The Dragonwing IQ-8275 EVK showcases the key capabilities of the Dragonwing IQ-8275 processor, purpose-built for robotics, edge AI boxes, gateways, AMRs, industrial automation, and many more applications that require multi-thread computing, independent AI, and graphics processing while minimizing cost and power requirements. Engineered for edge AI operations, it is designed to enable robust computing, high-speed connectivity, and long lifecycle support for mission-critical deployments.

IoT development kit designed for high-performance compute, accessibility, and flexible and customizable features. The Qualcomm® RB3 Gen 2 Lite Development Kit gives developers a valuable combination of impressive performance and customizable features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation. The Qualcomm RB3 Gen 2 Lite is based on the Qualcomm Dragonwing™ processor. This processor’s scalable performance is designed to deliver superior features and performance across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications. This includes support for Wi-Fi 6E for ubiquitous coverage, a unified software stack, powerful AI, and expanded interfaces across ecosystems. - Key Features: Based on the Qualcomm Dragonwing™ QCS5430 processor. Support for Wi-Fi 6E for ubiquitous coverage. Across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications.

Tiny (21mm x 17mm) low-power dynamic mesh module for rapid prototyping of mesh-enabled products. Multi-channel, multi-node relay of video, voice, and data with highly secure AES-256 encryption implemented in the DSP. A self-healing dynamic mesh protocol with auto-search and connect with group members, while dynamically optimizing the RF links between nodes in real-time. Wideband voice with virtually unlimited users per channel with 5 simultaneous talkers. Video relay to extend the reach for robots and drones, adding hundreds of meters per hop. Provision to mix streams and to relay device control data across the mesh network. For details see: https://elaratek.com/wp-content/uploads/2026/08/Mesh_Module-2026.pdf

TurboX I8275 Development Kit is an evaluation platform designed to accelerate development with the TurboX I8275 SOM family. The initial configuration integrates the I8275-AC SOM, providing up to 20 TOPS of AI performance for machine vision, robotics and industrial IoT evaluation. 2 3 The 120 mm x 100 mm carrier board provides HDMI and DisplayPort outputs, three MIPI CSI camera connectors, multiple USB interfaces, Gigabit Ethernet, M.2 Key M and Key E expansion, a 40-pin expansion connector and 12V power input. Qualcomm® Linux is supported for application development and system evaluation. 4 5 Initial development kit samples are targeted for late November to early December 2026, subject to PCB availability, board bring-up and validation.

SECO SOM-COMe-CT6-Dragonwing-IQ9 is a compact, high-performance COM Express Type 6 System-on-Module powered by the Qualcomm Dragonwing™ IQ9 platform, designed for demanding industrial Edge AI applications. Combining on-device AI acceleration, advanced multimedia capabilities and industrial-grade reliability, it supports low-latency inference and vision-intensive workloads for robotics, AMR/AGV, machine vision, intelligent HMI and industrial automation systems.

The Telit Cinterion FE990B40 LGA module family enables next-generation, high-performance 5G LGA modules. They feature 5G sub-6 technology with Gigabit LTE and WCDMA support, plus a state-of-the-art multi-constellation GNSS receiver.

The TRIA SM2S-QCS6490 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS6490 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS6490 integrates Qualcomm® Kryo™ 670 CPU which contains up to eight cores: four Arm® Cortex®-A78 cores, four Arm® Cortex®-A55 cores, Qualcomm® Adreno™ 643 GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K60 and many different display connictities (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with upto 12 TOPS at low power and massive camera support with 4 MIPI-CSI inputs.

The FE910C04 mPCIe enable 5G mid-speed connectivity relying on the latest 3GPP Release 17 RedCap technology. It levels up performance and efficiency compared to LTE, promising the highest level of flexibility by offering customers to move to a secure 5G future easily.

The Telit Cinterion FE990D60 delivers next‑generation, high‑performance 5G connectivity. The module features 5G sub-6 technology with Gigabit LTE and WCDMA support, along with innovative multi constellation GNSS. Built on the Qualcomm® Snapdragon® X85 5G Modem‑RF system and compliant with 3GPP Release 18, it is ideal for advanced industrial and enterprise applications.

The LN920 is an M.2 (NGFF) compact data card with versions available in Category (Cat) 12 and 6 worldwide. They are pre-certified by Tier 1 operators and ideal for mobile computing and IIoT gateways and routers.

Silex’s SX-PCEAX-AP modules are embedded wireless LAN modules using the Qualcomm® QCN9072 chipset, ideal for access points, gateways, and routers in medical and industrial applications. The SX-PCEAX-AP Wi-Fi 6 module enables a stable 2.4GHz/5GHz communication even in crowded wireless environments. Combining both the Wi-Fi 6 and 6E (SX-PCEAX-AP6E) modules can seamlessly add the 6GHz spectrum, achieving tri-band connectivity supporting 2.4GHz, 5GHz and 6GHz.

The MSC SM2S-QCS5430 SMARC 2.1.1 module family is powered by the Qualcomm Dragonwing™ QCS5430 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS5430 integrates Qualcomm® Kryo™ 670 CPU which contains up to six cores, Qualcomm® Adreno™ 642L GPU, Adreno 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K30 and many different display connectivity (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with up to 3.5 TOPS at low power and massive camera support with 4 MIPI-CSI inputs

This collaboration centers on the EXMP-Q911 COM-HPC Mini module, powered by Qualcomm Dragonwing™ IQ-9075 SoC featuring an 8-core Qualcomm® Kryo™ Gen 6 CPU and a Qualcomm® Adreno™ 663 GPU, enabling 100 TOPS dense or up to 200 TOPS sparse AI compute. Under defined 30W test scenarios, the EXMP-Q911 achieves up to 10× higher AI inference FPS compared to similar modules when running the YOLOv10n object detection model across 10 concurrent video channels. Designed for demanding edge workloads, the EXMP-Q911 integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, paired with a rich set of high-speed interfaces, including PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP 1.2, MIPI CSI-2, CAN FD, and more, providing exceptional connectivity and performance density for compact edge AI systems.

AK9569 is a highly integrated single chip one slot USB Contact Smart Card Reader controller. AK9569 supports multiple international standards including ISO7816 for IC card standard, PC/SC 2.0 for windows smart card standard, Microsoft WHQL, EMV for Europay MasterCard Visa standard and USB-IF CCID standard.

The BTM395 Bluetooth module features the Qualcomm® QCC3095 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz) technology. It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth speaker, headsets, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

ASM1352R is ASMedia’s single chip solution to bridge the USB 3.1 Gen2 to dual SATA interface. ASM1352R supports one USB 3.1 Gen2 ports and two SATA device ports, enabling USB PHY up to 10Gbps in compliance with USB 3.1 specifications and enabling Serial ATA PHYs up to 6Gbps high speed interface, following Serial ATA Revision 3.2 Specification.

ASM1162, a SATA host controller(AHCI) with upstream PCIe Gen3 x1 and downstream two SATA Gen3 ports. It's a low latency, low cost and low power AHCI controller. With two SATA ports and cascaded port multipliers, ASM1162 can enable users to build up various high speed IO systems, including server, high capacity system storage or surveillance platforms.

ASM1153E is the ASMedia third generation single chip solution, bridging the USB3.0 to Serial ATA host interface with highly integrated SuperSpeed USB3.0, High Speed USB2.0 and SATA1.5/3.0/6.0 Gbps ASMedia self-designed PHYs. Along with excellent compatibility with USB3.0 hosts and SATA devices, ASM1153E uses advanced process technology to optimize the chip power consumption. 

ASM2812, a low latency, low cost and low power 12 lane, maximum 6 downstream ports packet switch. With upstream PCIe Gen3x4 bandwidth, ASM2812 can enable users to build up various high speed IO systems, including server, system storage or communication platforms.

The BTM581 Bluetooth module features the Qualcomm® QCC5181 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz). It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth earbuds, headsets, and USB Dongle applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

The BTM383 Bluetooth module features the Qualcomm® QCC3083 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz). It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth speaker applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

The BTM386 Bluetooth module features the Qualcomm® QCC3086 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz) technology. It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC).Suitable for USB Dongle applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

ASM3142supports two USB3.1 Gen-II ports and perform trusting high speed bandwidth with PCI Express Gen-III x2 supporting. It uses advance process with low voltage supply, following standard PCI Express/USB bus power management and advance chip power management to reduce total power consumption efficiently under idle/standby state.

The BTM384 Bluetooth module features the Qualcomm® QCC3084 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz) technology. It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth headset applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

ASM2806, a low latency, low cost and low power 6 lane, maximum 4 downstream ports packet switch. With upstream PCIe Gen3x2 bandwidth, ASM2806 can enable users to build up various high speed IO systems, including server, system storage or communication platforms.

Quectel Pi H1 is a smart Single-Board Computer (SBC) based on the Qualcomm QCS6490 platform. It integrates a high-performance 64-bit octa-core processor delivering up to 12 TOPS of computing power, along with the Qualcomm Adreno™ 643L GPU. Supporting Yocto Linux, Debian, and Ubuntu operating systems, the product comes equipped with 8 GB of LPDDR4X memory and features a USB Type-C power interface, expandable with external eMMC or SSD storage. It offers dual-band Wi-Fi (2.4 & 5 GHz) compliant with IEEE 802.11a/ b/ g/ n/ ac and Bluetooth 5.0, while enabling dual-display output via DP and LCM or DP and Micro HDMI. Combining powerful performance with rich multimedia capabilities, the Quectel Pi H1 is designed to meet the demands of both industrial and consumer applications for high-speed connectivity, advanced multimedia, and robust computing power.

CQM220 is the latest 5G RedCap module in Cavli's C-Series portfolio based on 3GPP release 17 standards, supports SA mode and is backward compatible with 4G network. The module supports a theoretical data rate of 223Mbps and uplink speed of 123Mbps under the 5G RedCap network. It also offers multi-constellation dual band GNSS capability, with support for constellations like GPS, GLONASS, Galileo, BDU, NavIC, SBAZ and QZSS. The CQM220 is engineered in a compact LGA form factor, measuring 28.0mm x 25.5mm x 2.7 mm. Moreover, the CQM220 also integrates CQW685 support, based on the WCN6856 transceiver, enabling Wi-Fi 6E and Bluetooth 5.3 capabilities via the PCIe Gen2 interface.. The module currently comes in CQM220-WW variant that supports major World Wide bands, along with regional variants for North America, Eurasia & Japan, Latin America and India only. Additionally, an upcoming 450MHz variant will broaden the module's coverage and provide more options for network compatibility. The 40/41/42 bands are classified as PC2, irrespective of whether they are used for 5G or 4G networks. The CQM220 is an ideal candidate for IoT enabled applications that require high-throughput and precise location tracking such as Asset tracking, HD Smart Surveillance Solutions, Industry 4.0 etc.

Smux 5.0 Support NFC AI Touchpad Implement

Kiteboard 9207 is a low-power, production-ready SBC built on the Qualcomm MDM9207 SoC, designed for scalable IoT, Telematics and edge connectivity applications. Supports LTE Cat1 and Cat4 cellular connectivity. It enables reliable, wide-area communication for use cases such as telematics, asset tracking, industrial monitoring, and smart city deployments.

The Kiteboard 8250 System-on-Module (SOM) is a premier-tier, production-ready SOM built on the Qualcomm® Dragonwing™ QCS8250 SoC, designed to enable OEMs and ODMs to develop high-performance edge AI devices for multi-camera vision and intelligent IoT deployments. Combining powerful compute with advanced connectivity, the module supports real-time edge analytics and video processing for applications such as video telematics, industrial vision systems, AI-connected cameras, smart retail analytics, and healthcare edge devices

The Kiteboard 5165 is a high-compute, production-ready System-on-Module (SoM) based on the Qualcomm® Dragonwing™ QRB5165 SoC, designed to enable OEMs and robotics developers to build intelligent autonomous machines and AI-powered edge systems. Optimized for real-time perception, navigation, and multi-sensor processing, the module supports advanced robotics and autonomy workloads for applications such as autonomous delivery vehicles, industrial AMRs and AGVs, commercial and enterprise drones, industrial robotics, and defense and professional service robots.

The Kiteboard 2290 is a cost-efficient, production-ready System-on-Module (SOM) based on the Qualcomm® Dragonwing™ QCS2290 SoC. Designed in an ultra-small form factor with integrated compute and connectivity, it enables OEMs, entrepreneurs, and device makers to build custom connected devices for vertical-specific solutions. Available in both Wi-Fi only and LTE variants, the Kiteboard 2290 is optimized for cost-efficient, feature-rich IoT deployments and enables OEMs and ODMs to rapidly develop and commercialize smart devices such as industrial handhelds, retail POS systems, connected cameras, and asset-tracking solutions while accelerating time-to-market.

WPEQ-405AX, is based on Qualcomm® QCN9074 chipset solution. This is a true enterprise based wireless module that powers 4T4R (4x4) MU-MIMO, in 5Ghz Single band mode, hitting a theoretical speed of up to 4.8Gbps with 160MHz support. Unlike typical reference design, WPEQ-405AX shrinks the traditional 50mmx50mm M.2 E-Key design to a more popular Mini PCIe Full size formfactor of just 50mm x 30mm, run at 3.3V voltage. Provides a greater versatility to use on more common seen design. WPEQ-405AX performs both AP and STA functionality with 4 spatial streams, although recommended more for hardware AP applications as it supports 4096-QAM, OFDMA technology, makes it perfect for heavy lifting applications such as Enterprise grade AP, UTM, public & transportation Hotspot, and other industrial capable Access Points.  

WPEQ-276AX, is based on Qualcomm® QCN9072 chipset solution. This is a true enterprise based wireless module that powers 2T2R (2x2) MU-MIMO, in 6Ghz Single band mode, hitting a theoretical speed of up to 2.4Gbps with 160MHz support. Unlike the typical reference design, WPEQ-276AX shrinks the traditional 50mmx50mm M.2 E-Key design to a more popular Mini PCIe Full size formfactor of just 50mm x 30mm, run at 3.3V voltage. Provides a greater versatility to use on more common seen design.  

WNFQ-291BEI(Bluetooth) is able to concurrently run 2.4GHz with 5GHz, or 6GHz, and support full IEEE802.11 be/ax/ac/a/b/g/n protocol, up to 320MHz mode.WNFQ-291BEI(BT) designed with 2 spatial streams (2T2R, or 2x2) in MU-MIMO mode. With a standard M.2 E key2230 formfactor, WNFQ-291BEI(BT) can accommodate to all existing platform that has M.2 Adaptor pre-integrated, no extra work with platform design.

WNFQ-268AXI(BT) designed with 2 spatial streams (2T2R, or 2x2) in MU-MIMO mode. With a standard M.2 E key 2230 formfactor, WNFQ-268AXI(BT) can accommodate to all existing platform that has M.2 Adaptor pre-integrated, no extra work with platform design.  

WPEQ-268AXI(BT), first WiFi-6E (802.11ax) mini PCIe module based on Qualcomm® chipset, running PCIe (Wifi) and USB (Bluetooth), supports DBDC (Dual-band, Dual-concurrent) mode, but with Tri-band capability (2.4GHz, 5GHz, and 6GHz). WPEQ-268AXI(BT) is able to concurrently run 2.4GHz with 5GHz, or 6GHz, and support full IEEE802.11 ax/ac/a/b/g/n protocol, up to 160MHz mode. WPEQ-268AXI(BT) designed with 2 spatial streams (2T2R, or 2x2) in MU-MIMO mode. With a standard mini PCIe formfactor, WPEQ-268AXI(BT) can accommodate to all existing platform that has mini PCIe Adaptor pre-integrated, no extra work with platform design.  

Arduino UNO Q’s hybrid design makes it the ideal dual-brain platform for your next innovation. It combines a Linux® Debian-capable Qualcomm Dragonwing™ QRB2210 microprocessor with a real-time STM32U585 microcontroller (MCU). It’s Arduino, it’s a computer, it’s anything you want to build.

Fibocom MQ771-GL is a high-performance IoT module series tailor-made for the global IoT market. The series is based on the Qualcomm® E51 Modem-RF and packaged in LGA. It supports global LTE Cat M1/Cat NB1/Cat NB2 frequency bands, has global certification, and offers soft GPS feature.

VMM7100 is a highly integrated USB-C alt-mode / DP HBR3 to HDMI2.1 protocol converter with embedded USB PD controller and Billboard. It offers the maximum link bandwidth and advanced features in the latest DP and HDMI standards. The VMM7100 features a USB-C input port with DisplayPort Alt-mode, capable of receiving 2 or 4 lanes of DisplayPort™ video. Equipped with a built-in CC logic and a configurable analog front end (AFE), the VMM7100 enables flexible lane swap, cable orientation detection and communication with USB-C source. The DisplayPort receiver in VMM7100 supports transport streams up to HBR3 data rate. The HDMI2.1 transmitter supports FRL mode operation up to 12.0 Gbps per lane with 3 or 4 lane configurations and is backward-compatible with HDMI2.0 TMDS mode up to 6.0 Gbps per lane data rate.

–SMUX 4.0–54ch (32RX, 22TX)–134x92 @4.2mm pitch–LightingPad–HapticPad 1.0

The MitySOM-QC6490 / 5430 is a system on module family featuring a Qualcomm Dragonwing™ QCS6490 or Dragonwing QCS5430 processor with on-board power supplies, an LPDDR5 RAM memory subsystem, and a UFS configuration memory. Specifications: Dragonwing QCS6490 or Dragonwing QCS5430 SoC Processor. - Memory: 8 GB LPDDR5, 256GB Flash. - Power: 5-12Vdc Input, generated on board. - Interfaces: 2x PCIe Gen 3 (1x 1 lane, 1x 2), 5x MIPI x4 input + DSI output, USB 3.1 Gen 2, USB 2.0. - Mechanical: 45mm x 45mm (1.77″ x 1.77″).

The CRI I9074L is a high-performance M.2 module providing Wi-Fi 6 connectivity for long-range communication on both 2.4GHz and 5GHz bands. It is ideal for applications requiring reliable wireless communication over extended distances (>10km), such as robotics, drones, and IoT deployments, ensuring robust performance in demanding environments.The module integrates seamlessly with CRI’s R5165C SOM (Qualcomm® QRB5165) via a PCIe M.2 E-Key interface. The driver is specifically designed for the QRB5165 and is fully compatible with the CRI R5165C SOM.

COREXOM R6490WGQ SOM – Powered by the Qualcomm® QCS6490 SoC, the R6490WGQ SOM features the Qualcomm® Kryo™ 670 CPU and a fused AI-accelerator in the Qualcomm® Hexagon™ processor, offering exceptional computational power with energy efficiency. It supports up to five MIPI CSI interfaces, triple ISPs, 4K@60FPS video decoding, and 4K@30FPS encoding. With a wide range of external interfaces like GPIO, UART, I2C, SPI, DSI, USB 3.1, and PCIe, plus integrated GPS and Wi-Fi 6E/Bluetooth, it’s ideal for complex IoT applications.Supporting Android, Ubuntu, Linux, and Windows 11 IoT Enterprise, this SOM is designed to reduce design complexity and speed up time to market. It’s perfect for rugged handhelds, tablets, POS, kiosks, AI Box, AI cameras, robotics, and HMI, enabling developers to efficiently bring innovative products to market.

The CRI R405LQ Long Range WiFi Module is a WiFi 6 connectivity solution designed for long-range communication on both the 2.4GHz and 5GHz frequency bands. Ideal for applications requiring reliable wireless communication over extended distances (>10Km), such as robotics, drones, and IoT deployments, the R405LQ ensures robust performance in demanding environments.This module seamlessly integrates with host controllers via USB interfaces and functions similarly to an external WiFi network module. It supports the USB RNDIS (Remote Network Driver Interface Specification) standard, providing straightforward and reliable module interface control.

The NPCX498SA0BX is a highly integrated embedded controller (EC) with an embedded ARM® core and integrated advanced functions. It is targeted for a wide range of portable applications and provides best-in-class, complete EC functionality.The NPCX498SA0BX incorporates the 32-bit ARM® Cortex®-M4 core, on-chip ROM, standard and battery-backed RAM memories, an extended set of system support functions, and a high-performance Flash Interface Unit (FIU), which interfaces directly with internal and external SPI flash memory devices.The NPCX498SA0BX interfaces with the Host via an eSPI interface or SPI interface or I3C® interface and also supports an I2C® interface.In addition, the NPCX498SA0BX includes the high-performance Nuvoton Cryptographic library (NCL), based on the device’s security hardware accelerators.The NPCX498SA0BX includes power switch logic for ultra-low power consumption and a high-accuracy, 32 KHz crystal oscillator. 

The MRD5165 SOM (System on Module) integrates advanced AI-ML and IoT technologies within a compact form-factor, powering the next generation of high-compute, low-power smart robots, intelligent machines, autonomous devices, and drones across consumer, enterprise, defense, and industrial sectors. These devices can seamlessly connect over 5G networks.The MRD5165 SOM based on Qualcomm® QRB5165 features a robust heterogeneous computing architecture, complemented by the cutting-edge 5th generation Qualcomm® AI Engine, delivering an impressive 15 Trillion Operations Per Second (TOPS) of AI performance. This computational power efficiently handles complex AI and deep learning workloads, along with on-device edge inferencing, making it exceptionally well-suited for autonomous drone and robotics applications. 

MRD5165 Eagle Kit is an Advanced drone controller built around Qualcomm® QRB5165 SoC and Cube Pilot’s Cube Orange+ FCU. MRD5165 Eagle kit delivers high-performance & high-accuracy AI/ML inferencing technology to facilitate accelerated development of innovative, power-efficient, Edge-computing platform for robots, aerial vehicles, industrial PC, and applications. Kit supports various wireless connectivity for real-time communication including 802.11n/ac with option to connect 5G and 802.11 ax.Eagle Kit, is a high-compute, AI-enabled, low-power processor with 8GB LPDDR5 PoP memory, 128GB UFS storage for video analytics applications. It includes various peripheral connections such as 6 MIPI CSI cameras, an HDMI Camera, USB 3.0 ports, a Micro USB port for debugging, and a Gigabit Ethernet port for wired connectivity. 

IT8987 is a highly integrated embedded controller with system functions suitable for mobile system applications. The IT8987 directly interfaces to the LPC bus and provides ACPI embedded controller function, keyboard controller (KBC) and matrix scan, PWM and ADC for hardware monitor, PS/2 interface for external keyboard/mouse devices, BRAM, CIR, and system wakeup functions for system power management.

IT81202 is a 32-bit RISC-V Micro-controller and a highly integrated embedded controller with system functions suitable for mobile system applications.

qSmartAI80_CUQ610 is a ready-to-deploy AI vision kit based on the Qualcomm® QCS610 processor with powerful AI processing capabilities. This Qualcomm vision kit comprises of e-con's Sony STARVIS IMX415 based 4K MIPI CSI-2 camera module, a SoM based on Qualcomm® QCS610 SoC, and a carrier board.This Qualcomm camera kit is suited for running image-based machine learning and deep learning models at the edge making it perfect for industrial and retail applications. In addition, this is a multi-camera solution enabling an extended field of view for applications that need to cover a large area or scene. e-con Systems also provides all the necessary customization services for this AI vision development kit including the camera, carrier board, BSP, software, and enclosure.

Product Description: Crystal Unit SMD 1.2x1.0 76.8MHz TST Part No.: TZ3770AAAI82

WiFi 6/6E 802.11ax 2×2 MU-MIMO module for the2.4/5/6GHz Wireless and Bluetooth 5.2M.2 2230 Module2.4/5/6Ghz M.2 2230 , 802.11ax 2×2 WiFi+BT5.2Qualcomm WCN6856-5 / QCA2066-5

The SARA-R10 series features LTE Cat 1bis medium capacity data connectivity (10 Mbit/s downlink, 5 Mbit/s uplink) with very low energy consumption in the popular SARA form factor.The SARA-R10 series supports multi-band LTE and includes an embedded Wi‑Fi radio to scan Wi-Fi hotspots for indoor and outdoor locations. SARA-R10 modules are designed to provide an easy migration path from legacy SARA 2G/3G designs as well as for new designs.

The SARA-R4 is a Cat M/NB2 module with 2G fallback designed in the popular u-blox SARA form factor. SARA-R4 supports 3GPP Rel 14 and features the best coverage with 23 dBm LTE output power. SARA-R4 is available also in combo cellular + GNSS variant onboarding the u-blox M10 GNSS platform allowing best navigation performance concurrently with LTE operations.

LARA-R6 is an LTE Cat1 cellular module providing worldwide coverage thanks to 18 LTE bands plus 3G/2G fallback. LARA-R6 is ideally suited for medium data speed applications requiring superior coverage. LARA-R6 supports all u-blox services communication, security and location and is ready to be bundled with u-blox GNSS positioning platforms.

Classic R is a user-centric, easy-to-use hearing aid powered by RelaJet AI Speech Enhancement Engine. This unique technology allows Classic R to capture and enhance the human voice, while being constantly updated to offer users the best hearing experience under any scenario.

CODICO offers ISO/IEC 15118/ DIN 70121/ SAE J2847/2 HomePlug Green Phy PLC Modules and Chips, configured for eMobility applications on the vehicle side (PEV, Plug-In Electric Vehicles).

CODICO offers HomePlug Green Phy Powerline Communication Modules and Chips configured for eMobility applications on the charging station side (EVSE, Electric Vehicle Supply Equipment).

The W5+ SoM was engineered to be both energy efficient and powerful, yet small enough to fit into portable or wearable devices where space optimization is key. It includes a Qualcomm® SW5100 SoC, ensuring lighting-fast processing power. With a 250 MHz processor, it’s proficient at managing low-power tasks, allowing devices to operate for extended periods with ultra-low battery usage. The included NPU is ideal for AI and machine learning applications. The Beacon W5+ SoM also has HiFi5 DSP, dual Qualcomm Hexagon QDSP V66K DSPs, and a Qualcomm Adreno 702 GPU. The SoM has onboard LPDDR4 memory, eMMC, Wi-Fi, and Bluetooth in a package size of 15x27 mm. The Beacon W5+ leverages an advanced chipset design that gives engineers a robust yet easy to integrate solution for creating cutting-edge connected devices. The SoM is ideal for regulated applications in the medical device, aerospace/defense, and transportation/industrial industries.