing Engine for on-device edge AI capabilities. Aimed at connected visual intelligence applications, with built-in image sensor processing such as staggered HDR, lens de-warp, dual camera stitching, and image de-fog, the 610 μSOM is the ideal platform for your next smart camera product. Full-featured companion development kit also available. KEY FEATURES: - SoC 11nm technology for high performance with low power - On-device artificial intelligence & machine learning - Native Ethernet interface for high speed connectivity - Three camera ports for multi-camera systems - Yocto Linux or Android 12 with connected camera SDK - RTSP streaming support with GStreamer - Multiple options for AI inference engines By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc) Chipset: [QCS610](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs610) Type: System-on-Modules [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc.id-a1V8X000006N1xxUAC) ### Open-Q™ 610 μSOM Development Kit The Open-Q™ 610 µSOM Development Kit is a versatile, easy-to-use, exposed board platform, powered by our ultra-compact, production-ready, Open-Q™ 610 µSOM. The µSOM is based on the Qualcomm® QCS610 SoC, with built-in Qualcomm® Neural Processing Engine for on-device edge AI capabilities and is aimed at visual intelligence applications. KEY FEATURES: - Powered by micro-sized (50x25mm) Open-Q 610 µSOM - Open-frame Mini-ITX form-factor carrier board for evaluation and development - Numerous I/O and connectivity options - USB Type-C, USB Type-A, Gb Ethernet By [LANTRONIX INC.](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc) Chipset: [QCS610](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs610) Type: Development Kits [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.lantronix-inc.id-a1V6f00000YkFlDEAV) ### TRIA SM2S-QCS6490 Overview | Specifications The TRIA SM2S-QCS6490 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS6490 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS6490 integrates Qualcomm® Kryo™ 670 CPU which contains up to eight cores: four Arm® Cortex®-A78 cores, four Arm® Cortex®-A55 cores, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K60 and many different display connictities (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with upto 12 TOPS at low power and massive camera support with 4 MIPI-CSI inputs. KEY FEATURES: - Quad core Arm Cortex-A78 up to 2.7GHz - And Quad core Arm Cortex-A55 @ 1.95GHz - Adreno 643 GPU @ 812MHz - AI DSP/NSP Dual HVX, 4K HMX up to 12(15) TOPs - Up to 16GB LPDDR5 SDRAM 6400MT/s - Up to 1TB UFS Flash - Display up to FHD+144Hz - Video up to 4k30(E)/4K60(D) - 5xUSB 2.0, 2x USB 3.1 - 2x PCIe Gen3 x1, 1x PCIe Gen3 x2 - 1x MIPI-DSI or LVDS - 1x DP 1.4 (2 lane) + 1x eDP/DP - 4x MIPI-CSI Camera Interface - WLAN/BT Wireless Module (option) - 2x Gigabit Ethernet - 2x I2S Audio Interface - 4x UART, 2x SPI, 2x CAN2.0-FD - 5x I²C - HW Key manager and ECC, Secure boot, Crypto engines, etc. - Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request) By [TRIA](https://www.qualcomm.com/support/partner/member-directory/member.tria) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490), [QCS5430](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430) Type: Single-Board Computers [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.tria.id-a1VQo000001OIG9MAO) ### TRIA SM2S-QCS5430 Overview | Specifications The MSC SM2S-QCS5430 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS5430 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS5430 integrates Qualcomm® Kryo™ 670 CPU which contains up to six cores, Qualcomm® Adreno™ 642L GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K30 and many different display connectivity (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with up to 3.5 TOPS at low power and massive camera support with 4 MIPI-CSI inputs KEY FEATURES: - Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request) - Dual core Arm Cortex-A78 up to 2.1GHz - Adreno 642L GPU @ 315MHz - AI DSP/NSP Dual HVX, 4K HMX up to 3.5 TOPs - Up to 16GB LPDDR5 SDRAM 6400MT/s - Up to 1TB UFS Flash - 4x MIPI-CSI Camera Interface - Video up to 4k30(E)/4K30(D) - 5xUSB 2.0, 2x USB 3.1 - 1x MIPI-DSI or LVDS By [TRIA](https://www.qualcomm.com/support/partner/member-directory/member.tria) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490), [QCM5430](https://www.qualcomm.com/developer/software/android-on-dragonwing) Type: Single-Board Computers [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.tria.id-a1VQo000001OIHlMAO) ### Kiteboard 2290 SOM Overview | Specifications The Kiteboard 2290 is a cost-efficient, production-ready System-on-Module (SOM) based on the Qualcomm® Dragonwing™ QCS2290 SoC. Designed in an ultra-small form factor with integrated compute and connectivity, it enables OEMs, entrepreneurs, and device makers to build custom connected devices for vertical-specific solutions. Available in both Wi-Fi only and LTE variants, the Kiteboard 2290 is optimized for cost-efficient, feature-rich IoT deployments and enables OEMs and ODMs to rapidly develop and commercialize smart devices such as industrial handhelds, retail POS systems, connected cameras, and asset-tracking solutions while accelerating time-to-market. KEY FEATURES: - Ultra small form factor - Integrated with Digital FM Technology - Reference design for offroad vehicle telematics - Reference design for field diagnostics device - Reference design for two-wheeler device cluster - Integrated LTE Cat 4 modem with Dual SIM (DSDS) support - Azure/AWS cloud orchestration for device provisioning and management By [INNOMINDS SOFTWARE, INC.](https://www.qualcomm.com/support/partner/member-directory/member.innominds-software-inc) Chipset: [QCM2290](https://www.qualcomm.com/internet-of-things/products/q2-series/qcm2290), [QCS2290](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290), [QRB2210](https://www.qualcomm.com/internet-of-things/products/q2-series/qrb2210) Type: System-on-Modules ### Kiteboard 8250 SOM Overview | Specifications The Kiteboard 8250 System-on-Module (SOM) is a premier-tier, production-ready SOM built on the Qualcomm® Dragonwing™ QCS8250 SoC, designed to enable OEMs and ODMs to develop high-performance edge AI devices for multi-camera vision and intelligent IoT deployments. Combining powerful compute with advanced connectivity, the module supports real-time edge analytics and video processing for applications such as video telematics, industrial vision systems, AI-connected cameras, smart retail analytics, and healthcare edge devices KEY FEATURES: - SMARC Compatible with Customizable Carrier Board - Optimized for multi-camera edge AI deployments - Supports Multiple AI Models (e.g. YOLO, MobileNet, SAM-HQ, PatchCore) - Compatible with SNPE, QAIRT and Edge Impulse By [INNOMINDS SOFTWARE, INC.](https://www.qualcomm.com/support/partner/member-directory/member.innominds-software-inc) Chipset: [QCS8250](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8250) Type: System-on-Modules ### Quectel Pi H1 SBC (SG565D) Overview | Specifications Quectel Pi H1 is a smart Single-Board Computer (SBC) based on the Qualcomm QCS6490 platform. It integrates a high-performance 64-bit octa-core processor delivering up to 12 TOPS of computing power, along with the Qualcomm Adreno™ 643L GPU. Supporting Yocto Linux, Debian, and Ubuntu operating systems, the product comes equipped with 8 GB of LPDDR4X memory and features a USB Type-C power interface, expandable with external eMMC or SSD storage. It offers dual-band Wi-Fi (2.4 & 5 GHz) compliant with IEEE 802.11a/ b/ g/ n/ ac and Bluetooth 5.0, while enabling dual-display output via DP and LCM or DP and Micro HDMI. Combining powerful performance with rich multimedia capabilities, the Quectel Pi H1 is designed to meet the demands of both industrial and consumer applications for high-speed connectivity, advanced multimedia, and robust computing power. KEY FEATURES: - Robust computing power: Up to 12 TOPS, well-suited for most algorithm prototyping & inference applic - Feature-rich interfaces: USB, Micro HDMI, ADC, audio, Ethernet, camera, PCIe , antenna, etc. - Dual displays: DP and LCM or DP and Micro HDMI. - Wireless connectivity: Wi-Fi 5, 802.11a/ b/ g/ n/ ac, delivering enhanced wireless connectivity. - Multiple operating systems: Yocto Linux/ Debian/ Ubuntu. - Extended temperature range: For harsh outdoor & industrial use; and withstand ambient temperatures f - Diverse application scenarios: Edge computing, robotics, industrial automation, multimedia terminals - High-performance 64-bit octa-core processor, delivering up to 12 TOPS of computing power - 1 x A78 @ 2.7 GHz + 3 x A78 @ 2.4 GHz + 4 x A55 @ 1.9 GHz - 32 KB L1I cache, 32 KB L1D cache and 512 KB L2 cache - Adreno 643L @ 812 MHz - 8 GB LPDDR4X + 128 GB UFS - Yocto Linux/ Debian/ Ubuntu* By [QUECTEL WIRELESS SOLUTIONS CO., LTD.](https://www.qualcomm.com/support/partner/member-directory/member.quectel-wireless-solutions-co-ltd) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) Type: Single-Board Computers ### SagireEdge™ AI 600 Development Kit The SagireEdge™ AI 600 Development Kit (DK) is an open-frame platform that combines the production ready SagireEdge™ AI 600 SOM with a SMARC complaint carrier board providing numerous expansion options to support development and testing of peripherals and applications.​ KEY FEATURES: - SagireEdge AI 600 SOM & open chassis carrier board powered by the Qualcomm Dragonwing™ QCS6490 SoCPreloaded with a Ubuntu Linux O/S By [SAGIRE AI INC.](https://www.qualcomm.com/support/partner/member-directory/member.sagire-ai-inc) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) Type: Development Kits ### SagireEdge™ AI 600 System On Module The SagireEdge™ AI 600 SOM is an industrial grade production ready module based upon Qualcomm Dragonwing™ QCS6490 System on Chip (SoC). It enables low power, compute intensive camera and Edge AI Applications with up to 12 TOPS.The Smart Mobility ARChitecture (SMARC) compliant form factor is designed to enable digital transformation optimized at the edge for size, weight, power and cost sensitive applications. The standardized format of the SMARC SOM facilitates fast development and enables new designs to be quickly created, resulting in significantly reduced time to market. KEY FEATURES: - 8GB RAM/128GB UFS Flash in a µMCP packageExtensive range of I/O, including Ethernet, USB3.1, Wi-Fi 6E and BT 5.2, MIPI-CSI, eDP, CAN, and PCIe Extended temperature range By [SAGIRE AI INC.](https://www.qualcomm.com/support/partner/member-directory/member.sagire-ai-inc) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) Type: System-on-Modules ### KIMQ 6490 KIMQ 6490 is designed and developed by HSPTEK on the Snapdragon® SoC (QCS6490) platform with a 6nm manufacturing process, with high performance, energy saving and strong computing power (12 TOPs). This SOM supports 4K@60FPS video decoding, 4K@30FPS video encoding, three MIPI CSI interfaces, and supports diverse external interfaces (GPIO, UART, I2C, I3C, SPI, USB 3.0).KIMQ 6490 supports customers in accelerating the product development process and is applied in many fields such as specialized handheld devices, tablets, and payment devices. Besides, with powerful AI processing capabilities at the edge, KIMQ 6490 is developed for products such as AI Camera, AI Box, and other AI processing devices at the edge…. KEY FEATURES: - Ultra-compact size 40x47mm. Modular design with plug-and-play pins. Decodes video at 250 FPS FHD, AI processing at 12 TOPS. No maintenance, high stability. Supports AI model conversion & optimization. AI Hub with KIMQ-compatible models. By [HSPTEK JOINT STOCK COMPANY](https://www.qualcomm.com/support/partner/member-directory/member.hsptek-joint-stock-company) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) Type: System-on-Modules [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.hsptek-joint-stock-company.id-a1VQo000002ReufMAC) ### MitySOM-QC6490/5430 Development Kit The MitySOM-QC6490/5430 Development Kit supports Critical Link's Qualcomm Dragonwing QCS6490 and QCS5430-based system on modules.Each Dev Kit comes complete with all the connectivity needed in any application well suited for the MitySOM-QC6490/5430, including an on-board UART to Micro-USB Port, dual USB 2.0 Host Ports, one 3.1 USB Type-C with Display Port, one 1.4 Display Port connector, five MIPI camera interface ports, one 8-bit eMMC up to 64GB and one 3.5mm 4-conductor audio interface. The kit also includes an E-key M.2 connector, a 2 channel PCIe port, and two 34-pin 0.1” headers with direct connections to the QCS6490/5430 processor supporting GPIO, SPI, I2C, SoundWire, I2S and Slimbus peripherals.Additional details can be found at https://www.criticallink.com/product/mitysom-qc6490-5430-development-kit/ KEY FEATURES: - Full-featured development kit for Critical Link's QCS6490 and QCS5430-based system on modules - MitySOM system on modules are production-ready industrial solutions, designed for long term availability and performance - Developers have access to dev board design files to jump start their own baseboard design, as well as lifetime access to Critical Link's wiki-based support as well as our US-based engineering support team By [CRITICAL LINK LLC](https://www.qualcomm.com/support/partner/member-directory/member.critical-link-llc) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490), [QCS5430](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430) Type: Development Kits ### MitySOM-QC6490 / 5430 The MitySOM-QC6490 / 5430 is a system on module family featuring a Qualcomm Dragonwing™ QCS6490 or Dragonwing QCS5430 processor with on-board power supplies, an LPDDR5 RAM memory subsystem, and a UFS configuration memory. Specifications: Dragonwing QCS6490 or Dragonwing QCS5430 SoC Processor. - Memory: 8 GB LPDDR5, 256GB Flash. - Power: 5-12Vdc Input, generated on board. - Interfaces: 2x PCIe Gen 3 (1x 1 lane, 1x 2), 5x MIPI x4 input + DSI output, USB 3.1 Gen 2, USB 2.0. - Mechanical: 45mm x 45mm (1.77″ x 1.77″). KEY FEATURES: - Production-ready system on module - Expanded interfaces for industrial use cases - Long-term support expected through July 2036 with the Critical Link Product Longevity Program By [CRITICAL LINK LLC](https://www.qualcomm.com/support/partner/member-directory/member.critical-link-llc) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490), [QCS5430](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430) Type: System-on-Modules ### COREXOM R6490WGQ SOM COREXOM R6490WGQ SOM – Powered by the Qualcomm® QCS6490 SoC, the R6490WGQ SOM features the Qualcomm® Kryo™ 670 CPU and a fused AI-accelerator in the Qualcomm® Hexagon™ processor, offering exceptional computational power with energy efficiency. It supports up to five MIPI CSI interfaces, triple ISPs, 4K@60FPS video decoding, and 4K@30FPS encoding. With a wide range of external interfaces like GPIO, UART, I2C, SPI, DSI, USB 3.1, and PCIe, plus integrated GPS and Wi-Fi 6E/Bluetooth, it's ideal for complex IoT applications.Supporting Android, Ubuntu, Linux, and Windows 11 IoT Enterprise, this SOM is designed to reduce design complexity and speed up time to market. It's perfect for rugged handhelds, tablets, POS, kiosks, AI Box, AI cameras, robotics, and HMI, enabling developers to efficiently bring innovative products to market. KEY FEATURES: - High Performance Qualcomm® 6nm QCS6490 SoC - 8G / 128GB uMCP - AI Performance: Up to 12 TOPS - Five 4-lane MIPI-CSIs; 3x ISP@22MP, 2x IFE lite - Support Wi-Fi 6E / BT, and GPS - Supports Android, Linux, Ubuntu, Windows 11 IoT Enterprise By [CORETRONIC REALITY INC.](https://www.qualcomm.com/support/partner/member-directory/member.coretronic-reality-inc) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) Type: System-on-Modules ### qSmartAI80_CUQ610 - Qualcomm AI vision kit with multi-camera support qSmartAI80_CUQ610 is a ready-to-deploy AI vision kit based on the Qualcomm® QCS610 processor with powerful AI processing capabilities. This Qualcomm vision kit comprises of e-con's Sony STARVIS IMX415 based 4K MIPI CSI-2 camera module, a SoM based on Qualcomm® QCS610 SoC, and a carrier board.This Qualcomm camera kit is suited for running image-based machine learning and deep learning models at the edge making it perfect for industrial and retail applications. In addition, this is a multi-camera solution enabling an extended field of view for applications that need to cover a large area or scene. e-con Systems also provides all the necessary customization services for this AI vision development kit including the camera, carrier board, BSP, software, and enclosure. KEY FEATURES: - AI Vision Kit based on Qualcomm® QCS610/410 SoC * - 4K ultra low light camera based on Sony Starvis IMX415 sensor - Multi-camera support (Supports upto 3 cameras) - Qualcomm neural processing SDK for AI By [E-CON SYSTEMS INC.](https://www.qualcomm.com/support/partner/member-directory/member.econ-systems-inc) Chipset: [QCS610](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs610) Type: Development Kits [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.econ-systems-inc.id-a1V8X000009KMxsUAG) ### AGC6490 Robot Board AGC6490 is a Single-SoC Multi-Purpose high-performance board based on the Qualcomm Dragonwing™ QCM/QCS6490 SoC, specifically designed for robots. lt features an 8-core CPU, boast of 12 TOPS computing power by dedicated NPU, powerful intelligent edge capabilities, includes various peripheral connectors like USB*8, UART*8, and fully meets the robot multi-sensor sensing and control module access requirements, and equipped with industrial connectors, suitable for outdoor scenarios. It offers flexible operating system choices, with the standard configuration being Android+Linux dual-system integration for parallel operation, while also capable of independently running Android or Linux operating systems. It can be applied to various high-performance and high-computing power robot scenarios, including indoor and outdoor delivery robots, service robots, cleaning robots, smart lawnmowers, and more. KEY FEATURES: - Dual-OS: Android + Linux running concurrently to serve Android and Linux use-cases with reduced hardware footprint - High performance: 12 TOPS dedicate NPU for AI and also strong CPU and GPU - Extremely rich peripheral interfaces: USB*8, UART*8, CAN, RS485, mini-PCIE By [CHENGDU APLUX INTELLIGENCE TECHNOLOGY, LTD.](https://www.qualcomm.com/support/partner/member-directory/member.chengdu-aplux-intelligence-technology-ltd) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) Type: Development Kits ### 5G Industrial IoT / Ruggedized Handhelds (QCM6490 Reference Design) Accelerate Your IoT Development with QCM6490 Reference Design. QCM6490 Reference Design offer, featuring: Planning Workshop: Collaborate with us to define project objectives, requirements, and timelines with QCM6490. Reference Design: Leverage our pre-developed design to save $1M in NRE fees. Maximize Your Benefits by partnering with us, you'll accelerate the development and innovation. We can design chip on board design with any Qualcomm's X (thin modem) or QCM line of 5G chipsets, do all pre-certification testing (FCC, CE, against carrier requirements) and help with the carrier certification process as needed. Contact us to learn more about our IoT Solutions on the Qualcomm platform and kickstart your project. Let's work together to bring your vision to life. Contact Vesa Korkala (Vesa.Korkala@sigmaconnectivity.com) KEY FEATURES: - QCM/QCS6490 Ref Design to build your product upon - Key design and build experiences with multiple Qualcomm® Chipsets By [SIGMA CONNECTIVITY](https://www.qualcomm.com/support/partner/member-directory/member.sigma-connectivity) Chipset: [QCM6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcm6490), [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490), [QCM5430](https://www.qualcomm.com/developer/software/android-on-dragonwing)... Type: Reference Design Platforms ### QCM6490 Reference Design GET YOUR IOT PROJECT GOING!We offer the Sigma Connectivity/ Qualcomm® QCM6490 IoT Kickstarter, which includes the following:Planning Workshop:In this workshop, we will collaborate with you to establish clear objectives, define requirements, and create a realistic timeline for your project.QCM6490 Reference Design:As part of this offer, you can leverage the QCM6490 reference design. By using this design, you can save significant costs, as there will be no prototyping licensing fees involved. This translates to potential savings of up to $1M or more.By taking advantage of our expertise and the resources provided through Sigma Connectivity' and Qualcomm Technologies' IoT Kick Starter Offer, you can accelerate the development of your 5G IoT solutions and maximize the benefits of digital transformation. KEY FEATURES: - Complete Ref Design to build your product upon - Prototype Licenses covered. - Key Design and build experiences with multiple Qualcomm® Chipsets By [SIGMA CONNECTIVITY](https://www.qualcomm.com/support/partner/member-directory/member.sigma-connectivity) Chipset: [QCM6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcm6490), [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490), [QCM5430](https://www.qualcomm.com/developer/software/android-on-dragonwing)... Type: Reference Design Platforms ### VVDN QCS 410 SOM VVVDN QCS 410 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications. KEY FEATURES: - High-performance IoT System-on-Chip (SoC) - Compact SOM size - Advanced ISP, machine learning, sensor processing, and voice control By [VVDN TECHNOLOGIES PRIVATE LIMITED](https://www.qualcomm.com/support/partner/member-directory/member.vvdn-technologies-private-limited) Chipset: [QCS410](https://www.qualcomm.com/internet-of-things/products/q4-series/qcs410) Type: System-on-Modules [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.vvdn-technologies-private-limited.id-a1V8X000006k9ypUAA) ### VVDN QCS 610 SOM VVVDN QCS 610 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications. KEY FEATURES: - Compact SOM Size - High-performance IoT System-on-Chip (SoC) By [VVDN TECHNOLOGIES PRIVATE LIMITED](https://www.qualcomm.com/support/partner/member-directory/member.vvdn-technologies-private-limited) Chipset: [QCS610](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs610) Type: System-on-Modules [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.vvdn-technologies-private-limited.id-a1V8X000006k9ykUAA) ### VVDN-QCS6490 SOM VVDN is designing, and developing SOM based on Qualcomm® QCS6490 SoC. The SOM supports rich interfaces for connectivity including Wi-Fi 6 (802.11ax) & Bluetooth 5.2 ® technology and other rich peripherals including 5X4 lane MIPI CSI for cameras, 4 lane MIPI DSI for display, USB3.1, USB 2.0, etc.The SOM provides rich hardware interfaces and software SDKs for building quick prototypes and validation. It is ideal for developing various industrial and commercial IoT applications including Digital Signage, Retail, Smart Warehousing, Service robots, Rugged Handheld, etc. By [VVDN TECHNOLOGIES PRIVATE LIMITED](https://www.qualcomm.com/support/partner/member-directory/member.vvdn-technologies-private-limited) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) Type: System-on-Modules ### Development Kit based on QCS610 This development kit is based on powerful Qualcomm® QCS610 SoC along with a carrier board developed by VVDN. The system is intended for connecting camera intelligence applications such as 180° dual-camera stitching, advanced tracking algorithms, video conferencing, etc. The development system can be used for intelligent video analytics applications including smart surveillance, retail, traffic, dashcams, robotics, automotive and more. KEY FEATURES: - Rich I/O Peripherals including USB3.0, USB2.0, MIPI CSI(x3), HDMI, etc - Multiple connectivity solutions such as Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0 - Compact SOM size By [VVDN TECHNOLOGIES PRIVATE LIMITED](https://www.qualcomm.com/support/partner/member-directory/member.vvdn-technologies-private-limited) Chipset: [QCS610](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs610) Type: Development Kits ### VVDN-QCS2290 SOM VVDN-QCS220 SOM, designed and developed by VVDN is based on the Qualcomm® QCS2290 platform. It comes with integrated Wi-Fi: IEEE 802.11 a/b/g/n/ac, Bluetooth 5.0, and FM via Qualcomm® WCN3950 chipset. The SOM supports rich I/O interfaces including MIPI-CSI, MIPI-DSI, USB, SD card, GPIO, JTAG, to connect LCD panels, and camera modules, for the development of vision intelligent IoT applications.The system on module offers tight system integration and optimization for superior performance and power management features make it the best to facilitate a cost-effective and efficient embedded system application including two-wheelers digital instrument cluster, body-worn camera, connected camera, digital signage, control panels/industrial panels, retail PoS, video doorbells, etc. By [VVDN TECHNOLOGIES PRIVATE LIMITED](https://www.qualcomm.com/support/partner/member-directory/member.vvdn-technologies-private-limited) Chipset: [QCS2290](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290) Type: System-on-Modules ### VVDN QCS8250 SoM QCS8250 SoM designed, and developed by VVDN is based on Qualcomm Technologies next-gen processor, the Qualcomm® QCS8250. The SoM can be used in the development of applications that require intelligent processing including connected cameras, video collaboration, retail self-checkout, AR/VR, health care, fleet management, digital signage and other AI applications on the edge. KEY FEATURES: - Qualcomm® QCS8250 processor - Integrated Wi-Fi – (IEEE802.11 b/g/n/ac/ax 2.4/5Ghz) + BLE V5.1 - Supports multiple rich interfaces for camera, connectivity, and display - Android 10 OS - Ultra-compact form factor By [VVDN TECHNOLOGIES PRIVATE LIMITED](https://www.qualcomm.com/support/partner/member-directory/member.vvdn-technologies-private-limited) Chipset: [QCS8250](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8250) Type: System-on-Modules [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.vvdn-technologies-private-limited.id-a1V8X000006NBOJUA4) ### QSC8250 Video Conference Development Kit QCS8250 Video Conference Development Kit comprises 1 Qualcomm® QCS8250 processor-based SoM, 1 carrier board, mic and 3 cameras By [AMTRAN TECHNOLOGY CO., LTD.](https://www.qualcomm.com/support/partner/member-directory/member.amtran-technology-co-ltd) Chipset: [QCS8250](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8250) Type: Development Kits ### VVDN QCS 8250 Development Kit Our QCS 8250 development kit is a powerful compact solution for edge computing applications. The QCS 8250 development kit comprises of SOM (based on Qualcomm® QCS8250 IoT Octa-core SoC) and a carrier board designed and developed by VVDN. The SOM provides multiple standard interfaces such as UART, I2C, SPI, configurable GPIOs, CAN, and USB 3.1. It can support multiple cameras with six 4-lane MIPI CSI and two 4-lane MIPI DSIThe system is intended for kickstarting the development of applications that requires intelligent processing including connected cameras, video collaboration, retail self-checkout, AR/VR, health care, fleet management, digital signage, and other AI applications on the edge. KEY FEATURES: - Qualcomm® QCS8250 processor - Powerful processing cores - Dedicated computer vision engine - Android 10-based OS By [VVDN TECHNOLOGIES PRIVATE LIMITED](https://www.qualcomm.com/support/partner/member-directory/member.vvdn-technologies-private-limited) Chipset: [QCS8250](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8250) Type: Development Kits ### QCS8250 Video Collaboration Reference Design by AmTRAN All-in-one video conference room reference designIntegrated cameras, microphones, speaker and HDMI input/outputs in one deviceWall mountable or place on tabletopCollaboration application runs on the device, no need for a separate PC to host the application.Designed for medium to large rooms, 4.5 – 5.0-meter range.Intelligent AI based features for video and audio.Qualcomm® AI Suite for Video CollaborationAI based automatic ePTZ for group framing, person framing and speaker framing to make video meetings more engaging.AI based noise suppression to eliminate audio distractions.Intelligent Acoustic Echo CancelationExcellent double-talk performanceClear voice pickup up to 5 metersReduces meeting room reverberation.3-4 microphone array KEY FEATURES: - Based on powerful Qualcomm® QCS8250 processorAndroid T, kernel 5.15Memory 8GB, storage 32GB4K Ultra HD video calling, 4 Microphone Array, 5 Meters Pickup RangeTested for Teams and Zoom pre-certification By [AMTRAN TECHNOLOGY CO., LTD.](https://www.qualcomm.com/support/partner/member-directory/member.amtran-technology-co-ltd) Chipset: [QCS8250](https://www.qualcomm.com/internet-of-things/products/q8-series/qcs8250) Type: Reference Design Platforms ### Atlantik Elektronik – QCS6490 Based Single Board Computer Atlantik Elektronik offers direct access to compact single board computers (SBCs) based on the Qualcomm Dragonwing™ QCS6490.Targeting Edge AI, computer vision, robotics, smart cameras, industrial IoT, and education, we offer the Thundercomm Rubik Pi 3: a versatile, Raspberry Pi–style SBC suitable for both prototyping and deployment in industrial environments.Available Dragonwing QCS6490 based SBC:Thundercomm Rubik Pi 3 – compact 100 × 75 mm SBC with broad I/O and ecosystem compatibility, designed for seamless integration into embedded systemsThe Rubik Pi 3 is available directly from Atlantik Elektronik, with optional technical support, software configuration, and long-term logistics services. KEY FEATURES: - Our Services: One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project. Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering. Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof. By [ATLANTIK ELEKTRONIK GMBH](https://www.qualcomm.com/support/partner/member-directory/member.atlantik-elektronik-gmbh) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) Type: Single-Board Computers ### Atlantik Elektronik – QCS6490 Development Kits Atlantik Elektronik provides access to a curated selection of development kits from leading manufacturers including Qualcomm Technologies, Thundercomm, and Quectel, covering official reference platforms and commercial-grade evaluation systems.Targeting Edge AI, computer vision, robotics, smart cameras, and industrial IoT, these kits are ideal for rapid prototyping, performance evaluation, and design-in of next-generation embedded systems.Available Development Kits:Qualcomm Dragonwing™ RB3 Gen2 (Core and Vision Kits)Thundercomm C6490P Development KitThundercomm C6490 Development KitThundercomm Rubik Pi 3 (Single Board Computer)Quectel SG560D Development KitAll listed kits are available directly from Atlantik Elektronik, with optional services for integration support, BSP and driver assistance, software pre-configuration, and supply logistics. KEY FEATURES: - Our Services: One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project. Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering. Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof. By [ATLANTIK ELEKTRONIK GMBH](https://www.qualcomm.com/support/partner/member-directory/member.atlantik-elektronik-gmbh) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) Type: Development Kits ### Atlantik Elektronik – QCS6490-Based System-on-Modules (SOMs) Atlantik Elektronik offers direct access to a wide range of Qualcomm Dragonwing™ QCS6490/QCM6490-based System-on-Modules (SOMs) from leading manufacturers such as Thundercomm, Lantronix, Silex, Wireless Mobility, and Quectel.Designed for Edge AI, computer vision, industrial IoT, and robotics, these SOMs provide scalable, production-ready solutions for high-performance embedded applications. Whether for prototyping or full product rollout, we support integration with technical expertise and long-term supply services.Available Dragonwing QCS6490/QCM6490 based SOMs:Thundercomm C6490P / C6490Lantronix OpenQ 6490CS (NDAA and TAA compliant)Silex EP-200QWireless Mobility SUD500Quectel SG560DAll SOMs are available directly from Atlantik Elektronik, with optional support for evaluation, software adaptation, integration, and logistics. KEY FEATURES: - Our Services: One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project. Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering. Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof. By [ATLANTIK ELEKTRONIK GMBH](https://www.qualcomm.com/support/partner/member-directory/member.atlantik-elektronik-gmbh) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) Type: System-on-Modules ### ROS610 The ROS610 DVK is built with SOM610 module which is based on Qualcomm® QCS610, which can support various input and output interface, which is suitable for various high-end consumer Robotics applications. KEY FEATURES: - . ROS610 DVK. ROS1 Melodic. ROS2 Foxy By [INSIGNAL CO., LTD.](https://www.qualcomm.com/support/partner/member-directory/member.insignal-co-ltd) Chipset: [QCS610](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs610) Type: Development Kits [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.insignal-co-ltd.id-a1V8X000009KbWVUA0) ### QCS610 Development board Versatile development kit based on Qualcomm® QCS610 SOC supporting MIPI DSI to HDMI/MIPI DSI to LVDS, DisplayPort to HDMI, MIPI CSI Samsung S5KGM1 12Mpixel(4K 30fps) camera module (Option), External I2S audio codec (ALC5633Q), USB 3.1, USB 2.0, 6-Axis sensor (BMI160), RGMII interface (KSZ9031 or KSZ9131), Micro SD connector for SD Card and GNSS antenna connector. By [INSIGNAL CO., LTD.](https://www.qualcomm.com/support/partner/member-directory/member.insignal-co-ltd) Chipset: [QCS610](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs610) Type: Development Kits [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.insignal-co-ltd.id-a1V6f00000ZX1k9EAD) ### QCS610 SoM 4057 Featuring visual Intelligence platform based on Qualcomm® QCS610 SoC with Qualcomm® Kryo(TM) 460 Octa-core (x2 gold 2.2 GHz and x6 silver 1.8 GHz) CPU, Qualcomm® Hexagon(TM) DSP with dual Hexagon Vector eXtensions (HVX) 1.1 GHz and Qualcomm® Adreno(TM) 612 845 MHz GPU. Integrates a powerful image signal processor (ISP) and the Qualcomm® Artificial Intelligence (AI) Engine, along with a heterogeneous computing architecture. Supports 4K Ultra HD HEVC/VP9 video. KEY FEATURES: - Targeting various applications:AI cameraFace ID SystemVehicle top signageHandheld computing deviceNavigation systemVision computing By [INSIGNAL CO., LTD.](https://www.qualcomm.com/support/partner/member-directory/member.insignal-co-ltd) Chipset: [QCS610](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs610) Type: System-on-Modules [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.insignal-co-ltd.id-a1V6f00000ZX1juEAD) ### Vision AI ODK (Open Development Kit) based on the Qualcomm QCS6490 Powered by the Qualcomm® QCS6490 SoC (System on Chip) featuring the Qualcomm® Vision Intelligence Platform, the QCS6490 Open Development Kit produced by Altek Corporation is the perfect reference design for AI applications in automotive or IoT.Coupling the Qualcomm® Artificial Intelligence Engine with Altek Corporation's industry expertise in camera and imaging, you will have the best-in-class visual quality for your product. This design will ensure that your product will be both competitive and compelling for all your needs. KEY FEATURES: - Dual Camera: Front and Cabin Sensors - Memory: LPDDR5 (4GB), eMMC (128GB) - Connectivity: 5G, WiFi, BT 5.2, GPS - Display: 3" Display - Video Out (MIPI DSI), Resolution 480 x 854 - Interfaces: USB Type C/3.1 - Storage: Micro SD card By [ALTEK CORPORATION](https://www.qualcomm.com/support/partner/member-directory/member.altek-corporation) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490) Type: Development Kits ### IPC610 Open Development Kit based on Qualcomm® QCS610 platform Powered by the Qualcomm® QCS610 processor (Qualcomm® Vision Intelligence Platform), the IPC610 ODK produced by Altek Corporation is the perfect reference design for the AIoT camera. Combining the Qualcomm® Artificial Intelligence Engine with Altek's industry expertise in imaging products, this is a best-in-class product for your edge computing needs. By [ALTEK CORPORATION](https://www.qualcomm.com/support/partner/member-directory/member.altek-corporation) Chipset: [QCS610](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs610) Type: Development Kits [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.altek-corporation.id-a1V6f00000WodxzEAB) ### QCS6490 Vision-AI Development Kit The QCS6490 Vision-AI Development Kit features an energy-efficient, multi-camera, SMARC 2.1.1 compute module, based on the Qualcomm® QCS6490. It includes high-performance components such as an 8-core Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, Qualcomm®Hexagon™ DSP with 6th gen Qualcomm®AI Engine (13 TOPS), Qualcomm Spectra™ 570L ISP (64MP/30fps), and Adreno 633 VPU (4K30/4K60). The kit offers integrated TPM, Wi-Fi/Bluetooth modules as assembly options, and an M.2 slot for NVME storage and advanced wireless options. Its 100 mm x 79 mm carrier board is compatible with similar AI developer boards, enable a drop. It ships with a Yocto-based Linux BSP and example AI/multi-camera applications, with additional OS options, including Windows 11 IoT Enterprise, available in 2H24. KEY FEATURES: - M.2 key-M + E, Gig Eth RJ45, 2x USB 3.1, 2x USB 2.0, 1x USB-C OTG - miniDP + MIPI-DSI, 4L and 2L MIPI-CSI, Audio Codec, - 40-Pin Pi-HAT header, 4-pin CAN header, 10-pin Test IO header By [TRIA](https://www.qualcomm.com/support/partner/member-directory/member.tria) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490), [QCS5430](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430) Type: Development Kits [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.tria.id-a1VQo000001koKbMAI) ### QCS6490 Starterkit MSC SM2-SK-QCS6490-EP1 The SMARC 2.0 Starterkit for SMARC modules with Qualcomm® QCS6490/QCS5430 processors are based on a Mini-ITX SMARC 2.0 carrier board MSC SM2-MB-EP1 and contains all necessary products to quickly enable the user to run and evaluate the QCS6490/QCS5430 module range. The kit does not contain a SMARC module in order to give the user greater flexibility as to which particular module version and CPU speed variant is desired.As part of the SMARC 2.0 Starterkit, the appropriate Heatsink/Heatspreader and a Flash SD Card with USB Reader will be supplied. A bootable Linux installation can be downloaded from the MSC Support website and uploaded via USB downloader tool into the UFS flash (which is part of the SMARC module). A power supply with cable kit is also included for convenience. KEY FEATURES: - Heatspreader - 12V power supply and cable kit included for immediate operation of the Starterkit - DP graphics output - LVDS graphics output - Getting Started manual - Optional TFT kits available By [TRIA](https://www.qualcomm.com/support/partner/member-directory/member.tria) Chipset: [QCS6490](https://www.qualcomm.com/internet-of-things/products/q6-series/qcs6490), [QCS5430](https://www.qualcomm.com/internet-of-things/products/q5-series/qcs5430) Type: Evaluation Boards [Buy Now](https://www.qualcomm.com/support/partner/member-directory/member.tria.id-a1VQo000001koIzMAI)