Tiny (21mm x 17mm) low-power dynamic mesh module for rapid prototyping of mesh-enabled products. Multi-channel, multi-node relay of video, voice, and data with highly secure AES-256 encryption implemented in the DSP. A self-healing dynamic mesh protocol with auto-search and connect with group members, while dynamically optimizing the RF links between nodes in real-time. Wideband voice with virtually unlimited users per channel with 5 simultaneous talkers. Video relay to extend the reach for robots and drones, adding hundreds of meters per hop. Provision to mix streams and to relay device control data across the mesh network. For details see: https://elaratek.com/wp-content/uploads/2026/08/Mesh_Module-2026.pdf

TurboX I8275 Development Kit is an evaluation platform designed to accelerate development with the TurboX I8275 SOM family. The initial configuration integrates the I8275-AC SOM, providing up to 20 TOPS of AI performance for machine vision, robotics and industrial IoT evaluation. 2 3 The 120 mm x 100 mm carrier board provides HDMI and DisplayPort outputs, three MIPI CSI camera connectors, multiple USB interfaces, Gigabit Ethernet, M.2 Key M and Key E expansion, a 40-pin expansion connector and 12V power input. Qualcomm® Linux is supported for application development and system evaluation. 4 5 Initial development kit samples are targeted for late November to early December 2026, subject to PCB availability, board bring-up and validation.

SECO SOM-COMe-CT6-Dragonwing-IQ9 is a compact, high-performance COM Express Type 6 System-on-Module powered by the Qualcomm Dragonwing™ IQ9 platform, designed for demanding industrial Edge AI applications. Combining on-device AI acceleration, advanced multimedia capabilities and industrial-grade reliability, it supports low-latency inference and vision-intensive workloads for robotics, AMR/AGV, machine vision, intelligent HMI and industrial automation systems.

The Telit Cinterion FE990B40 LGA module family enables next-generation, high-performance 5G LGA modules. They feature 5G sub-6 technology with Gigabit LTE and WCDMA support, plus a state-of-the-art multi-constellation GNSS receiver.

The TRIA SM2S-QCS6490 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS6490 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS6490 integrates Qualcomm® Kryo™ 670 CPU which contains up to eight cores: four Arm® Cortex®-A78 cores, four Arm® Cortex®-A55 cores, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K60 and many different display connictities (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with upto 12 TOPS at low power and massive camera support with 4 MIPI-CSI inputs.

The FE910C04 mPCIe enable 5G mid-speed connectivity relying on the latest 3GPP Release 17 RedCap technology. It levels up performance and efficiency compared to LTE, promising the highest level of flexibility by offering customers to move to a secure 5G future easily.

The Telit Cinterion FE990D60 delivers next‑generation, high‑performance 5G connectivity. The module features 5G sub-6 technology with Gigabit LTE and WCDMA support, along with innovative multi constellation GNSS. Built on the Qualcomm® Snapdragon® X85 5G Modem‑RF system and compliant with 3GPP Release 18, it is ideal for advanced industrial and enterprise applications.

The LN920 is an M.2 (NGFF) compact data card with versions available in Category (Cat) 12 and 6 worldwide. They are pre-certified by Tier 1 operators and ideal for mobile computing and IIoT gateways and routers.

The MSC SM2S-QCS5430 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS5430 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS5430 integrates Qualcomm® Kryo™ 670 CPU which contains up to six cores, Qualcomm® Adreno™ 642L GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K30 and many different display connectivity (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with up to 3.5 TOPS at low power and massive camera support with 4 MIPI-CSI inputs

This collaboration centers on the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm Dragonwing™ IQ-9075 SoC featuring an 8-core Qualcomm® Kryo™ Gen 6 CPU and a Qualcomm® Adreno™ 663 GPU, enabling 100 TOPS dense or up to 200 TOPS sparse AI compute. Under defined 30W test scenarios, the EXMP-Q911 achieves up to 10× higher AI inference FPS compared to similar modules when running the YOLOv10n object detection model across 10 concurrent video channels. Designed for demanding edge workloads, the EXMP-Q911 integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, paired with a rich set of high-speed interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP 1.2, MIPI CSI-2, CAN FD, and more, providing exceptional connectivity and performance density for compact edge AI systems.

AK9569 is a highly integrated single chip one slot USB Contact Smart Card Reader controller. AK9569 supports multiple international standards including ISO7816 for IC card standard, PC/SC 2.0 for windows smart card standard, Microsoft WHQL, EMV for Europay MasterCard Visa standard and USB-IF CCID standard.

The BTM395 Bluetooth module features the Qualcomm® QCC3095 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz) technology. It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth speaker, headsets, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

ASM1352R is ASMedia’s single chip solution to bridge the USB 3.1 Gen2 to dual SATA interface. ASM1352R supports one USB 3.1 Gen2 ports and two SATA device ports, enabling USB PHY up to 10Gbps in compliance with USB 3.1 specifications and enabling Serial ATA PHYs up to 6Gbps high speed interface, following Serial ATA Revision 3.2 Specification.

ASM1162, a SATA host controller(AHCI) with upstream PCIe Gen3 x1 and downstream two SATA Gen3 ports. It's a low latency, low cost and low power AHCI controller. With two SATA ports and cascaded port multipliers, ASM1162 can enable users to build up various high speed IO systems, including server, high capacity system storage or surveillance platforms.

ASM1153E is the ASMedia third generation single chip solution, bridging the USB3.0 to Serial ATA host interface with highly integrated SuperSpeed USB3.0, High Speed USB2.0 and SATA1.5/3.0/6.0 Gbps ASMedia self-designed PHYs. Along with excellent compatibility with USB3.0 hosts and SATA devices, ASM1153E uses advanced process technology to optimize the chip power consumption. 

ASM2812, a low latency, low cost and low power 12 lane, maximum 6 downstream ports packet switch. With upstream PCIe Gen3x4 bandwidth, ASM2812 can enable users to build up various high speed IO systems, including server, system storage or communication platforms.

The BTM581 Bluetooth module features the Qualcomm® QCC5181 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz). It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth earbuds, headsets, and USB Dongle applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

The BTM383 Bluetooth module features the Qualcomm® QCC3083 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz). It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth speaker applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

The BTM386 Bluetooth module features the Qualcomm® QCC3086 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz) technology. It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC).Suitable for USB Dongle applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

ASM3142supports two USB3.1 Gen-II ports and perform trusting high speed bandwidth with PCI Express Gen-III x2 supporting. It uses advance process with low voltage supply, following standard PCI Express/USB bus power management and advance chip power management to reduce total power consumption efficiently under idle/standby state.