QCC3050
Not for new design
QCC3050
QCC3050

Extremely low-power Bluetooth Audio SoC in a BGA package with stacked Flash memory, designed for premium audio feature differentiation in truly wireless earbuds at price-challenged tiers.

Qualcomm® QCC3050 is an ultra-low power, single-chip solution, optimized for use in truly wireless earbuds and designed to support Qualcomm® Snapdragon Sound™ Technology. QCC3050 is designed specifically to help manufacturers to differentiate at a range of tiers by bringing our quad-core architecture and support for our premium audio technologies in the very fast-moving, price-sensitive truly wireless earbud category.

Qualcomm QCC3050 and Qualcomm Snapdragon Sound are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

*Battery life varies significantly with settings, usage, and other factors.

Product license agreement
Benefits
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Qualcomm TrueWireless Mirroring

Innovative Qualcomm TrueWireless™ Mirroring technology is designed to deliver a superior user experience by improving robustness and supporting dynamic and virtually seamless bud-to-bud role-swapping with Bluetooth address handover even during run time. Qualcomm TrueWireless Mirroring also supports balancing out power distribution between both earbuds.

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Wide range of differentiating audio features

Differentiate at a range of consumer price points with increased choice from our portfolio of audio technologies our licensable audio technologies, including voice service support with Always-on Wakeup Word activation or button press activation, Qualcomm® Adaptive Active Noise Cancellation, Qualcomm(R) aptX(TM) Adaptive Audio, Adaptive for up to 96Khz audio resolution, aptX™ Voice, and Qualcomm® cVc™ Echo Cancellation and Noise Suppression.

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Premium Audio with Snapdragon Sound

Supports Snapdragon Sound technology which is designed to deliver 24-bit 96kHz high-resolution music, 32kHz super wideband voice for crystal clear calls and low-latency for lag-free gaming. In addition to this Snapdragon Sound is optimized to deliver a robust connection with minimal drop-outs or audio glitches even in very busy RF environments. Find out more about Snapdragon Sound here.

QCC3050 Block Diagram

Specifications
Flash
Density
64 Mb
Location
Internal
CPU
Architecture
32-bit
Clock Speed
Up to 80 MHz
Features
Programmable CPU
DSP
Name
1x Qualcomm® Kalimba™
Clock Speed
2x 120 MHz
Data RAM
448 kB
Program RAM
112 kB
Features
Configurable DSP
Bluetooth
Specification Version
Bluetooth® 5.2 Qualified
Connection Technology
Bluetooth® Low Energy, Bluetooth® Classic, Dual-mode Bluetooth®
Topologies
Qualcomm TrueWireless™ Mirroring technology
Classic Data Rate
3 Mbps, 1 Mbps, 2 Mbps
Audio
Qualcomm® aptX™ audio technology support
Qualcomm® aptX™ Audio, Qualcomm® aptX™ Voice, Qualcomm® aptX™ Adaptive
Qualcomm® Active Noise Cancellation (ANC) technology support
Feedback, Adaptive, Feedforward, Hybrid
Qualcomm® cVc™ Echo Cancelling and Noise Suppression (ECNS) technology support
2-mic Headset, 1-mic Headset

Qualcomm TrueWireless, Qualcomm aptX, Qualcomm cVc, Qualcomm Kalimba, Qualcomm ANC, Qualcomm QCC304X and Qualcomm QCC302x are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

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3 of 3 total products

Product

DSP

Clock Speed

Bluetooth

Specification Version

Audio

Qualcomm® aptX™ audio technology support

Qualcomm® Active Noise Cancellation (ANC) technology support

Qualcomm® cVc™ Echo Cancelling and Noise Suppression (ECNS) technology support

Voice Services

Digital Assistant Activation

Package

Type

Size

IoT

Voice and Music Applications

High Tier

QCC5151
Active

2x 120 MHz

Bluetooth® 5.2 Qualified
Bluetooth® 5.2

Qualcomm® aptX™ Audio
Qualcomm® aptX™ Voice
Qualcomm® aptX™ Adaptive

Feedforward
Feedback
Adaptive
Hybrid

2-mic Headset
1-mic Headset
Qualcomm® cVc™ Echo Cancelling and Noise Suppression

Button press
Qualcomm® Voice Activation

WLCSP

—

Dongle
Truly Wireless Earbuds
Bluetooth® Loudspeakers
Bluetooth® Stereo Headphones and Headsets

Mid Tier

QCC3056
Active

2x 120 MHz

Bluetooth® 5.2 Qualified

Qualcomm® aptX™ Audio
Qualcomm® aptX™ Voice
Qualcomm® aptX™ Adaptive

Feedback
Adaptive
Feedforward
Hybrid

2-mic Headset
1-mic Headset
Qualcomm® cVc™ Echo Cancelling and Noise Suppression

Button press
Qualcomm® Voice Activation

WLCSP

4.38 × 4.26 × 0.4 mm

Truly Wireless Earbuds
Dongle

QCC3050
Active

2x 120 MHz

Bluetooth® 5.2 Qualified

Qualcomm® aptX™ Audio
Qualcomm® aptX™ Voice
Qualcomm® aptX™ Adaptive

Feedback
Adaptive
Feedforward
Hybrid

2-mic Headset
1-mic Headset

Button press
Qualcomm® Voice Activation

Stacked-flash
BGA

5.6 × 5.9 × 1.0mm

Truly Wireless Earbuds

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    Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patented technologies are licensed by Qualcomm Incorporated.

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