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Tria Vision AI-KIT IQ9
Tria's Vision AI-KIT IQ9 features an industrial 3.5-inch SBC board fitted with Qualcomm Dragonwing™ IQ-9075 SIP module, that delivers power-efficient on-device Edge AI and compute, for high-performance, heavy workload industrial applications in extreme environments. The Dragonwing IQ-9075 microprocessor domain (MD) has octa high-performance Kryo Gen6 cores, 100 TOPS of AI-acceleration, plus exceptional multimedia capabilities (up to 16 cameras, multiple displays, 4K170/4K275 enc/dec.). This SOC also features a real time subsystem (RTSS) with quad real-time cores @ 1.85 GHz and peripherals, for low-latency control applications. Dragonwing™ IQ-9075 SIP resources include 36 GB LPDDR5 (3200MHz, 96bit wide DRAM with inline ECC) plus four PMM8650AU PMICs for efficient power management. Vision AI-KIT IQ9 packs a wide range of connectivity interfaces, into a standard industrial 3.5-inch SBC form-factor, including 2x local MIPI CSI 4-lane camera inputs, 2x miniDP (4K) and 1x MIPI DSI display outputs, 6x USB ports (plus quad USB debug-bridge), 2x 2.5 GbE LAN interfaces, CAN, UART and GPIO interfaces. Add-on Wi-Fi/BT, cellular modem and NVME SSD storage options are supported via (key-E, key-B, key-M) M.2 slots. A mezzanine camera-adapter 120-pin connector enables the use of adapter boards for support of multiple concurrent remote cameras. Audio support includes stereo amplified outputs plus onboard PDM microphone.

KEY FEATURES:

  • Qualcomm Dragonwing™ IQ-9075 Development Kit
  • Industrial 3.5-inch SBC board
  • Qualcomm Dragonwing™ IQ-9075 SIP module
  • Kryo Gen6 cores
  • 100 TOPS of AI-acceleration
  • Up to 16 cameras
  • Multiple display support
  • 4K170/4K275 enc/dec.
  • Real time subsystem (RTSS) with quad real-time cores @ 1.85 GHz and peripherals
  • 36 GB LPDDR5 (3200MHz, 96bit wide DRAM with inline ECC)
  • Four PMM8650AU PMICs
ByTRIA
Chipset
QCS9075
IQ-9075 Evaluation Kit
The Dragonwing IQ-9075 EVK is a comprehensive evaluation platform to test the industrial-grade performance of the Dragonwing IQ-9075 processor for IoT solutions. The Dragonwing IQ-9075 EVK showcases the most common features of the Dragonwing IQ-9075 processor, which is optimized for industrial IoT and robotics applications involving heavy workloads in the most demanding environments like autonomous mobile robots (AMRs) and industrial machinery. The Dragonwing IQ-9075 EVK consists of a mainboard, supporting key interfaces, and optional expansion mezzanine boards to support additional features. It enables developers, OEMs, and ODMs to design and test their solutions powered by the industrial-grade Dragonwing IQ9075 processor integrated with standard interfaces and connectors, mezzanine expandability, and wireless connectivity. Test and prototype software development and hardware designs with less effort and cost to get your product to market faster.
ByQUALCOMM
Chipset
PMM8650AU,QCS9075,QCS9075M
IQ-8275 Evaluation Kit
The Dragonwing IQ-8275 EVK showcases the key capabilities of the Dragonwing IQ-8275 processor, purpose-built for robotics, edge AI boxes, gateways, AMRs, industrial automation, and many more applications that require multi-thread computing, independent AI, and graphics processing while minimizing cost and power requirements. Engineered for edge AI operations, it is designed to enable robust computing, high-speed connectivity, and long lifecycle support for mission-critical deployments.
ByQUALCOMM
Chipset
QCS8275
Dual Mode (LC3 Auracast, Unicast and Classic BR/EDR) Audio and Data Module
IDC777 is a fully integrated Dual Mode LE Audio and Classic Audio Bluetooth module. IDC777 offers both LE Audio (LC3 Codec Auracast and Unicast) and Bluetooth Classic (aptX, aptX-HD, apt-X Lossless, Snapdragon Sound). IDC777 offers best in class performance in every single aspect of Bluetooth. IDC777 is based on the latest generation Bluetooth 6.0 Qualcomm Audio chip. IDC777 is easy to supply and offers a long life. DC777 offers a high level UART command interface (AudioAgent) that provides full control of all profiles such as UniCast and Auracast for LE Audio (LC3 Codec) and HFP, HSP or HFP-AG (HandsFree Voice), A2DP Source and Sink and AVRCP (Music Streaming), PBAP (Phone Book Access Profile) and MAP (Message Access Profile) for Classic. IDC777 connects to Android and iOS Apps using Bluetooth Low Energy, the Serial Protocol Profile (SPP) or HID (Over Classic, USB or BLE GATT). The module can act as receiver of Audio but also as a Transmitter. IDC777 can be a Central or Peripheral BLE device. In Peripheral mode, it the users can create their own BLE profiles.

KEY FEATURES:

  • Concurrent LE Audio and Classic 6.0 Bluetooth Module
  • Standalone or Simple UART/USB commands. Classic Audio & Data Rx/Tx
  • HFP, HFP-AG, A2DP Sink, A2DP Source, SPP, BLE Central/Peripheral
  • PBAP, MAP, HID (USB, Bluetooth, BLE)
  • LE (LC3) Auracast (Broadcast) and Unicast Receive and Transmit
  • Analog (120dB SNR) and Digital Interface (-100dB SNR)
  • Snapdragon Sound: aptX (-HD), aptX-Lossless, LC3, SBC, AAC
  • Ultra Low Latency: Down to 20ms Latency (Gaming Mode)
  • I2S, PCM, UART, I2C, SPDIF, USB, IOs Interfaces
  • Firmware Upgrade via UART, USB or Bluetooth (Over the Air)
  • Bluetooth, FCC, RED, IC, MIC, KCC, SRRC Certified
  • Comes with variants for external Antenna or Long Range
ByIOT747
Chipset
QCC3083,QCC3084,QCC5190...
IDC777-DISKIT
IDC777 is the evaluation and development board for the IDC777 module. This board contains the IDC777 (LE Audio (Auracast and Unicast), Classic Bluetooth (A2DP Source and Sink, HFP, AGHFP, PBAP, HID and MAP) and BLE Data. So it is also used as a simple test board when you are testing your LE Audio or Classic Bluetooth Products.

KEY FEATURES:

  • Development Board for the IDC777
  • Dual Mode LE Audio (Auracast/Unicast) and BR/EDR
ByIOT747
Chipset
QCC5141,QCC3083,QCC5190...
Arduino®️ VENTUNO™ Q
The Arduino®️ VENTUNO™ Q is the edge AI computer that redefines what is possible at the edge, serving as the definitive powerhouse for AI and robotics applications. At its core lies a revolutionary Dual-Brain architecture: the robust Qualcomm Dragonwing™ IQ-8275 delivers a massive up to 40 dense TOPS of AI compute for advanced computer vision and local LLMs, VLMs, gesture recognition and more, while the dedicated STM32H5 Microcontroller ensures the low-latency precision required for complex motor control and robotics. Designed for a zero-friction start, the VENTUNO Q ensures you remain connected and ready to execute. It features integrated Wi-Fi® 6 connectivity for fast, reliable data transfer, alongside a suite of built-in connectors, including high-speed USB 3.0, HDMI, 2.5 Gb Ethernet, and expandable NVMe Gen.4 storage, eliminating the need for messy adapters. Compatible with Arduino® UNO Shields and Carriers, Raspberry Pi Hat and Arduino Modulino Nodes for rapid prototyp and development.

KEY FEATURES:

  • Dual-Brain Architecture — Powered by Qualcomm Dragonwing™ IQ8 NPU + STM32H5 MCU
  • 40 Dense TOPS NPU for Edge AI — Run local LLMs, VLMs and more AI models on-device
  • 16GB RAM + 64GB eMMC — Expandable with M.2 NVMe Gen.4 for memory-intensive AI workloads
  • Universal Compatibility — supports Arduino UNO Shields, Carrier, Raspberry Pi Hats, and Modulin
  • Production-Ready Connectivity — Wi-Fi 6, 2.5Gb Ethernet, CAN Bus, MIPI camera connector, USB 3.0
  • Robotics Control — Support ROS 2, Deterministic, low-latency actuation via MCU
ByARDUINO S.R.L.
Chipset
QCS8275
Open-Q™ 2210 System in Package
The Open-Q™ 2200 Series SIPs are a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QRB2210 (Yocto Linux) processors, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.Along with the companion development kit, OS and SDKs, and available accessories, it will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.

KEY FEATURES:

  • Entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power
  • Secure compute platform
  • Extended Operating Temperature (-25C to 85C)
ByLANTRONIX INC.
Chipset
QRB2210
Open-Q IQ6 SOM
The Open-Q™ IQ6 SOM module family is powered by the Qualcomm IQ615 processor, which features Qualcomm’s powerful image signal processor (ISP) and a heterogeneous computing architecture. The IQ-615’s ability to operate in wide thermal junction temperatures ranging from -40° to +105° makes the Open-Q™ 615IQ ideally suited for many industrial-grade use cases, including industrial gateways, controllers, smart controllers, industrial HMIs, and more.

KEY FEATURES:

  • Up to 8GB LPDDR4x RAM
  • Up to 128GB UFS with SDIO storage support
  • SMARC form factor
  • Qualcomm Linux
  • Industrial temperature availability
  • Optional pre-certified Wi-Fi/BT
  • Customizable memory and storage options
ByLANTRONIX INC.
Chipset
QCS615
Open-Q 8550CS SoM
The Open-Q™ 8550CS offers a premium performance level of 55 TOPs, meeting the higher AI/ML requirements for extreme edge computing, including Edge devices, Edge servers and Edge AI boxes. Based on the Qualcomm Dragonwing™ QCS8550 processor, the Open-Q 8550CS offers several benefits: low power consumption with a 4nm process, powerful heterogeneous computing, an 8th-generation AI engine delivering up to 10x performance over the previous generation, enterprise-level connectivity with Wi-Fi 7 supporting up to 5.8Gbps, and best-in-class performance across compute processing, camera, AI, security, and audio.

KEY FEATURES:

  • Up to 16GB LPDDR5 RAM + 128GB UFS Flash
  • Android™ 13 and Linux Yocto Kirkstone
  • On-device AI Engine with Qualcomm Hexagon™ Tensor Processor (HTP)
  • Dedicated Computer Vision Engine
  • Multiple MIPI camera and display ports
  • Multiple high speed connectivity options
ByLANTRONIX INC.
Chipset
QCS8550
Open-Q 4290CS™ System-in-Package (SIP)
The Open-Q™ 4290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.Designed for advanced AI vision applications, the Qualcomm® QCS4290 chipset utilizes Qualcomm Technologies’ heterogenous compute expertise to provide an SoC with multiple specialized processing cores.This is a Wi-Fi 5 solution with some Wi-Fi 6 features: TWT & 8SS. With security, advanced camera features, and high-speed interfaces, the Open-Q™ 4290 SIP creates the perfect computing core for a variety of edge AI video analytic applications.

KEY FEATURES:

  • Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor
  • 3rd generation Qualcomm® AI Engine
  • Vivid graphics with Qualcomm® Adreno™ 610 GPU
  • Multiple high speed connectivity options
  • Up to 6GB LPDDR4 and 256GB eMMC
  • Long term support with extended life hardware and software support through 2027
ByLANTRONIX INC.
Chipset
QCS4290
Open-Q 2290CS™ System-in-Package (SIP)
The Open-Q™ 2290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QCS2290, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.

KEY FEATURES:

  • Entry-tier solution delivers greater performance, graphic, and camera capabilities
  • Secure compute platform
  • Improved power performance
ByLANTRONIX INC.
Chipset
QCS2290
Open-Q™ 8250CS Module/SoM with Qualcomm® QCS8250
The Open-Q™ 8250CS production ready computing SOM delivered with Android™ 13 supports multiple concurrent decode+encode sessions, live tuning for cameras (not customer facing), 2A sync for 2 cameras, UVC/UAC source mode for video collaboration bars to function as a USB class device, low-latency MS codecs and MS Teams video extensions with a roadmap to include background blur and replacement, an AI director framework to track and zoom a camera onto the person speaking and QSAT for smooth zoom.

KEY FEATURES:

  • Long life IIoT chipset
  • 8GB LPDDR5 RAM + 128GB UFS Flash
  • Android™ 13
  • On-device AI Engine up to 15 TOPS
  • Dedicated Computer Vision Engine
  • Multiple MIPI camera and display ports
  • Multiple high speed connectivity options
  • Ultra-compact 50 x 29 mm form factor
ByLANTRONIX INC.
Chipset
QCS8250
EXMP-Q911
This collaboration centers on the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm Dragonwing™ IQ-9075 SoC featuring an 8-core Qualcomm® Kryo™ Gen 6 CPU and a Qualcomm® Adreno™ 663 GPU, enabling 100 TOPS dense or up to 200 TOPS sparse AI compute. Under defined 30W test scenarios, the EXMP-Q911 achieves up to 10× higher AI inference FPS compared to similar modules when running the YOLOv10n object detection model across 10 concurrent video channels. Designed for demanding edge workloads, the EXMP-Q911 integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, paired with a rich set of high-speed interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP 1.2, MIPI CSI-2, CAN FD, and more, providing exceptional connectivity and performance density for compact edge AI systems.

KEY FEATURES:

  • Powered by : Dragonwing IQ-9075 SoC, compliant with COM-HPC Mini form factor
  • Up to 100 TOPS (Dense) / 200 TOPS (Sparse) AI computing power
  • 36 GB onboard memory, 128 GB UFS 3.1 storage, 2 x 2.5G Ethernet and 2 x 4-lane MIPI CSI-2 interfaces
  • -40°C to 85°C (Ta) operating temperature
ByINNODISK CORPORATION
Chipset
QCS9075
A2B® Automotive Audio Bus
Analog Devices Automotive Audio Bus (A2B®) technology provides critical support to the vehicle infotainment systems of tomorrow. Our A2B products deliver high fidelity audio while increasing fuel efficiency, thanks to upward of 75% less cabling weight. The A2B portfolio helps enables multiple applications such as voice recognition and active noise cancellation. A2B is a single-master, multiple-slave system where the transceiver chip at the host controller is the master.

KEY FEATURES:

  • Reduced System & Cable Costs
  • Deterministic Low Latency
ByANALOG DEVICES, INC.
Chipset
SA8195P,SA8155P,SA8295P
ME910G1
This module includes Qualcomm® 9205 LTE modem. Global bands support for worldwide deployments; part of the Telit’s flagship xE910 family that includes 2G, 3G, 4G modules in the same form factor. • Multimode LTE Cat-M1 / NB2 / EGPRS • Size: 28.2mm x 28.2mm x 2.2mm
ByTELIT CINTERION
Chipset
MDM9205
ME310G1-W1
This module includes Qualcomm® 9205 LTE modem, offers global bands support for worldwide deployments. Miniature x310 family with flexible perimeter footprint and pin-to-pin compatibility • Multimode LTE Cat-M1 / NB2 • Size: 13.1mm x 14.3mm x 2
ByTELIT CINTERION
Chipset
MDM9205
FE990B34/40
The Telit Cinterion FE990B34/40 LGA module family enables next-generation, high-performance 5G LGA modules. They feature 5G sub-6 technology with Gigabit LTE and WCDMA support, plus a state-of-the-art multi-constellation GNSS receiver.

KEY FEATURES:

  • Available in two regional variants (EMEA and North America) with 5G sub-6 FDD and TDD bands
  • Each regional SKU is available with 2xCA or 3xCA support
  • Supports SA and NSA operations and 5G core network Opt. 3a/3x and Opt. 2 for full network compatibility
ByTELIT CINTERION
Chipset
SDX72
Open-Q 8550CS SoM Development Kit
The Open-Q™ 8550CS SOM Development Kit is designed to facilitate easy evaluation of the key features of the Qualcomm Dragonwing™ QCS8550 processor, such as the Low Power AI subsystem with a dedicated DSP and AI accelerator supporting always-on audio, sensors, contextual data streams, and an always-on camera. The kit supports the evaluation of C-PHY and D-PHY MIPI CSI and GMSL cameras, dual MIPI DSI, DisplayPort, audio, sensors, GNSS, Gigabit Ethernet and many more features.The development kit provides the ideal starting point for evaluating the Open-Q™ 8550CS SOM. The platform consists of Lantronix’s Open-Q™ 8550CS SOM, an open-frame carrier board exposing all the available I/O, and a range of accessories to fast-track your product development.

KEY FEATURES:

  • Based on the Qualcomm Dragonwing QCS8550
  • Android 13 and Yocto Linux Kirkstone
  • Standard M.2 & MikroBUS sockets
ByLANTRONIX INC.
Chipset
QCS8550
Open-Q AL Development Kit (4290 & 2290 Series)
The Open-Q™ AL development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.The development kit is compatible with the Open-Q™ 4290 and 2290 SIP families based on the Qualcomm® QCS4290 processor (Android).

KEY FEATURES:

  • Development kit provides interfaces to evaluate camera and video
  • Evaluate display on LCD & HDMI
  • Supports many robotic features
ByLANTRONIX INC.
Chipset
QCS4290,QCS2290
SOMW5P, Beacon W5+ System-on-Module (SoM)
The W5+ SoM was engineered to be both energy efficient and powerful, yet small enough to fit into portable or wearable devices where space optimization is key. It includes a Qualcomm® SW5100 SoC, ensuring lighting-fast processing power. With a 250 MHz processor, it’s proficient at managing low-power tasks, allowing devices to operate for extended periods with ultra-low battery usage. The included NPU is ideal for AI and machine learning applications. The Beacon W5+ SoM also has HiFi5 DSP, dual Qualcomm Hexagon QDSP V66K DSPs, and a Qualcomm Adreno 702 GPU. The SoM has onboard LPDDR4 memory, eMMC, Wi-Fi, and Bluetooth in a package size of 15x27 mm. The Beacon W5+ leverages an advanced chipset design that gives engineers a robust yet easy to integrate solution for creating cutting-edge connected devices. The SoM is ideal for regulated applications in the medical device, aerospace/defense, and transportation/industrial industries. 

KEY FEATURES:

  • Supports Android
  • 2GB LPDDR4X, 32GB eMMC
  • Bluetooth 5.3 Bluetooth Low Energy Support, Wi-Fi 802.11a/b/g/n 1x1
  • Up to 4 lanes MIPI-DSI
  • 4-lane x2 MIPI-CSI, D-PHY v1.2 and C-PHY v1.0
  • '-5C to +70C temp range
  • Manufactured in the USA
ByBEACON EMBEDDEDWORKS
Chipset
SW5100