The Qualcomm Dragonwing MBB Gen 3 Platform, featuring the Snapdragon® X75 5G Modem-RF, with a groundbreaking feature that drive unmatched design flexibility, low power consumption, and compact size.
The Dragonwing MBB Gen 3 Platform , featuring the Snapdragon X75 5G Modem-RF, offers a range of groundbreaking features that drive unmatched design flexibility, low power consumption, and compact size. Its fully integrated architecture includes a 5G modem-RF with support for Sub-6GHz and mmWave frequencies, a GNSS receiver, and Tri-Band Wi-Fi 7, ensuring advanced connectivity options.
Robust mmWave performance starts with our third-generation mmWave module, the Qualcomm® QTM567 mmWave Antenna Module, and is enhanced by Qualco...
Features
- Integrated 3GPP Rel-17 5G modem (2G to 5G and including GNSS) with support for Sub-6GHz and mmWave connectivity, a quad-core CPU, and Tri-Band Wi-Fi 7
- Extended-range mmWave and Sub-6GHz with eight receiver antennas and support for power class 1.5 (PC 1.5)
- Sub6-mmWave convergence (one transceiver)
- 8 Rx enhancements – 3CC (F+T)
- Excellent carrier aggregation and dual-connectivity supports Qualcomm® Tri-Band Wi-Fi 7 with expert Multi-Link Operation (MLO) for blazing-fast lower latency, reliable connections, and mesh capability for seamless coverage
- Support for 5G Dual-SIM Dual-Standby (DSDS) configurations
- Flexible software architecture with support for multiple frameworks, including OpenWRT and RDK-B
- Global 5G band support, including n259 (41GHz), n70, and n53
