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KEY FEATURES:
- Quad core Arm Cortex-A78 up to 2.7GHz
- And Quad core Arm Cortex-A55 @ 1.95GHz
- Adreno 643 GPU @ 812MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 12(15) TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- Display up to FHD+144Hz
- Video up to 4k30(E)/4K60(D)
- 5xUSB 2.0, 2x USB 3.1
- 2x PCIe Gen3 x1, 1x PCIe Gen3 x2
- 1x MIPI-DSI or LVDS
- 1x DP 1.4 (2 lane) + 1x eDP/DP
- 4x MIPI-CSI Camera Interface
- WLAN/BT Wireless Module (option)
- 2x Gigabit Ethernet
- 2x I2S Audio Interface
- 4x UART, 2x SPI, 2x CAN2.0-FD
- 5x I²C
- HW Key manager and ECC, Secure boot, Crypto engines, etc.
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
KEY FEATURES:
- Quad core Arm Cortex-A78 up to 2.7GHz
- And Quad core Arm Cortex-A55 @ 1.95GHz
- Adreno 643 GPU @ 812MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 12(15) TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- Display up to FHD+144Hz
- Video up to 4k30(E)/4K60(D)
- 5xUSB 2.0, 2x USB 3.1
- 2x PCIe Gen3 x1, 1x PCIe Gen3 x2
- 1x MIPI-DSI or LVDS
- 1x DP 1.4 (2 lane) + 1x eDP/DP
- 4x MIPI-CSI Camera Interface
- WLAN/BT Wireless Module (option)
- 2x Gigabit Ethernet
- 2x I2S Audio Interface
- 4x UART, 2x SPI, 2x CAN2.0-FD
- 5x I²C
- HW Key manager and ECC, Secure boot, Crypto engines, etc.
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
KEY FEATURES:
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
- Dual core Arm Cortex-A78 up to 2.1GHz
- Adreno 642L GPU @ 315MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 3.5 TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- 4x MIPI-CSI Camera Interface
- Video up to 4k30(E)/4K30(D)
- 5xUSB 2.0, 2x USB 3.1
- 1x MIPI-DSI or LVDS
KEY FEATURES:
- Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
- Dual core Arm Cortex-A78 up to 2.1GHz
- Adreno 642L GPU @ 315MHz
- AI DSP/NSP Dual HVX, 4K HMX up to 3.5 TOPs
- Up to 16GB LPDDR5 SDRAM 6400MT/s
- Up to 1TB UFS Flash
- 4x MIPI-CSI Camera Interface
- Video up to 4k30(E)/4K30(D)
- 5xUSB 2.0, 2x USB 3.1
- 1x MIPI-DSI or LVDS
KEY FEATURES:
- Robust computing power: Up to 12 TOPS, well-suited for most algorithm prototyping & inference applic
- Feature-rich interfaces: USB, Micro HDMI, ADC, audio, Ethernet, camera, PCIe , antenna, etc.
- Dual displays: DP and LCM or DP and Micro HDMI.
- Wireless connectivity: Wi-Fi 5, 802.11a/ b/ g/ n/ ac, delivering enhanced wireless connectivity.
- Multiple operating systems: Yocto Linux/ Debian/ Ubuntu.
- Extended temperature range: For harsh outdoor & industrial use; and withstand ambient temperatures f
- Diverse application scenarios: Edge computing, robotics, industrial automation, multimedia terminals
- High-performance 64-bit octa-core processor, delivering up to 12 TOPS of computing power
- 1 x A78 @ 2.7 GHz + 3 x A78 @ 2.4 GHz + 4 x A55 @ 1.9 GHz
- 32 KB L1I cache, 32 KB L1D cache and 512 KB L2 cache
- Adreno 643L @ 812 MHz
- 8 GB LPDDR4X + 128 GB UFS
- Yocto Linux/ Debian/ Ubuntu*
KEY FEATURES:
- Robust computing power: Up to 12 TOPS, well-suited for most algorithm prototyping & inference applic
- Feature-rich interfaces: USB, Micro HDMI, ADC, audio, Ethernet, camera, PCIe , antenna, etc.
- Dual displays: DP and LCM or DP and Micro HDMI.
- Wireless connectivity: Wi-Fi 5, 802.11a/ b/ g/ n/ ac, delivering enhanced wireless connectivity.
- Multiple operating systems: Yocto Linux/ Debian/ Ubuntu.
- Extended temperature range: For harsh outdoor & industrial use; and withstand ambient temperatures f
- Diverse application scenarios: Edge computing, robotics, industrial automation, multimedia terminals
- High-performance 64-bit octa-core processor, delivering up to 12 TOPS of computing power
- 1 x A78 @ 2.7 GHz + 3 x A78 @ 2.4 GHz + 4 x A55 @ 1.9 GHz
- 32 KB L1I cache, 32 KB L1D cache and 512 KB L2 cache
- Adreno 643L @ 812 MHz
- 8 GB LPDDR4X + 128 GB UFS
- Yocto Linux/ Debian/ Ubuntu*
KEY FEATURES:
- SMARC Compatible with Customizable Carrier Board
- Optimized for multi-camera edge AI deployments
- Supports Multiple AI Models (e.g. YOLO, MobileNet, SAM-HQ, PatchCore)
- Compatible with SNPE, QAIRT and Edge Impulse
KEY FEATURES:
- SMARC Compatible with Customizable Carrier Board
- Optimized for multi-camera edge AI deployments
- Supports Multiple AI Models (e.g. YOLO, MobileNet, SAM-HQ, PatchCore)
- Compatible with SNPE, QAIRT and Edge Impulse
KEY FEATURES:
- Ultra small form factor
- Integrated with Digital FM Technology
- Reference design for offroad vehicle telematics
- Reference design for field diagnostics device
- Reference design for two-wheeler device cluster
- Integrated LTE Cat 4 modem with Dual SIM (DSDS) support
- Azure/AWS cloud orchestration for device provisioning and management
KEY FEATURES:
- Ultra small form factor
- Integrated with Digital FM Technology
- Reference design for offroad vehicle telematics
- Reference design for field diagnostics device
- Reference design for two-wheeler device cluster
- Integrated LTE Cat 4 modem with Dual SIM (DSDS) support
- Azure/AWS cloud orchestration for device provisioning and management
KEY FEATURES:
- Production-ready system on module
- Expanded interfaces for industrial use cases
- Long-term support expected through July 2036 with the Critical Link Product Longevity Program
KEY FEATURES:
- Production-ready system on module
- Expanded interfaces for industrial use cases
- Long-term support expected through July 2036 with the Critical Link Product Longevity Program
KEY FEATURES:
- High Performance Qualcomm® 6nm QCS6490 SoC
- 8G / 128GB uMCP
- AI Performance: Up to 12 TOPS
- Five 4-lane MIPI-CSIs; 3x ISP@22MP, 2x IFE lite
- Support Wi-Fi 6E / BT, and GPS
- Supports Android, Linux, Ubuntu, Windows 11 IoT Enterprise
KEY FEATURES:
- High Performance Qualcomm® 6nm QCS6490 SoC
- 8G / 128GB uMCP
- AI Performance: Up to 12 TOPS
- Five 4-lane MIPI-CSIs; 3x ISP@22MP, 2x IFE lite
- Support Wi-Fi 6E / BT, and GPS
- Supports Android, Linux, Ubuntu, Windows 11 IoT Enterprise
KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- 4K ultra low light camera based on Sony Starvis IMX415 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- 4K ultra low light camera based on Sony Starvis IMX415 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
KEY FEATURES:
- Full-featured development kit for Critical Link's QCS6490 and QCS5430-based system on modules
- MitySOM system on modules are production-ready industrial solutions, designed for long term availability and performance
- Developers have access to dev board design files to jump start their own baseboard design, as well as lifetime access to Critical Link's wiki-based support as well as our US-based engineering support team
KEY FEATURES:
- Full-featured development kit for Critical Link's QCS6490 and QCS5430-based system on modules
- MitySOM system on modules are production-ready industrial solutions, designed for long term availability and performance
- Developers have access to dev board design files to jump start their own baseboard design, as well as lifetime access to Critical Link's wiki-based support as well as our US-based engineering support team
KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- Full HD ultra low light camera based on Sony Starvis IMX462 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- Full HD ultra low light camera based on Sony Starvis IMX462 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
KEY FEATURES:
- SagireEdge AI 600 SOM & open chassis carrier board powered by the Qualcomm Dragonwing™ QCS6490 SoCPreloaded with a Ubuntu Linux O/S
KEY FEATURES:
- SagireEdge AI 600 SOM & open chassis carrier board powered by the Qualcomm Dragonwing™ QCS6490 SoCPreloaded with a Ubuntu Linux O/S
KEY FEATURES:
- High AI processing performance of 12 TOPS, supports up to 8 Full HD cameras. Equipped with 4 USB-A 3.0 port, 1 USB-Type port, 1 SD card slot, and 1 Ethernet port (1 Gbps). 4G connectivity supported (optional). Compatible with multiple OS: Android, Ubuntu, and Linux.
KEY FEATURES:
- High AI processing performance of 12 TOPS, supports up to 8 Full HD cameras. Equipped with 4 USB-A 3.0 port, 1 USB-Type port, 1 SD card slot, and 1 Ethernet port (1 Gbps). 4G connectivity supported (optional). Compatible with multiple OS: Android, Ubuntu, and Linux.
KEY FEATURES:
- Ultra-compact size 40x47mm. Modular design with plug-and-play pins. Decodes video at 250 FPS FHD, AI processing at 12 TOPS. No maintenance, high stability. Supports AI model conversion & optimization. AI Hub with KIMQ-compatible models.
KEY FEATURES:
- Ultra-compact size 40x47mm. Modular design with plug-and-play pins. Decodes video at 250 FPS FHD, AI processing at 12 TOPS. No maintenance, high stability. Supports AI model conversion & optimization. AI Hub with KIMQ-compatible models.
KEY FEATURES:
- 8GB RAM/128GB UFS Flash in a µMCP packageExtensive range of I/O, including Ethernet, USB3.1, Wi-Fi 6E and BT 5.2, MIPI-CSI, eDP, CAN, and PCIe Extended temperature range
KEY FEATURES:
- 8GB RAM/128GB UFS Flash in a µMCP packageExtensive range of I/O, including Ethernet, USB3.1, Wi-Fi 6E and BT 5.2, MIPI-CSI, eDP, CAN, and PCIe Extended temperature range
KEY FEATURES:
- Dual-OS: Android + Linux running concurrently to serve Android and Linux use-cases with reduced hardware footprint
- High performance: 12 TOPS dedicate NPU for AI and also strong CPU and GPU
- Extremely rich peripheral interfaces: USB*8, UART*8, CAN, RS485, mini-PCIE
KEY FEATURES:
- Dual-OS: Android + Linux running concurrently to serve Android and Linux use-cases with reduced hardware footprint
- High performance: 12 TOPS dedicate NPU for AI and also strong CPU and GPU
- Extremely rich peripheral interfaces: USB*8, UART*8, CAN, RS485, mini-PCIE
KEY FEATURES:
- QCM/QCS6490 Ref Design to build your product upon
- Key design and build experiences with multiple Qualcomm® Chipsets
KEY FEATURES:
- QCM/QCS6490 Ref Design to build your product upon
- Key design and build experiences with multiple Qualcomm® Chipsets
KEY FEATURES:
- Complete Ref Design to build your product upon
- Prototype Licenses covered.
- Key Design and build experiences with multiple Qualcomm® Chipsets
KEY FEATURES:
- Complete Ref Design to build your product upon
- Prototype Licenses covered.
- Key Design and build experiences with multiple Qualcomm® Chipsets
KEY FEATURES:
- Rich I/O Peripherals including USB3.0, USB2.0, MIPI CSI(x3), HDMI, etc
- Multiple connectivity solutions such as Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0
- Compact SOM size
KEY FEATURES:
- Rich I/O Peripherals including USB3.0, USB2.0, MIPI CSI(x3), HDMI, etc
- Multiple connectivity solutions such as Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0
- Compact SOM size
KEY FEATURES:
- High-performance IoT System-on-Chip (SoC)
- Compact SOM size
- Advanced ISP, machine learning, sensor processing, and voice control
KEY FEATURES:
- High-performance IoT System-on-Chip (SoC)
- Compact SOM size
- Advanced ISP, machine learning, sensor processing, and voice control
KEY FEATURES:
- Compact SOM Size
- High-performance IoT System-on-Chip (SoC)
KEY FEATURES:
- Compact SOM Size
- High-performance IoT System-on-Chip (SoC)
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Powerful processing cores
- Dedicated computer vision engine
- Android 10-based OS
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Powerful processing cores
- Dedicated computer vision engine
- Android 10-based OS
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Integrated Wi-Fi – (IEEE802.11 b/g/n/ac/ax 2.4/5Ghz) + BLE V5.1
- Supports multiple rich interfaces for camera, connectivity, and display
- Android 10 OS
- Ultra-compact form factor
KEY FEATURES:
- Qualcomm® QCS8250 processor
- Integrated Wi-Fi – (IEEE802.11 b/g/n/ac/ax 2.4/5Ghz) + BLE V5.1
- Supports multiple rich interfaces for camera, connectivity, and display
- Android 10 OS
- Ultra-compact form factor
KEY FEATURES:
- Based on powerful Qualcomm® QCS8250 processorAndroid T, kernel 5.15Memory 8GB, storage 32GB4K Ultra HD video calling, 4 Microphone Array, 5 Meters Pickup RangeTested for Teams and Zoom pre-certification
KEY FEATURES:
- Based on powerful Qualcomm® QCS8250 processorAndroid T, kernel 5.15Memory 8GB, storage 32GB4K Ultra HD video calling, 4 Microphone Array, 5 Meters Pickup RangeTested for Teams and Zoom pre-certification
KEY FEATURES:
- Cost-effective platforms for video conference, camera and handheld devices
- Rich interfaces and SDK
KEY FEATURES:
- Cost-effective platforms for video conference, camera and handheld devices
- Rich interfaces and SDK
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- Our Services:· One contact & one contract: Atlantik Elektronik acts as the single point of contact for your entire project.· Complete solution from one source:We provide hardware, software, logistics, project management, and technical support—bundled into one efficient offering.· Efficient partner integration:We coordinate leading SoM partners (e.g. Qualcomm Technologies, Thundercomm, Lantronix, Quectel), ODMs (mechanical design, assembly), and third parties (HW/SW development, UI/UX, testing, certification) under one roof.
KEY FEATURES:
- . ROS610 DVK. ROS1 Melodic. ROS2 Foxy
KEY FEATURES:
- . ROS610 DVK. ROS1 Melodic. ROS2 Foxy
KEY FEATURES:
- Targeting various applications:AI cameraFace ID SystemVehicle top signageHandheld computing deviceNavigation systemVision computing
KEY FEATURES:
- Targeting various applications:AI cameraFace ID SystemVehicle top signageHandheld computing deviceNavigation systemVision computing
KEY FEATURES:
- Dual Camera: Front and Cabin Sensors
- Memory: LPDDR5 (4GB), eMMC (128GB)
- Connectivity: 5G, WiFi, BT 5.2, GPS
- Display: 3" Display
- Video Out (MIPI DSI), Resolution 480 x 854
- Interfaces: USB Type C/3.1
- Storage: Micro SD card
KEY FEATURES:
- Dual Camera: Front and Cabin Sensors
- Memory: LPDDR5 (4GB), eMMC (128GB)
- Connectivity: 5G, WiFi, BT 5.2, GPS
- Display: 3" Display
- Video Out (MIPI DSI), Resolution 480 x 854
- Interfaces: USB Type C/3.1
- Storage: Micro SD card
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1; Video up to 4K30
- Wi-Fi, Bluetooth, Ethernet
- Pre-built Linux
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1; Video up to 4K30
- Wi-Fi, Bluetooth, Ethernet
- Pre-built Linux
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ GPU, Adreno VPU, Adreno DPU and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- 8GB LPDDR5 and 128GB UFS; OS: Linux
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ GPU, Adreno VPU, Adreno DPU and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- 8GB LPDDR5 and 128GB UFS; OS: Linux
KEY FEATURES:
- Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, 633 VPU, 1075 DPU and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- 8GB LPDDR5 and 128GB UFS; OS: Android 13.0
KEY FEATURES:
- Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, 633 VPU, 1075 DPU and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- 8GB LPDDR5 and 128GB UFS; OS: Android 13.0
KEY FEATURES:
- Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU, and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- Running on Android 13
KEY FEATURES:
- Qualcomm® Kryo™ 670 CPU, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU, and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- Running on Android 13
KEY FEATURES:
- Services to enable RAW, Bayer, or YUV sensors; ToF sensors
- Integration with all necessary camera firmware components; Camera firmware upgrades on-field; ONVIF compliance
- HDR enabling and improvement; Camera sensor tuning
KEY FEATURES:
- Services to enable RAW, Bayer, or YUV sensors; ToF sensors
- Integration with all necessary camera firmware components; Camera firmware upgrades on-field; ONVIF compliance
- HDR enabling and improvement; Camera sensor tuning
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and Bluetooth 5.0
- OS: Android 12, Kernel 4.19; Dimensions: 85mm x 54mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and Bluetooth 5.0
- OS: Android 12, Kernel 4.19; Dimensions: 85mm x 54mm
KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Android 12; Dimensions: 85mm x 54mm
KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.1
- OS: Android 12; Dimensions: 85mm x 54mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0
- OS: Android 12; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0
- OS: Android 12; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT 5.1
- OS: Android 12; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- Qualcomm® Kyro™ 260 CPU, 64-bit, Octa-core; Qualcomm® Hexagon™ DSP; Qualcomm® Adreno™ GPU 610; Qualcomm Spectra™ 340T ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; WCD9370 audio codec; WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and BT 5.1
- OS: Android 12; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1
- Pin and software compatible with Qualcomm® QCS410 processor
- Supports Linux
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1
- Pin and software compatible with Qualcomm® QCS410 processor
- Supports Linux
KEY FEATURES:
- Pin compatible and software compatible with Qualcomm® QCS610
- 4GB LPDDR4x and 16GB eMMC 5.1
- Supports Linux
KEY FEATURES:
- Pin compatible and software compatible with Qualcomm® QCS610
- 4GB LPDDR4x and 16GB eMMC 5.1
- Supports Linux
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1; Video up to 4K30
- Wi-Fi 802.11ac, BT 5.0, Ethernet/RGMII
- Pre-built Linux
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1; Video up to 4K30
- Wi-Fi 802.11ac, BT 5.0, Ethernet/RGMII
- Pre-built Linux
KEY FEATURES:
- Six 4-lane CSI; Two 4-lane MIPI DSI
- Wi-Fi 6, Bluetooth 5.1
- 170mm x 170mm
KEY FEATURES:
- Six 4-lane CSI; Two 4-lane MIPI DSI
- Wi-Fi 6, Bluetooth 5.1
- 170mm x 170mm
KEY FEATURES:
- Dimension: 59.7mm x 32.2
- 6 x 4-lane CSIs (4-Lane each); D-PHY & C-PHY (supported by design)
- DisplayPort 1.4 data concurrency over USB 3.1 Type-C
KEY FEATURES:
- Dimension: 59.7mm x 32.2
- 6 x 4-lane CSIs (4-Lane each); D-PHY & C-PHY (supported by design)
- DisplayPort 1.4 data concurrency over USB 3.1 Type-C
KEY FEATURES:
- M.2 key-M + E, Gig Eth RJ45, 2x USB 3.1, 2x USB 2.0, 1x USB-C OTG
- miniDP + MIPI-DSI, 4L and 2L MIPI-CSI, Audio Codec,
- 40-Pin Pi-HAT header, 4-pin CAN header, 10-pin Test IO header
KEY FEATURES:
- M.2 key-M + E, Gig Eth RJ45, 2x USB 3.1, 2x USB 2.0, 1x USB-C OTG
- miniDP + MIPI-DSI, 4L and 2L MIPI-CSI, Audio Codec,
- 40-Pin Pi-HAT header, 4-pin CAN header, 10-pin Test IO header
KEY FEATURES:
- Heatspreader
- 12V power supply and cable kit included for immediate operation of the Starterkit
- DP graphics output
- LVDS graphics output
- Getting Started manual
- Optional TFT kits available
KEY FEATURES:
- Heatspreader
- 12V power supply and cable kit included for immediate operation of the Starterkit
- DP graphics output
- LVDS graphics output
- Getting Started manual
- Optional TFT kits available
KEY FEATURES:
- Small form factor Single Board Computer
KEY FEATURES:
- Small form factor Single Board Computer
KEY FEATURES:
- Reference design for biometric authentication and access control
- Support for facial recognition
- Integrated Dual-NFC for use of Government IDs such as Passports and National IDs
KEY FEATURES:
- Reference design for biometric authentication and access control
- Support for facial recognition
- Integrated Dual-NFC for use of Government IDs such as Passports and National IDs
KEY FEATURES:
- First upstream version based on Qualcomm® QCS6490 platform for developers
- Compatible with Raspberry Pi accessories
- 12 Tops AI capability, Deploy 1.8B LLM
- C5430P/6490P/C8550 SOM are P2P compatible
- Minimalist design, affordable price
KEY FEATURES:
- First upstream version based on Qualcomm® QCS6490 platform for developers
- Compatible with Raspberry Pi accessories
- 12 Tops AI capability, Deploy 1.8B LLM
- C5430P/6490P/C8550 SOM are P2P compatible
- Minimalist design, affordable price
KEY FEATURES:
- SOM form-factor
- Artificial Intelligence at the edge
- Scalable solution, based on QCS6490
KEY FEATURES:
- SOM form-factor
- Artificial Intelligence at the edge
- Scalable solution, based on QCS6490
TurboX C865C SOM (System on Module) is a high-performance intelligent module based on Qualcomm® QCS8250 processor. It has integrated Android and the advanced 7nm Fin FET processor, a customized 64-bit Octa-core Qualcomm® Kryo™ 585 application processor.
TurboX C865C SOM supports wide-range Wi-Fi, Wi-Fi6 (Wi-Fi 802.11 a/b/g/n/ac/ax) . It supports one 4K@60FPS or two 4K@30FPS display, as well as multi-camera concurrency. It also integrates multiple audio and video input/output interfaces. TurboX C865C SOM provides a variety of GPIO, I2C, UART and SPI standard interfaces.
In addition, it supports four 4-lane MIPI-CSIs (D-PHY) and one 3-lane MIPI-CSI (C-PHY) together with SOM common standard protocol interfaces such as USB3.1, PCIE2.1/3.0 and I2S.
TurboX C865C SOM provides convenient and stable system solutions for IoT (Internet of Things) application. It can be embedded into devices including VR/AR, Robot, Smart Camera, AI devices, drones and medical devices.
KEY FEATURES:
- Qualcomm® Hexagon™ DSP with quad HVX
- Support one C-PHY Camera, up to 64MP sensor
- Long life cycle, up to 2028
- Support one 4K@60FPS or two 4K@30FPS display
- Wi-Fi 802.11a/b/g/n/ac/ax
TurboX C865C SOM (System on Module) is a high-performance intelligent module based on Qualcomm® QCS8250 processor. It has integrated Android and the advanced 7nm Fin FET processor, a customized 64-bit Octa-core Qualcomm® Kryo™ 585 application processor.
TurboX C865C SOM supports wide-range Wi-Fi, Wi-Fi6 (Wi-Fi 802.11 a/b/g/n/ac/ax) . It supports one 4K@60FPS or two 4K@30FPS display, as well as multi-camera concurrency. It also integrates multiple audio and video input/output interfaces. TurboX C865C SOM provides a variety of GPIO, I2C, UART and SPI standard interfaces.
In addition, it supports four 4-lane MIPI-CSIs (D-PHY) and one 3-lane MIPI-CSI (C-PHY) together with SOM common standard protocol interfaces such as USB3.1, PCIE2.1/3.0 and I2S.
TurboX C865C SOM provides convenient and stable system solutions for IoT (Internet of Things) application. It can be embedded into devices including VR/AR, Robot, Smart Camera, AI devices, drones and medical devices.
KEY FEATURES:
- Qualcomm® Hexagon™ DSP with quad HVX
- Support one C-PHY Camera, up to 64MP sensor
- Long life cycle, up to 2028
- Support one 4K@60FPS or two 4K@30FPS display
- Wi-Fi 802.11a/b/g/n/ac/ax
Thundercomm TurboX C865C Development Kit is based on the TurboX C865C SOM that facilitates accelerated development of innovative, power-efficient, high computing robots and drones for enterprise, industrial, and professional service applications.
At the heart of the kit is the Qualcomm® QCS8250 processor. Customized for robotics applications, this processor offers powerful heterogeneous computing architecture that delivers 15 Tera Operations Per Second of compute. It also offers incredible ML (Machine Learning) accuracy, a powerful ISP (Image Signal Processor) with support for multi concurrent cameras, a dedicated computer vision engine for EVA (Enhanced Video Analytics), as well as the new HTA (Hexagon™ Tensor Accelerator). Its fifth-generation Qualcomm® AI Engine powers inferencing and accuracy with the dedicated HTA. With long life support to 2028.
KEY FEATURES:
- Advance Imaging capability
- On-device intelligence powered by Qualcomm Artificial Intelligence (AI) Engine
- Advanced connectivity
- Heterogenous computing with efficient power budgets
- Flexible design options for commercialization
- Advance Security
Thundercomm TurboX C865C Development Kit is based on the TurboX C865C SOM that facilitates accelerated development of innovative, power-efficient, high computing robots and drones for enterprise, industrial, and professional service applications.
At the heart of the kit is the Qualcomm® QCS8250 processor. Customized for robotics applications, this processor offers powerful heterogeneous computing architecture that delivers 15 Tera Operations Per Second of compute. It also offers incredible ML (Machine Learning) accuracy, a powerful ISP (Image Signal Processor) with support for multi concurrent cameras, a dedicated computer vision engine for EVA (Enhanced Video Analytics), as well as the new HTA (Hexagon™ Tensor Accelerator). Its fifth-generation Qualcomm® AI Engine powers inferencing and accuracy with the dedicated HTA. With long life support to 2028.
KEY FEATURES:
- Advance Imaging capability
- On-device intelligence powered by Qualcomm Artificial Intelligence (AI) Engine
- Advanced connectivity
- Heterogenous computing with efficient power budgets
- Flexible design options for commercialization
- Advance Security
TurboX C6490P development kit is a hardware and software development kit based on the C6490P smart module. It integrates a high-performance and power-efficient 6nm Qualcomm® QCS6490 SoC with strong computing power (12.5 TOPS). It has the ability of 4K@60FPS decode and 4K@30FPS encode. The C6490P DK provides a rich set of interfaces for customers to evaluate performance in different application scenarios, including 2 x 1000M RJ45 Ethernet ports, 7 x USB Type-A ports, HDMI IN, HDMI OUT, 3 x MIPI camera connectors, and 2 x GMSL camera connectors. The C6490P SOM is the best platform choice for IoT products with high AI performance requirements, such as industrial handheld devices, industrial tablets, service robots, industrial robots, and edge computing.
KEY FEATURES:
- Excellent Heat Dissipation (non-pop)
- Pin-to-pin compatible with TurboX C5430P/C8550 SOM
- Superior computing capability (12.5 TOPS)
- Long life cycle: 2028
TurboX C6490P development kit is a hardware and software development kit based on the C6490P smart module. It integrates a high-performance and power-efficient 6nm Qualcomm® QCS6490 SoC with strong computing power (12.5 TOPS). It has the ability of 4K@60FPS decode and 4K@30FPS encode. The C6490P DK provides a rich set of interfaces for customers to evaluate performance in different application scenarios, including 2 x 1000M RJ45 Ethernet ports, 7 x USB Type-A ports, HDMI IN, HDMI OUT, 3 x MIPI camera connectors, and 2 x GMSL camera connectors. The C6490P SOM is the best platform choice for IoT products with high AI performance requirements, such as industrial handheld devices, industrial tablets, service robots, industrial robots, and edge computing.
KEY FEATURES:
- Excellent Heat Dissipation (non-pop)
- Pin-to-pin compatible with TurboX C5430P/C8550 SOM
- Superior computing capability (12.5 TOPS)
- Long life cycle: 2028
