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KEY FEATURES:
- Quad core Arm Cortex-A78 up to 2.7GHz
- And Quad core Arm Cortex-A55 @ 1.95GHz
- Adreno 643 GPU @ 812MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 12(15) TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- Display up to FHD+144Hz
- Video up to 4k30(E)/4K60(D)
- 5xUSB 2.0, 2x USB 3.1
- 2x PCIe Gen3 x1, 1x PCIe Gen3 x2
- 1x MIPI-DSI or LVDS
- 1x DP 1.4 (2 lane) + 1x eDP/DP
- 4x MIPI-CSI Camera Interface
- WLAN/BT Wireless Module (option)
- 2x Gigabit Ethernet
- 2x I2S Audio Interface
- 4x UART, 2x SPI, 2x CAN2.0-FD
- 5x I²C
- HW Key manager and ECC, Secure boot, Crypto engines, etc.
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
KEY FEATURES:
- Quad core Arm Cortex-A78 up to 2.7GHz
- And Quad core Arm Cortex-A55 @ 1.95GHz
- Adreno 643 GPU @ 812MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 12(15) TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- Display up to FHD+144Hz
- Video up to 4k30(E)/4K60(D)
- 5xUSB 2.0, 2x USB 3.1
- 2x PCIe Gen3 x1, 1x PCIe Gen3 x2
- 1x MIPI-DSI or LVDS
- 1x DP 1.4 (2 lane) + 1x eDP/DP
- 4x MIPI-CSI Camera Interface
- WLAN/BT Wireless Module (option)
- 2x Gigabit Ethernet
- 2x I2S Audio Interface
- 4x UART, 2x SPI, 2x CAN2.0-FD
- 5x I²C
- HW Key manager and ECC, Secure boot, Crypto engines, etc.
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
KEY FEATURES:
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
- Dual core Arm Cortex-A78 up to 2.1GHz
- Adreno 642L GPU @ 315MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 3.5 TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- 4x MIPI-CSI Camera Interface
- Video up to 4k30(E)/4K30(D)
- 5xUSB 2.0, 2x USB 3.1
- 1x MIPI-DSI or LVDS
KEY FEATURES:
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
- Dual core Arm Cortex-A78 up to 2.1GHz
- Adreno 642L GPU @ 315MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 3.5 TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- 4x MIPI-CSI Camera Interface
- Video up to 4k30(E)/4K30(D)
- 5xUSB 2.0, 2x USB 3.1
- 1x MIPI-DSI or LVDS
KEY FEATURES:
- Robust computing power: Up to 12 TOPS, well-suited for most algorithm prototyping & inference applic
- Feature-rich interfaces: USB, Micro HDMI, ADC, audio, Ethernet, camera, PCIe , antenna, etc.
- Dual displays: DP and LCM or DP and Micro HDMI.
- Wireless connectivity: Wi-Fi 5, 802.11a/ b/ g/ n/ ac, delivering enhanced wireless connectivity.
- Multiple operating systems: Yocto Linux/ Debian/ Ubuntu.
- Extended temperature range: For harsh outdoor & industrial use; and withstand ambient temperatures f
- Diverse application scenarios: Edge computing, robotics, industrial automation, multimedia terminals
- High-performance 64-bit octa-core processor, delivering up to 12 TOPS of computing power
- 1 x A78 @ 2.7 GHz + 3 x A78 @ 2.4 GHz + 4 x A55 @ 1.9 GHz
- 32 KB L1I cache, 32 KB L1D cache and 512 KB L2 cache
- Adreno 643L @ 812 MHz
- 8 GB LPDDR4X + 128 GB UFS
- Yocto Linux/ Debian/ Ubuntu*
KEY FEATURES:
- Robust computing power: Up to 12 TOPS, well-suited for most algorithm prototyping & inference applic
- Feature-rich interfaces: USB, Micro HDMI, ADC, audio, Ethernet, camera, PCIe , antenna, etc.
- Dual displays: DP and LCM or DP and Micro HDMI.
- Wireless connectivity: Wi-Fi 5, 802.11a/ b/ g/ n/ ac, delivering enhanced wireless connectivity.
- Multiple operating systems: Yocto Linux/ Debian/ Ubuntu.
- Extended temperature range: For harsh outdoor & industrial use; and withstand ambient temperatures f
- Diverse application scenarios: Edge computing, robotics, industrial automation, multimedia terminals
- High-performance 64-bit octa-core processor, delivering up to 12 TOPS of computing power
- 1 x A78 @ 2.7 GHz + 3 x A78 @ 2.4 GHz + 4 x A55 @ 1.9 GHz
- 32 KB L1I cache, 32 KB L1D cache and 512 KB L2 cache
- Adreno 643L @ 812 MHz
- 8 GB LPDDR4X + 128 GB UFS
- Yocto Linux/ Debian/ Ubuntu*
KEY FEATURES:
- SMARC Compatible with Customizable Carrier Board
- Optimized for multi-camera edge AI deployments
- Supports Multiple AI Models (e.g. YOLO, MobileNet, SAM-HQ, PatchCore)
- Compatible with SNPE, QAIRT and Edge Impulse
KEY FEATURES:
- SMARC Compatible with Customizable Carrier Board
- Optimized for multi-camera edge AI deployments
- Supports Multiple AI Models (e.g. YOLO, MobileNet, SAM-HQ, PatchCore)
- Compatible with SNPE, QAIRT and Edge Impulse
KEY FEATURES:
- Ultra small form factor
- Integrated with Digital FM Technology
- Reference design for offroad vehicle telematics
- Reference design for field diagnostics device
- Reference design for two-wheeler device cluster
- Integrated LTE Cat 4 modem with Dual SIM (DSDS) support
- Azure/AWS cloud orchestration for device provisioning and management
KEY FEATURES:
- Ultra small form factor
- Integrated with Digital FM Technology
- Reference design for offroad vehicle telematics
- Reference design for field diagnostics device
- Reference design for two-wheeler device cluster
- Integrated LTE Cat 4 modem with Dual SIM (DSDS) support
- Azure/AWS cloud orchestration for device provisioning and management
KEY FEATURES:
- Production-ready system on module
- Expanded interfaces for industrial use cases
- Long-term support expected through July 2036 with the Critical Link Product Longevity Program
KEY FEATURES:
- Production-ready system on module
- Expanded interfaces for industrial use cases
- Long-term support expected through July 2036 with the Critical Link Product Longevity Program
KEY FEATURES:
- High Performance Qualcomm® 6nm QCS6490 SoC
- 8G / 128GB uMCP
- AI Performance: Up to 12 TOPS
- Five 4-lane MIPI-CSIs; 3x ISP@22MP, 2x IFE lite
- Support Wi-Fi 6E / BT, and GPS
- Supports Android, Linux, Ubuntu, Windows 11 IoT Enterprise
KEY FEATURES:
- High Performance Qualcomm® 6nm QCS6490 SoC
- 8G / 128GB uMCP
- AI Performance: Up to 12 TOPS
- Five 4-lane MIPI-CSIs; 3x ISP@22MP, 2x IFE lite
- Support Wi-Fi 6E / BT, and GPS
- Supports Android, Linux, Ubuntu, Windows 11 IoT Enterprise
KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- 4K ultra low light camera based on Sony Starvis IMX415 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- 4K ultra low light camera based on Sony Starvis IMX415 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
KEY FEATURES:
- Full-featured development kit for Critical Link's QCS6490 and QCS5430-based system on modules
- MitySOM system on modules are production-ready industrial solutions, designed for long term availability and performance
- Developers have access to dev board design files to jump start their own baseboard design, as well as lifetime access to Critical Link's wiki-based support as well as our US-based engineering support team
KEY FEATURES:
- Full-featured development kit for Critical Link's QCS6490 and QCS5430-based system on modules
- MitySOM system on modules are production-ready industrial solutions, designed for long term availability and performance
- Developers have access to dev board design files to jump start their own baseboard design, as well as lifetime access to Critical Link's wiki-based support as well as our US-based engineering support team
KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- Full HD ultra low light camera based on Sony Starvis IMX462 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- Full HD ultra low light camera based on Sony Starvis IMX462 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
KEY FEATURES:
- SagireEdge AI 600 SOM & open chassis carrier board powered by the Qualcomm Dragonwing™ QCS6490 SoCPreloaded with a Ubuntu Linux O/S
KEY FEATURES:
- SagireEdge AI 600 SOM & open chassis carrier board powered by the Qualcomm Dragonwing™ QCS6490 SoCPreloaded with a Ubuntu Linux O/S
KEY FEATURES:
- High AI processing performance of 12 TOPS, supports up to 8 Full HD cameras. Equipped with 4 USB-A 3.0 port, 1 USB-Type port, 1 SD card slot, and 1 Ethernet port (1 Gbps). 4G connectivity supported (optional). Compatible with multiple OS: Android, Ubuntu, and Linux.
KEY FEATURES:
- High AI processing performance of 12 TOPS, supports up to 8 Full HD cameras. Equipped with 4 USB-A 3.0 port, 1 USB-Type port, 1 SD card slot, and 1 Ethernet port (1 Gbps). 4G connectivity supported (optional). Compatible with multiple OS: Android, Ubuntu, and Linux.
KEY FEATURES:
- Ultra-compact size 40x47mm. Modular design with plug-and-play pins. Decodes video at 250 FPS FHD, AI processing at 12 TOPS. No maintenance, high stability. Supports AI model conversion & optimization. AI Hub with KIMQ-compatible models.
KEY FEATURES:
- Ultra-compact size 40x47mm. Modular design with plug-and-play pins. Decodes video at 250 FPS FHD, AI processing at 12 TOPS. No maintenance, high stability. Supports AI model conversion & optimization. AI Hub with KIMQ-compatible models.
KEY FEATURES:
- 8GB RAM/128GB UFS Flash in a µMCP packageExtensive range of I/O, including Ethernet, USB3.1, Wi-Fi 6E and BT 5.2, MIPI-CSI, eDP, CAN, and PCIe Extended temperature range
KEY FEATURES:
- 8GB RAM/128GB UFS Flash in a µMCP packageExtensive range of I/O, including Ethernet, USB3.1, Wi-Fi 6E and BT 5.2, MIPI-CSI, eDP, CAN, and PCIe Extended temperature range
KEY FEATURES:
- Dual-OS: Android + Linux running concurrently to serve Android and Linux use-cases with reduced hardware footprint
- High performance: 12 TOPS dedicate NPU for AI and also strong CPU and GPU
- Extremely rich peripheral interfaces: USB*8, UART*8, CAN, RS485, mini-PCIE
KEY FEATURES:
- Dual-OS: Android + Linux running concurrently to serve Android and Linux use-cases with reduced hardware footprint
- High performance: 12 TOPS dedicate NPU for AI and also strong CPU and GPU
- Extremely rich peripheral interfaces: USB*8, UART*8, CAN, RS485, mini-PCIE
KEY FEATURES:
- QCM/QCS6490 Ref Design to build your product upon
- Key design and build experiences with multiple Qualcomm® Chipsets
KEY FEATURES:
- QCM/QCS6490 Ref Design to build your product upon
- Key design and build experiences with multiple Qualcomm® Chipsets
KEY FEATURES:
- Complete Ref Design to build your product upon
- Prototype Licenses covered.
- Key Design and build experiences with multiple Qualcomm® Chipsets
KEY FEATURES:
- Complete Ref Design to build your product upon
- Prototype Licenses covered.
- Key Design and build experiences with multiple Qualcomm® Chipsets
KEY FEATURES:
- Rich I/O Peripherals including USB3.0, USB2.0, MIPI CSI(x3), HDMI, etc
- Multiple connectivity solutions such as Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0
- Compact SOM size
KEY FEATURES:
- Rich I/O Peripherals including USB3.0, USB2.0, MIPI CSI(x3), HDMI, etc
- Multiple connectivity solutions such as Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0
- Compact SOM size
KEY FEATURES:
- High-performance IoT System-on-Chip (SoC)
- Compact SOM size
- Advanced ISP, machine learning, sensor processing, and voice control
KEY FEATURES:
- High-performance IoT System-on-Chip (SoC)
- Compact SOM size
- Advanced ISP, machine learning, sensor processing, and voice control
KEY FEATURES:
- Compact SOM Size
- High-performance IoT System-on-Chip (SoC)
KEY FEATURES:
- Compact SOM Size
- High-performance IoT System-on-Chip (SoC)
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Powerful processing cores
- Dedicated computer vision engine
- Android 10-based OS
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Powerful processing cores
- Dedicated computer vision engine
- Android 10-based OS
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Integrated Wi-Fi – (IEEE802.11 b/g/n/ac/ax 2.4/5Ghz) + BLE V5.1
- Supports multiple rich interfaces for camera, connectivity, and display
- Android 10 OS
- Ultra-compact form factor
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Integrated Wi-Fi – (IEEE802.11 b/g/n/ac/ax 2.4/5Ghz) + BLE V5.1
- Supports multiple rich interfaces for camera, connectivity, and display
- Android 10 OS
- Ultra-compact form factor
KEY FEATURES:
- Based on powerful Qualcomm® QCS8250 processorAndroid T, kernel 5.15Memory 8GB, storage 32GB4K Ultra HD video calling, 4 Microphone Array, 5 Meters Pickup RangeTested for Teams and Zoom pre-certification
KEY FEATURES:
- Based on powerful Qualcomm® QCS8250 processorAndroid T, kernel 5.15Memory 8GB, storage 32GB4K Ultra HD video calling, 4 Microphone Array, 5 Meters Pickup RangeTested for Teams and Zoom pre-certification
KEY FEATURES:
- Cost-effective platforms for video conference, camera and handheld devices
- Rich interfaces and SDK
KEY FEATURES:
- Cost-effective platforms for video conference, camera and handheld devices
- Rich interfaces and SDK
KEY FEATURES:
- Small form factor Sysyem-On-Module
KEY FEATURES:
- Small form factor Sysyem-On-Module
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- . ROS610 DVK. ROS1 Melodic. ROS2 Foxy
KEY FEATURES:
- . ROS610 DVK. ROS1 Melodic. ROS2 Foxy
KEY FEATURES:
- Targeting various applications:AI cameraFace ID SystemVehicle top signageHandheld computing deviceNavigation systemVision computing
KEY FEATURES:
- Targeting various applications:AI cameraFace ID SystemVehicle top signageHandheld computing deviceNavigation systemVision computing
KEY FEATURES:
- Dual Camera: Front and Cabin Sensors
- Memory: LPDDR5 (4GB), eMMC (128GB)
- Connectivity: 5G, WiFi, BT 5.2, GPS
- Display: 3" Display
- Video Out (MIPI DSI), Resolution 480 x 854
- Interfaces: USB Type C/3.1
- Storage: Micro SD card
KEY FEATURES:
- Dual Camera: Front and Cabin Sensors
- Memory: LPDDR5 (4GB), eMMC (128GB)
- Connectivity: 5G, WiFi, BT 5.2, GPS
- Display: 3" Display
- Video Out (MIPI DSI), Resolution 480 x 854
- Interfaces: USB Type C/3.1
- Storage: Micro SD card
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1; Video up to 4K30
- Wi-Fi, Bluetooth, Ethernet
- Pre-built Linux
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1; Video up to 4K30
- Wi-Fi, Bluetooth, Ethernet
- Pre-built Linux
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ GPU, Adreno VPU, Adreno DPU and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- 8GB LPDDR5 and 128GB UFS; OS: Linux
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ GPU, Adreno VPU, Adreno DPU and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- 8GB LPDDR5 and 128GB UFS; OS: Linux
KEY FEATURES:
- Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, 633 VPU, 1075 DPU and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- 8GB LPDDR5 and 128GB UFS; OS: Android 13.0
KEY FEATURES:
- Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, 633 VPU, 1075 DPU and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- 8GB LPDDR5 and 128GB UFS; OS: Android 13.0
KEY FEATURES:
- Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU, and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- Running on Android 13
KEY FEATURES:
- Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU, and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- Running on Android 13
KEY FEATURES:
- Services to enable RAW, Bayer, or YUV sensors; ToF sensors
- Integration with all necessary camera firmware components; Camera firmware upgrades on-field; ONVIF compliance
- HDR enabling and improvement; Camera sensor tuning
KEY FEATURES:
- Services to enable RAW, Bayer, or YUV sensors; ToF sensors
- Integration with all necessary camera firmware components; Camera firmware upgrades on-field; ONVIF compliance
- HDR enabling and improvement; Camera sensor tuning
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and Bluetooth 5.0
- OS: Android 12, Kernel 4.19; Dimensions: 85mm x 54mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and Bluetooth 5.0
- OS: Android 12, Kernel 4.19; Dimensions: 85mm x 54mm
KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Android 12; Dimensions: 85mm x 54mm
KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Android 12; Dimensions: 85mm x 54mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0
- OS: Android 12; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0
- OS: Android 12; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT 5.1
- OS: Android 12; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT 5.1
- OS: Android 12; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1
- Pin and software compatible with Qualcomm® QCS410 processor
- Supports Linux
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1
- Pin and software compatible with Qualcomm® QCS410 processor
- Supports Linux
KEY FEATURES:
- Pin compatible and software compatible with Qualcomm® QCS610
- 4GB LPDDR4x and 16GB eMMC 5.1
- Supports Linux
KEY FEATURES:
- Pin compatible and software compatible with Qualcomm® QCS610
- 4GB LPDDR4x and 16GB eMMC 5.1
- Supports Linux
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1; Video up to 4K30
- Wi-Fi 802.11ac, BT 5.0, Ethernet/RGMII
- Pre-built Linux
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1; Video up to 4K30
- Wi-Fi 802.11ac, BT 5.0, Ethernet/RGMII
- Pre-built Linux
KEY FEATURES:
- Six 4-lane CSI; Two 4-lane MIPI DSI
- Wi-Fi 6, Bluetooth 5.1
- 170mm x 170mm
KEY FEATURES:
- Six 4-lane CSI; Two 4-lane MIPI DSI
- Wi-Fi 6, Bluetooth 5.1
- 170mm x 170mm
KEY FEATURES:
- Dimension: 59.7mm x 32.2
- 6 x 4-lane CSIs (4-Lane each); D-PHY & C-PHY (supported by design)
- DisplayPort 1.4 data concurrency over USB 3.1 Type-C
KEY FEATURES:
- Dimension: 59.7mm x 32.2
- 6 x 4-lane CSIs (4-Lane each); D-PHY & C-PHY (supported by design)
- DisplayPort 1.4 data concurrency over USB 3.1 Type-C
KEY FEATURES:
- M.2 key-M + E, Gig Eth RJ45, 2x USB 3.1, 2x USB 2.0, 1x USB-C OTG
- miniDP + MIPI-DSI, 4L and 2L MIPI-CSI, Audio Codec,
- 40-Pin Pi-HAT header, 4-pin CAN header, 10-pin Test IO header
KEY FEATURES:
- M.2 key-M + E, Gig Eth RJ45, 2x USB 3.1, 2x USB 2.0, 1x USB-C OTG
- miniDP + MIPI-DSI, 4L and 2L MIPI-CSI, Audio Codec,
- 40-Pin Pi-HAT header, 4-pin CAN header, 10-pin Test IO header
KEY FEATURES:
- Heatspreader
- 12V power supply and cable kit included for immediate operation of the Starterkit
- DP graphics output
- LVDS graphics output
- Getting Started manual
- Optional TFT kits available
KEY FEATURES:
- Heatspreader
- 12V power supply and cable kit included for immediate operation of the Starterkit
- DP graphics output
- LVDS graphics output
- Getting Started manual
- Optional TFT kits available
KEY FEATURES:
- Small form factor Single Board Computer
KEY FEATURES:
- Small form factor Single Board Computer
KEY FEATURES:
- Ultra-small form factor
KEY FEATURES:
- Ultra-small form factor
KEY FEATURES:
- Reference design for biometric authentication and access control
- Support for facial recognition
- Integrated Dual-NFC for use of Government IDs such as Passports and National IDs
KEY FEATURES:
- Reference design for biometric authentication and access control
- Support for facial recognition
- Integrated Dual-NFC for use of Government IDs such as Passports and National IDs
KEY FEATURES:
- First upstream version based on Qualcomm® QCS6490 platform for developers
- Compatible with Raspberry Pi accessories
- 12 Tops AI capability, Deploy 1.8B LLM
- C5430P/6490P/C8550 SOM are P2P compatible
- Minimalist design, affordable price
KEY FEATURES:
- First upstream version based on Qualcomm® QCS6490 platform for developers
- Compatible with Raspberry Pi accessories
- 12 Tops AI capability, Deploy 1.8B LLM
- C5430P/6490P/C8550 SOM are P2P compatible
- Minimalist design, affordable price
KEY FEATURES:
- SOM form-factor
- Artificial Intelligence at the edge
- Scalable solution, based on QCS6490
KEY FEATURES:
- SOM form-factor
- Artificial Intelligence at the edge
- Scalable solution, based on QCS6490
TurboX C865C SOM (System on Module) is a high-performance intelligent module based on Qualcomm® QCS8250 processor. It has integrated Android and the advanced 7nm Fin FET processor, a customized 64-bit Octa-core Qualcomm® Kryo™ 585 application processor.
TurboX C865C SOM supports wide-range Wi-Fi, Wi-Fi6 (Wi-Fi 802.11 a/b/g/n/ac/ax) . It supports one 4K@60FPS or two 4K@30FPS display, as well as multi-camera concurrency. It also integrates multiple audio and video input/output interfaces. TurboX C865C SOM provides a variety of GPIO, I2C, UART and SPI standard interfaces.
In addition, it supports four 4-lane MIPI-CSIs (D-PHY) and one 3-lane MIPI-CSI (C-PHY) together with SOM common standard protocol interfaces such as USB3.1, PCIE2.1/3.0 and I2S.
TurboX C865C SOM provides convenient and stable system solutions for IoT (Internet of Things) application. It can be embedded into devices including VR/AR, Robot, Smart Camera, AI devices, drones and medical devices.
KEY FEATURES:
- Qualcomm® Hexagon™ DSP with quad HVX
- Support one C-PHY Camera, up to 64MP sensor
- Long life cycle, up to 2028
- Support one 4K@60FPS or two 4K@30FPS display
- Wi-Fi 802.11a/b/g/n/ac/ax
TurboX C865C SOM (System on Module) is a high-performance intelligent module based on Qualcomm® QCS8250 processor. It has integrated Android and the advanced 7nm Fin FET processor, a customized 64-bit Octa-core Qualcomm® Kryo™ 585 application processor.
TurboX C865C SOM supports wide-range Wi-Fi, Wi-Fi6 (Wi-Fi 802.11 a/b/g/n/ac/ax) . It supports one 4K@60FPS or two 4K@30FPS display, as well as multi-camera concurrency. It also integrates multiple audio and video input/output interfaces. TurboX C865C SOM provides a variety of GPIO, I2C, UART and SPI standard interfaces.
In addition, it supports four 4-lane MIPI-CSIs (D-PHY) and one 3-lane MIPI-CSI (C-PHY) together with SOM common standard protocol interfaces such as USB3.1, PCIE2.1/3.0 and I2S.
TurboX C865C SOM provides convenient and stable system solutions for IoT (Internet of Things) application. It can be embedded into devices including VR/AR, Robot, Smart Camera, AI devices, drones and medical devices.
KEY FEATURES:
- Qualcomm® Hexagon™ DSP with quad HVX
- Support one C-PHY Camera, up to 64MP sensor
- Long life cycle, up to 2028
- Support one 4K@60FPS or two 4K@30FPS display
- Wi-Fi 802.11a/b/g/n/ac/ax
