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585 resultsKEY FEATURES:
- Dragonwing IQ-X processors
- Up to 12 Qualcomm® Oryon™ CPU cores
- Qualcomm® Hexagon™ NPU with 45 TOPS
- High-performance Qualcomm® Adreno™ GPU
- PCI Express Gen 4 | USB 4
- Industrial Temperature Range -40°C to +85°C
KEY FEATURES:
- Dragonwing IQ-X processors
- Up to 12 Qualcomm® Oryon™ CPU cores
- Qualcomm® Hexagon™ NPU with 45 TOPS
- High-performance Qualcomm® Adreno™ GPU
- PCI Express Gen 4 | USB 4
- Industrial Temperature Range -40°C to +85°C
KEY FEATURES:
- Low Power Dual-Band 1x1 module for Wi-Fi & Bluetooth®
- Based on the QCA9377-3 chipset
- 802.11 a/b/g/n/ac Wave 2 MU-MIMO
- Bluetooth 5.0 BR/EDR/LE Smart Ready
- SDIO 3.0 WLAN host interface
- On-chip Power Management Unit (PMU)
- Link Rate upto 433 Mbps
- On-board and u. antenna options
- Supports enterprise security, seamless roaming and CCX
- Fine tuned calibration per module
- FCC/IC/CE/MIC modular certification
- Connector mount, surface mount, and SDIO card form factor
KEY FEATURES:
- Low Power Dual-Band 1x1 module for Wi-Fi & Bluetooth®
- Based on the QCA9377-3 chipset
- 802.11 a/b/g/n/ac Wave 2 MU-MIMO
- Bluetooth 5.0 BR/EDR/LE Smart Ready
- SDIO 3.0 WLAN host interface
- On-chip Power Management Unit (PMU)
- Link Rate upto 433 Mbps
- On-board and u. antenna options
- Supports enterprise security, seamless roaming and CCX
- Fine tuned calibration per module
- FCC/IC/CE/MIC modular certification
- Connector mount, surface mount, and SDIO card form factor
KEY FEATURES:
- Dynamic mesh intercom for video, wideband voice and data
- Virtually unlimited users per channel with 5 simultaneous talkers
- Video relay and control data transfer to extend reach for robots and drones
- Security-focused comms with AES-256 implemented in the DSP
- Mature technology, used in end-user devices for many years
- Demo & trial units available for mesh intercom
KEY FEATURES:
- Dynamic mesh intercom for video, wideband voice and data
- Virtually unlimited users per channel with 5 simultaneous talkers
- Video relay and control data transfer to extend reach for robots and drones
- Security-focused comms with AES-256 implemented in the DSP
- Mature technology, used in end-user devices for many years
- Demo & trial units available for mesh intercom
KEY FEATURES:
- Self-Verified
KEY FEATURES:
- Self-Verified
KEY FEATURES:
- Snapdragon Compute Verified
KEY FEATURES:
- Snapdragon Compute Verified
KEY FEATURES:
- Self- Verified
KEY FEATURES:
- Self- Verified
KEY FEATURES:
- Dual Image Signal Processors enhancing audio, video, and computer vision
- Advanced Graphics & 3D Gaming
- LTE Connectivity & all day Battery Life
KEY FEATURES:
- Dual Image Signal Processors enhancing audio, video, and computer vision
- Advanced Graphics & 3D Gaming
- LTE Connectivity & all day Battery Life
KEY FEATURES:
- Dual Streaming perfect for Proximity Detection, Semantic Segmentation, Autonomous Driving, and Facial Recognition.
- Ideal for IoE edge devices for healthcare, smart cities, digital signage, smart cameras.
KEY FEATURES:
- Dual Streaming perfect for Proximity Detection, Semantic Segmentation, Autonomous Driving, and Facial Recognition.
- Ideal for IoE edge devices for healthcare, smart cities, digital signage, smart cameras.
KEY FEATURES:
- Perfect for Industrial IoT applications, video analytics, medical imaging, & teleconferencing
- WIFI, Bluetooth 4.0, 4K HD, & Dual HDMI Output
KEY FEATURES:
- Perfect for Industrial IoT applications, video analytics, medical imaging, & teleconferencing
- WIFI, Bluetooth 4.0, 4K HD, & Dual HDMI Output
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and Bluetooth 5.0
- OS: Android 12, Kernel 4.19; Dimensions: 85mm x 54mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and Bluetooth 5.0
- OS: Android 12, Kernel 4.19; Dimensions: 85mm x 54mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0
- OS: Android 12; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- 64-bit Quad-core at 2.0 GHz; Qualcomm® Adreno™ 702 GPU; Qualcomm Spectra™ 340L ISP
- 4GB LPDDR4x and 64GB eMMC 5.1; PM4125 PMIC codec; WCN3950: WLAN 1 × 1 802.11a/b/g/n/ac and BT5.0
- OS: Android 12; Dimensions: 58 mm x 39 mm
KEY FEATURES:
- Qualcomm ® Adreno™ 306 GPU; 2x Qualcomm® Hexagon™ QDSP6 v66
- 1GB LPDDR3 and 8GB eMMC; WCN3999: 2x2 WLAN802.11 a/b/g/ac & Bluetooth® 5.0 wireless technology
- OS: Linux, Yocto Thud, Kernel 4.14; Dimensions: 85mm x 54mm
KEY FEATURES:
- Qualcomm ® Adreno™ 306 GPU; 2x Qualcomm® Hexagon™ QDSP6 v66
- 1GB LPDDR3 and 8GB eMMC; WCN3999: 2x2 WLAN802.11 a/b/g/ac & Bluetooth® 5.0 wireless technology
- OS: Linux, Yocto Thud, Kernel 4.14; Dimensions: 85mm x 54mm
KEY FEATURES:
- 2x Qualcomm® Hexagon™ QDSP6 v66
- 1GB LPDDR3 and 8GB eMMC; WCN3999: 2x2 WLAN802.11 a/b/g/ac & Bluetooth 5.0
- OS: Linux, Yocto Thud, Kernel 4.14; Dimensions: 85mm x 54mm
KEY FEATURES:
- 2x Qualcomm® Hexagon™ QDSP6 v66
- 1GB LPDDR3 and 8GB eMMC; WCN3999: 2x2 WLAN802.11 a/b/g/ac & Bluetooth 5.0
- OS: Linux, Yocto Thud, Kernel 4.14; Dimensions: 85mm x 54mm
KEY FEATURES:
- Qualcomm® Adreno™ 306 GPU; 2 x Qualcomm® Hexagon™ QDSP6 v66
- 1GB LPDDR3 and 8GB eMMC; WCN3999: 2x2 WLAN802.11 a/b/g/ac & Bluetooth 5.0
- OS: Linux, Yocto Thud, Kernel 4.14; Dimensions: 65.42 mm X 57.82 mm
KEY FEATURES:
- Qualcomm® Adreno™ 306 GPU; 2 x Qualcomm® Hexagon™ QDSP6 v66
- 1GB LPDDR3 and 8GB eMMC; WCN3999: 2x2 WLAN802.11 a/b/g/ac & Bluetooth 5.0
- OS: Linux, Yocto Thud, Kernel 4.14; Dimensions: 65.42 mm X 57.82 mm
KEY FEATURES:
- 2 x Qualcomm® Hexagon™ QDSP6 v66
- 1GB LPDDR3 and 8GB eMMC; WCN3999: 2x2 WLAN802.11 a/b/g/ac & Bluetooth® 5.0 wireless technology
- OS: Linux, Yocto Thud, Kernel 4.14; Dimensions: 65.42 mm X 57.82 mm
KEY FEATURES:
- 2 x Qualcomm® Hexagon™ QDSP6 v66
- 1GB LPDDR3 and 8GB eMMC; WCN3999: 2x2 WLAN802.11 a/b/g/ac & Bluetooth® 5.0 wireless technology
- OS: Linux, Yocto Thud, Kernel 4.14; Dimensions: 65.42 mm X 57.82 mm
KEY FEATURES:
- The LCD display is an add-on accessory and not part of the standard kit
KEY FEATURES:
- The LCD display is an add-on accessory and not part of the standard kit
KEY FEATURES:
- Features Snapdragon Elite Gaming™ Features, Sensing Hub, Artificial Intelligence Engine, Adaptive Audio and Audio Technologies
KEY FEATURES:
- Features Snapdragon Elite Gaming™ Features, Sensing Hub, Artificial Intelligence Engine, Adaptive Audio and Audio Technologies
KEY FEATURES:
- 2 x USB 2.0, 2 x serial port, 100 Base-T Ethernet port, I2S, SPI, I2C, PCIe, GPIO, MDIO | Max output power per chain 21 dBm | Max power consumption 3.7 W
KEY FEATURES:
- 2 x USB 2.0, 2 x serial port, 100 Base-T Ethernet port, I2S, SPI, I2C, PCIe, GPIO, MDIO | Max output power per chain 21 dBm | Max power consumption 3.7 W
KEY FEATURES:
- 1000 Base-T ETH port, Mini-PCIe connector, Hardware SPI, GPIO header, DIP switch for bootstrap configuration
- Power supply (+3.3V) and GND headers, USB Type-C connector (console UART+power)
KEY FEATURES:
- 1000 Base-T ETH port, Mini-PCIe connector, Hardware SPI, GPIO header, DIP switch for bootstrap configuration
- Power supply (+3.3V) and GND headers, USB Type-C connector (console UART+power)
