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IQ-9075 Evaluation Kit
The Dragonwing IQ-9075 EVK is a comprehensive evaluation platform to test the industrial-grade performance of the Dragonwing IQ-9075 processor for IoT solutions. The Dragonwing IQ-9075 EVK showcases the most common features of the Dragonwing IQ-9075 processor, which is optimized for industrial IoT and robotics applications involving heavy workloads in the most demanding environments like autonomous mobile robots (AMRs) and industrial machinery. The Dragonwing IQ-9075 EVK consists of a mainboard, supporting key interfaces, and optional expansion mezzanine boards to support additional features. It enables developers, OEMs, and ODMs to design and test their solutions powered by the industrial-grade Dragonwing IQ9075 processor integrated with standard interfaces and connectors, mezzanine expandability, and wireless connectivity. Test and prototype software development and hardware designs with less effort and cost to get your product to market faster.
The Dragonwing IQ-9075 EVK is a comprehensive evaluation platform to test the industrial-grade performance of the Dragonwing IQ-9075 processor for IoT solutions. The Dragonwing IQ-9075 EVK showcases the most common features of the Dragonwing IQ-9075 processor, which is optimized for industrial IoT and robotics applications involving heavy workloads in the most demanding environments like autonomous mobile robots (AMRs) and industrial machinery. The Dragonwing IQ-9075 EVK consists of a mainboard, supporting key interfaces, and optional expansion mezzanine boards to support additional features. It enables developers, OEMs, and ODMs to design and test their solutions powered by the industrial-grade Dragonwing IQ9075 processor integrated with standard interfaces and connectors, mezzanine expandability, and wireless connectivity. Test and prototype software development and hardware designs with less effort and cost to get your product to market faster.
Arduino UNO Q
Arduino UNO Q’s hybrid design makes it the ideal dual-brain platform for your next innovation. It combines a Linux® Debian-capable Qualcomm Dragonwing™ QRB2210 microprocessor with a real-time STM32U585 microcontroller (MCU). It’s Arduino, it’s a computer, it’s anything you want to build.
KEY FEATURES:
- AI in a blink: Unlock AI-powered vision and sound solutions that react to their environment in real time.Quick start apps: Jumpstart development with plenty of pre-built examples and templates available through Arduino App Lab.Designed to expand: Expandable with Qwiic connector for Modulino nodes, carriers and more.
Arduino UNO Q’s hybrid design makes it the ideal dual-brain platform for your next innovation. It combines a Linux® Debian-capable Qualcomm Dragonwing™ QRB2210 microprocessor with a real-time STM32U585 microcontroller (MCU). It’s Arduino, it’s a computer, it’s anything you want to build.
KEY FEATURES:
- AI in a blink: Unlock AI-powered vision and sound solutions that react to their environment in real time.Quick start apps: Jumpstart development with plenty of pre-built examples and templates available through Arduino App Lab.Designed to expand: Expandable with Qwiic connector for Modulino nodes, carriers and more.
Chipset
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit)
The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.The Qualcomm® RB3 Gen 2 Development Kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. Support for Qualcomm® Linux® and Android. Multiple interfaces and I/Os which can connect multiple sensors.Qualcomm® RB3 Gen 2 Development Kit (Core Kit)
The Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guideThe Qualcomm® RB3 Gen 2 Development Kit (Core Kit) provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation. The Qualcomm RB3 Gen 2 features support for Qualcomm® Linux® software stack—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms. Utilizing the Qualcomm Dragonwing™ QCS6490, the Qualcomm RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data. - Key Features: Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guide
KEY FEATURES:
Contains advanced platform Qualcomm Dragonwing™ QCS6490 processor. 12V wall power supply, USB type-C cable, mini speakers, setup guideQualcomm® RB3 Gen 2 Development Kit (Lite)
IoT development kit designed for high-performance compute, accessibility, and flexible and customizable features. The Qualcomm® RB3 Gen 2 Lite Development Kit gives developers a valuable combination of impressive performance and customizable features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation. The Qualcomm RB3 Gen 2 Lite is based on the Qualcomm Dragonwing™ processor. This processor’s scalable performance is designed to deliver superior features and performance across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications. This includes support for Wi-Fi 6E for ubiquitous coverage, a unified software stack, powerful AI, and expanded interfaces across ecosystems. - Key Features: Based on the Qualcomm Dragonwing™ QCS5430 processor. Support for Wi-Fi 6E for ubiquitous coverage. Across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications.
KEY FEATURES:
Based on the Qualcomm Dragonwing™ QCS5430 processor. Support for Wi-Fi 6E for ubiquitous coverage. Across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications.IoT development kit designed for high-performance compute, accessibility, and flexible and customizable features. The Qualcomm® RB3 Gen 2 Lite Development Kit gives developers a valuable combination of impressive performance and customizable features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation. The Qualcomm RB3 Gen 2 Lite is based on the Qualcomm Dragonwing™ processor. This processor’s scalable performance is designed to deliver superior features and performance across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications. This includes support for Wi-Fi 6E for ubiquitous coverage, a unified software stack, powerful AI, and expanded interfaces across ecosystems. - Key Features: Based on the Qualcomm Dragonwing™ QCS5430 processor. Support for Wi-Fi 6E for ubiquitous coverage. Across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications.
KEY FEATURES:
Based on the Qualcomm Dragonwing™ QCS5430 processor. Support for Wi-Fi 6E for ubiquitous coverage. Across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications.AIR-055
Compact and fanless AIR-055 powered by Qualcomm Dragonwing™ IQ9 delivers superior AI inference efficiency with significantly lower power consumption than comparable platforms. Ideal for edge AI applications including vision AI, AOI inspection, and smart networks. Features complete M.2 and I/O expansion, dual DisplayPort and dual HDMI outputs, and integrated Qualcomm® AI Hub and Advantech EdgeAI SDK for rapid deployment.
KEY FEATURES:
- Qualcomm Dragonwing IQ9 NPU Platform
- Fanless Thermal Design – Silent, maintenance-free operation with low noise level
- Complete M.2 Key M/E/B support with modular Wi-Fi, Bluetooth® technology, 5G, and dual-LAN with POE
- 2× DisplayPort and 2× HDMI outputs enabling diverse visual output configurations
- Extended Operating Range – Wide temperature support from -20°C to +55°C
- Integrated Qualcomm AI Hub, Edge Impulse, and Advantech EdgeAI SDK
Compact and fanless AIR-055 powered by Qualcomm Dragonwing™ IQ9 delivers superior AI inference efficiency with significantly lower power consumption than comparable platforms. Ideal for edge AI applications including vision AI, AOI inspection, and smart networks. Features complete M.2 and I/O expansion, dual DisplayPort and dual HDMI outputs, and integrated Qualcomm® AI Hub and Advantech EdgeAI SDK for rapid deployment.
KEY FEATURES:
- Qualcomm Dragonwing IQ9 NPU Platform
- Fanless Thermal Design – Silent, maintenance-free operation with low noise level
- Complete M.2 Key M/E/B support with modular Wi-Fi, Bluetooth® technology, 5G, and dual-LAN with POE
- 2× DisplayPort and 2× HDMI outputs enabling diverse visual output configurations
- Extended Operating Range – Wide temperature support from -20°C to +55°C
- Integrated Qualcomm AI Hub, Edge Impulse, and Advantech EdgeAI SDK
AFE-A503
Powered by the Qualcomm® IQ9075M processor, the AFE-A503 is a robust robot control system delivering up to 100 TOPS of AI performance for Autonomous Mobile Robots (AMRs). It features dedicated AMR I/Os, including 4x GbE, 4x USB, 2x COM, 2x CAN FD, and 16-bit DIO. With three M.2 expansions and flexible sensor connectivity for LiDAR, IMUs, and optional GMSL cameras, it seamlessly integrates advanced navigation. Operating on Ubuntu 24.04 and the Advantech Robotic Suite, it ensures efficient, intelligent robotic automation.
KEY FEATURES:
- AMR AI control system up to 100 TOPS
- Dedicated I/Os for AMR: 4x GbE, 4xUSB, 2x CAN FD, 16-bit DIO
- 3x M.2 Expansions: 1x E-Key, 1x B-Key, 1x M-Key (support NVMe)
- Sensor connection for camera, LiDAR, IMU, and optional GMSL…etc
- Supports Ubuntu 24.04
- Supports Advantech Robotic Suite
Powered by the Qualcomm® IQ9075M processor, the AFE-A503 is a robust robot control system delivering up to 100 TOPS of AI performance for Autonomous Mobile Robots (AMRs). It features dedicated AMR I/Os, including 4x GbE, 4x USB, 2x COM, 2x CAN FD, and 16-bit DIO. With three M.2 expansions and flexible sensor connectivity for LiDAR, IMUs, and optional GMSL cameras, it seamlessly integrates advanced navigation. Operating on Ubuntu 24.04 and the Advantech Robotic Suite, it ensures efficient, intelligent robotic automation.
KEY FEATURES:
- AMR AI control system up to 100 TOPS
- Dedicated I/Os for AMR: 4x GbE, 4xUSB, 2x CAN FD, 16-bit DIO
- 3x M.2 Expansions: 1x E-Key, 1x B-Key, 1x M-Key (support NVMe)
- Sensor connection for camera, LiDAR, IMU, and optional GMSL…etc
- Supports Ubuntu 24.04
- Supports Advantech Robotic Suite
Open-Q™ 8550CS μSOM
Open-Q™ 8550CS µSOM is the compact SOM variant in Lantronix’s Open-Q 8550 product series. Powered by Qualcomm’s Dragonwing™ QCS8550, it delivers premium performance with 48 INT8 TOPs and 12 FP16 TOPs, meeting the advanced AI/ML requirements of extreme edge computing. Its compact size and low power draw make it ideal for drone integration. For gimbal camera systems, it can operate without Wi-Fi or Ethernet at the hardware level, simplifying design and reducing weight. With its cost-effectiveness, compact footprint, and broad support for AI models and multimodal capabilities including AI context sharing across camera, audio, and sensors, the Open-Q 8550CS µSOM is a compelling choice for modern video surveillance and low-cost, compact video conferencing devices.
KEY FEATURES:
- Up to 12GB LPDDR5x RAM + 256GB UFS Flash
- Android™ 13 and Linux Yocto Kirkstone
- On-device AI Engine with Qualcomm® Hexagon™ Tensor Processor (HTP)
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
Open-Q™ 8550CS µSOM is the compact SOM variant in Lantronix’s Open-Q 8550 product series. Powered by Qualcomm’s Dragonwing™ QCS8550, it delivers premium performance with 48 INT8 TOPs and 12 FP16 TOPs, meeting the advanced AI/ML requirements of extreme edge computing. Its compact size and low power draw make it ideal for drone integration. For gimbal camera systems, it can operate without Wi-Fi or Ethernet at the hardware level, simplifying design and reducing weight. With its cost-effectiveness, compact footprint, and broad support for AI models and multimodal capabilities including AI context sharing across camera, audio, and sensors, the Open-Q 8550CS µSOM is a compelling choice for modern video surveillance and low-cost, compact video conferencing devices.
KEY FEATURES:
- Up to 12GB LPDDR5x RAM + 256GB UFS Flash
- Android™ 13 and Linux Yocto Kirkstone
- On-device AI Engine with Qualcomm® Hexagon™ Tensor Processor (HTP)
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
Chipset
Open-Q 6490CS SOM Development Kit
The Open-Q™ 6490 Development Kit is designed to facilitate easy evaluation and development. The kit includes many standard sockets, enabling customers to choose from a wide range of third-party accessories. The SOM utilizes Qualcomm Technologies’ heterogeneous computing expertise to offer a system-on-chip with multiple specialized processing cores for powerful AI processing, image and graphics processing, and audio processing.
KEY FEATURES:
- Standard M.2 sockets for evaluating Wi-Fi
- TAA/NDAA Compliant
- Android™ 13 and Qualcom Linux OSs
The Open-Q™ 6490 Development Kit is designed to facilitate easy evaluation and development. The kit includes many standard sockets, enabling customers to choose from a wide range of third-party accessories. The SOM utilizes Qualcomm Technologies’ heterogeneous computing expertise to offer a system-on-chip with multiple specialized processing cores for powerful AI processing, image and graphics processing, and audio processing.
KEY FEATURES:
- Standard M.2 sockets for evaluating Wi-Fi
- TAA/NDAA Compliant
- Android™ 13 and Qualcom Linux OSs
Chipset
Open-Q 6490CS SOM
The Open-Q 6490CS provides flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as AI cameras, video collaboration, industrial handhelds, and video telematics. Based on Qualcomm Dragonwing™ QCS6490 processor, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution.
KEY FEATURES:
- Multiple MIPI camera and display ports
- Up to 8GB LPDDR5 RAM + 64GB eMMC
- Android™ 13 and Qualcomm Linux
- TAA/NDAA Compliant
The Open-Q 6490CS provides flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as AI cameras, video collaboration, industrial handhelds, and video telematics. Based on Qualcomm Dragonwing™ QCS6490 processor, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution.
KEY FEATURES:
- Multiple MIPI camera and display ports
- Up to 8GB LPDDR5 RAM + 64GB eMMC
- Android™ 13 and Qualcomm Linux
- TAA/NDAA Compliant
Chipset
Open-Q™ 2210 System in Package
The Open-Q™ 2200 Series SIPs are a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QRB2210 (Yocto Linux) processors, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth® wireless technology. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.
KEY FEATURES:
- Entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power
- Secure compute platform
- Extended Operating Temperature (-25C to 85C)
The Open-Q™ 2200 Series SIPs are a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QRB2210 (Yocto Linux) processors, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth® wireless technology. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.
KEY FEATURES:
- Entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power
- Secure compute platform
- Extended Operating Temperature (-25C to 85C)
Chipset
APEX-A100
Built on the latest Qualcomm Dragonwing™ IQ-9075 SoC, Innodisk’s APEX-A100 delivers high AI performance with low power consumption for edge deployments. Backed by Innodisk’s self-developed software toolkit and Qualcomm® AI Hub resources, it helps accelerate time to market across AGV, AMR, and edge VLM applications.
KEY FEATURES:
- Powered by Dragonwing IQ-9075 SoC
- Provides up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI performance
- Up to 36GB onboard memory and 128GB UFS 3.1 storage
- 2 x 2.5GbE | 2 x DP 1.2 | 3 x M.2 | 1 x COM | 1 x CAN FD
- Fanless design, operating from -40°C to 70°C (Ta)
- Built for AGV, AMR, and VLM applications at the edge
- Chipset longevity through 2038
Built on the latest Qualcomm Dragonwing™ IQ-9075 SoC, Innodisk’s APEX-A100 delivers high AI performance with low power consumption for edge deployments. Backed by Innodisk’s self-developed software toolkit and Qualcomm® AI Hub resources, it helps accelerate time to market across AGV, AMR, and edge VLM applications.
KEY FEATURES:
- Powered by Dragonwing IQ-9075 SoC
- Provides up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI performance
- Up to 36GB onboard memory and 128GB UFS 3.1 storage
- 2 x 2.5GbE | 2 x DP 1.2 | 3 x M.2 | 1 x COM | 1 x CAN FD
- Fanless design, operating from -40°C to 70°C (Ta)
- Built for AGV, AMR, and VLM applications at the edge
- Chipset longevity through 2038
Chipset
FV08 EDGE BOX
Qualcomm Dragonwing™ IQ9-based computing box
KEY FEATURES:
- Dragonwing IQ9
- 100 TOPS
- Small size with rich I/O
Qualcomm Dragonwing™ IQ9-based computing box
KEY FEATURES:
- Dragonwing IQ9
- 100 TOPS
- Small size with rich I/O
Chipset
MT200
MeiG MT200 is an industrial-grade edge AI BOX featuring a modular architecture. The highest-configuration variant is equipped with the MeiG SNM983 intelligent module. SNM983 is based on the Qualcomm Dragonwing™ QCS9075 (IQ-9 Series) platform.
MeiG MT200 is an industrial-grade edge AI BOX featuring a modular architecture. The highest-configuration variant is equipped with the MeiG SNM983 intelligent module. SNM983 is based on the Qualcomm Dragonwing™ QCS9075 (IQ-9 Series) platform.
Open-Q™ 9075IQ SOM
The Open-Q Qualcomm Dragonwing™ 9075IQ System-on-Module (SOM) solutions offer scalable, power-efficient, and robust computing capabilities for autonomous devices and next-generation Industry 4.0 designs. These advanced AI-powered SOMs enable a range of critical functionalities, including robust safety features for autonomous mobile robots with enhanced device robustness through fault-tolerant ECC memory support and a dedicated real-time subsystem.
The new SOM series facilitates the deployment of interactive industrial edge AI systems by integrating Large Language Model (LLM) support, achieving a generation rate of up to 22 tokens per second when running the LIama2 7B parameter model.
KEY FEATURES:
- Dragonwing IQ-9075 SoC
- Up to 36GB LPDDR5 SDRAM
- On-device AI Engine up to 100 INT-8 TOPS
- Support up to 16 concurrent cameras
- Multiple PCIe, USB, and CAN-FD interfaces
- 2.5Gbps Time Sensitive Ethernet (TSN)
- Dedicated real-time subsystem
- Qualcomm® Linux
The Open-Q Qualcomm Dragonwing™ 9075IQ System-on-Module (SOM) solutions offer scalable, power-efficient, and robust computing capabilities for autonomous devices and next-generation Industry 4.0 designs. These advanced AI-powered SOMs enable a range of critical functionalities, including robust safety features for autonomous mobile robots with enhanced device robustness through fault-tolerant ECC memory support and a dedicated real-time subsystem.
The new SOM series facilitates the deployment of interactive industrial edge AI systems by integrating Large Language Model (LLM) support, achieving a generation rate of up to 22 tokens per second when running the LIama2 7B parameter model.
KEY FEATURES:
- Dragonwing IQ-9075 SoC
- Up to 36GB LPDDR5 SDRAM
- On-device AI Engine up to 100 INT-8 TOPS
- Support up to 16 concurrent cameras
- Multiple PCIe, USB, and CAN-FD interfaces
- 2.5Gbps Time Sensitive Ethernet (TSN)
- Dedicated real-time subsystem
- Qualcomm® Linux
Chipset
Tria Vision AI-KIT IQ9
Tria's Vision AI-KIT IQ9 features an industrial 3.5-inch SBC board fitted with Qualcomm Dragonwing™ IQ-9075 SIP module, that delivers power-efficient on-device Edge AI and compute, for high-performance, heavy workload industrial applications in extreme environments.
The Dragonwing IQ-9075 microprocessor domain (MD) has octa high-performance Kryo Gen6 cores, 100 TOPS of AI-acceleration, plus exceptional multimedia capabilities (up to 16 cameras, multiple displays, 4K170/4K275 enc/dec.). This SOC also features a real time subsystem (RTSS) with quad real-time cores @ 1.85 GHz and peripherals, for low-latency control applications.
Dragonwing™ IQ-9075 SIP resources include 36 GB LPDDR5 (3200MHz, 96bit wide DRAM with inline ECC) plus four PMM8650AU PMICs for efficient power management.
Vision AI-KIT IQ9 packs a wide range of connectivity interfaces, into a standard industrial 3.5-inch SBC form-factor, including 2x local MIPI CSI 4-lane camera inputs, 2x miniDP (4K) and 1x MIPI DSI display outputs, 6x USB ports (plus quad USB debug-bridge), 2x 2.5 GbE LAN interfaces, CAN, UART and GPIO interfaces. Add-on Wi-Fi/BT, cellular modem and NVME SSD storage options are supported via (key-E, key-B, key-M) M.2 slots. A mezzanine camera-adapter 120-pin connector enables the use of adapter boards for support of multiple concurrent remote cameras. Audio support includes stereo amplified outputs plus onboard PDM microphone.
KEY FEATURES:
- Qualcomm Dragonwing™ IQ-9075 Development Kit
- Industrial 3.5-inch SBC board
- Qualcomm Dragonwing™ IQ-9075 SIP module
- Kryo Gen6 cores
- 100 TOPS of AI-acceleration
- Up to 16 cameras
- Multiple display support
- 4K170/4K275 enc/dec.
- Real time subsystem (RTSS) with quad real-time cores @ 1.85 GHz and peripherals
- 36 GB LPDDR5 (3200MHz, 96bit wide DRAM with inline ECC)
- Four PMM8650AU PMICs
Tria's Vision AI-KIT IQ9 features an industrial 3.5-inch SBC board fitted with Qualcomm Dragonwing™ IQ-9075 SIP module, that delivers power-efficient on-device Edge AI and compute, for high-performance, heavy workload industrial applications in extreme environments.
The Dragonwing IQ-9075 microprocessor domain (MD) has octa high-performance Kryo Gen6 cores, 100 TOPS of AI-acceleration, plus exceptional multimedia capabilities (up to 16 cameras, multiple displays, 4K170/4K275 enc/dec.). This SOC also features a real time subsystem (RTSS) with quad real-time cores @ 1.85 GHz and peripherals, for low-latency control applications.
Dragonwing™ IQ-9075 SIP resources include 36 GB LPDDR5 (3200MHz, 96bit wide DRAM with inline ECC) plus four PMM8650AU PMICs for efficient power management.
Vision AI-KIT IQ9 packs a wide range of connectivity interfaces, into a standard industrial 3.5-inch SBC form-factor, including 2x local MIPI CSI 4-lane camera inputs, 2x miniDP (4K) and 1x MIPI DSI display outputs, 6x USB ports (plus quad USB debug-bridge), 2x 2.5 GbE LAN interfaces, CAN, UART and GPIO interfaces. Add-on Wi-Fi/BT, cellular modem and NVME SSD storage options are supported via (key-E, key-B, key-M) M.2 slots. A mezzanine camera-adapter 120-pin connector enables the use of adapter boards for support of multiple concurrent remote cameras. Audio support includes stereo amplified outputs plus onboard PDM microphone.
KEY FEATURES:
- Qualcomm Dragonwing™ IQ-9075 Development Kit
- Industrial 3.5-inch SBC board
- Qualcomm Dragonwing™ IQ-9075 SIP module
- Kryo Gen6 cores
- 100 TOPS of AI-acceleration
- Up to 16 cameras
- Multiple display support
- 4K170/4K275 enc/dec.
- Real time subsystem (RTSS) with quad real-time cores @ 1.85 GHz and peripherals
- 36 GB LPDDR5 (3200MHz, 96bit wide DRAM with inline ECC)
- Four PMM8650AU PMICs
Open-Q 8550CS SoM
The Open-Q™ 8550CS offers a premium performance level of 55 TOPs, meeting the higher AI/ML requirements for extreme edge computing, including Edge devices, Edge servers and Edge AI boxes. Based on the Qualcomm Dragonwing™ QCS8550 processor, the Open-Q 8550CS offers several benefits: low power consumption with a 4nm process, powerful heterogeneous computing, an 8th-generation AI engine delivering up to 10x performance over the previous generation, enterprise-level connectivity with Wi-Fi 7 supporting up to 5.8Gbps, and best-in-class performance across compute processing, camera, AI, security, and audio.
KEY FEATURES:
- Up to 16GB LPDDR5 RAM + 128GB UFS Flash
- Android™ 13 and Linux Yocto Kirkstone
- On-device AI Engine with Qualcomm Hexagon™ Tensor Processor (HTP)
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
The Open-Q™ 8550CS offers a premium performance level of 55 TOPs, meeting the higher AI/ML requirements for extreme edge computing, including Edge devices, Edge servers and Edge AI boxes. Based on the Qualcomm Dragonwing™ QCS8550 processor, the Open-Q 8550CS offers several benefits: low power consumption with a 4nm process, powerful heterogeneous computing, an 8th-generation AI engine delivering up to 10x performance over the previous generation, enterprise-level connectivity with Wi-Fi 7 supporting up to 5.8Gbps, and best-in-class performance across compute processing, camera, AI, security, and audio.
KEY FEATURES:
- Up to 16GB LPDDR5 RAM + 128GB UFS Flash
- Android™ 13 and Linux Yocto Kirkstone
- On-device AI Engine with Qualcomm Hexagon™ Tensor Processor (HTP)
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
Chipset
Open-Q 4290CS™ System-in-Package (SIP)
The Open-Q™ 4290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QCS4290 chipset utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4290 SIP creates the perfect computing core for a variety of edge AI video analytic applications.
KEY FEATURES:
- Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
- 3rd generation Qualcomm® AI Engine
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Multiple high speed connectivity options
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
The Open-Q™ 4290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QCS4290 chipset utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4290 SIP creates the perfect computing core for a variety of edge AI video analytic applications.
KEY FEATURES:
- Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
- 3rd generation Qualcomm® AI Engine
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Multiple high speed connectivity options
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
Chipset
Open-Q 2290CS™ System-in-Package (SIP)
The Open-Q™ 2290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QCS2290, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.
KEY FEATURES:
- Entry-tier solution delivers greater performance, graphic, and camera capabilities
- Secure compute platform
- Improved power performance
The Open-Q™ 2290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QCS2290, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.
KEY FEATURES:
- Entry-tier solution delivers greater performance, graphic, and camera capabilities
- Secure compute platform
- Improved power performance
Chipset
Open-Q™ 8250CS Module/SoM with Qualcomm® QCS8250
The Open-Q™ 8250CS production ready computing SOM delivered with Android™ 13 supports multiple concurrent decode+encode sessions, live tuning for cameras (not customer facing), 2A sync for 2 cameras, UVC/UAC source mode for video collaboration bars to function as a USB class device, low-latency MS codecs and MS Teams video extensions with a roadmap to include background blur and replacement, an AI director framework to track and zoom a camera onto the person speaking and QSAT for smooth zoom.
KEY FEATURES:
- Long life IIoT chipset
- 8GB LPDDR5 RAM + 128GB UFS Flash
- Android™ 13
- On-device AI Engine up to 15 TOPS
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
- Ultra-compact 50 x 29 mm form factor
The Open-Q™ 8250CS production ready computing SOM delivered with Android™ 13 supports multiple concurrent decode+encode sessions, live tuning for cameras (not customer facing), 2A sync for 2 cameras, UVC/UAC source mode for video collaboration bars to function as a USB class device, low-latency MS codecs and MS Teams video extensions with a roadmap to include background blur and replacement, an AI director framework to track and zoom a camera onto the person speaking and QSAT for smooth zoom.
KEY FEATURES:
- Long life IIoT chipset
- 8GB LPDDR5 RAM + 128GB UFS Flash
- Android™ 13
- On-device AI Engine up to 15 TOPS
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
- Ultra-compact 50 x 29 mm form factor
Chipset
