Find hardware, software and services to develop better Industrial and Commercial technology.

COM-HPC Mini Computer-on-Module based on Qualcomm Dragonwing™ IQ-X Series

Aikri-22X-90AD-4 development kit is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 kit comprises Qualcomm® QCS2290-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

Aikri-22X-90AS-4 System-on-Module (SoM) is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

The Snapdragon® 845 Mobile Platform includes high performance camera and graphics features that are designed to capture advance color information. Qualcomm® Adreno™ 630 GPU and Qualcomm Spectra™ 280 ISP has enabled vivid graphics, crystal-clear audio and improved area awareness, making Snapdragon 845 Mobile Platform ideal for real-life experience solution. To support the ecosystem of technology companies and application providers looking to utilize these advanced features, eInfochips is offering a Hardware Development Kit (HDK) featuring the Snapdragon SDA845 processor. This development kit is designed to help OEMs and device makers in evaluating the processor and peripherals; an ideal starting point for creating high-performance mobile devices, software development and applications.

New generation of multi-mode Smart LTE Cat 6 modules based on the Qualcomm® SDM660 SoC with Android 9.0 OS is well suited for a wide range of industrial and consumer applications with high date-rate and multimedia requirements.

BG77 is an ultra-compact LPWA module supporting LTE Cat M1, LTE Cat NB2 and integrated GNSS. It is fully compliant with 3GPP Rel.14 specification and provides maximum data rates of 588 kbps downlink and 1119 kbps uplink. It features ultra-low power consumption by leveraging the integrated RAM/flash as well as the processor supporting ThreadX, achieving up to 70% reduction in PSM leakage and 85% reduction in eDRX current consumption compared to its predecessor.

Based on the Qualcomm® 9150 C-V2X ASIC, Quectel's AG15 is an automotive grade C-V2X module designed and manufactured according to IATF 16949:2016 standards. It is designed for use in extremely harsh environments and provides superior ESD/EMI protection performance. Through C-V2X PC5 direct communications, AG15 can make traffic smoother and more efficient through paving the way for automated driving and achieving the goal of fully connected traffic.

MeigSmart SLM156 is a high-performance module with multiple modes of NB-IoT/Cat M/EGPRS using Qualcomm® MDM9205 LTE modem. It features extremely low power consumption and ultra-compact size of 21x20x2.3mm profile to ideally suit for size consious applications, such as smart metering, smart city and asset tracking. SLM156 supports LCC package which makes it an ideal solution for large-scale manufacturing. The complete GPS and Voice services meet client-side demands for wide range connectivity.

Powered by Qualcomm Technologies' processors, supporting 4-lane USB, RJ45, RJ12, RJ11, Micro-USB and headset interfaces. Adopting structured light camera to support facial recognition and its adoption in financial payment. ESIM card function starts the new era of sim card, which is a convenient solution for unmanned supermarket, chain restaurants, convenient stores, etc by providing automatic check outs, online orders, membership management, auto closing and warehouse management.

MeiG Smart utilizes Qualcomm Technologies chipsets and narrow band modules to provide customized integrated smart system with narrowband and broadband network. The solution integrates DMR, PDT, TETRA and MPT narrowband private network 4G/3G/2G, WLAN broadband technology to provide end-to-end voice, data and video solution. It makes it possible for industrial customers to realize voice command, multi-media cluster, real-time data interaction and collaborative operation.

The Open-Q™ 2290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QCS2290, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.

Lantronix Open-Q™ 626 µSOM based on the Qualcomm® APQ8053-Pro processor, is an ultra-compact (50mm x 25mm) production-ready, pre-certified SOM that is ideal for powering next-generation connected cameras, and other IoT devices. The feature-rich SOM with its advanced processor technology supports premium 4K video with HEVC capture and playback for optimal balance of quality and bandwidth.

Lantronix’s Open-Q™ 626 µSOM Development Kit is a cost-effective, feature rich, camera tuned, exposed board platform powered by our Open-Q™ 626 µSOM (Micro System on Module) that is based on the Qualcomm™ APQ8053 Pro processor. The Development Kit is ideal for evaluation of the Open-Q™ 626 µSOM (Micro System on Module) as well as jump-starting development of connected camera devices or other high performance embedded products.

This module includes Qualcomm® 9205 LTE modem, offers global bands support for worldwide deployments. Miniature x310 family with flexible perimeter footprint and pin-to-pin compatibility • Multimode LTE Cat-M1 / NB2 • Size: 13.1mm x 14.3mm x 2

The Telit Cinterion FE990D60 delivers next‑generation, high‑performance 5G connectivity. The module features 5G sub-6 technology with Gigabit LTE and WCDMA support, along with innovative multi constellation GNSS. Built on the Qualcomm® Snapdragon® X85 5G Modem‑RF system and compliant with 3GPP Release 18, it is ideal for advanced industrial and enterprise applications.

LTE to Wi-Fi conversion module utilizes Qualcomm® QCA9531, Qualcomm® QCA9887 and Qualcomm® MDM9607 chipset platforms.

LTE to Wi-Fi conversion module utilizes Qualcomm® QCA8337, Qualcomm® QCA9550 and Qualcomm® IMDM9607chipset platforms.

Cat-M/Cat-NB, SIM7090 in LGA form factor and has a compact size of 14.8mm*12.8mm which makes it ideal for compact product design. SIM7090 has powerful expansibility with abundant interfaces including UART, GPIO, PCM, SPI, I2C etc. The SIM7090 is designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions. Due to the unique combination of performance, security and flexibility, this module is ideally suited for M2M applications.

LTE Cat.4 Module The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. The SIM7600-H series adopts LCC1 form factor and is compatible with SIM5320/SIM5360 series (UMTS/HSPA+ modules), and SIM7600 series (LTE modules), which enables smooth migration from 3G products to LTE products, and greatly facilitates more compatible product design for customers.