Snapdragon 2150 Platform
Snapdragon 2150 Platform

The Snapdragon 2150 is an application processor for smart infrastructure roadside units (RSUs), and onboard units (OBUs) for vehicles to support C-V2X worldwide.

As part of the C-V2X reference platform announced by Qualcomm Technologies at CES in January 2020, the Snapdragon 2150 application processor is an integral part of our advanced C-V2X solutions. For the roadside units (RSUs) and onboard units for vehicles (OBUs) that are critical to the smart infrastructure of C-V2X, the Snapdragon 2150 will help provide the high-performance/low-power solution needed to support the growing momentum for C-V2X in the US and around the world.

The recently announced C-V2X reference platform will leverage v...

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Benefits
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Engineered for smart RSUs, OBUs and vehicles

Leveraging the Qualcomm C-V2X reference platform, the Snapdragon 2150 offers C-V2X, 4G and 5G connectivity, as well as other technologies to make RSUs, OBUs and connected cars easier to develop and deploy.

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Highly integrated V2X solution

Includes an application processor, ITS stack, Aerolink Security, message signing, up to 2500 message verifications per second, PC5/Uu modem connectivity, Wi-Fi 6 and BT 5.1 connectivity, MF-GNSS, and controller area network (CAN) support.

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Optimized for Qualcomm Automotive 4G and 5G platforms

Includes simultaneous WWAN Uu network communication and C-V2X side-link PC5 direct communications. Also features clean architecture with modular, scalable and future-poof design.

Features

  • Applications: Arm Cortex-A53 microprocessor cores, 64-bit processor, quad-core (1.4 GHz), primary boot processor
  • RPM system
    • Arm Cortex M3: SoC power manager
    • MPM coordinates shutdown/wakeup, clock rates, and VDDs
  • System memory via external bus interface (EBI)
    • LPDDR3 SDRAM; 32-bit wide; up to 800 MHz
    • PCDDR3/3L SDRAM: 32-bit wide (2x16); up to 800 MHz
    • LPDDR2 SDRAM: 32-bit wide; up to 533 MHz
  • External memory via SDC1: eMMC v5.1
  • Wired Connectivity
    • BAM-enabled low-speed peripheral (BLSP) ports: Six, 4 bits each; multiplexed serial interface functions
    • Universal asynchronous receiver/transmitter (UART): Up to 4 Mbps inter-integrated circuit interface (I²C)
    • SPI (master only)
  • Other interfaces
    • One USB 3.0 high-speed port, Type-C is supported
    • One USB 2.0 port
    • 1xPCIe Gen2, Ethernet RGMI, IR-Rx
  • Secure digital (SD) interfaces
    • Up to two ports
    • One 8-bit (SDC1, 1.8 V) and one 4-bit (SDC2, 1.8/2.95 V)
    • Parallel NAND 8b ECC
  • Audio interfaces: Serial low-power interchip media bus (SLIMbus)
    • One port SLIMbus interface
    • MI2S: Four inter-integrated circuit sound (I²S) channels under PX3 and two I2S under low power island
  • Configurable GPIOs
    • Number of GPIO ports: 120 GPIOs and 21 LPI GPIOs
    • Input configurations: Pull-up, pull-down, keeper, or no pull
    • Output configurations: Programmable drive current
    • Top-level mode multiplexer: Provides a convenient way to program groups of GPIOs
Specifications
CPU
Architecture
64-bit
Security
Features
Trust Zone, Secure Boot, Crypto Engine
Memory
Speed
533 MHz, 740 MHz
Type
PCDDR3, LPDDR2, PCDDR3L
Bit Width
16-bit, 32-bit
Flash
Type
NAND
Storage
eMMC
eMMC 5.1
SD
SD 3.0 (UHS-I)
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