26 products
Sort
Filter
26 results
Categories
Filter by:
EVK-QCC748M-2-01-0-AB
RF Connector, 4 MB PSRAM, 8 MB Flash, 32 GPIO, Camera & Display interfaces, USB 2.0
RF Connector, 4 MB PSRAM, 8 MB Flash, 32 GPIO, Camera & Display interfaces, USB 2.0
DVK-QCC730 (iPA + RF Connector)
DEV KIT, RF CONNECTOR, QCC730M, IPA
DEV KIT, RF CONNECTOR, QCC730M, IPA
DK-QCC3026-WLCSP81-A-0
The Qualcomm® QCC3026 Development Kit for QCC3026 is an entry-level Flash SoC. The baseboard is common for all QCC30xx and QCC51xx products.
The Qualcomm® QCC3026 Development Kit for QCC3026 is an entry-level Flash SoC. The baseboard is common for all QCC30xx and QCC51xx products.
DK-QCC3034-VFBGA90-A-0
Transceiver; Bluetooth® 5 For Use With QCC3034
Transceiver; Bluetooth® 5 For Use With QCC3034
Qualcomm® QCA4024 Product Development Kit
The QCA4024 Product Development Kit for creating IoT products supports key wireless technologies and cloud ecosystems.
The QCA4024 Product Development Kit for creating IoT products supports key wireless technologies and cloud ecosystems.
DVK-QCC730 (xPA + RF Connector)
DEV KIT, RF CONNECTOR, QCC730M, XPA
DEV KIT, RF CONNECTOR, QCC730M, XPA
EVK-QCC748M-2-01-0-AA
PCB Antenna, 4 MB PSRAM, 8 MB Flash, 32 GPIO, Camera & Display interfaces, USB 2.0
PCB Antenna, 4 MB PSRAM, 8 MB Flash, 32 GPIO, Camera & Display interfaces, USB 2.0
DK-QCC3031-QFN80-A-0
Transceiver; Bluetooth® 5 For Use With QCC3031
Transceiver; Bluetooth® 5 For Use With QCC3031
EVK-QCC744M-2-01-0-AA
PCB Antenna, 4 MB PSRAM, 8 MB Flash, 35 GPIO, Camera & Display interfaces
PCB Antenna, 4 MB PSRAM, 8 MB Flash, 35 GPIO, Camera & Display interfaces
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit)
The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.Qualcomm QCC3004 Bluetooth Audio SoC Development Kit
The QCC3004 Entry-Level Flash Programmable Bluetooth Audio SoC Development Kit for developing mid to low tier Bluetooth headphones and speakers.
The QCC3004 Entry-Level Flash Programmable Bluetooth Audio SoC Development Kit for developing mid to low tier Bluetooth headphones and speakers.
EVK-QCC744M-2-01-0-AB
RF Connector, 4 MB PSRAM, 8 MB Flash, 35 GPIO, Camera & Display interfaces
RF Connector, 4 MB PSRAM, 8 MB Flash, 35 GPIO, Camera & Display interfaces
Qualcomm® CSRB5348 Dual-mode Development Kit
Full featured Bluetooth dual-mode development kit for a variety of next generation IoT applications.
Full featured Bluetooth dual-mode development kit for a variety of next generation IoT applications.
DB-8645-10067-1A
BlueCore Transceiver; Bluetooth® Smart 4.x Low Energy (BLE) For Use With CSR8645
BlueCore Transceiver; Bluetooth® Smart 4.x Low Energy (BLE) For Use With CSR8645
Qualcomm® RB3 Gen 2 Development Kit (Core Kit)
The Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guideThe Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guideEVK-QCC748M-3-01-0-AA
PCB Antenna, 8 MB PSRAM, 8 MB Flash, 32 GPIO, Camera & Display interfaces, USB 2.0
PCB Antenna, 8 MB PSRAM, 8 MB Flash, 32 GPIO, Camera & Display interfaces, USB 2.0
