Multi-mode intelligent connectivity solution integrating IEEE 802.15.4 and Bluetooth.
The QCA4024 SoC is a multi-mode system-on-chip with support for Bluetooth 5 and 802.15.4-based technologies, including Zigbee and Thread.
This low power SOC integrates a processor for application processing and another for network stack processing designed to enable a highly concurrent multiple radio solution.
The QCA4020 SDK from Qualcomm Technologies pre-integrates support for advanced security features and mesh networking. This solution complements portions of the portfolio beyond IoT devices to address multiple industries.
Qualcomm Bluetooth Low Energy, Qualcomm Trusted Execution Environment, CSRmesh and QCA4024 are products of Qualcomm Technologies, Inc.and/or its subsidiaries.
Features
- Multi-mode SOC supporting Bluetooth 5.0, and IEEE 802.15.4 concurrently
- BLE mesh, Zigbee 3.0 and OpenThread support
- Isolated power islands for low power operation
- Advanced hardware-based security featuring secure boot, trusted execution environment, encrypted storage, key provisioning and application level security
- Comprehensive set of peripherals and interfaces: SPI, UART, PWM, I2S, I2C, SDIO, ADC and GPIOs
- Integrated sensor hub for post-processing designed to enable low power sensor use cases
- Small package size allows for optimized form factors
- 300+KB RAM reserved for applications
- Bluetooth radio details: v5.0 with PA =+4dBm/+10dBm (for Long Range)
- 802.15.4 radio details: 2006 compliant, 15.4e, 2.4GHz DSSS +4dBm/+21dBm (for Long Range)
- 8ch, 12-bit 1Msps
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Product | LR-WPAN Protocol | CPU Name | Clock Speed | Wi-Fi Standards | Spectral Bands | MIMO Configuration | Bluetooth Specification Version | Topologies | Connection Technology | Package Type | Size | Pitch |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
Other | ||||||||||||
Active | — | Tensilica Xtensa | Up to 130 MHz | 802.11a | 2.4 GHz | 1x1 | — | — | — | DRQFN | 9 × 9 × 0.9 mm | 0.5 mm |
Active | Zigbee | — | Up to 128 MHz | — | — | — | Bluetooth® 5.0 | Qualcomm® Bluetooth® mesh technology | Bluetooth® Low Energy | QFN | 8 × 8 mm | 0.9 mm |
Active | — | Tensilica Xtensa | Up to 130 MHz | 802.11b | 2.4 GHz | 1x1 | — | — | — | DRQFN | 9 × 9 × 0.9 mm | 0.5 mm |
Active | Zigbee | Tensilica Xtensa1 | Up to 128 MHz | 802.11a | 2.4 GHz | 1x1 | Bluetooth® 5.0 | Qualcomm® Bluetooth® mesh technology | Bluetooth® Low Energy | BGA | 11.2 × 11.2 × 0.95 mm | 0.65 mm |
Active | — | Tensilica Xtensa | Up to 130 MHz | 802.11a | 2.4 GHz | 1x1 | — | — | — | MQFN | 8 × 8 × 0.9 mm | 0.4 mm |
Not for new design | — | Tensilica Xtensa | Up to 130 MHz | 802.11b | 2.4 GHz | 1x1 | — | — | — | MQFN | 7 × 7 × 0.85 mm | 0.4 mm |
Active | — | MIPS 24Kc | Up to 650 MHz | 802.11b | 2.4 GHz | 2x2 | — | — | — | DRQFN | 12 × 12 × 0.9 mm | 0.45 mm |
- Up to 130 MHz. Dedicated Wi-Fi CPU. And 2 other processors.
