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Thundercomm TurboX I8275 Development Kit
TurboX I8275 Development Kit is an evaluation platform designed to accelerate development with the TurboX I8275 SOM family. The initial configuration integrates the I8275-AC SOM, providing up to 20 TOPS of AI performance for machine vision, robotics and industrial IoT evaluation. 2 3 The 120 mm x 100 mm carrier board provides HDMI and DisplayPort outputs, three MIPI CSI camera connectors, multiple USB interfaces, Gigabit Ethernet, M.2 Key M and Key E expansion, a 40-pin expansion connector and 12V power input. Qualcomm® Linux is supported for application development and system evaluation. 4 5 Initial development kit samples are targeted for late November to early December 2026, subject to PCB availability, board bring-up and validation.

KEY FEATURES:

  • Initial configuration with the I8275-AC SOM
  • Up to 40 TOPS of edge AI performance
  • Three 22-pin MIPI CSI camera connectors
  • HDMI output and DisplayPort 1.4
  • Three USB 3.0 Type-A ports
  • One USB 3.0 Type-C and one USB 2.0 Type-A port
  • Gigabit Ethernet
  • M.2 Key M and M.2 Key E expansion
  • 40-pin expansion connector and PWM fan connector
  • Qualcomm Linux support
  • Compact 120 mm x 100 mm carrier board
Chipset
Type Development Kits
SECO SOM-COMe-CT6-Dragonwing-IQ9
SECO SOM-COMe-CT6-Dragonwing-IQ9 is a compact, high-performance COM Express Type 6 System-on-Module powered by the Qualcomm Dragonwing™ IQ9 platform, designed for demanding industrial Edge AI applications. Combining on-device AI acceleration, advanced multimedia capabilities and industrial-grade reliability, it supports low-latency inference and vision-intensive workloads for robotics, AMR/AGV, machine vision, intelligent HMI and industrial automation systems.

KEY FEATURES:

  • Powered by Dragonwing IQ9 with 8-core Qualcomm® Kryo™ CPU and up to 100 TOPS AI performance
  • Industrial reliability with ECC memory and extended temperature support
  • Vision-ready platform for multi-camera and sensor-fusion workloads
  • Clea OS support with OTA updates, device management and managed edge deployment capabilities
  • COM Express Type 6 Compact for scalable embedded designs and custom carrier board integration
Chipset
Type System-on-Modules
TRIA SM2S-QCS6490
The TRIA SM2S-QCS6490 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS6490 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS6490 integrates Qualcomm® Kryo™ 670 CPU which contains up to eight cores: four Arm® Cortex®-A78 cores, four Arm® Cortex®-A55 cores, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K60 and many different display connictities (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with upto 12 TOPS at low power and massive camera support with 4 MIPI-CSI inputs.

KEY FEATURES:

  • Quad core Arm Cortex-A78 up to 2.7GHz
  • And Quad core Arm Cortex-A55 @ 1.95GHz
  • Adreno 643 GPU @ 812MHz
  • AI DSP/NSP Dual HVX, 4K HMX up to 12(15) TOPs
  • Up to 16GB LPDDR5 SDRAM 6400MT/s
  • Up to 1TB UFS Flash
  • Display up to FHD+144Hz
  • Video up to 4k30(E)/4K60(D)
  • 5xUSB 2.0, 2x USB 3.1
  • 2x PCIe Gen3 x1, 1x PCIe Gen3 x2
  • 1x MIPI-DSI or LVDS
  • 1x DP 1.4 (2 lane) + 1x eDP/DP
  • 4x MIPI-CSI Camera Interface
  • WLAN/BT Wireless Module (option)
  • 2x Gigabit Ethernet
  • 2x I2S Audio Interface
  • 4x UART, 2x SPI, 2x CAN2.0-FD
  • 5x I²C
  • HW Key manager and ECC, Secure boot, Crypto engines, etc.
  • Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
Type Single-Board Computers
TRIA SM2S-QCS5430
The MSC SM2S-QCS5430 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS5430 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS5430 integrates Qualcomm® Kryo™ 670 CPU which contains up to six cores, Qualcomm® Adreno™ 642L GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K30 and many different display connectivity (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with up to 3.5 TOPS at low power and massive camera support with 4 MIPI-CSI inputs

KEY FEATURES:

  • Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)
  • Dual core Arm Cortex-A78 up to 2.1GHz
  • Adreno 642L GPU @ 315MHz
  • AI DSP/NSP Dual HVX, 4K HMX up to 3.5 TOPs
  • Up to 16GB LPDDR5 SDRAM 6400MT/s
  • Up to 1TB UFS Flash
  • 4x MIPI-CSI Camera Interface
  • Video up to 4k30(E)/4K30(D)
  • 5xUSB 2.0, 2x USB 3.1
  • 1x MIPI-DSI or LVDS
Type Single-Board Computers
EXMP-Q911
This collaboration centers on the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm Dragonwing™ IQ-9075 SoC featuring an 8-core Qualcomm® Kryo™ Gen 6 CPU and a Qualcomm® Adreno™ 663 GPU, enabling 100 TOPS dense or up to 200 TOPS sparse AI compute. Under defined 30W test scenarios, the EXMP-Q911 achieves up to 10× higher AI inference FPS compared to similar modules when running the YOLOv10n object detection model across 10 concurrent video channels. Designed for demanding edge workloads, the EXMP-Q911 integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, paired with a rich set of high-speed interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP 1.2, MIPI CSI-2, CAN FD, and more, providing exceptional connectivity and performance density for compact edge AI systems.

KEY FEATURES:

  • Powered by : Dragonwing IQ-9075 SoC, compliant with COM-HPC Mini form factor
  • Up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI computing power
  • 36 GB onboard memory, 128 GB UFS 3.1 storage, 2 x 2.5G Ethernet and 2 x 4-lane MIPI CSI-2 interfaces
  • -40°C to 85°C (Ta) operating temperature
Chipset
Type System-on-Modules
BTM581 Module
The BTM581 Bluetooth module features the Qualcomm® QCC5181 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz). It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth earbuds, headsets, and USB Dongle applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

KEY FEATURES:

  • Bluetooth 5.4 & Qualcomm® QCC5181 chip
  • Multi - codec (aptX, aptX HD, aptx-adaptive) support
  • 240 MHz audio DSP integration
Quectel Pi H1 SBC (SG565D)
Quectel Pi H1 is a smart Single-Board Computer (SBC) based on the Qualcomm QCS6490 platform. It integrates a high-performance 64-bit octa-core processor delivering up to 12 TOPS of computing power, along with the Qualcomm Adreno™ 643L GPU. Supporting Yocto Linux, Debian, and Ubuntu operating systems, the product comes equipped with 8 GB of LPDDR4X memory and features a USB Type-C power interface, expandable with external eMMC or SSD storage. It offers dual-band Wi-Fi (2.4 & 5 GHz) compliant with IEEE 802.11a/ b/ g/ n/ ac and Bluetooth 5.0, while enabling dual-display output via DP and LCM or DP and Micro HDMI. Combining powerful performance with rich multimedia capabilities, the Quectel Pi H1 is designed to meet the demands of both industrial and consumer applications for high-speed connectivity, advanced multimedia, and robust computing power.

KEY FEATURES:

  • Robust computing power: Up to 12 TOPS, well-suited for most algorithm prototyping & inference applic
  • Feature-rich interfaces: USB, Micro HDMI, ADC, audio, Ethernet, camera, PCIe , antenna, etc.
  • Dual displays: DP and LCM or DP and Micro HDMI.
  • Wireless connectivity: Wi-Fi 5, 802.11a/ b/ g/ n/ ac, delivering enhanced wireless connectivity.
  • Multiple operating systems: Yocto Linux/ Debian/ Ubuntu.
  • Extended temperature range: For harsh outdoor & industrial use; and withstand ambient temperatures f
  • Diverse application scenarios: Edge computing, robotics, industrial automation, multimedia terminals
  • High-performance 64-bit octa-core processor, delivering up to 12 TOPS of computing power
  • 1 x A78 @ 2.7 GHz + 3 x A78 @ 2.4 GHz + 4 x A55 @ 1.9 GHz
  • 32 KB L1I cache, 32 KB L1D cache and 512 KB L2 cache
  • Adreno 643L @ 812 MHz
  • 8 GB LPDDR4X + 128 GB UFS
  • Yocto Linux/ Debian/ Ubuntu*
Chipset
Type Single-Board Computers
Kiteboard 9207 SBC
Kiteboard 9207 is a low-power, production-ready SBC built on the Qualcomm MDM9207 SoC, designed for scalable IoT, Telematics and edge connectivity applications. Supports LTE Cat1 and Cat4 cellular connectivity. It enables reliable, wide-area communication for use cases such as telematics, asset tracking, industrial monitoring, and smart city deployments.

KEY FEATURES:

  • Secure, reliable connectivity for remote deployments
  • Low power battery-backed operations for reliable remote telemetry
  • Automotive interfaces (CAN, DIO, AIO, Freq) for telematics applications
Chipset
Type Single-Board Computers
Kiteboard 8250 SOM
The Kiteboard 8250 System-on-Module (SOM) is a premier-tier, production-ready SOM built on the Qualcomm® Dragonwing™ QCS8250 SoC, designed to enable OEMs and ODMs to develop high-performance edge AI devices for multi-camera vision and intelligent IoT deployments. Combining powerful compute with advanced connectivity, the module supports real-time edge analytics and video processing for applications such as video telematics, industrial vision systems, AI-connected cameras, smart retail analytics, and healthcare edge devices

KEY FEATURES:

  • SMARC Compatible with Customizable Carrier Board
  • Optimized for multi-camera edge AI deployments
  • Supports Multiple AI Models (e.g. YOLO, MobileNet, SAM-HQ, PatchCore)
  • Compatible with SNPE, QAIRT and Edge Impulse
Chipset
Type System-on-Modules
Kiteboard 5165 SOM
The Kiteboard 5165 is a high-compute, production-ready System-on-Module (SoM) based on the Qualcomm® Dragonwing™ QRB5165 SoC, designed to enable OEMs and robotics developers to build intelligent autonomous machines and AI-powered edge systems. Optimized for real-time perception, navigation, and multi-sensor processing, the module supports advanced robotics and autonomy workloads for applications such as autonomous delivery vehicles, industrial AMRs and AGVs, commercial and enterprise drones, industrial robotics, and defense and professional service robots.

KEY FEATURES:

  • SMARC Compatible with Customizable Carrier Board
  • Optimized for ROS2 & robotics stacks
  • Supports Multiple AI Models (e.g. YOLO, MobileNet, SAM-HQ, PatchCore)
  • Compatible with SNPE, QAIRT and Edge Impulse
Chipset
Type System-on-Modules
Kiteboard 2290 SOM
The Kiteboard 2290 is a cost-efficient, production-ready System-on-Module (SOM) based on the Qualcomm® Dragonwing™ QCS2290 SoC. Designed in an ultra-small form factor with integrated compute and connectivity, it enables OEMs, entrepreneurs, and device makers to build custom connected devices for vertical-specific solutions. Available in both Wi-Fi only and LTE variants, the Kiteboard 2290 is optimized for cost-efficient, feature-rich IoT deployments and enables OEMs and ODMs to rapidly develop and commercialize smart devices such as industrial handhelds, retail POS systems, connected cameras, and asset-tracking solutions while accelerating time-to-market.

KEY FEATURES:

  • Ultra small form factor
  • Integrated with Digital FM Technology
  • Reference design for offroad vehicle telematics
  • Reference design for field diagnostics device
  • Reference design for two-wheeler device cluster
  • Integrated LTE Cat 4 modem with Dual SIM (DSDS) support
  • Azure/AWS cloud orchestration for device provisioning and management
Arduino UNO Q
Arduino UNO Q’s hybrid design makes it the ideal dual-brain platform for your next innovation. It combines a Linux® Debian-capable Qualcomm Dragonwing™ QRB2210 microprocessor with a real-time STM32U585 microcontroller (MCU). It’s Arduino, it’s a computer, it’s anything you want to build.

KEY FEATURES:

  • AI in a blink: Unlock AI-powered vision and sound solutions that react to their environment in real time.Quick start apps: Jumpstart development with plenty of pre-built examples and templates available through Arduino App Lab.Designed to expand: Expandable with Qwiic connector for Modulino nodes, carriers and more.
Chipset
Type Development Kits
MitySOM-QC6490 / 5430
The MitySOM-QC6490 / 5430 is a system on module family featuring a Qualcomm Dragonwing™ QCS6490 or Dragonwing QCS5430 processor with on-board power supplies, an LPDDR5 RAM memory subsystem, and a UFS configuration memory. Specifications: Dragonwing QCS6490 or Dragonwing QCS5430 SoC Processor. - Memory: 8 GB LPDDR5, 256GB Flash. - Power: 5-12Vdc Input, generated on board. - Interfaces: 2x PCIe Gen 3 (1x 1 lane, 1x 2), 5x MIPI x4 input + DSI output, USB 3.1 Gen 2, USB 2.0. - Mechanical: 45mm x 45mm (1.77″ x 1.77″).

KEY FEATURES:

  • Production-ready system on module
  • Expanded interfaces for industrial use cases
  • Long-term support expected through July 2036 with the Critical Link Product Longevity Program
Type System-on-Modules
COREXOM R6490WGQ SOM
COREXOM R6490WGQ SOM – Powered by the Qualcomm® QCS6490 SoC, the R6490WGQ SOM features the Qualcomm® Kryo™ 670 CPU and a fused AI-accelerator in the Qualcomm® Hexagon™ processor, offering exceptional computational power with energy efficiency. It supports up to five MIPI CSI interfaces, triple ISPs, 4K@60FPS video decoding, and 4K@30FPS encoding. With a wide range of external interfaces like GPIO, UART, I2C, SPI, DSI, USB 3.1, and PCIe, plus integrated GPS and Wi-Fi 6E/Bluetooth, it’s ideal for complex IoT applications.Supporting Android, Ubuntu, Linux, and Windows 11 IoT Enterprise, this SOM is designed to reduce design complexity and speed up time to market. It’s perfect for rugged handhelds, tablets, POS, kiosks, AI Box, AI cameras, robotics, and HMI, enabling developers to efficiently bring innovative products to market.

KEY FEATURES:

  • High Performance Qualcomm® 6nm QCS6490 SoC
  • 8G / 128GB uMCP
  • AI Performance: Up to 12 TOPS
  • Five 4-lane MIPI-CSIs; 3x ISP@22MP, 2x IFE lite
  • Support Wi-Fi 6E / BT, and GPS
  • Supports Android, Linux, Ubuntu, Windows 11 IoT Enterprise
Chipset
Type System-on-Modules
MRD5165 SOM
The MRD5165 SOM (System on Module) integrates advanced AI-ML and IoT technologies within a compact form-factor, powering the next generation of high-compute, low-power smart robots, intelligent machines, autonomous devices, and drones across consumer, enterprise, defense, and industrial sectors. These devices can seamlessly connect over 5G networks.The MRD5165 SOM based on Qualcomm® QRB5165 features a robust heterogeneous computing architecture, complemented by the cutting-edge 5th generation Qualcomm® AI Engine, delivering an impressive 15 Trillion Operations Per Second (TOPS) of AI performance. This computational power efficiently handles complex AI and deep learning workloads, along with on-device edge inferencing, making it exceptionally well-suited for autonomous drone and robotics applications. 

KEY FEATURES:

  • Powerful ISP supports 6 concurrent cameras & computer vision engine for video analytics
  • Multiple high-speed interconnects w/ storage, LTE, high-speed wireless/radio etc.
  • Seamlessly blends AI, ML & IoT for autonomous machines and smart devices
Chipset
Type System-on-Modules
MRD5165 Eagle - Kit
MRD5165 Eagle Kit is an Advanced drone controller built around Qualcomm® QRB5165 SoC and Cube Pilot’s Cube Orange+ FCU. MRD5165 Eagle kit delivers high-performance & high-accuracy AI/ML inferencing technology to facilitate accelerated development of innovative, power-efficient, Edge-computing platform for robots, aerial vehicles, industrial PC, and applications. Kit supports various wireless connectivity for real-time communication including 802.11n/ac with option to connect 5G and 802.11 ax.Eagle Kit, is a high-compute, AI-enabled, low-power processor with 8GB LPDDR5 PoP memory, 128GB UFS storage for video analytics applications. It includes various peripheral connections such as 6 MIPI CSI cameras, an HDMI Camera, USB 3.0 ports, a Micro USB port for debugging, and a Gigabit Ethernet port for wired connectivity. 

KEY FEATURES:

  • MRD5165 is an integrated powerful platform designed for next-gen AI-Enabled autonomous systems.
  • Kit integrates independent FCU, HDMI-input, multiple tracking camera input to support VSLAM
  • 802.11n/ac/ax further enhances the connectivity on Ubuntu 20.04 and ROS 2.0.
Chipset
PMK8002,QCA6391,PM8009...
Type Development Kits
qSmartAI80_CUQ610 - Qualcomm AI vision kit with multi-camera support
qSmartAI80_CUQ610 is a ready-to-deploy AI vision kit based on the Qualcomm® QCS610 processor with powerful AI processing capabilities. This Qualcomm vision kit comprises of e-con's Sony STARVIS IMX415 based 4K MIPI CSI-2 camera module, a SoM based on Qualcomm® QCS610 SoC, and a carrier board.This Qualcomm camera kit is suited for running image-based machine learning and deep learning models at the edge making it perfect for industrial and retail applications. In addition, this is a multi-camera solution enabling an extended field of view for applications that need to cover a large area or scene. e-con Systems also provides all the necessary customization services for this AI vision development kit including the camera, carrier board, BSP, software, and enclosure.

KEY FEATURES:

  • AI Vision Kit based on Qualcomm® QCS610/410 SoC *
  • 4K ultra low light camera based on Sony Starvis IMX415 sensor
  • Multi-camera support (Supports upto 3 cameras)
  • Qualcomm neural processing SDK for AI
Chipset
Type Development Kits
Classic R
Classic R is a user-centric, easy-to-use hearing aid powered by RelaJet AI Speech Enhancement Engine. This unique technology allows Classic R to capture and enhance the human voice, while being constantly updated to offer users the best hearing experience under any scenario.

KEY FEATURES:

  • Better Hearing Experience - RelaJet AI Speech Enhancement Engine
  • Sustainable design - Replaceable lithium battery
  • User interaction - Qualcomm Technologies chipset with Bluetooth® compatibility & Qualcomm® tuning APP
Chipset
Type Reference Design Platforms
SOMW5P, Beacon W5+ System-on-Module (SoM)
The W5+ SoM was engineered to be both energy efficient and powerful, yet small enough to fit into portable or wearable devices where space optimization is key. It includes a Qualcomm® SW5100 SoC, ensuring lighting-fast processing power. With a 250 MHz processor, it’s proficient at managing low-power tasks, allowing devices to operate for extended periods with ultra-low battery usage. The included NPU is ideal for AI and machine learning applications. The Beacon W5+ SoM also has HiFi5 DSP, dual Qualcomm Hexagon QDSP V66K DSPs, and a Qualcomm Adreno 702 GPU. The SoM has onboard LPDDR4 memory, eMMC, Wi-Fi, and Bluetooth in a package size of 15x27 mm. The Beacon W5+ leverages an advanced chipset design that gives engineers a robust yet easy to integrate solution for creating cutting-edge connected devices. The SoM is ideal for regulated applications in the medical device, aerospace/defense, and transportation/industrial industries. 

KEY FEATURES:

  • Supports Android
  • 2GB LPDDR4X, 32GB eMMC
  • Bluetooth 5.3 Bluetooth Low Energy Support, Wi-Fi 802.11a/b/g/n 1x1
  • Up to 4 lanes MIPI-DSI
  • 4-lane x2 MIPI-CSI, D-PHY v1.2 and C-PHY v1.0
  • '-5C to +70C temp range
  • Manufactured in the USA
Chipset
Type System-on-Modules
MitySOM-QC6490/5430 Development Kit
The MitySOM-QC6490/5430 Development Kit supports Critical Link’s Qualcomm Dragonwing QCS6490 and QCS5430-based system on modules.Each Dev Kit comes complete with all the connectivity needed in any application well suited for the MitySOM-QC6490/5430, including an on-board UART to Micro-USB Port, dual USB 2.0 Host Ports, one 3.1 USB Type-C with Display Port, one 1.4 Display Port connector, five MIPI camera interface ports, one 8-bit eMMC up to 64GB and one 3.5mm 4-conductor audio interface. The kit also includes an E-key M.2 connector, a 2 channel PCIe port, and two 34-pin 0.1” headers with direct connections to the QCS6490/5430 processor supporting GPIO, SPI, I2C, SoundWire, I2S and Slimbus peripherals.Additional details can be found at https://www.criticallink.com/product/mitysom-qc6490-5430-development-kit/

KEY FEATURES:

  • Full-featured development kit for Critical Link's QCS6490 and QCS5430-based system on modules
  • MitySOM system on modules are production-ready industrial solutions, designed for long term availability and performance
  • Developers have access to dev board design files to jump start their own baseboard design, as well as lifetime access to Critical Link's wiki-based support as well as our US-based engineering support team
Type Development Kits

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