8 results
Filter
8 results
Filter by:
TurboX C8750 Development Kit
Thundercomm TurboX C8750 Development Kit is a high-performance Development Kit which is powered by next Gen Flagship Qualcomm® Snapdragon™ CQ8750s processor. It supports both Android and Linux operating systems. TurboX C8750 Development Kit supports Android, featuring powerful computing, extreme edge AI processing, and robust video and graphics. It is an ideal platform for IoT products that demand powerful computing, advanced imaging, and exceptional graphics rendering.TurboX C8750 Development Kit supports customers accelerate product development process and can be widely used in Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots (AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing and other application scenarios.
KEY FEATURES:
- 8th Gen AI Engine: Over 10x performance boost to previous gen
- Next Gen Oryon™ CPU:up to 1.5x over previous gen
- 3A+IQ upgrades;3 ISP, 3 x 48MP@30FPS HW sHDR, ASE
- Hypervisor enables multiple trusted VMs (TVMs)
- 3 times GPU performance improvement compared to the previous generation
- 4K240/8K60 decoding, 4K120/8K30 encoding AV1 decoder
Thundercomm TurboX C8750 Development Kit is a high-performance Development Kit which is powered by next Gen Flagship Qualcomm® Snapdragon™ CQ8750s processor. It supports both Android and Linux operating systems. TurboX C8750 Development Kit supports Android, featuring powerful computing, extreme edge AI processing, and robust video and graphics. It is an ideal platform for IoT products that demand powerful computing, advanced imaging, and exceptional graphics rendering.TurboX C8750 Development Kit supports customers accelerate product development process and can be widely used in Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots (AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing and other application scenarios.
KEY FEATURES:
- 8th Gen AI Engine: Over 10x performance boost to previous gen
- Next Gen Oryon™ CPU:up to 1.5x over previous gen
- 3A+IQ upgrades;3 ISP, 3 x 48MP@30FPS HW sHDR, ASE
- Hypervisor enables multiple trusted VMs (TVMs)
- 3 times GPU performance improvement compared to the previous generation
- 4K240/8K60 decoding, 4K120/8K30 encoding AV1 decoder
SP895BD-AP smart module
The SP895BD-AP is Quectel’s new generation of flagship Android smart module. Based on Qualcomm Techolongies’ IoT chipset CQ8750-S, with built-in incredible octa-core high-performance Qualcomm Oryon™ CPU, Qualcomm® Adreno™ 830 GPU, Adreno DPU, Adreno 8550 VPU, Qualcomm® Hexagon™ DSP, and Qualcomm Spectra™ ISP. Featuring powerful performance and rich multimedia functions, it is ideal for both industrial and consumer applications requiring high computing power, AI, and multimedia functions.A rich set of interfaces (such as LCM, camera, touch panel, I2S, PCIe, UART, USB, I2C, SPI, etc.) extend the applicability of the module to a wide range of M2M applications, including video conference systems, live streaming devices, gaming, edge computing, robots, AR/ VR, intelligent retail, smart safety, and more.
KEY FEATURES:
- Android 15/Linux smart module
- LGA package
- 33.0mm x 39.0mm x 3.85mm
- Operating temperature range of -30°C to +75°C
- Qualcomm Oryon CPU
- Adreno 830 GPU
- Hexagon DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX)
- Qualcomm Spectra ISP
- Adreno 8550 VPU
- Adreno DPU
- Neural processing unit
- Security processing
- Video encoder: 4K @ 120fps; 8K @ 30fps
- Video decoder: 4K @ 240fps; 8K @ 60fps
- Computing power of up to 80 TOPS
The SP895BD-AP is Quectel’s new generation of flagship Android smart module. Based on Qualcomm Techolongies’ IoT chipset CQ8750-S, with built-in incredible octa-core high-performance Qualcomm Oryon™ CPU, Qualcomm® Adreno™ 830 GPU, Adreno DPU, Adreno 8550 VPU, Qualcomm® Hexagon™ DSP, and Qualcomm Spectra™ ISP. Featuring powerful performance and rich multimedia functions, it is ideal for both industrial and consumer applications requiring high computing power, AI, and multimedia functions.A rich set of interfaces (such as LCM, camera, touch panel, I2S, PCIe, UART, USB, I2C, SPI, etc.) extend the applicability of the module to a wide range of M2M applications, including video conference systems, live streaming devices, gaming, edge computing, robots, AR/ VR, intelligent retail, smart safety, and more.
KEY FEATURES:
- Android 15/Linux smart module
- LGA package
- 33.0mm x 39.0mm x 3.85mm
- Operating temperature range of -30°C to +75°C
- Qualcomm Oryon CPU
- Adreno 830 GPU
- Hexagon DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX)
- Qualcomm Spectra ISP
- Adreno 8550 VPU
- Adreno DPU
- Neural processing unit
- Security processing
- Video encoder: 4K @ 120fps; 8K @ 30fps
- Video decoder: 4K @ 240fps; 8K @ 60fps
- Computing power of up to 80 TOPS
QSM560DR
The QSM560DR is a high-performance 5G smart control panel from Quectel, built on the SG560D smart module and powered by 64-bit octa-core QCM6490/QCS6490 processors with Adreno 643 GPU, supporting both Ubuntu and Android operating systems. Designed for industrial and consumer applications, it supports 3GPP Release 15, 5G NSA/SA, 4G/3G fallback, Wi-Fi 6E, 2x2 MU-MIMO, and Bluetooth 5.2, making it suitable for high-speed data, edge computing, and multimedia tasks. The module supports 5G/LTE MIMO technology for optimized data transfer and features integrated multi-constellation GNSS (GPS, GLONASS, BDS, NavIC, Galileo, QZSS, SBAS) for precise positioning. With a rich set of interfaces including HDMI, eDP, Ethernet, USB, CAN, RS-232, and RS-485, it fits seamlessly into a wide range of edge computing use cases such as robotics, smart retail, industrial automation, and safety systems.
KEY FEATURES:
- Small form factor Single Board Computer
The QSM560DR is a high-performance 5G smart control panel from Quectel, built on the SG560D smart module and powered by 64-bit octa-core QCM6490/QCS6490 processors with Adreno 643 GPU, supporting both Ubuntu and Android operating systems. Designed for industrial and consumer applications, it supports 3GPP Release 15, 5G NSA/SA, 4G/3G fallback, Wi-Fi 6E, 2x2 MU-MIMO, and Bluetooth 5.2, making it suitable for high-speed data, edge computing, and multimedia tasks. The module supports 5G/LTE MIMO technology for optimized data transfer and features integrated multi-constellation GNSS (GPS, GLONASS, BDS, NavIC, Galileo, QZSS, SBAS) for precise positioning. With a rich set of interfaces including HDMI, eDP, Ethernet, USB, CAN, RS-232, and RS-485, it fits seamlessly into a wide range of edge computing use cases such as robotics, smart retail, industrial automation, and safety systems.
KEY FEATURES:
- Small form factor Single Board Computer
Smart 5G EVB kit for SG520B, SG560D series
Applicable modules: SG520B series, SG560D series. USB interfaces. (U)SIM card interfaces. SD card interface. Camera interfaces. NFC + SPI/I2S interface. LCM interfaces. Touch panel interfaces. UART interface. Debug interface. Status LED.
KEY FEATURES:
- Please refer to the full user guide containing detailed information on the Smart 5G EVB Kit, an assistant tool to develop applications, test basic functionalities of modules. Link above takes you to the product page for full information.
Applicable modules: SG520B series, SG560D series. USB interfaces. (U)SIM card interfaces. SD card interface. Camera interfaces. NFC + SPI/I2S interface. LCM interfaces. Touch panel interfaces. UART interface. Debug interface. Status LED.
KEY FEATURES:
- Please refer to the full user guide containing detailed information on the Smart 5G EVB Kit, an assistant tool to develop applications, test basic functionalities of modules. Link above takes you to the product page for full information.
5G SG560D Smart Module Series
SG560D series is Quectel’s new generation of multi-mode 5G smart module with built-in Android 12 or Android 13 OS. Based on the Qualcomm® QCM6490|QCS6490 high-performance 64-bit octa-core processors with built in Qualcomm® Adreno™ 643 GPU, ideal for industrial & consumer applications requiring high data rates & multimedia functions. SG560D series is available in 4 variants: SG560D-CE, SG560D-EM, SG560D-WF and SG560D-NA. It also supports 3GPP Rel-15 specification, both 5G NSA/SA modes with 4G/ 3G fallback. Wi-Fi 6E & DBS, IEEE 802.11a/ b/ g/ n/ ac/ ax, Wi-Fi 2 × 2 MU-MIMO & Bluetooth® 5.2. Combining high-speed wireless connectivity with embedded multi-constellation & high sensitivity GNSS (GPS, GLONASS, BDS, NavIC, Galileo, QZSS and SBAS) receiver for positioning.
KEY FEATURES:
- Applications including smart gateway, CPE, MiFi, MID, PND, POS, router, multimedia terminal, smart phone, digital signage, industrial PDA.
SG560D series is Quectel’s new generation of multi-mode 5G smart module with built-in Android 12 or Android 13 OS. Based on the Qualcomm® QCM6490|QCS6490 high-performance 64-bit octa-core processors with built in Qualcomm® Adreno™ 643 GPU, ideal for industrial & consumer applications requiring high data rates & multimedia functions. SG560D series is available in 4 variants: SG560D-CE, SG560D-EM, SG560D-WF and SG560D-NA. It also supports 3GPP Rel-15 specification, both 5G NSA/SA modes with 4G/ 3G fallback. Wi-Fi 6E & DBS, IEEE 802.11a/ b/ g/ n/ ac/ ax, Wi-Fi 2 × 2 MU-MIMO & Bluetooth® 5.2. Combining high-speed wireless connectivity with embedded multi-constellation & high sensitivity GNSS (GPS, GLONASS, BDS, NavIC, Galileo, QZSS and SBAS) receiver for positioning.
KEY FEATURES:
- Applications including smart gateway, CPE, MiFi, MID, PND, POS, router, multimedia terminal, smart phone, digital signage, industrial PDA.
