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Open-Q™ 865 Development Kit
The Open-Q™ 865 Development Kit is a versatile, easy-to-use, exposed board platform, compatible with our production-ready Open-Q 865 family of SOMs. The development kit provides the ideal starting point for evaluating any of the compatible Open-Q 865 family of SOMs or developing next generation embedded and IoT devices. Compatible with the Open-Q 5165RB SOM and Open-Q 865XR SOM.

KEY FEATURES:

  • • Compatible with the micro-sized (50x29mm) Open-Q 865 family of SOMs• Open-frame Mini-ITX Form-factor carrier board for evaluation and development• Wi-Fi and Bluetooth antennas on carrier board
ByLantronix Inc.
Chipset
QRB5165
Type Development Kits
Open-Q™ 5165RB SOM
The Open-Q™ 5165RB SOM is an ultra-compact (50mm x 29mm) production-ready computing module based on the powerful Qualcomm® QRB5165 System-on-Chip. The QRB5165 utilizes Qualcomm Technologies heterogenous compute expertise to provide an SoC with multiple specialized processing cores such as the 5th gen Qualcomm® AI Engine, hardware video analytics engine, Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP. Coupled with the latest WiFi 6 connectivity and camera features.

KEY FEATURES:

  • Qualcomm® QRB5165 chipset
  • 8GB LPDDR5 RAM + 128GB UFS Flash
  • Ubuntu 18.04 Linux
  • Dedicated Computer Vision Engine
  • Multiple MIPI camera and display ports
  • Ultra-compact 50 x 29 mm form factor
ByLantronix Inc.
Chipset
QRB5165
Type System-on-Modules
5G Mezz package(Sub-6G only, Japan&Korea), Thundercomm T55M

With 5G mezzanine board and Thundercomm 5G NR module T55M-EA, offers the 5G NR Sub-6GHz connectivity in Asia on core kit or vision kit.

ByThundercomm Technology Co., Ltd.
Chipset
QRB5165
Type Expansion Boards
5G Mezz package(Sub-6G only, North America&Europe), RM502Q-AE

With 5G mezzanine board and Thundercomm 5G NR module T55M-EA, offers the 5G NR Sub-6GHz connectivity in Asia on core kit or vision kit.

ByThundercomm Technology Co., Ltd.
Chipset
QRB5165
Type Expansion Boards
TDK Mezzanine Board

The TDK Mezzanine Board includes all the latest technologies offerings from TDK focused on the Robotics industry. The TDK Mezzanine combines the market leading performance of the ICM-42688-P IMU with the World’s Highest Performing Digital Microphone (T5818) and TDK’s Ultrasonic Time-of-Flight (ToF) range.

ByThundercomm Technology Co., Ltd.
Chipset
QRB5165
Type Expansion Boards