This Wi‑Fi SDIO module is a single-stream wireless solution supporting IEEE 802.11a/b/g/n/ac connectivity and is based on the Qualcomm® QCA9377 System-on-Chip. The module supports Wave 2 MU-MIMO (client mode), which is designed to improve network efficiency in compatible WLAN environments compared with earlier 802.11n implementations. Its compact form factor, feature set, and power-conscious design make it well suited for portable-device applications.

The new TRIA SM2S-IQ615 module family is powered by the Qualcomm Dragonwing™ IQ-615 Processor from Qualcomm. The processor integrates eight Arm CPU cores (2x A76 and 6x A55) together with the Qualcomm® Adreno™ 612 GPU and is designed to support Linux-based edge-computing applications. The Qualcomm® Hexagon™ V66 DSP with Dual Hexagon Vector extensions is built to support machine-learning (ML) workloads and AI-enabled applications. The IQ-615 processor incorporates security features including Secure Boot, Secure Debug, Arm TrustZone®, the Qualcomm® Trusted Execution Environment, and hardware-supported KeyStore functionality. TRIA SM2S-IQ615 supports LPDDR4 memory technology and up to 256 GB eMMC flash storage. A broad range of interfaces is available for embedded applications, including dual Gigabit Ethernet, PCI Express Gen 2, USB 2.0/3.1, DisplayPort v1.4, MIPI-DSI, LVDS, and up to three MIPI CSI-2 interfaces for camera connectivity. The module complies with the SMARC 2.2 specification and is designed for integration with SMARC-compatible baseboards. For evaluation and design activities, Tria Technologies provides a development platform and starter kit. A Yocto-based Linux Board Support Package is also available.

The Open-Q™ 615IQ Development Kit is engineered to support evaluation and prototyping with Lantronix’s new industrial SMARC System on Module (SOM) product line. Built around the Qualcomm Dragonwing™ IQ-615 chipset, this kit highlights key features such as MIPI CSI camera, display, Ethernet, audio, and sensor interfaces. Its SMARC standard form factor makes it ideal for proof-of-concept applications in industrial robotics and control systems. The kit also serves as a reference design, showcasing the unique camera and audio interface capabilities of the SOM.

The Open-Q™ 6490CS SMARC SOM Development Kit is a development platform built to support evaluation and prototyping for Lantronix's SMARC System on Module (SOM) product line. Powered by the Qualcomm Dragonwing™ QCS6490 chipset, the kit is engineered to support proof-of-concept development for computer-vision and multimedia applications. Designed around the standard SMARC form factor, the platform highlights the SOM's capabilities and provides access to interfaces for MIPI CSI cameras, displays, Ethernet, audio, and sensors. The kit serves as a starting point for product evaluation and a reference platform for hardware-integration projects.

The Open-Q™ 6490CS SMARC SOM is a compute module designed for edge AI and embedded applications such as industrial PCs, robotics, security cameras and video surveillance, retail self-checkout, and video telematics. Based on the Qualcomm Dragonwing™ QCS6490 SoC, the module is built to support AI and machine-learning workloads within a compact SMARC form factor. Built on 6 nm process technology, it supports on-device AI processing, edge computing, Wi‑Fi 6E connectivity, multiple camera interfaces, and up to 4K video encoding and decoding. The pin-compatible Open-Q™ 6490CS SMARC SOM is designed to support product scalability across multiple performance tiers while helping reduce integration effort.

The Quanta Generic AI Box is a compact, sealed-enclosure compute platform built around the Qualcomm Dragonwing™ QCS9075M SOM, engineered to provide up to 100 TOPS of on-device AI processing. Designed as a minimal, headless compute node, it omits integrated peripherals in favor of a streamlined external I/O configuration. Cameras, displays, and storage devices can be connected as needed, giving developers flexibility to prototype, evaluate, and refine on-device AI applications without being tied to a predefined hardware configuration. Running Qualcomm Linux 2.0, the platform combines a compact form factor and sealed chassis with Wi-Fi, Ethernet, and USB connectivity options. It supports development workflows ranging from model deployment and validation to pilot and field-testing activities before transitioning to a purpose-built production design.

The Snapdragon® 8 Gen 2 Mobile Platform is an AI-focused connected-computing platform created by Qualcomm Technologies, Inc. Powered by the Snapdragon® SM8550P SoC, the HDK is built to support natural-language processing, including multi-language translation and transcription, AI-enhanced video capture, and direct voice-command functionality.

CRI COREKEY PICO-ITX 2.5" Turnkey PCBA (R6490WGQ / R6490Q / R5430Q) – Built on Coretronic Reality's COREXOM SOM family and powered by the Qualcomm Dragonwing™ QCS6490 or QCS5430 SoC, this 100 × 72 mm PICO-ITX 2.5" single-board controller is designed to support edge-computing applications within a compact form factor. The QCS6490 integrates the Qualcomm® Kryo™ 670 CPU and an AI accelerator within the Qualcomm® Hexagon™ processor, while the QCS5430 provides an alternative configuration within the same form factor. Three SKUs support a range of deployment requirements: R6490WGQ with integrated Wi‑Fi 6E, Bluetooth®, and GNSS; R6490Q without wireless connectivity for wired designs; and R5430Q as an entry-level configuration. The board features dual Gigabit Ethernet, USB 3.2 Gen 1 Type‑A and Type‑C (with DisplayPort Alt Mode), four RS‑232 ports, a 40‑pin GPIO header with QUP-configurable peripherals (SPI, I²C, UART, I²S, and I3C), two MIPI CSI camera connectors, and HDMI or eDP (2‑lane, 30‑pin) primary display output. An optional M.2 E‑key socket (PCIe Gen3 x1) supports Wi‑Fi and Bluetooth expansion, while DC‑in (20 V @ 5 A) or optional USB‑C PD input powers the system. An optional USB‑C PD output provides up to 36 W of power delivery. Supporting Windows 11 IoT Enterprise LTSC, Android 13, Ubuntu 24.04 LTS, and Qualcomm Linux, and available with an optional fanless enclosure, the platform is designed to help simplify hardware integration and support product-development workflows. The solution is intended for applications such as industrial automation, smart-building systems, digital signage, AI boxes, AI cameras, robotics, kiosks, and HMI systems.

Tiny (21mm x 17mm) low-power dynamic mesh module for rapid prototyping of mesh-enabled products. Multi-channel, multi-node relay of video, voice, and data with security focused AES-256 encryption implemented in the DSP. A self-healing dynamic mesh protocol with auto-search and connect with group members, while dynamically optimizing the RF links between nodes in real-time. Wideband voice with virtually unlimited users per channel with 5 simultaneous talkers. Video relay to extend the reach for robots and drones, adding hundreds of meters per hop. Provision to mix streams and to relay device control data across the mesh network. For details see: https://elaratek.com/wp-content/uploads/2026/08/Mesh_Module-2026.pdf

Smux 5.0 Support NFC AI Touchpad Implement

IT8987 is a highly integrated embedded controller with system functions suitable for mobile system applications. The IT8987 directly interfaces to the LPC bus and provides ACPI embedded controller function, keyboard controller (KBC) and matrix scan, PWM and ADC for hardware monitor, PS/2 interface for external keyboard/mouse devices, BRAM, CIR, and system wakeup functions for system power management.

IT81202 is a 32-bit RISC-V Micro-controller and a highly integrated embedded controller with system functions suitable for mobile system applications.

qSmartAI20_CUQ610 is a ready-to-deploy AI vision kit based on the Qualcomm® QCS610 processor with powerful AI processing capabilities. This Qualcomm vision kit comprises e-con's Sony IMX462 based Full HD MIPI CSI-2 camera module.This AI vision kit has a small form factor and can perform all image processing and analytics indigenously without the connectivity or power of the cloud. In addition, this is a multi-camera solution enabling an extended field of view for applications that need to cover a large area or scene. e-con Systems provides all the necessary customization services for this vision AI development kit including the camera, carrier board, and software.

Thundercomm TurboX C8750 Development Kit is a high-performance Development Kit which is powered by next Gen Flagship Qualcomm® Snapdragon™ CQ8750s processor. It supports both Android and Linux operating systems. TurboX C8750 Development Kit supports Android, featuring powerful computing, extreme edge AI processing, and robust video and graphics. It is an ideal platform for IoT products that demand powerful computing, advanced imaging, and exceptional graphics rendering.TurboX C8750 Development Kit supports customers accelerate product development process and can be widely used in Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots (AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing and other application scenarios.

The Thundercomm TurboX T75 Series Cellular Modules feature an integrated Qualcomm® X75 5G Modem-RF system and can support both 5G NR Sub-6 SA/NSA and mmWave mode, making it backwards compatible with 4G/3G network.Integrating advanced 4nm process of the Qualcomm X75 chipset, T75 series supports 3GPP Release 17 with superior performance and power efficiency. It can help ODM/OEM easily bring blazing fast connected devices to global market and perfectly apply to CPE/MiFi/Industrial routers with multiple high-speed PCIe interfaces and 10Gbps USXGMII interfaces for Ethernet. It is also applicable to mission-critical applications (ambulances, security, robotics, AR/VR, livestreaming, etc.) and remote health technologies (surgery, diagnostics, assistance, etc.).

The Aikri 8550 dev kit is based on Aikri System on Module powered by the Qualcomm® QCS8550 platform. The dev kit is an ideal choice to kick-start development of a wide range of performance heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming.

The Aikri 8550 smart camera dev kit is based on Aikri System on Module powered by the Qualcomm® QCS8550 platform. The dev kit is an ideal choice to kick-start development of a wide range of performance heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming. The Aikri 8550 SoM, with multiple camera and display interfaces provides concurrent processing capabilities of multiple video streams up to 4K120 decode/encode to enable smart camera use-cases on this dev kit. 

The Aikri 8550 dev kit is based on Aikri System on Module powered by the Qualcomm® QCS8550 platform. The dev kit is an ideal choice to kick-start development of a wide range of performance heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming.

The Aikri 8550 dev kit is based on Aikri System on Module powered by the Qualcomm® QCS8550 platform. The dev kit is an ideal choice to kick-start development of a wide range of performance heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming.

The Aikri 8550 dev kit is based on Aikri System on Module powered by the Qualcomm® QCS8550 platform. The dev kit is an ideal choice to kick-start development of a wide range of performance heavy IoT applications including autonomous mobile robots, industrial drones, camera, edge AI box, video collaboration, video transcoding, and cloud gaming.