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Dual Mode (LC3 Auracast, Unicast and Classic BR/EDR) Audio and Data Module
IDC777 is a fully integrated Dual Mode LE Audio and Classic Audio Bluetooth module. IDC777 offers both LE Audio (LC3 Codec Auracast and Unicast) and Bluetooth Classic (aptX, aptX-HD, apt-X Lossless, Snapdragon Sound). IDC777 offers best in class performance in every single aspect of Bluetooth. IDC777 is based on the latest generation Bluetooth 6.0 Qualcomm Audio chip. IDC777 is easy to supply and offers a long life. DC777 offers a high level UART command interface (AudioAgent) that provides full control of all profiles such as UniCast and Auracast for LE Audio (LC3 Codec) and HFP, HSP or HFP-AG (HandsFree Voice), A2DP Source and Sink and AVRCP (Music Streaming), PBAP (Phone Book Access Profile) and MAP (Message Access Profile) for Classic. IDC777 connects to Android and iOS Apps using Bluetooth Low Energy, the Serial Protocol Profile (SPP) or HID (Over Classic, USB or BLE GATT). The module can act as receiver of Audio but also as a Transmitter. IDC777 can be a Central or Peripheral BLE device. In Peripheral mode, it the users can create their own BLE profiles.
KEY FEATURES:
- Concurrent LE Audio and Classic 6.0 Bluetooth Module
- Standalone or Simple UART/USB commands. Classic Audio & Data Rx/Tx
- HFP, HFP-AG, A2DP Sink, A2DP Source, SPP, BLE Central/Peripheral
- PBAP, MAP, HID (USB, Bluetooth, BLE)
- LE (LC3) Auracast (Broadcast) and Unicast Receive and Transmit
- Analog (120dB SNR) and Digital Interface (-100dB SNR)
- Snapdragon Sound: aptX (-HD), aptX-Lossless, LC3, SBC, AAC
- Ultra Low Latency: Down to 20ms Latency (Gaming Mode)
- I2S, PCM, UART, I2C, SPDIF, USB, IOs Interfaces
- Firmware Upgrade via UART, USB or Bluetooth (Over the Air)
- Bluetooth, FCC, RED, IC, MIC, KCC, SRRC Certified
- Comes with variants for external Antenna or Long Range
IDC777 is a fully integrated Dual Mode LE Audio and Classic Audio Bluetooth module. IDC777 offers both LE Audio (LC3 Codec Auracast and Unicast) and Bluetooth Classic (aptX, aptX-HD, apt-X Lossless, Snapdragon Sound). IDC777 offers best in class performance in every single aspect of Bluetooth. IDC777 is based on the latest generation Bluetooth 6.0 Qualcomm Audio chip. IDC777 is easy to supply and offers a long life. DC777 offers a high level UART command interface (AudioAgent) that provides full control of all profiles such as UniCast and Auracast for LE Audio (LC3 Codec) and HFP, HSP or HFP-AG (HandsFree Voice), A2DP Source and Sink and AVRCP (Music Streaming), PBAP (Phone Book Access Profile) and MAP (Message Access Profile) for Classic. IDC777 connects to Android and iOS Apps using Bluetooth Low Energy, the Serial Protocol Profile (SPP) or HID (Over Classic, USB or BLE GATT). The module can act as receiver of Audio but also as a Transmitter. IDC777 can be a Central or Peripheral BLE device. In Peripheral mode, it the users can create their own BLE profiles.
KEY FEATURES:
- Concurrent LE Audio and Classic 6.0 Bluetooth Module
- Standalone or Simple UART/USB commands. Classic Audio & Data Rx/Tx
- HFP, HFP-AG, A2DP Sink, A2DP Source, SPP, BLE Central/Peripheral
- PBAP, MAP, HID (USB, Bluetooth, BLE)
- LE (LC3) Auracast (Broadcast) and Unicast Receive and Transmit
- Analog (120dB SNR) and Digital Interface (-100dB SNR)
- Snapdragon Sound: aptX (-HD), aptX-Lossless, LC3, SBC, AAC
- Ultra Low Latency: Down to 20ms Latency (Gaming Mode)
- I2S, PCM, UART, I2C, SPDIF, USB, IOs Interfaces
- Firmware Upgrade via UART, USB or Bluetooth (Over the Air)
- Bluetooth, FCC, RED, IC, MIC, KCC, SRRC Certified
- Comes with variants for external Antenna or Long Range
IDC777-DISKIT
IDC777 is the evaluation and development board for the IDC777 module. This board contains the IDC777 (LE Audio (Auracast and Unicast), Classic Bluetooth (A2DP Source and Sink, HFP, AGHFP, PBAP, HID and MAP) and BLE Data. So it is also used as a simple test board when you are testing your LE Audio or Classic Bluetooth Products.
KEY FEATURES:
- Development Board for the IDC777
- Dual Mode LE Audio (Auracast/Unicast) and BR/EDR
IDC777 is the evaluation and development board for the IDC777 module. This board contains the IDC777 (LE Audio (Auracast and Unicast), Classic Bluetooth (A2DP Source and Sink, HFP, AGHFP, PBAP, HID and MAP) and BLE Data. So it is also used as a simple test board when you are testing your LE Audio or Classic Bluetooth Products.
KEY FEATURES:
- Development Board for the IDC777
- Dual Mode LE Audio (Auracast/Unicast) and BR/EDR
Qualcomm QCC517x reference design Powerofyle by Exeger
Powerfoyle is groundbreaking solar-cell technology, invented and produced in Sweden by Exeger and designed to power electronic devices with indoor and outdoor light.Exeger reference design for integration with Qualcomm Technologies, Inc. development boards, File contains guide, schematic and source code for Qualcomm ® QCC5171 module with Bluetooth connectivity.
Powerfoyle is groundbreaking solar-cell technology, invented and produced in Sweden by Exeger and designed to power electronic devices with indoor and outdoor light.Exeger reference design for integration with Qualcomm Technologies, Inc. development boards, File contains guide, schematic and source code for Qualcomm ® QCC5171 module with Bluetooth connectivity.
BTM383 Module
The BTM383 Bluetooth module features the Qualcomm® QCC3083 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz). It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth speaker applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.
KEY FEATURES:
- Bluetooth 5.4 & QCC3083 chip
- Multi - codec (aptX, aptX HD, aptx-adaptive) support
- 240 MHz audio DSP integration
The BTM383 Bluetooth module features the Qualcomm® QCC3083 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz). It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth speaker applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.
KEY FEATURES:
- Bluetooth 5.4 & QCC3083 chip
- Multi - codec (aptX, aptX HD, aptx-adaptive) support
- 240 MHz audio DSP integration
BTM581 Module
The BTM581 Bluetooth module features the Qualcomm® QCC5181 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz). It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth earbuds, headsets, and USB Dongle applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.
KEY FEATURES:
- Bluetooth 5.4 & Qualcomm® QCC5181 chip
- Multi - codec (aptX, aptX HD, aptx-adaptive) support
- 240 MHz audio DSP integration
The BTM581 Bluetooth module features the Qualcomm® QCC5181 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz). It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth earbuds, headsets, and USB Dongle applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.
KEY FEATURES:
- Bluetooth 5.4 & Qualcomm® QCC5181 chip
- Multi - codec (aptX, aptX HD, aptx-adaptive) support
- 240 MHz audio DSP integration
Secure Wireless Mesh for Group Comms
Fully qualified Mesh module for rapid prototyping of professional and special operation headsets. Offering: AES encryption, secured dynamic mesh networking with no central control, auto search and connect and self-healing with auto-optimizing RF links. Up to 16 independent groups, with 24 users per group and 5 simultaneous talkers per group. Integrated noise reduction, speech enhancement, glitch suppression, equalizer, compressor, audio stream mixer and robust Voice Activity Detector (VOX) with no false triggering in harsh noisy and windy environments.
KEY FEATURES:
- Mesh networking with HFP and A2DP connectivity
- Certified, approved and field tested module
- Demo & trial units available on request
Fully qualified Mesh module for rapid prototyping of professional and special operation headsets. Offering: AES encryption, secured dynamic mesh networking with no central control, auto search and connect and self-healing with auto-optimizing RF links. Up to 16 independent groups, with 24 users per group and 5 simultaneous talkers per group. Integrated noise reduction, speech enhancement, glitch suppression, equalizer, compressor, audio stream mixer and robust Voice Activity Detector (VOX) with no false triggering in harsh noisy and windy environments.
KEY FEATURES:
- Mesh networking with HFP and A2DP connectivity
- Certified, approved and field tested module
- Demo & trial units available on request
IoT RAM 16Mb QSPI
A low pin count & low power memory customized to support Qualcomm® QC51xx SoC when external RAM is required.
A low pin count & low power memory customized to support Qualcomm® QC51xx SoC when external RAM is required.
Classic R
Classic R is a user-centric, easy-to-use hearing aid powered by RelaJet AI Speech Enhancement Engine. This unique technology allows Classic R to capture and enhance the human voice, while being constantly updated to offer users the best hearing experience under any scenario.
KEY FEATURES:
- Better Hearing Experience - RelaJet AI Speech Enhancement Engine
- Sustainable design - Replaceable lithium battery
- User interaction - Qualcomm Technologies chipset with Bluetooth® compatibility & Qualcomm® tuning APP
Classic R is a user-centric, easy-to-use hearing aid powered by RelaJet AI Speech Enhancement Engine. This unique technology allows Classic R to capture and enhance the human voice, while being constantly updated to offer users the best hearing experience under any scenario.
KEY FEATURES:
- Better Hearing Experience - RelaJet AI Speech Enhancement Engine
- Sustainable design - Replaceable lithium battery
- User interaction - Qualcomm Technologies chipset with Bluetooth® compatibility & Qualcomm® tuning APP
SonicBoom by Virscient
Launching a new audio product? Our hardware reference designs make it easy. Whether it’s earbuds, headsets, glasses, or speakers, we deliver complete, application-specific platforms packed with everything you need—microphones, amps, sensors, chargers, even a charging case. Designed for quick and easy customization, our schematics and layouts are clean, functional, and structured for speed. And yes, we provide polished Altium master design files, so you’re not starting from scratch. Just plug in your vision—we’ll help bring it to life.
KEY FEATURES:
- Application specific reference designs
- Easily customizable
Launching a new audio product? Our hardware reference designs make it easy. Whether it’s earbuds, headsets, glasses, or speakers, we deliver complete, application-specific platforms packed with everything you need—microphones, amps, sensors, chargers, even a charging case. Designed for quick and easy customization, our schematics and layouts are clean, functional, and structured for speed. And yes, we provide polished Altium master design files, so you’re not starting from scratch. Just plug in your vision—we’ll help bring it to life.
KEY FEATURES:
- Application specific reference designs
- Easily customizable
IDUN spatial audio
IDUN’s dynamic spatial audio embedded software simulates an interactive virtual environment, with sound sources around a listener in a room. The signal processing is done inside the headphone, as opposed to a smartphone or computer. This allows for low-latency head tracking, ensuring pinpoint accuracy, leading to high quality audio experiences. In addition it enables the headphone to provide spatialization no matter the playback device.
The software is very flexible and can be configured from an app, to support a large range of use cases, from online meetings, listening to music, watching movies, mobile gaming, etc. It was designed to use very low processing power and memory on embedded platforms. For this reason it is well-suited to running inside wireless headphones and truly wireless (TWS) earbuds. The processing works with bluetooth profiles for communication (HFP) and high-quality audio streaming (A2DP), and supports mono, stereo and multi-channel audio.
KEY FEATURES:
- Dynamic spatial audio for wireless / TWS headphones
- High precision due to fast head tracking
- Low processing power and memory requirements
IDUN’s dynamic spatial audio embedded software simulates an interactive virtual environment, with sound sources around a listener in a room. The signal processing is done inside the headphone, as opposed to a smartphone or computer. This allows for low-latency head tracking, ensuring pinpoint accuracy, leading to high quality audio experiences. In addition it enables the headphone to provide spatialization no matter the playback device.
The software is very flexible and can be configured from an app, to support a large range of use cases, from online meetings, listening to music, watching movies, mobile gaming, etc. It was designed to use very low processing power and memory on embedded platforms. For this reason it is well-suited to running inside wireless headphones and truly wireless (TWS) earbuds. The processing works with bluetooth profiles for communication (HFP) and high-quality audio streaming (A2DP), and supports mono, stereo and multi-channel audio.
KEY FEATURES:
- Dynamic spatial audio for wireless / TWS headphones
- High precision due to fast head tracking
- Low processing power and memory requirements
Type Application / Software
