This product is not recommended for new design. It is being replaced by the Snapdragon S3 Gen 1 Sound Platform
An ultra-low power, single-chip audio platform, optimized for use in truly wireless earbuds at a range of tiers.
Qualcomm® QCC3071 is designed for the future of wireless sound, with support for LE Audio use cases and CD-Lossless (16-bit 44.1kHz) audio with Snapdragon Sound™ technology - our optimized chain of superior audio, connectivity, and mobile innovations.
This dual-mode platform brings LE Audio use cases for audio sharing, gaming and stereo recording supported alongside traditional Bluetooth tech, for the best listening experiences in a wide range of environments.
Qualcomm QCC3071, Qualcomm aptX, Qualcomm cVc, Qualcomm Kalimba, Qualcomm TrueWireless Mirroring, Qualcomm QCC302x, Qualcomm QCC304x, Qualcomm QCC304x, Qualcomm QCC305x, and Snapdragon Sound are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
*Battery life varies with settings, usage, and other factors.
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Product | IoT Voice and Music Applications | IoT Wearables | Bluetooth Classic Data Rate | Bluetooth Connection Technology | Bluetooth Specification Version | Bluetooth Topologies | Part Part Number(s) | Flash Location | Audio Qualcomm® Active Noise Cancellation (ANC) technology support | Audio Qualcomm® aptX™ audio technology support | Audio Qualcomm® cVc™ Echo Cancelling and Noise Suppression (ECNS) technology support | Voice Services Digital Assistant Activation | Voice Services Ecosystems | Analog-To-Digital Converter (ADC) Number of Channels | Analog-To-Digital Converter (ADC) Resolution | Analog-To-Digital Converter (ADC) Sample Rate | Audio Characteristics Resolution | Audio Playback Interfaces Modes | Digital-To-Analog Converter (DAC) Amplifier Class | Digital-To-Analog Converter (DAC) Number of Channels | Interfaces Supported Interfaces | Package Ball | Package Pins | Package Pitch | Package Size | Package Type | Power Consumption Music Streaming (A2DP) | CPU Architecture | CPU Clock Speed | CPU Features | DSP Clock Speed | DSP Data RAM | DSP Features | DSP Name | DSP Program RAM | Product Function Audio Components | Product | Product Tier Tier |
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Mid Tier | ||||||||||||||||||||||||||||||||||||||
QCC3071 Active | Truly Wireless Earbuds | Headphones Headsets & Earbuds | 3 Mbps | Bluetooth® Low Energy | Bluetooth® 5.3 | Qualcomm TrueWireless™ Mirroring technology | QCC3071 | External | Adaptive Transparency | Qualcomm® aptX™ Audio | 1-mic Earbuds | Button press | Amazon Voice Services | 4 | 24-bit | Up to 192 kHz | 24-bit | Mono | Class-AB | 1 | UART | 99-ball | 99 pins | 0.4 mm | 4.930 × 3.936 × 0.57 mm | WLCSP | ~4 mA | 32-bit | Up to 80 MHz | Programmable CPU | 1x 240 MHz | 1024 kB | Configurable DSP | 1x Qualcomm® Kalimba™ | 384 kB | Processors | ACTIVE | Mid |
