34 results
Filter
34 results
Filter by:
Open-Q™ 5165RB SOM
The Open-Q™ 5165RB SOM is an ultra-compact (50mm x 29mm) production-ready computing module based on the powerful Qualcomm® QRB5165 System-on-Chip. The QRB5165 utilizes Qualcomm Technologies heterogenous compute expertise to provide an SoC with multiple specialized processing cores such as the 5th gen Qualcomm® AI Engine, hardware video analytics engine, Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP. Coupled with the latest WiFi 6 connectivity and camera features.
KEY FEATURES:
- Qualcomm® QRB5165 chipset
- 8GB LPDDR5 RAM + 128GB UFS Flash
- Ubuntu 18.04 Linux
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Ultra-compact 50 x 29 mm form factor
The Open-Q™ 5165RB SOM is an ultra-compact (50mm x 29mm) production-ready computing module based on the powerful Qualcomm® QRB5165 System-on-Chip. The QRB5165 utilizes Qualcomm Technologies heterogenous compute expertise to provide an SoC with multiple specialized processing cores such as the 5th gen Qualcomm® AI Engine, hardware video analytics engine, Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP. Coupled with the latest WiFi 6 connectivity and camera features.
KEY FEATURES:
- Qualcomm® QRB5165 chipset
- 8GB LPDDR5 RAM + 128GB UFS Flash
- Ubuntu 18.04 Linux
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Ultra-compact 50 x 29 mm form factor
Chipset
Open-Q™ 865 Development Kit
The Open-Q™ 865 Development Kit is a versatile, easy-to-use, exposed board platform, compatible with our production-ready Open-Q 865 family of SOMs. The development kit provides the ideal starting point for evaluating any of the compatible Open-Q 865 family of SOMs or developing next generation embedded and IoT devices. Compatible with the Open-Q 5165RB SOM and Open-Q 865XR SOM.
KEY FEATURES:
- • Compatible with the micro-sized (50x29mm) Open-Q 865 family of SOMs• Open-frame Mini-ITX Form-factor carrier board for evaluation and development• Wi-Fi and Bluetooth antennas on carrier board
The Open-Q™ 865 Development Kit is a versatile, easy-to-use, exposed board platform, compatible with our production-ready Open-Q 865 family of SOMs. The development kit provides the ideal starting point for evaluating any of the compatible Open-Q 865 family of SOMs or developing next generation embedded and IoT devices. Compatible with the Open-Q 5165RB SOM and Open-Q 865XR SOM.
KEY FEATURES:
- • Compatible with the micro-sized (50x29mm) Open-Q 865 family of SOMs• Open-frame Mini-ITX Form-factor carrier board for evaluation and development• Wi-Fi and Bluetooth antennas on carrier board
Chipset
VVDN-QRB5165 Development Kit
VVDN-QRB5165 development kit designed, developed, and manufactured by VVDN comprises of carrier board and SOM based on powerful Qualcomm® QRB5165 System-on-Chip. The development kit supports multiple interfaces including 6x 4-lane MIPI CSI for camera, 2x 4-lane MIPI DSI for display, and WLAN 2 x 2 802.11ax, Bluetooth 5.1 connectivity.The development kit is suitable for developing visual intelligence applications requiring the highest AI processing performance. Some of the applications include advanced robotics, autonomous delivery vehicles, edge AI boxes, industrial drones, etc.
KEY FEATURES:
- Based on powerful Qualcomm® QRB5165 SoC
- Advanced imaging capability
- Ultra-compact form factor
VVDN-QRB5165 development kit designed, developed, and manufactured by VVDN comprises of carrier board and SOM based on powerful Qualcomm® QRB5165 System-on-Chip. The development kit supports multiple interfaces including 6x 4-lane MIPI CSI for camera, 2x 4-lane MIPI DSI for display, and WLAN 2 x 2 802.11ax, Bluetooth 5.1 connectivity.The development kit is suitable for developing visual intelligence applications requiring the highest AI processing performance. Some of the applications include advanced robotics, autonomous delivery vehicles, edge AI boxes, industrial drones, etc.
KEY FEATURES:
- Based on powerful Qualcomm® QRB5165 SoC
- Advanced imaging capability
- Ultra-compact form factor
LEC-RB5N
The ADLINK LEC-RB5N is a SMARC module powered by the Qualcomm® QRB5165 SoC and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device AI capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, defense, industrial and logistics sectors.
KEY FEATURES:
- Qualcomm® Kryo™ 585 CPU, Hexagon HTA up to 15 TOPS
- 4K HDMI/MIPI DSI display, MIPI CSI cameras
- 2x PCIe x2 Gen3, 2x GbE Ethernet, 2x USB 3.1/2.0 and 4x USB 2.0, GPIO/SD and UFS, 5VDC +/-5% voltage input
The ADLINK LEC-RB5N is a SMARC module powered by the Qualcomm® QRB5165 SoC and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device AI capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, defense, industrial and logistics sectors.
KEY FEATURES:
- Qualcomm® Kryo™ 585 CPU, Hexagon HTA up to 15 TOPS
- 4K HDMI/MIPI DSI display, MIPI CSI cameras
- 2x PCIe x2 Gen3, 2x GbE Ethernet, 2x USB 3.1/2.0 and 4x USB 2.0, GPIO/SD and UFS, 5VDC +/-5% voltage input
Chipset
I-Pi SMARC RB5
The ADLINK I-Pi SMARC RB5 is an advanced robotics platform development kit designed to help you build consumer, enterprise or industrial robots, drones with on-device AI and machine learning, superior computing, and intelligent sensing capabilities. The LEC-RB5 SMARC module provides on-device AI capabilities, delivering up to 15 TOPS for machine learning inference at the edge, support for up to six cameras, and low power consumption.
KEY FEATURES:
- Qualcomm® Kryo™ 585 CPU
- 4K HDMI/MIPI DSI display, up to 6 MIPI CSI cameras support
- 2x PCIe x2 Gen3, 2x GbE Ethernet, 2x USB 3.1/2.0 and 4x USB 2.0, GPIO/SD and UFS, 5VDC +/-5% voltage input
The ADLINK I-Pi SMARC RB5 is an advanced robotics platform development kit designed to help you build consumer, enterprise or industrial robots, drones with on-device AI and machine learning, superior computing, and intelligent sensing capabilities. The LEC-RB5 SMARC module provides on-device AI capabilities, delivering up to 15 TOPS for machine learning inference at the edge, support for up to six cameras, and low power consumption.
KEY FEATURES:
- Qualcomm® Kryo™ 585 CPU
- 4K HDMI/MIPI DSI display, up to 6 MIPI CSI cameras support
- 2x PCIe x2 Gen3, 2x GbE Ethernet, 2x USB 3.1/2.0 and 4x USB 2.0, GPIO/SD and UFS, 5VDC +/-5% voltage input
Chipset
