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Atlantik Elektronik – QCS6490 System-on-Chip (SoC)
Atlantik Elektronik provides direct access to the Qualcomm Dragonwing™ QCS6490—an advanced, high-performance SoC built for demanding edge applications in AI, vision, and industrial systems.We support customers from early evaluation through integration and production, offering the Dragonwing QCS6490 as a standalone SoC as well as through ready-to-use modules, boards, and edge systems.Dragonwing QCS6490 SoC – high-performance edge AI processor with 8-core CPU, GPU, and 12.5 TOPS NPU, built for intelligent vision, robotics, and industrial IoT applications.The Dragonwing QCS6490 and its ecosystem are available directly from Atlantik Elektronik, including hardware access, design-in support, software integration, and logistics services.
Atlantik Elektronik – QCS6490-Based Edge AI Systems
Atlantik Elektronik provides access to production-ready AI computing systems based on the Qualcomm Dragonwing™ QCS6490 platform. These compact, industrial-grade solutions are designed for edge deployment in sectors such as manufacturing, retail, transportation, and smart city infrastructure.Focused on intelligent video processing, sensor fusion, AI inference, and robust industrial connectivity, these systems are ideal for real-world field use with demanding performance and reliability requirements.Available Dragonwing QCS6490 based Edge AI Systems:Thundercomm EB3G2 Edge AI Station – fanless, high-performance edge computing system for applications such as digital signage, smart manufacturing, surveillance, and computer vision analyticsDragonwing QCS6490 based Edge AI systems are available directly from Atlantik Elektronik, with optional support for system evaluation, integration, and deployment.
SECO Modular Vision 10.1 QCS6490
The SECO Modular Vision based on Qualcomm Dragonwing™  QCS6490 is a a ready-to-deploy HMI platform designed for next-generation industrial automation. Available in both 10.1-inch and 15.6-inch versions, it combines advanced computer vision, voice command processing, and intuitive user interaction in a single device, enabling smarter and more efficient factory operations.
Qualcomm® RB3 Gen 2 Development Kit (Core Kit)
The Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide

KEY FEATURES:

Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
ByQUALCOMM
Chipset
Type Development Board / Kit
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit)
The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.

KEY FEATURES:

Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
ByQUALCOMM
Chipset
Type Development Board / Kit
Open-Q 6490CS SOM Development Kit
The Open-Q™ 6490 Development Kit is designed to facilitate easy evaluation and development. The kit includes many standard sockets, enabling customers to choose from a wide range of third-party accessories. The SOM utilizes Qualcomm Technologies’ heterogeneous computing expertise to offer a system-on-chip with multiple specialized processing cores for powerful AI processing, image and graphics processing, and audio processing.

KEY FEATURES:

  • Standard M.2 sockets for evaluating Wi-Fi
  • TAA/NDAA Compliant
  • Android™ 13 and Qualcom Linux OSs
Open-Q 6490CS SOM
The Open-Q 6490CS provides flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as AI cameras, video collaboration, industrial handhelds, and video telematics. Based on Qualcomm Dragonwing™ QCS6490 processor, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution.

KEY FEATURES:

  • Multiple MIPI camera and display ports
  • Up to 8GB LPDDR5 RAM + 64GB eMMC
  • Android™ 13 and Qualcomm Linux
  • TAA/NDAA Compliant
CAM570
The CAM570 is a PTZ conferencing camera, with premium-grade features that enable users to deliver in-person meeting experiences to remote participants. The CAM570 features a 4K dual-lens camera with 36X total zoom and an AI lens with 95-degree FOV. AVer’s beamforming technology guides the PTZ camera to focus on the most relevant activity in a meeting, meanwhile eliminating unnecessary audio with mouth and human voice detection. The CAM570 includes three pairs of built-in voice sensors with beamforming technology and two 4K lenses to track speakers up to 10 meters away. The CAM570 is Zoom and Microsoft Teams certified and works seamlessly with Google Meet and other video conferencing platforms.
VB350
Elevate your video conferencing experience with the VB350, the premium version of all-in-one solutions. Boasting a sleek, streamlined design, dual 4K lenses for crystal-clear visuals, seamless lens switching, enhanced audio technology, and effortless setup, it's the perfect choice for transforming your mid-to-large conference rooms into premium audio and video hubs. Make the leap to next-level video meetings with the VB350 and unlock a new era of meeting equity, productivity, and engagement.
Open-Q 2290CS™ System-in-Package (SIP)
The Open-Q™ 2290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QCS2290, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.

KEY FEATURES:

  • Entry-tier solution delivers greater performance, graphic, and camera capabilities
  • Secure compute platform
  • Improved power performance
Open-Q 4290CS™ System-in-Package (SIP)
The Open-Q™ 4290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QCS4290 chipset utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4290 SIP creates the perfect computing core for a variety of edge AI video analytic applications.

KEY FEATURES:

  • Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
  • 3rd generation Qualcomm® AI Engine
  • Vivid graphics with Qualcomm® Adreno™ 610 GPU
  • Multiple high speed connectivity options
  • Up to 6GB LPDDR4 and 256GB eMMC
  • Long term support with extended life hardware and software support through 2027
Open-Q™ 8250CS Module/SoM with Qualcomm® QCS8250
The Open-Q™ 8250CS production ready computing SOM delivered with Android™ 13 supports multiple concurrent decode+encode sessions, live tuning for cameras (not customer facing), 2A sync for 2 cameras, UVC/UAC source mode for video collaboration bars to function as a USB class device, low-latency MS codecs and MS Teams video extensions with a roadmap to include background blur and replacement, an AI director framework to track and zoom a camera onto the person speaking and QSAT for smooth zoom.

KEY FEATURES:

  • Long life IIoT chipset
  • 8GB LPDDR5 RAM + 128GB UFS Flash
  • Android™ 13
  • On-device AI Engine up to 15 TOPS
  • Dedicated Computer Vision Engine
  • Multiple MIPI camera and display ports
  • Multiple high speed connectivity options
  • Ultra-compact 50 x 29 mm form factor
Open-Q AL Development Kit (4290 & 2290 Series)
The Open-Q™ AL development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4290 and 2290 SIP families based on the Qualcomm® QCS4290 processor (Android).

KEY FEATURES:

  • Development kit provides interfaces to evaluate camera and video
  • Evaluate display on LCD & HDMI
  • Supports many robotic features
Open-Q™ 610 μSOM
Lantronix’s Open-Q™ 610 μSOM is an ultra-compact (50mm x 25mm) production-ready SOM based on the Qualcomm® QCS610 SOC, with built-in Qualcomm® Neural Processing Engine for on-device edge AI capabilities. Aimed at connected visual intelligence applications, with built-in image sensor processing such as staggered HDR, lens de-warp, dual camera stitching, and image de-fog, the 610 μSOM is the ideal platform for your next smart camera product. Full-featured companion development kit also available.

KEY FEATURES:

  • SoC 11nm technology for high performance with low power
  • On-device artificial intelligence & machine learning
  • Native Ethernet interface for high speed connectivity
  • Three camera ports for multi-camera systems
  • Yocto Linux or Android 12 with connected camera SDK
  • RTSP streaming support with GStreamer
  • Multiple options for AI inference engines
5G Industrial IoT / Ruggedized Handhelds (QCM6490 Reference Design)
Accelerate Your IoT Development with QCM6490 Reference Design. QCM6490 Reference Design offer, featuring: Planning Workshop: Collaborate with us to define project objectives, requirements, and timelines with QCM6490. Reference Design: Leverage our pre-developed design to save $1M in NRE fees. Maximize Your Benefits by partnering with us, you'll accelerate the development and innovation. We can design chip on board design with any Qualcomm's X (thin modem) or QCM line of 5G chipsets, do all pre-certification testing (FCC, CE, against carrier requirements) and help with the carrier certification process as needed. Contact us to learn more about our IoT Solutions on the Qualcomm platform and kickstart your project. Let's work together to bring your vision to life. Contact Vesa Korkala (Vesa.Korkala@sigmaconnectivity.com)

KEY FEATURES:

  • QCM/QCS6490 Ref Design to build your product upon
  • Key design and build experiences with multiple Qualcomm® Chipsets
QCM6490 Reference Design
GET YOUR IOT PROJECT GOING!We offer the Sigma Connectivity/ Qualcomm® QCM6490 IoT Kickstarter, which includes the following:Planning Workshop:In this workshop, we will collaborate with you to establish clear objectives, define requirements, and create a realistic timeline for your project.QCM6490 Reference Design:As part of this offer, you can leverage the QCM6490 reference design. By using this design, you can save significant costs, as there will be no prototyping licensing fees involved. This translates to potential savings of up to $1M or more.By taking advantage of our expertise and the resources provided through Sigma Connectivity’ and Qualcomm Technologies' IoT Kick Starter Offer, you can accelerate the development of your 5G IoT solutions and maximize the benefits of digital transformation.

KEY FEATURES:

  • Complete Ref Design to build your product upon
  • Prototype Licenses covered.
  • Key Design and build experiences with multiple Qualcomm® Chipsets
VVDN QCS 410 SOM
VVVDN QCS 410 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.

KEY FEATURES:

  • High-performance IoT System-on-Chip (SoC)
  • Compact SOM size
  • Advanced ISP, machine learning, sensor processing, and voice control
VVDN QCS 610 SOM
VVVDN QCS 610 SOM is a compact and powerful solution based on Qualcomm® QCS610 SoC, Qualcomm® Kryo™ 460 CPU, and Qualcomm® Adreno™ GPU 612 for advanced visual intelligence applications. The module offers multiple connectivity options with integrated Wi-Fi and Bluetooth 5.0. The SOM is intended for connecting various computer vision applications.

KEY FEATURES:

  • Compact SOM Size
  • High-performance IoT System-on-Chip (SoC)