COM-HPC Mini Computer-on-Module based on Qualcomm Dragonwing™ IQ-X Series

Aikri-22X-90AD-4 development kit is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 kit comprises Qualcomm® QCS2290-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

Aikri-22X-90AS-4 System-on-Module (SoM) is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

The Snapdragon® 845 Mobile Platform includes high performance camera and graphics features that are designed to capture advance color information. Qualcomm® Adreno™ 630 GPU and Qualcomm Spectra™ 280 ISP has enabled vivid graphics, crystal-clear audio and improved area awareness, making Snapdragon 845 Mobile Platform ideal for real-life experience solution. To support the ecosystem of technology companies and application providers looking to utilize these advanced features, eInfochips is offering a Hardware Development Kit (HDK) featuring the Snapdragon SDA845 processor. This development kit is designed to help OEMs and device makers in evaluating the processor and peripherals; an ideal starting point for creating high-performance mobile devices, software development and applications.

The BTM581 Bluetooth module features the Qualcomm® QCC5181 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz). It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth earbuds, headsets, and USB Dongle applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

CQ10 is an LTE Cat 1 module with 2G fall back supporting 3GPP release 10 designed for IoT and M2M applications. It delivers a maximum data rate of 10 Mbit/s DL & 5 Mbit/s UL. It has a compact LGA form factor. CQ10 supports In-built GNSS with Qualcomm® Location Suite Gen8C Lite (GPS, GLONASS, BeiDou/Compass, Galileo and QZSS), for precise and dependable positioning. CQ10 supports VoLTE and SMS over IMS/SG/CS and supports wide set Internet protocols and industry-standard interfaces. The CQ10 Module is available in five regional variants, CQ10-EAJ for Eurasia & Japan, CQ10- NA for North America CQ10-IN for India, CQ10-AN for Australia & New Zealand, CQ10-LA for Latin America along with a worldwide variant, CQ10-WW, for global deployments. CQ10 is ideal for IoT applications such as asset tracking, automotive, e-mobility, data loggers, fleet management and environmental monitoring.

Classic R is a user-centric, easy-to-use hearing aid powered by RelaJet AI Speech Enhancement Engine. This unique technology allows Classic R to capture and enhance the human voice, while being constantly updated to offer users the best hearing experience under any scenario.

Powerfoyle is groundbreaking solar-cell technology, invented and produced in Sweden by Exeger and designed to power electronic devices with indoor and outdoor light.Exeger reference design for integration with Qualcomm Technologies, Inc. development boards, File contains guide, schematic and source code for Qualcomm ® QCC5171 module with Bluetooth connectivity.

LTE Cat.1. The SIM7500 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7500 series adopts LGA form factor and has a compact size of 24mm*27mm which makes it ideal for compact product design.

LTE Cat.1. The SIM7500 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7500 series adopts LGA form factor and has a compact size of 24mm*27mm which makes it ideal for compact product design.

LTE Cat.1. The SIM7500 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7500 series adopts a LGA form factor and has a compact size of 24mm*27mm which makes it ideal for compact products design.

LTE Cat.1. The SIM7500 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7500 series adopts LGA form factor and has a compact size of 24mm*27mm which makes it ideal for compact products design.

LTE Cat.1 Module. The SIM7600 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7600 series adopts a LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600/SIM7600-H series(LTE modules) , which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product for a customer.

LTE Cat.1 The SIM7500 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7500 series adopts a LGA form factor and has a compact size of 24mm*27mm which makes it ideal for compact products designs.

LTE Cat.1 Module The SIM7600 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7600 series adopts a LCC1 form factor and is compatible with SIM5320/SIM5360 series(UMTS/HSPA+ modules), and SIM7600/SIM7600-H series(LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product for a customer.

LTE Cat.1. The SIM7500 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7500 series adopts a LGA form factor and has a compact size of 24mm*27mm which makes it ideal for compact products designs.

LTE Cat.1 Module The SIM7600 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7600 series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600/SIM7600-H series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product for customers.

LTE Cat.4 Module The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

LTE Cat.4 Module. SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.

LTE Cat.1 Module. The SIM7600 series is the LTE Cat 1 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. The SIM7600 series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600/SIM7600-H series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product for a customer.