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281 resultsKEY FEATURES:
- Up to 8GB LPDDR4x RAM
- Up to 128GB UFS with SDIO storage support
- Support SMARC 2.2 SOM
- Qualcomm Linux
- Industrial temperature availability
- Support up to Wi-Fi 6/Bluetooth® 5.2
- Customizable memory and storage options
KEY FEATURES:
- Up to 8GB LPDDR4x RAM
- Up to 128GB UFS with SDIO storage support
- Support SMARC 2.2 SOM
- Qualcomm Linux
- Industrial temperature availability
- Support up to Wi-Fi 6/Bluetooth® 5.2
- Customizable memory and storage options
KEY FEATURES:
- Up to 8GB LPDDR5 RAM + 64GB UFS
- Additional storage via SD card and NVME
- Multiple D-PHY MIPI camera & Display Ports
- Multiple high speed connectivity options
- Supports SMARC 2.2 SOM
- Android™ 13 and Qualcomm Linux
KEY FEATURES:
- Up to 8GB LPDDR5 RAM + 64GB UFS
- Additional storage via SD card and NVME
- Multiple D-PHY MIPI camera & Display Ports
- Multiple high speed connectivity options
- Supports SMARC 2.2 SOM
- Android™ 13 and Qualcomm Linux
KEY FEATURES:
- Up to 8GB LPDDR5 RAM + 64GB eMMC
- Support UFS and NVMe storage
- Android™ 13 and Qualcomm Linux
- On-device AI Engine up to 12.5 TOPS
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
- SMARC 2.2 form factor
KEY FEATURES:
- Up to 8GB LPDDR5 RAM + 64GB eMMC
- Support UFS and NVMe storage
- Android™ 13 and Qualcomm Linux
- On-device AI Engine up to 12.5 TOPS
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
- SMARC 2.2 form factor
KEY FEATURES:
- Dragonwing QCS9075M SOM, up to 100 TOPS on-device AI performance for edge AI development
- Qualcomm Linux 2.0
- 12GB LPDDR5 memory, with 256GB UFS 3.1 storage + 2Gb NOR boot flash
- Wi-Fi 7 connectivity
- 1x Gigabit Ethernet (RJ45)
- 2x USB-C, both DisplayPort Alt Mode + Power Delivery capable (HDMI output via active adapter) — flex
- Compact 110 x 110mm PCB in a sealed enclosure with active thermal solution (fan + heatsink)
KEY FEATURES:
- Dragonwing QCS9075M SOM, up to 100 TOPS on-device AI performance for edge AI development
- Qualcomm Linux 2.0
- 12GB LPDDR5 memory, with 256GB UFS 3.1 storage + 2Gb NOR boot flash
- Wi-Fi 7 connectivity
- 1x Gigabit Ethernet (RJ45)
- 2x USB-C, both DisplayPort Alt Mode + Power Delivery capable (HDMI output via active adapter) — flex
- Compact 110 x 110mm PCB in a sealed enclosure with active thermal solution (fan + heatsink)
KEY FEATURES:
- High-performance Dragonwing QCS6490 (6 nm) / QCS5430 SoC with integrated NPU (QCS6490: up to 12 TOPS
- Three SKUs: R6490WGQ (Wi-Fi 6E / BT / GNSS), R6490Q (no wireless), R5430Q (entry level)
- Memory & storage: 8 GB LPDDR4 + 128 GB UFS (R6490WGQ / R6490Q); 4 GB LPDDR4 + 64 GB UFS (R5430Q)
- Compact PICO-ITX 2.5" form factor: 100 × 72 mm, ~90 g
- Display: HDMI or eDP (30-pin, 2-lane, up to 1920 × 1080 @ 60 fps) selectable via DIP switch; seconda
- Dual MIPI CSI 4-lane camera connectors (supports IMX577 camera modules)
- Dual 1 GbE RJ45
- USB 3.2 Gen 1 Type-A × 2, USB Type-C × 1, USB 2.0 × 2 (2.0 mm header)
- RS-232 × 4 (with transceivers), debug UART, 40-pin GPIO / peripheral header
- Optional M.2 E-key (PCIe Gen3 x1) for Wi-Fi/BT (R6490Q / R5430Q); IPEX antenna connectors on R6490WG
- WSA8835 speaker amplifier, RX8900CE RTC, fan connector, user-definable LEDs, and onboard Power / Vol
- Power input: DC-in 20 V @ 5 A, or optional USB-C PD-in; optional USB-C PD-out (up to 36 W)
- Supports Windows 11 IoT Enterprise LTSC, Android 13, Ubuntu 24.04 LTS
- Optional fanless aluminum enclosure
KEY FEATURES:
- High-performance Dragonwing QCS6490 (6 nm) / QCS5430 SoC with integrated NPU (QCS6490: up to 12 TOPS
- Three SKUs: R6490WGQ (Wi-Fi 6E / BT / GNSS), R6490Q (no wireless), R5430Q (entry level)
- Memory & storage: 8 GB LPDDR4 + 128 GB UFS (R6490WGQ / R6490Q); 4 GB LPDDR4 + 64 GB UFS (R5430Q)
- Compact PICO-ITX 2.5" form factor: 100 × 72 mm, ~90 g
- Display: HDMI or eDP (30-pin, 2-lane, up to 1920 × 1080 @ 60 fps) selectable via DIP switch; seconda
- Dual MIPI CSI 4-lane camera connectors (supports IMX577 camera modules)
- Dual 1 GbE RJ45
- USB 3.2 Gen 1 Type-A × 2, USB Type-C × 1, USB 2.0 × 2 (2.0 mm header)
- RS-232 × 4 (with transceivers), debug UART, 40-pin GPIO / peripheral header
- Optional M.2 E-key (PCIe Gen3 x1) for Wi-Fi/BT (R6490Q / R5430Q); IPEX antenna connectors on R6490WG
- WSA8835 speaker amplifier, RX8900CE RTC, fan connector, user-definable LEDs, and onboard Power / Vol
- Power input: DC-in 20 V @ 5 A, or optional USB-C PD-in; optional USB-C PD-out (up to 36 W)
- Supports Windows 11 IoT Enterprise LTSC, Android 13, Ubuntu 24.04 LTS
- Optional fanless aluminum enclosure
KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- Full HD ultra low light camera based on Sony Starvis IMX462 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
KEY FEATURES:
- AI Vision Kit based on Qualcomm® QCS610/410 SoC *
- Full HD ultra low light camera based on Sony Starvis IMX462 sensor
- Multi-camera support (Supports upto 3 cameras)
- Qualcomm neural processing SDK for AI
KEY FEATURES:
- 8th Gen AI Engine: Over 10x performance boost to previous gen
- Next Gen Oryon™ CPU:up to 1.5x over previous gen
- 3A+IQ upgrades;3 ISP, 3 x 48MP@30FPS HW sHDR, ASE
- Hypervisor enables multiple trusted VMs (TVMs)
- 3 times GPU performance improvement compared to the previous generation
- 4K240/8K60 decoding, 4K120/8K30 encoding AV1 decoder
KEY FEATURES:
- 8th Gen AI Engine: Over 10x performance boost to previous gen
- Next Gen Oryon™ CPU:up to 1.5x over previous gen
- 3A+IQ upgrades;3 ISP, 3 x 48MP@30FPS HW sHDR, ASE
- Hypervisor enables multiple trusted VMs (TVMs)
- 3 times GPU performance improvement compared to the previous generation
- 4K240/8K60 decoding, 4K120/8K30 encoding AV1 decoder
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Linux Kernel 5.15; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Linux Kernel 5.15; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x and 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 172 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x and 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 172 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x and 128GB UFS 3.1; OS: Linux Kernerl 5.15; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x and 128GB UFS 3.1; OS: Linux Kernerl 5.15; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x and 128GB UFS 3.1; OS: Linux Kernel 5.15; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x and 128GB UFS 3.1; OS: Linux Kernel 5.15; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x and 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, and Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x and 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 160 x 75 mm
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Linux Kernel5.15; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode decode up to 4K120/8K30 and 4K240/8K60
- Onboard Wi-Fi; 16GB LPDDR5x; 128GB UFS 3.1; OS: Linux Kernel5.15; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x; 128GB UFS 3.1; OS: Linux,Kernel5.15; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 8GB LPDDR5x; 128GB UFS 3.1; OS: Linux,Kernel5.15; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x; 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x; 128GB UFS 3.1; OS: Android 13.0 ; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1; Video up to 4K30
- Wi-Fi, Bluetooth, Ethernet
- Pre-built Linux
KEY FEATURES:
- 4GB LPDDR4x, 16GB eMMC 5.1; Video up to 4K30
- Wi-Fi, Bluetooth, Ethernet
- Pre-built Linux
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x; 128GB UFS 3.1; OS: Linux,Kernel5.15; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 740 GPU and VPU, Qualcomm® Hexagon™ Tensor Processor
- Qualcomm Spectra™ ISP; Video encode and decode up to 4K120/8K30 and 4K240/8K60 respectively
- 16GB LPDDR5x; 128GB UFS 3.1; OS: Linux,Kernel5.15; Dimensions: 40.27 x 33.41mm LGA
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ GPU, Adreno VPU, Adreno DPU and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- 8GB LPDDR5 and 128GB UFS; OS: Linux
KEY FEATURES:
- Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ GPU, Adreno VPU, Adreno DPU and Qualcomm® Hexagon™ DSP with dual HVX
- Qualcomm Spectra™ ISP 570L and video encode/decode at up to 4K30/4K60 respectively; 6th gen Qualcomm® AI Engine
- 8GB LPDDR5 and 128GB UFS; OS: Linux
