COM-HPC Mini Computer-on-Module based on Qualcomm Dragonwing™ IQ-X Series

This Wi‑Fi SDIO module is a single-stream wireless solution supporting IEEE 802.11a/b/g/n/ac connectivity and is based on the Qualcomm® QCA9377 System-on-Chip. The module supports Wave 2 MU-MIMO (client mode), which is designed to improve network efficiency in compatible WLAN environments compared with earlier 802.11n implementations. Its compact form factor, feature set, and power-conscious design make it well suited for portable-device applications.

Tiny (21mm x 17mm) low-power dynamic mesh module for rapid prototyping of mesh-enabled products. Multi-channel, multi-node relay of video, voice, and data with security focused AES-256 encryption implemented in the DSP. A self-healing dynamic mesh protocol with auto-search and connect with group members, while dynamically optimizing the RF links between nodes in real-time. Wideband voice with virtually unlimited users per channel with 5 simultaneous talkers. Video relay to extend the reach for robots and drones, adding hundreds of meters per hop. Provision to mix streams and to relay device control data across the mesh network. For details see: https://elaratek.com/wp-content/uploads/2026/08/Mesh_Module-2026.pdf

Smux 5.0 Support NFC AI Touchpad Implement

IT8987 is a highly integrated embedded controller with system functions suitable for mobile system applications. The IT8987 directly interfaces to the LPC bus and provides ACPI embedded controller function, keyboard controller (KBC) and matrix scan, PWM and ADC for hardware monitor, PS/2 interface for external keyboard/mouse devices, BRAM, CIR, and system wakeup functions for system power management.

IT81202 is a 32-bit RISC-V Micro-controller and a highly integrated embedded controller with system functions suitable for mobile system applications.

Aikri-22X-90AD-4 development kit is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 kit comprises Qualcomm® QCS2290-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

Aikri-22X-90AS-4 System-on-Module (SoM) is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

The Aikri-40X-5LD-1 development kit comprises of the Qualcomm® QCS405 based SoM mounted on a carrier board, interfaced with a mezzanine board. All native interfaces that the QCS405 supports, such as GPIOs, USB 3.0, PCIe, HDMI, SDIO, I2S, UART, I2C, and SPI are made available on the development kit. The Aikri development kit with QCS405 helps kick-start and optimize your creation of complex, feature-rich smart-audio solutions such as Smart-speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc. within a short turnaround time.

The Aikri-40X-4LD-1 development kit comprises of the Qualcomm® QCS404 based SoM mounted on a carrier board, interfaced with a mezzanine board. All native interfaces that the QCS404 supports, such as GPIOs, USB 3.0, PCIe, SDIO, I2S, UART, I2C, and SPI are made available on the development kit. The Aikri development kit with QCS404 helps kick-start and optimize your creation of complex, feature-rich smart-audio solutions such as Smart speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc. within a short turnaround time.

The Aikri-40X-5LS-1 System on Module (SoM) is powered by Qualcomm® QCS405 SoC, which is designed specifically for smart audio applications. The QCS405 supports features such as Multi-mic Qualcomm® Noise and Echo Cancellation that isolates noisy environments from voice, simultaneous multi-keyword detection to aid voice services. This production-ready SoM has a Yocto Linux BSP pre-loaded and helps manufacturers easily create complex, feature-rich, and voice-supported smart audio applications such as Smart speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc.

The Aikri-40X-4LS-1 System on Module (SoM) is powered by Qualcomm® QCS404 SoC, which is designed specifically for smart audio applications. The QCS404 supports features such as Multi-mic Qualcomm® Noise and Echo Cancellation that isolates noisy environments from voice, simultaneous multi-keyword detection to aid voice services. This production-ready SoM has a Yocto Linux BSP pre-loaded and helps manufacturers easily create complex, feature-rich, and voice-supported smart audio applications such as Smart speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc.

The eInfochips 855 hardware development kit (HDK) is based on Snapdragon® 855 processor that offers next generation on-device AI capabilities to make voice, camera, gaming and power management smarter, faster and more intuitive. This HDK is an ideal platform to kick-start development of embedded devices for AR/VR, infotainment, 4K cameras as well as automation solutions. The main purpose of Snapdragon 855 HDK is to kick start development and testing of devices for original equipment manufacturers (OEMs), hardware/software vendors and developers for faster time to market.

The Snapdragon® 845 Mobile Platform includes high performance camera and graphics features that are designed to capture advance color information. Qualcomm® Adreno™ 630 GPU and Qualcomm Spectra™ 280 ISP has enabled vivid graphics, crystal-clear audio and improved area awareness, making Snapdragon 845 Mobile Platform ideal for real-life experience solution. To support the ecosystem of technology companies and application providers looking to utilize these advanced features, eInfochips is offering a Hardware Development Kit (HDK) featuring the Snapdragon SDA845 processor. This development kit is designed to help OEMs and device makers in evaluating the processor and peripherals; an ideal starting point for creating high-performance mobile devices, software development and applications.

The eInfochips 865 hardware development kit (HDK) is based on Snapdragon® 865 processor (SM8250). The HDK offers intelligent on-device AI, 2-gigapixel-per-second camera speeds, and high-end graphics at low power consumption. This feature-rich Android 10 development platform is an ideal starting point for integration and innovation of connected devices. The main purpose of Snapdragon 865 HDK is to kick start development and testing of devices for original equipment manufacturers (OEMs), hardware/software vendors and developers for faster time to market. This HDK is an ideal platform to kick-start development of embedded devices for Gaming, AR/VR, infotainment, 4K cameras as well as automation solutions.

Rambutan is based on Qualcomm® QCA9557 or Qualcomm® QCA9550 SoC and comes in two temperature ranges: commercial* (Rambutan) and industrial** (Rambutan-I).It is a surface-mountable, dual-sided, Wi-Fi enabled Linux module. Dual-band radio (2.4 or 5 GHz), powerful 720 MHz CPU, 300 Mbps data rate, 128 MB RAM and Flash, and a development kit with multiple interfaces (e.g. Gigabit Ethernet port, PCIe, hardware SPI, etc.) are the main advantages of the Rambutan module. Commercial temperature range: 0-65°C, **Industrial temperature range: -40-85°C

Rambutan DVK from 8devices is a thoughtfully designed development kit tailored for the commercial version of the Rambutan system-on-module (SOM). Powered by the advanced Qualcomm® QCA9557 SoC, this high-performance kit seamlessly integrates a wide range of essential interfaces, including Gigabit and Fast Ethernet ports, USB Type-C and USB2.0 connectors, integrated Dual-band antennas, programmable buttons, and more. The Rambutan supports the embedded Linux framework FirmUx from 8devices. The software can be also built by using OpenWRT. Unleash the full potential of your Rambutan projects with this exceptional development kit.

The Telit Cinterion FE990B40 LGA module family enables next-generation, high-performance 5G LGA modules. They feature 5G sub-6 technology with Gigabit LTE and WCDMA support, plus a state-of-the-art multi-constellation GNSS receiver.

This module includes Qualcomm® 9205 LTE modem, offers global bands support for worldwide deployments. Miniature x310 family with flexible perimeter footprint and pin-to-pin compatibility • Multimode LTE Cat-M1 / NB2 • Size: 13.1mm x 14.3mm x 2

The FE910C04 mPCIe enable 5G mid-speed connectivity relying on the latest 3GPP Release 17 RedCap technology. It levels up performance and efficiency compared to LTE, promising the highest level of flexibility by offering customers to move to a secure 5G future easily.