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APEX-A100
Built on the latest Qualcomm Dragonwing™ IQ-9075 SoC, Innodisk’s APEX-A100 delivers high AI performance with low power consumption for edge deployments. Backed by Innodisk’s self-developed software toolkit and Qualcomm® AI Hub resources, it helps accelerate time to market across AGV, AMR, and edge VLM applications.
KEY FEATURES:
- Powered by Dragonwing IQ-9075 SoC
- Provides up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI performance
- Up to 36GB onboard memory and 128GB UFS 3.1 storage
- 2 x 2.5GbE | 2 x DP 1.2 | 3 x M.2 | 1 x COM | 1 x CAN FD
- Fanless design, operating from -40°C to 70°C (Ta)
- Built for AGV, AMR, and VLM applications at the edge
- Chipset longevity through 2038
Built on the latest Qualcomm Dragonwing™ IQ-9075 SoC, Innodisk’s APEX-A100 delivers high AI performance with low power consumption for edge deployments. Backed by Innodisk’s self-developed software toolkit and Qualcomm® AI Hub resources, it helps accelerate time to market across AGV, AMR, and edge VLM applications.
KEY FEATURES:
- Powered by Dragonwing IQ-9075 SoC
- Provides up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI performance
- Up to 36GB onboard memory and 128GB UFS 3.1 storage
- 2 x 2.5GbE | 2 x DP 1.2 | 3 x M.2 | 1 x COM | 1 x CAN FD
- Fanless design, operating from -40°C to 70°C (Ta)
- Built for AGV, AMR, and VLM applications at the edge
- Chipset longevity through 2038
Chipset
FV08 EDGE BOX
Qualcomm Dragonwing™ IQ9-based computing box
KEY FEATURES:
- Dragonwing IQ9
- 100 TOPS
- Small size with rich I/O
Qualcomm Dragonwing™ IQ9-based computing box
KEY FEATURES:
- Dragonwing IQ9
- 100 TOPS
- Small size with rich I/O
Chipset
MT200
MeiG MT200 is an industrial-grade edge AI BOX featuring a modular architecture. The highest-configuration variant is equipped with the MeiG SNM983 intelligent module. SNM983 is based on the Qualcomm Dragonwing™ QCS9075 (IQ-9 Series) platform.
MeiG MT200 is an industrial-grade edge AI BOX featuring a modular architecture. The highest-configuration variant is equipped with the MeiG SNM983 intelligent module. SNM983 is based on the Qualcomm Dragonwing™ QCS9075 (IQ-9 Series) platform.
Open-Q™ 9075IQ SOM
The Open-Q Qualcomm Dragonwing™ 9075IQ System-on-Module (SOM) solutions offer scalable, power-efficient, and robust computing capabilities for autonomous devices and next-generation Industry 4.0 designs. These advanced AI-powered SOMs enable a range of critical functionalities, including robust safety features for autonomous mobile robots with enhanced device robustness through fault-tolerant ECC memory support and a dedicated real-time subsystem.
The new SOM series facilitates the deployment of interactive industrial edge AI systems by integrating Large Language Model (LLM) support, achieving a generation rate of up to 22 tokens per second when running the LIama2 7B parameter model.
KEY FEATURES:
- Dragonwing IQ-9075 SoC
- Up to 36GB LPDDR5 SDRAM
- On-device AI Engine up to 100 INT-8 TOPS
- Support up to 16 concurrent cameras
- Multiple PCIe, USB, and CAN-FD interfaces
- 2.5Gbps Time Sensitive Ethernet (TSN)
- Dedicated real-time subsystem
- Qualcomm® Linux
The Open-Q Qualcomm Dragonwing™ 9075IQ System-on-Module (SOM) solutions offer scalable, power-efficient, and robust computing capabilities for autonomous devices and next-generation Industry 4.0 designs. These advanced AI-powered SOMs enable a range of critical functionalities, including robust safety features for autonomous mobile robots with enhanced device robustness through fault-tolerant ECC memory support and a dedicated real-time subsystem.
The new SOM series facilitates the deployment of interactive industrial edge AI systems by integrating Large Language Model (LLM) support, achieving a generation rate of up to 22 tokens per second when running the LIama2 7B parameter model.
KEY FEATURES:
- Dragonwing IQ-9075 SoC
- Up to 36GB LPDDR5 SDRAM
- On-device AI Engine up to 100 INT-8 TOPS
- Support up to 16 concurrent cameras
- Multiple PCIe, USB, and CAN-FD interfaces
- 2.5Gbps Time Sensitive Ethernet (TSN)
- Dedicated real-time subsystem
- Qualcomm® Linux
Chipset
SECO SOM-SMARC-Dragonwing-IQ8
SECO SOM-SMARC-Dragonwing-IQ8 is a compact, industrial-grade SMARC System-on-Module powered by the Qualcomm® Dragonwing™ IQ8 platform, designed to accelerate the transition from AI prototyping to scalable edge deployment. Combining high-performance AI processing with robust industrial features, it enables low-latency on-device inference for industrial automation, robotics, smart surveillance, and smart infrastructure applications.
KEY FEATURES:
- Powered by Qualcomm® Dragonwing™ IQ8 with octa-core Kryo CPU
- Qualcomm Hexagon NPU delivering up to 40 TOPS AI performance
- High-speed connectivity and expansion with PCIe Gen4, MIPI-CSI camera interfaces, and 2.5GbE
- Enhanced security with TPM 2.0 and support for SECO Clea OS, simplifying AI deployment at the edge
SECO SOM-SMARC-Dragonwing-IQ8 is a compact, industrial-grade SMARC System-on-Module powered by the Qualcomm® Dragonwing™ IQ8 platform, designed to accelerate the transition from AI prototyping to scalable edge deployment. Combining high-performance AI processing with robust industrial features, it enables low-latency on-device inference for industrial automation, robotics, smart surveillance, and smart infrastructure applications.
KEY FEATURES:
- Powered by Qualcomm® Dragonwing™ IQ8 with octa-core Kryo CPU
- Qualcomm Hexagon NPU delivering up to 40 TOPS AI performance
- High-speed connectivity and expansion with PCIe Gen4, MIPI-CSI camera interfaces, and 2.5GbE
- Enhanced security with TPM 2.0 and support for SECO Clea OS, simplifying AI deployment at the edge
Tria Vision AI-KIT IQ9
Tria's Vision AI-KIT IQ9 features an industrial 3.5-inch SBC board fitted with Qualcomm Dragonwing™ IQ-9075 SIP module, that delivers power-efficient on-device Edge AI and compute, for high-performance, heavy workload industrial applications in extreme environments.
The Dragonwing IQ-9075 microprocessor domain (MD) has octa high-performance Kryo Gen6 cores, 100 TOPS of AI-acceleration, plus exceptional multimedia capabilities (up to 16 cameras, multiple displays, 4K170/4K275 enc/dec.). This SOC also features a real time subsystem (RTSS) with quad real-time cores @ 1.85 GHz and peripherals, for low-latency control applications.
Dragonwing™ IQ-9075 SIP resources include 36 GB LPDDR5 (3200MHz, 96bit wide DRAM with inline ECC) plus four PMM8650AU PMICs for efficient power management.
Vision AI-KIT IQ9 packs a wide range of connectivity interfaces, into a standard industrial 3.5-inch SBC form-factor, including 2x local MIPI CSI 4-lane camera inputs, 2x miniDP (4K) and 1x MIPI DSI display outputs, 6x USB ports (plus quad USB debug-bridge), 2x 2.5 GbE LAN interfaces, CAN, UART and GPIO interfaces. Add-on Wi-Fi/BT, cellular modem and NVME SSD storage options are supported via (key-E, key-B, key-M) M.2 slots. A mezzanine camera-adapter 120-pin connector enables the use of adapter boards for support of multiple concurrent remote cameras. Audio support includes stereo amplified outputs plus onboard PDM microphone.
KEY FEATURES:
- Qualcomm Dragonwing™ IQ-9075 Development Kit
- Industrial 3.5-inch SBC board
- Qualcomm Dragonwing™ IQ-9075 SIP module
- Kryo Gen6 cores
- 100 TOPS of AI-acceleration
- Up to 16 cameras
- Multiple display support
- 4K170/4K275 enc/dec.
- Real time subsystem (RTSS) with quad real-time cores @ 1.85 GHz and peripherals
- 36 GB LPDDR5 (3200MHz, 96bit wide DRAM with inline ECC)
- Four PMM8650AU PMICs
Tria's Vision AI-KIT IQ9 features an industrial 3.5-inch SBC board fitted with Qualcomm Dragonwing™ IQ-9075 SIP module, that delivers power-efficient on-device Edge AI and compute, for high-performance, heavy workload industrial applications in extreme environments.
The Dragonwing IQ-9075 microprocessor domain (MD) has octa high-performance Kryo Gen6 cores, 100 TOPS of AI-acceleration, plus exceptional multimedia capabilities (up to 16 cameras, multiple displays, 4K170/4K275 enc/dec.). This SOC also features a real time subsystem (RTSS) with quad real-time cores @ 1.85 GHz and peripherals, for low-latency control applications.
Dragonwing™ IQ-9075 SIP resources include 36 GB LPDDR5 (3200MHz, 96bit wide DRAM with inline ECC) plus four PMM8650AU PMICs for efficient power management.
Vision AI-KIT IQ9 packs a wide range of connectivity interfaces, into a standard industrial 3.5-inch SBC form-factor, including 2x local MIPI CSI 4-lane camera inputs, 2x miniDP (4K) and 1x MIPI DSI display outputs, 6x USB ports (plus quad USB debug-bridge), 2x 2.5 GbE LAN interfaces, CAN, UART and GPIO interfaces. Add-on Wi-Fi/BT, cellular modem and NVME SSD storage options are supported via (key-E, key-B, key-M) M.2 slots. A mezzanine camera-adapter 120-pin connector enables the use of adapter boards for support of multiple concurrent remote cameras. Audio support includes stereo amplified outputs plus onboard PDM microphone.
KEY FEATURES:
- Qualcomm Dragonwing™ IQ-9075 Development Kit
- Industrial 3.5-inch SBC board
- Qualcomm Dragonwing™ IQ-9075 SIP module
- Kryo Gen6 cores
- 100 TOPS of AI-acceleration
- Up to 16 cameras
- Multiple display support
- 4K170/4K275 enc/dec.
- Real time subsystem (RTSS) with quad real-time cores @ 1.85 GHz and peripherals
- 36 GB LPDDR5 (3200MHz, 96bit wide DRAM with inline ECC)
- Four PMM8650AU PMICs
Arduino®️ VENTUNO™ Q
The Arduino®️ VENTUNO™ Q is the edge AI computer that redefines what is possible at the edge, serving as the definitive powerhouse for AI and robotics applications.
At its core lies a revolutionary Dual-Brain architecture: the robust Qualcomm Dragonwing™ IQ-8275 delivers a massive up to 40 dense TOPS of AI compute for advanced computer vision and local LLMs, VLMs, gesture recognition and more, while the dedicated STM32H5 Microcontroller ensures the low-latency precision required for complex motor control and robotics.
Designed for a zero-friction start, the VENTUNO Q ensures you remain connected and ready to execute. It features integrated Wi-Fi® 6 connectivity for fast, reliable data transfer, alongside a suite of built-in connectors, including high-speed USB 3.0, HDMI, 2.5 Gb Ethernet, and expandable NVMe Gen.4 storage, eliminating the need for messy adapters.
Compatible with Arduino® UNO Shields and Carriers, Raspberry Pi Hat and Arduino Modulino Nodes for rapid prototyp and development.
KEY FEATURES:
- Dual-Brain Architecture — Powered by Qualcomm Dragonwing™ IQ8 NPU + STM32H5 MCU
- 40 Dense TOPS NPU for Edge AI — Run local LLMs, VLMs and more AI models on-device
- 16GB RAM + 64GB eMMC — Expandable with M.2 NVMe Gen.4 for memory-intensive AI workloads
- Universal Compatibility — supports Arduino UNO Shields, Carrier, Raspberry Pi Hats, and Modulin
- Production-Ready Connectivity — Wi-Fi 6, 2.5Gb Ethernet, CAN Bus, MIPI camera connector, USB 3.0
- Robotics Control — Support ROS 2, Deterministic, low-latency actuation via MCU
The Arduino®️ VENTUNO™ Q is the edge AI computer that redefines what is possible at the edge, serving as the definitive powerhouse for AI and robotics applications.
At its core lies a revolutionary Dual-Brain architecture: the robust Qualcomm Dragonwing™ IQ-8275 delivers a massive up to 40 dense TOPS of AI compute for advanced computer vision and local LLMs, VLMs, gesture recognition and more, while the dedicated STM32H5 Microcontroller ensures the low-latency precision required for complex motor control and robotics.
Designed for a zero-friction start, the VENTUNO Q ensures you remain connected and ready to execute. It features integrated Wi-Fi® 6 connectivity for fast, reliable data transfer, alongside a suite of built-in connectors, including high-speed USB 3.0, HDMI, 2.5 Gb Ethernet, and expandable NVMe Gen.4 storage, eliminating the need for messy adapters.
Compatible with Arduino® UNO Shields and Carriers, Raspberry Pi Hat and Arduino Modulino Nodes for rapid prototyp and development.
KEY FEATURES:
- Dual-Brain Architecture — Powered by Qualcomm Dragonwing™ IQ8 NPU + STM32H5 MCU
- 40 Dense TOPS NPU for Edge AI — Run local LLMs, VLMs and more AI models on-device
- 16GB RAM + 64GB eMMC — Expandable with M.2 NVMe Gen.4 for memory-intensive AI workloads
- Universal Compatibility — supports Arduino UNO Shields, Carrier, Raspberry Pi Hats, and Modulin
- Production-Ready Connectivity — Wi-Fi 6, 2.5Gb Ethernet, CAN Bus, MIPI camera connector, USB 3.0
- Robotics Control — Support ROS 2, Deterministic, low-latency actuation via MCU
Chipset
Open-Q™ 2210 System in Package
The Open-Q™ 2200 Series SIPs are a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QRB2210 (Yocto Linux) processors, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.
KEY FEATURES:
- Entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power
- Secure compute platform
- Extended Operating Temperature (-25C to 85C)
The Open-Q™ 2200 Series SIPs are a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QRB2210 (Yocto Linux) processors, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.
KEY FEATURES:
- Entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power
- Secure compute platform
- Extended Operating Temperature (-25C to 85C)
Chipset
Open-Q 8550CS SoM
The Open-Q™ 8550CS offers a premium performance level of 55 TOPs, meeting the higher AI/ML requirements for extreme edge computing, including Edge devices, Edge servers and Edge AI boxes. Based on the Qualcomm Dragonwing™ QCS8550 processor, the Open-Q 8550CS offers several benefits: low power consumption with a 4nm process, powerful heterogeneous computing, an 8th-generation AI engine delivering up to 10x performance over the previous generation, enterprise-level connectivity with Wi-Fi 7 supporting up to 5.8Gbps, and best-in-class performance across compute processing, camera, AI, security, and audio.
KEY FEATURES:
- Up to 16GB LPDDR5 RAM + 128GB UFS Flash
- Android™ 13 and Linux Yocto Kirkstone
- On-device AI Engine with Qualcomm Hexagon™ Tensor Processor (HTP)
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
The Open-Q™ 8550CS offers a premium performance level of 55 TOPs, meeting the higher AI/ML requirements for extreme edge computing, including Edge devices, Edge servers and Edge AI boxes. Based on the Qualcomm Dragonwing™ QCS8550 processor, the Open-Q 8550CS offers several benefits: low power consumption with a 4nm process, powerful heterogeneous computing, an 8th-generation AI engine delivering up to 10x performance over the previous generation, enterprise-level connectivity with Wi-Fi 7 supporting up to 5.8Gbps, and best-in-class performance across compute processing, camera, AI, security, and audio.
KEY FEATURES:
- Up to 16GB LPDDR5 RAM + 128GB UFS Flash
- Android™ 13 and Linux Yocto Kirkstone
- On-device AI Engine with Qualcomm Hexagon™ Tensor Processor (HTP)
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
Chipset
Open-Q IQ6 SOM
The Open-Q™ IQ6 SOM module family is powered by the Qualcomm IQ615 processor, which features Qualcomm’s powerful image signal processor (ISP) and a heterogeneous computing architecture. The IQ-615’s ability to operate in wide thermal junction temperatures ranging from -40° to +105° makes the Open-Q™ 615IQ ideally suited for many industrial-grade use cases, including industrial gateways, controllers, smart controllers, industrial HMIs, and more.
KEY FEATURES:
- Up to 8GB LPDDR4x RAM
- Up to 128GB UFS with SDIO storage support
- SMARC form factor
- Qualcomm Linux
- Industrial temperature availability
- Optional pre-certified Wi-Fi/BT
- Customizable memory and storage options
The Open-Q™ IQ6 SOM module family is powered by the Qualcomm IQ615 processor, which features Qualcomm’s powerful image signal processor (ISP) and a heterogeneous computing architecture. The IQ-615’s ability to operate in wide thermal junction temperatures ranging from -40° to +105° makes the Open-Q™ 615IQ ideally suited for many industrial-grade use cases, including industrial gateways, controllers, smart controllers, industrial HMIs, and more.
KEY FEATURES:
- Up to 8GB LPDDR4x RAM
- Up to 128GB UFS with SDIO storage support
- SMARC form factor
- Qualcomm Linux
- Industrial temperature availability
- Optional pre-certified Wi-Fi/BT
- Customizable memory and storage options
Chipset
Open-Q 4290CS™ System-in-Package (SIP)
The Open-Q™ 4290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QCS4290 chipset utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4290 SIP creates the perfect computing core for a variety of edge AI video analytic applications.
KEY FEATURES:
- Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
- 3rd generation Qualcomm® AI Engine
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Multiple high speed connectivity options
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
The Open-Q™ 4290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QCS4290 chipset utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4290 SIP creates the perfect computing core for a variety of edge AI video analytic applications.
KEY FEATURES:
- Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
- 3rd generation Qualcomm® AI Engine
- Vivid graphics with Qualcomm® Adreno™ 610 GPU
- Multiple high speed connectivity options
- Up to 6GB LPDDR4 and 256GB eMMC
- Long term support with extended life hardware and software support through 2027
Chipset
Open-Q 2290CS™ System-in-Package (SIP)
The Open-Q™ 2290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QCS2290, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.
KEY FEATURES:
- Entry-tier solution delivers greater performance, graphic, and camera capabilities
- Secure compute platform
- Improved power performance
The Open-Q™ 2290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QCS2290, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.
KEY FEATURES:
- Entry-tier solution delivers greater performance, graphic, and camera capabilities
- Secure compute platform
- Improved power performance
Chipset
Open-Q™ 8250CS Module/SoM with Qualcomm® QCS8250
The Open-Q™ 8250CS production ready computing SOM delivered with Android™ 13 supports multiple concurrent decode+encode sessions, live tuning for cameras (not customer facing), 2A sync for 2 cameras, UVC/UAC source mode for video collaboration bars to function as a USB class device, low-latency MS codecs and MS Teams video extensions with a roadmap to include background blur and replacement, an AI director framework to track and zoom a camera onto the person speaking and QSAT for smooth zoom.
KEY FEATURES:
- Long life IIoT chipset
- 8GB LPDDR5 RAM + 128GB UFS Flash
- Android™ 13
- On-device AI Engine up to 15 TOPS
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
- Ultra-compact 50 x 29 mm form factor
The Open-Q™ 8250CS production ready computing SOM delivered with Android™ 13 supports multiple concurrent decode+encode sessions, live tuning for cameras (not customer facing), 2A sync for 2 cameras, UVC/UAC source mode for video collaboration bars to function as a USB class device, low-latency MS codecs and MS Teams video extensions with a roadmap to include background blur and replacement, an AI director framework to track and zoom a camera onto the person speaking and QSAT for smooth zoom.
KEY FEATURES:
- Long life IIoT chipset
- 8GB LPDDR5 RAM + 128GB UFS Flash
- Android™ 13
- On-device AI Engine up to 15 TOPS
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Multiple high speed connectivity options
- Ultra-compact 50 x 29 mm form factor
Chipset
EXMP-Q911
This collaboration centers on the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm Dragonwing™ IQ-9075 SoC featuring an 8-core Qualcomm® Kryo™ Gen 6 CPU and a Qualcomm® Adreno™ 663 GPU, enabling 100 TOPS dense or up to 200 TOPS sparse AI compute.
Under defined 30W test scenarios, the EXMP-Q911 achieves up to 10× higher AI inference FPS compared to similar modules when running the YOLOv10n object detection model across 10 concurrent video channels.
Designed for demanding edge workloads, the EXMP-Q911 integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, paired with a rich set of high-speed interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP 1.2, MIPI CSI-2, CAN FD, and more, providing exceptional connectivity and performance density for compact edge AI systems.
KEY FEATURES:
- Powered by : Dragonwing IQ-9075 SoC, compliant with COM-HPC Mini form factor
- Up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI computing power
- 36 GB onboard memory, 128 GB UFS 3.1 storage, 2 x 2.5G Ethernet and 2 x 4-lane MIPI CSI-2 interfaces
- -40°C to 85°C (Ta) operating temperature
This collaboration centers on the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm Dragonwing™ IQ-9075 SoC featuring an 8-core Qualcomm® Kryo™ Gen 6 CPU and a Qualcomm® Adreno™ 663 GPU, enabling 100 TOPS dense or up to 200 TOPS sparse AI compute.
Under defined 30W test scenarios, the EXMP-Q911 achieves up to 10× higher AI inference FPS compared to similar modules when running the YOLOv10n object detection model across 10 concurrent video channels.
Designed for demanding edge workloads, the EXMP-Q911 integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, paired with a rich set of high-speed interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP 1.2, MIPI CSI-2, CAN FD, and more, providing exceptional connectivity and performance density for compact edge AI systems.
KEY FEATURES:
- Powered by : Dragonwing IQ-9075 SoC, compliant with COM-HPC Mini form factor
- Up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI computing power
- 36 GB onboard memory, 128 GB UFS 3.1 storage, 2 x 2.5G Ethernet and 2 x 4-lane MIPI CSI-2 interfaces
- -40°C to 85°C (Ta) operating temperature
Chipset
ME910G1
This module includes Qualcomm® 9205 LTE modem. Global bands support for worldwide deployments; part of the Telit’s flagship xE910 family that includes 2G, 3G, 4G modules in the same form factor. • Multimode LTE Cat-M1 / NB2 / EGPRS • Size: 28.2mm x 28.2mm x 2.2mm
This module includes Qualcomm® 9205 LTE modem. Global bands support for worldwide deployments; part of the Telit’s flagship xE910 family that includes 2G, 3G, 4G modules in the same form factor. • Multimode LTE Cat-M1 / NB2 / EGPRS • Size: 28.2mm x 28.2mm x 2.2mm
Chipset
ME310G1-W1
This module includes Qualcomm® 9205 LTE modem, offers global bands support for worldwide deployments. Miniature x310 family with flexible perimeter footprint and pin-to-pin compatibility • Multimode LTE Cat-M1 / NB2 • Size: 13.1mm x 14.3mm x 2
This module includes Qualcomm® 9205 LTE modem, offers global bands support for worldwide deployments. Miniature x310 family with flexible perimeter footprint and pin-to-pin compatibility • Multimode LTE Cat-M1 / NB2 • Size: 13.1mm x 14.3mm x 2
Chipset
Open-Q 8550CS SoM Development Kit
The Open-Q™ 8550CS SOM Development Kit is designed to facilitate easy evaluation of the key features of the Qualcomm Dragonwing™ QCS8550 processor, such as the Low Power AI subsystem with a dedicated DSP and AI accelerator supporting always-on audio, sensors, contextual data streams, and an always-on camera. The kit supports the evaluation of C-PHY and D-PHY MIPI CSI and GMSL cameras, dual MIPI DSI, DisplayPort, audio, sensors, GNSS, Gigabit Ethernet and many more features.The development kit provides the ideal starting point for evaluating the Open-Q™ 8550CS SOM. The platform consists of Lantronix’s Open-Q™ 8550CS SOM, an open-frame carrier board exposing all the available I/O, and a range of accessories to fast-track your product development.
KEY FEATURES:
- Based on the Qualcomm Dragonwing QCS8550
- Android 13 and Yocto Linux Kirkstone
- Standard M.2 & MikroBUS sockets
The Open-Q™ 8550CS SOM Development Kit is designed to facilitate easy evaluation of the key features of the Qualcomm Dragonwing™ QCS8550 processor, such as the Low Power AI subsystem with a dedicated DSP and AI accelerator supporting always-on audio, sensors, contextual data streams, and an always-on camera. The kit supports the evaluation of C-PHY and D-PHY MIPI CSI and GMSL cameras, dual MIPI DSI, DisplayPort, audio, sensors, GNSS, Gigabit Ethernet and many more features.The development kit provides the ideal starting point for evaluating the Open-Q™ 8550CS SOM. The platform consists of Lantronix’s Open-Q™ 8550CS SOM, an open-frame carrier board exposing all the available I/O, and a range of accessories to fast-track your product development.
KEY FEATURES:
- Based on the Qualcomm Dragonwing QCS8550
- Android 13 and Yocto Linux Kirkstone
- Standard M.2 & MikroBUS sockets
Chipset
Open-Q AL Development Kit (4290 & 2290 Series)
The Open-Q™ AL development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4290 and 2290 SIP families based on the Qualcomm® QCS4290 processor (Android).
KEY FEATURES:
- Development kit provides interfaces to evaluate camera and video
- Evaluate display on LCD & HDMI
- Supports many robotic features
The Open-Q™ AL development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4290 and 2290 SIP families based on the Qualcomm® QCS4290 processor (Android).
KEY FEATURES:
- Development kit provides interfaces to evaluate camera and video
- Evaluate display on LCD & HDMI
- Supports many robotic features
Open-Q™ 5165RB SOM
The Open-Q™ 5165RB SOM is an ultra-compact (50mm x 29mm) production-ready computing module based on the powerful Qualcomm® QRB5165 System-on-Chip. The QRB5165 utilizes Qualcomm Technologies heterogenous compute expertise to provide an SoC with multiple specialized processing cores such as the 5th gen Qualcomm® AI Engine, hardware video analytics engine, Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP. Coupled with the latest WiFi 6 connectivity and camera features.
KEY FEATURES:
- Qualcomm® QRB5165 chipset
- 8GB LPDDR5 RAM + 128GB UFS Flash
- Ubuntu 18.04 Linux
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Ultra-compact 50 x 29 mm form factor
The Open-Q™ 5165RB SOM is an ultra-compact (50mm x 29mm) production-ready computing module based on the powerful Qualcomm® QRB5165 System-on-Chip. The QRB5165 utilizes Qualcomm Technologies heterogenous compute expertise to provide an SoC with multiple specialized processing cores such as the 5th gen Qualcomm® AI Engine, hardware video analytics engine, Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP. Coupled with the latest WiFi 6 connectivity and camera features.
KEY FEATURES:
- Qualcomm® QRB5165 chipset
- 8GB LPDDR5 RAM + 128GB UFS Flash
- Ubuntu 18.04 Linux
- Dedicated Computer Vision Engine
- Multiple MIPI camera and display ports
- Ultra-compact 50 x 29 mm form factor
Chipset
Open-Q™ 865 Development Kit
The Open-Q™ 865 Development Kit is a versatile, easy-to-use, exposed board platform, compatible with our production-ready Open-Q 865 family of SOMs. The development kit provides the ideal starting point for evaluating any of the compatible Open-Q 865 family of SOMs or developing next generation embedded and IoT devices. Compatible with the Open-Q 5165RB SOM and Open-Q 865XR SOM.
KEY FEATURES:
- • Compatible with the micro-sized (50x29mm) Open-Q 865 family of SOMs• Open-frame Mini-ITX Form-factor carrier board for evaluation and development• Wi-Fi and Bluetooth antennas on carrier board
The Open-Q™ 865 Development Kit is a versatile, easy-to-use, exposed board platform, compatible with our production-ready Open-Q 865 family of SOMs. The development kit provides the ideal starting point for evaluating any of the compatible Open-Q 865 family of SOMs or developing next generation embedded and IoT devices. Compatible with the Open-Q 5165RB SOM and Open-Q 865XR SOM.
KEY FEATURES:
- • Compatible with the micro-sized (50x29mm) Open-Q 865 family of SOMs• Open-frame Mini-ITX Form-factor carrier board for evaluation and development• Wi-Fi and Bluetooth antennas on carrier board
Chipset
