--- markdown_generated_at: "2026-11-04" title: "Member Offerings" url: "https://www.qualcomm.com/support/partner/member-offerings" --- # Member Offerings Explore offerings powered by Qualcomm® technologies to drive innovation and commercialize faster. ## Filter 588 results **Offerings** - Development Hardware (588) - End Devices (440) - Peripherals (147) - Services (56) - Software (116) - Solution (2) **Filters** **Track** - Audio & Hearables Track - Industrial & Embedded IoT Track **Type** - Development Kits - Evaluation Boards - Expansion Boards - Reference Design Platforms - Single-Board Computers **Chip Products** - APQ8009W - APQ8016E - APQ8053 - APQ8096 - AR9280 **Company** - 8devices - ADLINK Technology Inc. - Advantech Co., Ltd. - Alango Technologies Ltd. - Algoltek, Inc. **Operating System** - Android - Android 13 - FreeRTOS - Hypervisor - Linux **Application** - AR device - Access Point - Body Worn Camera - Dash Camera - Desktop PC **Industry** - Aerospace - Agriculture - Automotive - Consumer Electronics - Defense **Regions served** - Africa - Americas - Asia - Europe - Oceania 588 results ![](https://d28eiw7gjp7gcv.cloudfront.net/hardware/partner/a1VQo00000CVcJpMAL_0.PNG) ### [SX-SDMAC](https://www.qualcomm.com/support/partner/member-directory/member.a158X00000EuTUAQA3.id-a1VQo00000CVcJpMAL) This Wi‑Fi SDIO module is a single-stream wireless solution supporting IEEE 802.11a/b/g/n/ac connectivity and is based on the Qualcomm® QCA9377 System-on-Chip. The module supports Wave 2 MU-MIMO (client mode), which is designed to improve network efficiency in compatible WLAN environments compared with earlier 802.11n implementations. Its compact form factor, feature set, and power-conscious design make it well suited for portable-device applications. **KEY FEATURES:** - Low Power Dual-Band 1x1 module for Wi-Fi & Bluetooth® - Based on the QCA9377-3 chipset - 802.11 a/b/g/n/ac Wave 2 MU-MIMO - Bluetooth 5.0 BR/EDR/LE Smart Ready - SDIO 3.0 WLAN host interface - On-chip Power Management Unit (PMU) - Link Rate upto 433 Mbps - On-board and u. antenna options - Supports enterprise security, seamless roaming and CCX - Fine tuned calibration per module - FCC/IC/CE/MIC modular certification - Connector mount, surface mount, and SDIO card form factor By: [SILEX TECHNOLOGY, INC.](https://www.qualcomm.com/support/partner/member-directory/member.a158X00000EuTUAQA3) Chipset: [QCA9377](https://www.qualcomm.com/wi-fi/products/qca9377) Type: System-on-Modules Buy Now ![](https://d28eiw7gjp7gcv.cloudfront.net/hardware/partner/a1V8X000006ymuXUAQ_0.jpg) ### [SonoKlara Wireless Mesh Intercom](https://www.qualcomm.com/support/partner/member-directory/member.a158X00000CSxAHQA1.id-a1V8X000006ymuXUAQ) Tiny (21mm x 17mm) low-power dynamic mesh module for rapid prototyping of mesh-enabled products. Multi-channel, multi-node relay of video, voice, and data with security focused AES-256 encryption implemented in the DSP. A self-healing dynamic mesh protocol with auto-search and connect with group members, while dynamically optimizing the RF links between nodes in real-time. Wideband voice with virtually unlimited users per channel with 5 simultaneous talkers. Video relay to extend the reach for robots and drones, adding hundreds of meters per hop. Provision to mix streams and to relay device control data across the mesh network. For details see: https://elaratek.com/wp-content/uploads/2026/08/Mesh_Module-2026.pdf **KEY FEATURES:** - Dynamic mesh intercom for video, wideband voice and data - Virtually unlimited users per channel with 5 simultaneous talkers - Video relay and control data transfer to extend reach for robots and drones - Security-focused comms with AES-256 implemented in the DSP - Mature technology, used in end-user devices for many years - Demo & trial units available for mesh intercom By: [ELARATEK LTD.](https://www.qualcomm.com/support/partner/member-directory/member.a158X00000CSxAHQA1) Chipset: [CSR8670](https://www.qualcomm.com/audio/products/csr8670) Type: System-on-Modules Buy Now ![](https://d28eiw7gjp7gcv.cloudfront.net/hardware/partner/a1VJx00000e1w1JMAQ_0.PNG) ### [ELAN Touchpad Gen 8](https://www.qualcomm.com/support/partner/member-directory/member.a158X00000FKGbzQAH.id-a1VJx00000e1w1JMAQ) Smux 5.0 Support NFC AI Touchpad Implement **KEY FEATURES:** - Self-Verified By: [ELAN MICROELECTRONICS CORP.](https://www.qualcomm.com/support/partner/member-directory/member.a158X00000FKGbzQAH) Chipset: [X2E88100](https://www.qualcomm.com/laptops/products/snapdragon-x2-elite) Type: System-on-Modules ![](https://d28eiw7gjp7gcv.cloudfront.net/hardware/partner/a1V8X00000BFb3oUAD_0.JPEG) ### [IT8987](https://www.qualcomm.com/support/partner/member-directory/member.a158X00000EqhELQAZ.id-a1V8X00000BFb3oUAD) IT8987 is a highly integrated embedded controller with system functions suitable for mobile system applications. The IT8987 directly interfaces to the LPC bus and provides ACPI embedded controller function, keyboard controller (KBC) and matrix scan, PWM and ADC for hardware monitor, PS/2 interface for external keyboard/mouse devices, BRAM, CIR, and system wakeup functions for system power management. **KEY FEATURES:** - Snapdragon Compute Verified By: [ITE TECH. INC.](https://www.qualcomm.com/support/partner/member-directory/member.a158X00000EqhELQAZ) Chipset: [SC7280,](https://www.qualcomm.com/laptops/products/snapdragon-7c-plus-gen-3-compute-platform) [SC7180,](https://www.qualcomm.com/laptops/products/snapdragon-7c-gen-2-compute-platform) SC7180P ... Type: Reference Design Platforms ![](https://d28eiw7gjp7gcv.cloudfront.net/hardware/partner/a1V8X00000BFb35UAD_0.JPEG) ### [IT81202](https://www.qualcomm.com/support/partner/member-directory/member.a158X00000EqhELQAZ.id-a1V8X00000BFb35UAD) IT81202 is a 32-bit RISC-V Micro-controller and a highly integrated embedded controller with system functions suitable for mobile system applications. **KEY FEATURES:** - Self- Verified By: [ITE TECH. INC.](https://www.qualcomm.com/support/partner/member-directory/member.a158X00000EqhELQAZ) Chipset: [SC7280](https://www.qualcomm.com/laptops/products/snapdragon-7c-plus-gen-3-compute-platform) Type: Reference Design Platforms ![](https://d28eiw7gjp7gcv.cloudfront.net/hardware/partner/a1V6f00000aaegJEAQ_0.JPEG) ### [Inforce 6310™ Micro Single Board Computer (SBC)](https://www.qualcomm.com/support/partner/member-directory/member.__.id-a1V6f00000aaegJEAQ) Inforce 6310™ Micro Single Board Computer (SBC) powered by the Qualcomm® SDA450 platform provides vibrant displays and immersive multimedia experiences. It enables concurrent 1080p60 fps HDMI output and 1080p60 fps camera encode. It is designed exclusively to drive digital signage and display use-cases by enabling distribution of your full HD resolution video content smoothly. **KEY FEATURES:** - Dual Image Signal Processors enhancing audio, video, and computer vision - Advanced Graphics & 3D Gaming - LTE Connectivity & all day Battery Life By: SMART WIRELESS COMPUTING Chipset: WCN3680B, SDA450 Type: Single-Board Computers Buy Now ![](https://d28eiw7gjp7gcv.cloudfront.net/hardware/partner/a1V6f00000aaegEEAQ_0.JPEG) ### [Inforce 6560™ Micro Single Board Computer (SBC)](https://www.qualcomm.com/support/partner/member-directory/member.__.id-a1V6f00000aaegEEAQ) The Inforce 6560 Single Board Computer (SBC) combines the heterogeneous compute capabilities of the Qualcomm® SDA660 SoC with 2x2 802.11ac Wi-Fi, Bluetooth 5.x, a full-featured USB-C interface with UltraHD display capability, an integrated battery charging circuitry with battery header, an onboard RTC, and ample internal memory to make it a complete 4K encode/decode plug-n-play system. Qualcomm® AI Engine enables advanced visual computing, enhanced graphics, and machine learning capabilities. **KEY FEATURES:** - Dual Streaming perfect for Proximity Detection, Semantic Segmentation, Autonomous Driving, and Facial Recognition. - Ideal for IoE edge devices for healthcare, smart cities, digital signage, smart cameras. By: SMART WIRELESS COMPUTING Chipset: WCN3990, PM660L, [SDA660](https://www.qualcomm.com/processors/application-processors/products/sda660) ... Type: Single-Board Computers Buy Now ### [Inforce 6640™ Single Board Computer (SBC)](https://www.qualcomm.com/support/partner/member-directory/member.__.id-a1V6f00000aaedUEAQ) The Inforce 6640 SBC is based on Qualcomm® APQ8096 processor equipped with the Qualcomm® AI Engine and the Qualcomm Spectra™ camera ISP to enable high-end industrial IoT applications, video analytics, advanced medical imaging and teleconferencing use-cases. It has dual band WiFi, Bluetooth 4.0, 4K HDMI-Input and concurrent dual HDMI Outputs rendering capability a complete solution for Capturing & Streaming UHD Video content. **KEY FEATURES:** - Perfect for Industrial IoT applications, video analytics, medical imaging, & teleconferencing - WIFI, Bluetooth 4.0, 4K HD, & Dual HDMI Output By: SMART WIRELESS COMPUTING Chipset: [WCD9335,](https://www.qualcomm.com/audio/applications/compute-and-mobile-audio/products/wcd9335) WGR7640, APQ8096 Type: Single-Board Computers Buy Now ![](https://d28eiw7gjp7gcv.cloudfront.net/hardware/partner/a1V8X000009KXczUAG_0.PNG) ### [Aikri QCS2290: Aikri-22X-90AD-4](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE.id-a1V8X000009KXczUAG) Aikri-22X-90AD-4 development kit is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 kit comprises Qualcomm® QCS2290-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras. **KEY FEATURES:** - 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP - 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and Bluetooth 5.0 - OS: Android 12, Kernel 4.19; Dimensions: 85mm x 54mm By: [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE) Chipset: [QCS2290](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290) Type: Development Kits Buy Now ![](https://d28eiw7gjp7gcv.cloudfront.net/hardware/partner/a1V8X000009KXcaUAG_0.PNG) ### [Aikri QCS2290: Aikri-22X-90AS-4](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE.id-a1V8X000009KXcaUAG) Aikri-22X-90AS-4 System-on-Module (SoM) is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras. **KEY FEATURES:** - 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP - 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0 - OS: Android 12; Dimensions: 58 mm x 39 mm By: [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE) Chipset: [QCS2290](https://www.qualcomm.com/internet-of-things/products/q2-series/qcs2290) Type: System-on-Modules Buy Now ![](https://d28eiw7gjp7gcv.cloudfront.net/hardware/partner/a1V8X000009KXbaUAG_0.PNG) ### [Aikri QCS405: Aikri-40X-5LD-1](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE.id-a1V8X000009KXbaUAG) The Aikri-40X-5LD-1 development kit comprises of the Qualcomm® QCS405 based SoM mounted on a carrier board, interfaced with a mezzanine board. All native interfaces that the QCS405 supports, such as GPIOs, USB 3.0, PCIe, HDMI, SDIO, I2S, UART, I2C, and SPI are made available on the development kit. The Aikri development kit with QCS405 helps kick-start and optimize your creation of complex, feature-rich smart-audio solutions such as Smart-speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc. within a short turnaround time. **KEY FEATURES:** - Qualcomm ® Adreno™ 306 GPU; 2x Qualcomm® Hexagon™ QDSP6 v66 - 1GB LPDDR3 and 8GB eMMC; WCN3999: 2x2 WLAN802.11 a/b/g/ac & Bluetooth® 5.0 wireless technology - OS: Linux, Yocto Thud, Kernel 4.14; Dimensions: 85mm x 54mm By: [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE) Chipset: [QCS405](https://www.qualcomm.com/processors/application-processors/products/qcs400-series/qcs405) Type: Development Kits Buy Now ![](https://d28eiw7gjp7gcv.cloudfront.net/hardware/partner/a1V8X000009KXbVUAW_0.PNG) ### [Aikri QCS404: Aikri-40X-4LD-1](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE.id-a1V8X000009KXbVUAW) The Aikri-40X-4LD-1 development kit comprises of the Qualcomm® QCS404 based SoM mounted on a carrier board, interfaced with a mezzanine board. All native interfaces that the QCS404 supports, such as GPIOs, USB 3.0, PCIe, SDIO, I2S, UART, I2C, and SPI are made available on the development kit. The Aikri development kit with QCS404 helps kick-start and optimize your creation of complex, feature-rich smart-audio solutions such as Smart speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc. within a short turnaround time. **KEY FEATURES:** - 2x Qualcomm® Hexagon™ QDSP6 v66 - 1GB LPDDR3 and 8GB eMMC; WCN3999: 2x2 WLAN802.11 a/b/g/ac & Bluetooth 5.0 - OS: Linux, Yocto Thud, Kernel 4.14; Dimensions: 85mm x 54mm By: [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE) Chipset: [QCS404](https://www.qualcomm.com/processors/application-processors/products/qcs400-series/qcs404) Type: Development Kits Buy Now ![](https://d28eiw7gjp7gcv.cloudfront.net/hardware/partner/a1V8X000009KXbLUAW_0.PNG) ### [Aikri QCS405: Aikri-40X-5LS-1](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE.id-a1V8X000009KXbLUAW) The Aikri-40X-5LS-1 System on Module (SoM) is powered by Qualcomm® QCS405 SoC, which is designed specifically for smart audio applications. The QCS405 supports features such as Multi-mic Qualcomm® Noise and Echo Cancellation that isolates noisy environments from voice, simultaneous multi-keyword detection to aid voice services. This production-ready SoM has a Yocto Linux BSP pre-loaded and helps manufacturers easily create complex, feature-rich, and voice-supported smart audio applications such as Smart speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc. **KEY FEATURES:** - Qualcomm® Adreno™ 306 GPU; 2 x Qualcomm® Hexagon™ QDSP6 v66 - 1GB LPDDR3 and 8GB eMMC; WCN3999: 2x2 WLAN802.11 a/b/g/ac & Bluetooth 5.0 - OS: Linux, Yocto Thud, Kernel 4.14; Dimensions: 65.42 mm X 57.82 mm By: [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE) Chipset: [QCS405](https://www.qualcomm.com/processors/application-processors/products/qcs400-series/qcs405) Type: System-on-Modules Buy Now ![](https://d28eiw7gjp7gcv.cloudfront.net/hardware/partner/a1V8X000009KXbGUAW_0.PNG) ### [Aikri QCS404: Aikri-40X-4LS-1](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE.id-a1V8X000009KXbGUAW) The Aikri-40X-4LS-1 System on Module (SoM) is powered by Qualcomm® QCS404 SoC, which is designed specifically for smart audio applications. The QCS404 supports features such as Multi-mic Qualcomm® Noise and Echo Cancellation that isolates noisy environments from voice, simultaneous multi-keyword detection to aid voice services. This production-ready SoM has a Yocto Linux BSP pre-loaded and helps manufacturers easily create complex, feature-rich, and voice-supported smart audio applications such as Smart speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc. **KEY FEATURES:** - 2 x Qualcomm® Hexagon™ QDSP6 v66 - 1GB LPDDR3 and 8GB eMMC; WCN3999: 2x2 WLAN802.11 a/b/g/ac & Bluetooth® 5.0 wireless technology - OS: Linux, Yocto Thud, Kernel 4.14; Dimensions: 65.42 mm X 57.82 mm By: [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE) Chipset: [QCS404](https://www.qualcomm.com/processors/application-processors/products/qcs400-series/qcs404) Type: System-on-Modules Buy Now ![](https://d28eiw7gjp7gcv.cloudfront.net/qan/qan-logo-a154P0000069Zd9QAE.JPEG) ### [EIC-Q855-210](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE.id-a1V8X000006PETcUAO) The eInfochips 855 hardware development kit (HDK) is based on Snapdragon® 855 processor that offers next generation on-device AI capabilities to make voice, camera, gaming and power management smarter, faster and more intuitive. This HDK is an ideal platform to kick-start development of embedded devices for AR/VR, infotainment, 4K cameras as well as automation solutions. The main purpose of Snapdragon 855 HDK is to kick start development and testing of devices for original equipment manufacturers (OEMs), hardware/software vendors and developers for faster time to market. By: [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE) Type: Development Kits ![](https://d28eiw7gjp7gcv.cloudfront.net/qan/qan-logo-a154P0000069Zd9QAE.JPEG) ### [EIC-Q845-210](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE.id-a1V8X000006PETdUAO) The Snapdragon® 845 Mobile Platform includes high performance camera and graphics features that are designed to capture advance color information. Qualcomm® Adreno™ 630 GPU and Qualcomm Spectra™ 280 ISP has enabled vivid graphics, crystal-clear audio and improved area awareness, making Snapdragon 845 Mobile Platform ideal for real-life experience solution. To support the ecosystem of technology companies and application providers looking to utilize these advanced features, eInfochips is offering a Hardware Development Kit (HDK) featuring the Snapdragon SDA845 processor. This development kit is designed to help OEMs and device makers in evaluating the processor and peripherals; an ideal starting point for creating high-performance mobile devices, software development and applications. **KEY FEATURES:** - The LCD display is an add-on accessory and not part of the standard kit By: [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE) Chipset: [SDA845](https://www.qualcomm.com/internet-of-things/products/q8-series/sda845) Type: Development Kits Buy Now ![](https://d28eiw7gjp7gcv.cloudfront.net/qan/qan-logo-a154P0000069Zd9QAE.JPEG) ### [EIC-Q865-210](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE.id-a1V8X000006PETJUA4) The eInfochips 865 hardware development kit (HDK) is based on Snapdragon® 865 processor (SM8250). The HDK offers intelligent on-device AI, 2-gigapixel-per-second camera speeds, and high-end graphics at low power consumption. This feature-rich Android 10 development platform is an ideal starting point for integration and innovation of connected devices. The main purpose of Snapdragon 865 HDK is to kick start development and testing of devices for original equipment manufacturers (OEMs), hardware/software vendors and developers for faster time to market. This HDK is an ideal platform to kick-start development of embedded devices for Gaming, AR/VR, infotainment, 4K cameras as well as automation solutions. **KEY FEATURES:** - Features Snapdragon Elite Gaming™ Features, Sensing Hub, Artificial Intelligence Engine, Adaptive Audio and Audio Technologies By: [EINFOCHIPS INC.](https://www.qualcomm.com/support/partner/member-directory/member.a154P0000069Zd9QAE) Chipset: [SM8250](https://www.qualcomm.com/smartphones/products/8-series/snapdragon-865-5g-mobile-platform) Type: Development Kits Buy Now ![](https://d28eiw7gjp7gcv.cloudfront.net/hardware/partner/a1V8X000006NBVnUAO_0.PNG) ### [Rambutan](https://www.qualcomm.com/support/partner/member-directory/member.a150B000004NUWoQAO.id-a1V8X000006NBVnUAO) Rambutan is based on Qualcomm® QCA9557 or Qualcomm® QCA9550 SoC and comes in two temperature ranges: commercial* (Rambutan) and industrial** (Rambutan-I).It is a surface-mountable, dual-sided, Wi-Fi enabled Linux module. Dual-band radio (2.4 or 5 GHz), powerful 720 MHz CPU, 300 Mbps data rate, 128 MB RAM and Flash, and a development kit with multiple interfaces (e.g. Gigabit Ethernet port, PCIe, hardware SPI, etc.) are the main advantages of the Rambutan module. Commercial temperature range: 0-65°C, **Industrial temperature range: -40-85°C **KEY FEATURES:** - 2 x USB 2.0, 2 x serial port, 100 Base-T Ethernet port, I2S, SPI, I2C, PCIe, GPIO, MDIO | Max output power per chain 21 dBm | Max power consumption 3.7 W By: [8DEVICES](https://www.qualcomm.com/support/partner/member-directory/member.a150B000004NUWoQAO) Chipset: QCA9550, QCA9557 Type: System-on-Modules Buy Now ![](https://d28eiw7gjp7gcv.cloudfront.net/hardware/partner/a1V8X000006NBVXUA4_0.PNG) ### [Pineapple](https://www.qualcomm.com/support/partner/member-directory/member.a150B000004NUWoQAO.id-a1V8X000006NBVXUA4) The Pineapple PCIe module is based on the Qualcomm® QCN9074 SoC, a highly integrated wireless local area network (LAN) solution designed for 2.4/5/6 GHz IEEE802.11ax/ac/n/g/b/a applications, including the Wi-Fi 6E standard. With support for Wi-Fi 6E, it delivers enhanced performance and expanded frequency options for even higher data rates and reduced interference. The module performs access point (AP) and station (STA) functionality with 4x4 MIMO and 4 spatial streams, ensuring efficient and reliable data transmission. The QCN9074 chip features a dual-synthesizer WLAN radio with native 160 MHz support, further enhancing the module's capabilities. The module is designed for surface-mount installation and can be soldered onto M.2 and miniPCIe cards for seamless integration. The Pineapple supports the embedded Linux framework FirmUx from 8devices. The software can be also built by using OpenWRT. **KEY FEATURES:** - Module Comes in 3 Different Versions:Pineapple 2 | 2400 - 2500MHz frequency range , 28dBm power per chainPineapple 5 | 4920 - 5925MHz frequency range, 27dBm power per chainPineapple 6 | 5925 - 7125MHz frequency range, 27dBm power per chain By: [8DEVICES](https://www.qualcomm.com/support/partner/member-directory/member.a150B000004NUWoQAO) Chipset: QCN5550, QCN9074 Type: System-on-Modules Buy Now ![](https://d28eiw7gjp7gcv.cloudfront.net/hardware/partner/a1V8X000006NDiwUAG_0.JPEG) ### [Rambutan DVK](https://www.qualcomm.com/support/partner/member-directory/member.a150B000004NUWoQAO.id-a1V8X000006NDiwUAG) Rambutan DVK from 8devices is a thoughtfully designed development kit tailored for the commercial version of the Rambutan system-on-module (SOM). Powered by the advanced Qualcomm® QCA9557 SoC, this high-performance kit seamlessly integrates a wide range of essential interfaces, including Gigabit and Fast Ethernet ports, USB Type-C and USB2.0 connectors, integrated Dual-band antennas, programmable buttons, and more. The Rambutan supports the embedded Linux framework FirmUx from 8devices. The software can be also built by using OpenWRT. Unleash the full potential of your Rambutan projects with this exceptional development kit. **KEY FEATURES:** - 1000 Base-T ETH port, Mini-PCIe connector, Hardware SPI, GPIO header, DIP switch for bootstrap configuration - Power supply (+3.3V) and GND headers, USB Type-C connector (console UART+power) By: [8DEVICES](https://www.qualcomm.com/support/partner/member-directory/member.a150B000004NUWoQAO) Chipset: QCA9557 Type: Development Kits Buy Now