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5G Industrial IoT / Ruggedized Handhelds (QCM6490 Reference Design)
Accelerate Your IoT Development with QCM6490 Reference Design. QCM6490 Reference Design offer, featuring: Planning Workshop: Collaborate with us to define project objectives, requirements, and timelines with QCM6490. Reference Design: Leverage our pre-developed design to save $1M in NRE fees. Maximize Your Benefits by partnering with us, you'll accelerate the development and innovation.
We can design chip on board design with any Qualcomm's X (thin modem) or QCM line of 5G chipsets, do all pre-certification testing (FCC, CE, against carrier requirements) and help with the carrier certification process as needed.
Contact us to learn more about our IoT Solutions on the Qualcomm platform and kickstart your project. Let's work together to bring your vision to life. Contact Vesa Korkala (Vesa.Korkala@sigmaconnectivity.com)
KEY FEATURES:
- QCM/QCS6490 Ref Design to build your product upon
- Key design and build experiences with multiple Qualcomm® Chipsets
Accelerate Your IoT Development with QCM6490 Reference Design. QCM6490 Reference Design offer, featuring: Planning Workshop: Collaborate with us to define project objectives, requirements, and timelines with QCM6490. Reference Design: Leverage our pre-developed design to save $1M in NRE fees. Maximize Your Benefits by partnering with us, you'll accelerate the development and innovation.
We can design chip on board design with any Qualcomm's X (thin modem) or QCM line of 5G chipsets, do all pre-certification testing (FCC, CE, against carrier requirements) and help with the carrier certification process as needed.
Contact us to learn more about our IoT Solutions on the Qualcomm platform and kickstart your project. Let's work together to bring your vision to life. Contact Vesa Korkala (Vesa.Korkala@sigmaconnectivity.com)
KEY FEATURES:
- QCM/QCS6490 Ref Design to build your product upon
- Key design and build experiences with multiple Qualcomm® Chipsets
QCM6490 Reference Design
GET YOUR IOT PROJECT GOING!We offer the Sigma Connectivity/ Qualcomm® QCM6490 IoT Kickstarter, which includes the following:Planning Workshop:In this workshop, we will collaborate with you to establish clear objectives, define requirements, and create a realistic timeline for your project.QCM6490 Reference Design:As part of this offer, you can leverage the QCM6490 reference design. By using this design, you can save significant costs, as there will be no prototyping licensing fees involved. This translates to potential savings of up to $1M or more.By taking advantage of our expertise and the resources provided through Sigma Connectivity’ and Qualcomm Technologies' IoT Kick Starter Offer, you can accelerate the development of your 5G IoT solutions and maximize the benefits of digital transformation.
KEY FEATURES:
- Complete Ref Design to build your product upon
- Prototype Licenses covered.
- Key Design and build experiences with multiple Qualcomm® Chipsets
GET YOUR IOT PROJECT GOING!We offer the Sigma Connectivity/ Qualcomm® QCM6490 IoT Kickstarter, which includes the following:Planning Workshop:In this workshop, we will collaborate with you to establish clear objectives, define requirements, and create a realistic timeline for your project.QCM6490 Reference Design:As part of this offer, you can leverage the QCM6490 reference design. By using this design, you can save significant costs, as there will be no prototyping licensing fees involved. This translates to potential savings of up to $1M or more.By taking advantage of our expertise and the resources provided through Sigma Connectivity’ and Qualcomm Technologies' IoT Kick Starter Offer, you can accelerate the development of your 5G IoT solutions and maximize the benefits of digital transformation.
KEY FEATURES:
- Complete Ref Design to build your product upon
- Prototype Licenses covered.
- Key Design and build experiences with multiple Qualcomm® Chipsets
SP895BD-AP smart module
The SP895BD-AP is Quectel’s new generation of flagship Android smart module. Based on Qualcomm Techolongies’ IoT chipset CQ8750-S, with built-in incredible octa-core high-performance Qualcomm Oryon™ CPU, Qualcomm® Adreno™ 830 GPU, Adreno DPU, Adreno 8550 VPU, Qualcomm® Hexagon™ DSP, and Qualcomm Spectra™ ISP. Featuring powerful performance and rich multimedia functions, it is ideal for both industrial and consumer applications requiring high computing power, AI, and multimedia functions.A rich set of interfaces (such as LCM, camera, touch panel, I2S, PCIe, UART, USB, I2C, SPI, etc.) extend the applicability of the module to a wide range of M2M applications, including video conference systems, live streaming devices, gaming, edge computing, robots, AR/ VR, intelligent retail, smart safety, and more.
KEY FEATURES:
- Android 15/Linux smart module
- LGA package
- 33.0mm x 39.0mm x 3.85mm
- Operating temperature range of -30°C to +75°C
- Qualcomm Oryon CPU
- Adreno 830 GPU
- Hexagon DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX)
- Qualcomm Spectra ISP
- Adreno 8550 VPU
- Adreno DPU
- Neural processing unit
- Security processing
- Video encoder: 4K @ 120fps; 8K @ 30fps
- Video decoder: 4K @ 240fps; 8K @ 60fps
- Computing power of up to 80 TOPS
The SP895BD-AP is Quectel’s new generation of flagship Android smart module. Based on Qualcomm Techolongies’ IoT chipset CQ8750-S, with built-in incredible octa-core high-performance Qualcomm Oryon™ CPU, Qualcomm® Adreno™ 830 GPU, Adreno DPU, Adreno 8550 VPU, Qualcomm® Hexagon™ DSP, and Qualcomm Spectra™ ISP. Featuring powerful performance and rich multimedia functions, it is ideal for both industrial and consumer applications requiring high computing power, AI, and multimedia functions.A rich set of interfaces (such as LCM, camera, touch panel, I2S, PCIe, UART, USB, I2C, SPI, etc.) extend the applicability of the module to a wide range of M2M applications, including video conference systems, live streaming devices, gaming, edge computing, robots, AR/ VR, intelligent retail, smart safety, and more.
KEY FEATURES:
- Android 15/Linux smart module
- LGA package
- 33.0mm x 39.0mm x 3.85mm
- Operating temperature range of -30°C to +75°C
- Qualcomm Oryon CPU
- Adreno 830 GPU
- Hexagon DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX)
- Qualcomm Spectra ISP
- Adreno 8550 VPU
- Adreno DPU
- Neural processing unit
- Security processing
- Video encoder: 4K @ 120fps; 8K @ 30fps
- Video decoder: 4K @ 240fps; 8K @ 60fps
- Computing power of up to 80 TOPS
TurboX C8750 Development Kit
Thundercomm TurboX C8750 Development Kit is a high-performance Development Kit which is powered by next Gen Flagship Qualcomm® Snapdragon™ CQ8750s processor. It supports both Android and Linux operating systems. TurboX C8750 Development Kit supports Android, featuring powerful computing, extreme edge AI processing, and robust video and graphics. It is an ideal platform for IoT products that demand powerful computing, advanced imaging, and exceptional graphics rendering.TurboX C8750 Development Kit supports customers accelerate product development process and can be widely used in Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots (AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing and other application scenarios.
KEY FEATURES:
- 8th Gen AI Engine: Over 10x performance boost to previous gen
- Next Gen Oryon™ CPU:up to 1.5x over previous gen
- 3A+IQ upgrades;3 ISP, 3 x 48MP@30FPS HW sHDR, ASE
- Hypervisor enables multiple trusted VMs (TVMs)
- 3 times GPU performance improvement compared to the previous generation
- 4K240/8K60 decoding, 4K120/8K30 encoding AV1 decoder
Thundercomm TurboX C8750 Development Kit is a high-performance Development Kit which is powered by next Gen Flagship Qualcomm® Snapdragon™ CQ8750s processor. It supports both Android and Linux operating systems. TurboX C8750 Development Kit supports Android, featuring powerful computing, extreme edge AI processing, and robust video and graphics. It is an ideal platform for IoT products that demand powerful computing, advanced imaging, and exceptional graphics rendering.TurboX C8750 Development Kit supports customers accelerate product development process and can be widely used in Smart Camera, Video Conference, Automated Manufacturing Robots, Autonomous Mobile Robots (AMRs), Collaborative Robots, Delivery Robots, Urban Air Mobility (UAM) Transportation, Edge Computing and other application scenarios.
KEY FEATURES:
- 8th Gen AI Engine: Over 10x performance boost to previous gen
- Next Gen Oryon™ CPU:up to 1.5x over previous gen
- 3A+IQ upgrades;3 ISP, 3 x 48MP@30FPS HW sHDR, ASE
- Hypervisor enables multiple trusted VMs (TVMs)
- 3 times GPU performance improvement compared to the previous generation
- 4K240/8K60 decoding, 4K120/8K30 encoding AV1 decoder
MSC SM2S-QCS5430
The MSC SM2S-QCS5430 SMARC 2.1.1 module family is powered by the Qualcomm® QCS5430 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS5430 integrates Qualcomm® Kryo™ 670 CPU which contains up to six cores, Qualcomm® Adreno™ 642L GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K30 and many different display connectivity (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with up to 3.5 TOPS at low power and massive camera support with 4 MIPI-CSI inputs
KEY FEATURES:
- USB: 5x2.0, 2x 3.1PCIe: 2x x1, 1x x21x MIPI-DSI or LVDS, 1x DP 1.4 (2 lane), 1x eDP/DP4x MIPI-CSIWLAN/BT Module2x Gigabit Ethernet2x I2S Audio Interface4x UART, 2x SPI, 2x CAN2.0-FD, 5x I²CWIN 11 IOT, Yocto Linux-30°....85°C
The MSC SM2S-QCS5430 SMARC 2.1.1 module family is powered by the Qualcomm® QCS5430 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS5430 integrates Qualcomm® Kryo™ 670 CPU which contains up to six cores, Qualcomm® Adreno™ 642L GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K30 and many different display connectivity (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with up to 3.5 TOPS at low power and massive camera support with 4 MIPI-CSI inputs
KEY FEATURES:
- USB: 5x2.0, 2x 3.1PCIe: 2x x1, 1x x21x MIPI-DSI or LVDS, 1x DP 1.4 (2 lane), 1x eDP/DP4x MIPI-CSIWLAN/BT Module2x Gigabit Ethernet2x I2S Audio Interface4x UART, 2x SPI, 2x CAN2.0-FD, 5x I²CWIN 11 IOT, Yocto Linux-30°....85°C
