Development Hardware

IoT development kit designed for high-performance compute, accessibility, and flexible and customizable features. The Qualcomm® RB3 Gen 2 Lite Development Kit gives developers a valuable combination of impressive performance and customizable features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation. The Qualcomm RB3 Gen 2 Lite is based on the Qualcomm Dragonwing™ processor. This processor’s scalable performance is designed to deliver superior features and performance across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications. This includes support for Wi-Fi 6E for ubiquitous coverage, a unified software stack, powerful AI, and expanded interfaces across ecosystems. - Key Features: Based on the Qualcomm Dragonwing™ QCS5430 processor. Support for Wi-Fi 6E for ubiquitous coverage. Across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications.

QCC3081 Module Only Development Board

QCC3086 Module Only Development Board

QCC5181 Development Kit

QCC3083 Development Kit

QCC5181 Module Only Development Board

QCC3095 Development Kit

QCC3095 Module Only Development Board

QCC3091 Module Only Development Board

QCC3091 Development Kit

QCC732x Development Kit V1.0

QCC5229 Development Kit

The Dragonwing IQ-9075 EVK is a comprehensive evaluation platform to test the industrial-grade performance of the Dragonwing IQ-9075 processor for IoT solutions. The Dragonwing IQ-9075 EVK showcases the most common features of the Dragonwing IQ-9075 processor, which is optimized for industrial IoT and robotics applications involving heavy workloads in the most demanding environments like autonomous mobile robots (AMRs) and industrial machinery. The Dragonwing IQ-9075 EVK consists of a mainboard, supporting key interfaces, and optional expansion mezzanine boards to support additional features. It enables developers, OEMs, and ODMs to design and test their solutions powered by the industrial-grade Dragonwing IQ9075 processor integrated with standard interfaces and connectors, mezzanine expandability, and wireless connectivity. Test and prototype software development and hardware designs with less effort and cost to get your product to market faster.

The Dragonwing IQ-8275 EVK showcases the key capabilities of the Dragonwing IQ-8275 processor, purpose-built for robotics, edge AI boxes, gateways, AMRs, industrial automation, and many more applications that require multi-thread computing, independent AI, and graphics processing while minimizing cost and power requirements. Engineered for edge AI operations, it is designed to enable robust computing, high-speed connectivity, and long lifecycle support for mission-critical deployments.

QCC7228 Development Kit

QCC7226 Development Kit

QCC7228+QCP7321 Module Only Development Board

QCC7228 Module Only Development Board

QCC7228+QCP7321 Development Kit

This Wi‑Fi SDIO module is a single-stream wireless solution supporting IEEE 802.11a/b/g/n/ac connectivity and is based on the Qualcomm® QCA9377 System-on-Chip. The module supports Wave 2 MU-MIMO (client mode), which is designed to improve network efficiency in compatible WLAN environments compared with earlier 802.11n implementations. Its compact form factor, feature set, and power-conscious design make it well suited for portable-device applications.

Tiny (21mm x 17mm) low-power dynamic mesh module for rapid prototyping of mesh-enabled products. Multi-channel, multi-node relay of video, voice, and data with security focused AES-256 encryption implemented in the DSP. A self-healing dynamic mesh protocol with auto-search and connect with group members, while dynamically optimizing the RF links between nodes in real-time. Wideband voice with virtually unlimited users per channel with 5 simultaneous talkers. Video relay to extend the reach for robots and drones, adding hundreds of meters per hop. Provision to mix streams and to relay device control data across the mesh network. For details see: https://elaratek.com/wp-content/uploads/2026/08/Mesh_Module-2026.pdf

Development Kit for QCC3024 based on BGA package designed to help educe development time and cost when developing Bluetooth Stereo Headsets.

Smux 5.0 Support NFC AI Touchpad Implement

IT8987 is a highly integrated embedded controller with system functions suitable for mobile system applications. The IT8987 directly interfaces to the LPC bus and provides ACPI embedded controller function, keyboard controller (KBC) and matrix scan, PWM and ADC for hardware monitor, PS/2 interface for external keyboard/mouse devices, BRAM, CIR, and system wakeup functions for system power management.

IT81202 is a 32-bit RISC-V Micro-controller and a highly integrated embedded controller with system functions suitable for mobile system applications.

Inforce 6310™ Micro Single Board Computer (SBC) powered by the Qualcomm® SDA450 platform provides vibrant displays and immersive multimedia experiences. It enables concurrent 1080p60 fps HDMI output and 1080p60 fps camera encode. It is designed exclusively to drive digital signage and display use-cases by enabling distribution of your full HD resolution video content smoothly.

The Inforce 6560 Single Board Computer (SBC) combines the heterogeneous compute capabilities of the Qualcomm® SDA660 SoC with 2x2 802.11ac Wi-Fi, Bluetooth 5.x, a full-featured USB-C interface with UltraHD display capability, an integrated battery charging circuitry with battery header, an onboard RTC, and ample internal memory to make it a complete 4K encode/decode plug-n-play system. Qualcomm® AI Engine enables advanced visual computing, enhanced graphics, and machine learning capabilities.

The Inforce 6640 SBC is based on Qualcomm® APQ8096 processor equipped with the Qualcomm® AI Engine and the Qualcomm Spectra™ camera ISP to enable high-end industrial IoT applications, video analytics, advanced medical imaging and teleconferencing use-cases. It has dual band WiFi, Bluetooth 4.0, 4K HDMI-Input and concurrent dual HDMI Outputs rendering capability a complete solution for Capturing & Streaming UHD Video content.

Aikri-22X-90AD-4 development kit is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 kit comprises Qualcomm® QCS2290-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

Aikri-22X-90AS-4 System-on-Module (SoM) is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

The Aikri-40X-5LD-1 development kit comprises of the Qualcomm® QCS405 based SoM mounted on a carrier board, interfaced with a mezzanine board. All native interfaces that the QCS405 supports, such as GPIOs, USB 3.0, PCIe, HDMI, SDIO, I2S, UART, I2C, and SPI are made available on the development kit. The Aikri development kit with QCS405 helps kick-start and optimize your creation of complex, feature-rich smart-audio solutions such as Smart-speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc. within a short turnaround time.

The Aikri-40X-4LD-1 development kit comprises of the Qualcomm® QCS404 based SoM mounted on a carrier board, interfaced with a mezzanine board. All native interfaces that the QCS404 supports, such as GPIOs, USB 3.0, PCIe, SDIO, I2S, UART, I2C, and SPI are made available on the development kit. The Aikri development kit with QCS404 helps kick-start and optimize your creation of complex, feature-rich smart-audio solutions such as Smart speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc. within a short turnaround time.

The Aikri-40X-5LS-1 System on Module (SoM) is powered by Qualcomm® QCS405 SoC, which is designed specifically for smart audio applications. The QCS405 supports features such as Multi-mic Qualcomm® Noise and Echo Cancellation that isolates noisy environments from voice, simultaneous multi-keyword detection to aid voice services. This production-ready SoM has a Yocto Linux BSP pre-loaded and helps manufacturers easily create complex, feature-rich, and voice-supported smart audio applications such as Smart speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc.

The Aikri-40X-4LS-1 System on Module (SoM) is powered by Qualcomm® QCS404 SoC, which is designed specifically for smart audio applications. The QCS404 supports features such as Multi-mic Qualcomm® Noise and Echo Cancellation that isolates noisy environments from voice, simultaneous multi-keyword detection to aid voice services. This production-ready SoM has a Yocto Linux BSP pre-loaded and helps manufacturers easily create complex, feature-rich, and voice-supported smart audio applications such as Smart speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc.

The eInfochips 855 hardware development kit (HDK) is based on Snapdragon® 855 processor that offers next generation on-device AI capabilities to make voice, camera, gaming and power management smarter, faster and more intuitive. This HDK is an ideal platform to kick-start development of embedded devices for AR/VR, infotainment, 4K cameras as well as automation solutions. The main purpose of Snapdragon 855 HDK is to kick start development and testing of devices for original equipment manufacturers (OEMs), hardware/software vendors and developers for faster time to market.

The Snapdragon® 845 Mobile Platform includes high performance camera and graphics features that are designed to capture advance color information. Qualcomm® Adreno™ 630 GPU and Qualcomm Spectra™ 280 ISP has enabled vivid graphics, crystal-clear audio and improved area awareness, making Snapdragon 845 Mobile Platform ideal for real-life experience solution. To support the ecosystem of technology companies and application providers looking to utilize these advanced features, eInfochips is offering a Hardware Development Kit (HDK) featuring the Snapdragon SDA845 processor. This development kit is designed to help OEMs and device makers in evaluating the processor and peripherals; an ideal starting point for creating high-performance mobile devices, software development and applications.

The eInfochips 865 hardware development kit (HDK) is based on Snapdragon® 865 processor (SM8250). The HDK offers intelligent on-device AI, 2-gigapixel-per-second camera speeds, and high-end graphics at low power consumption. This feature-rich Android 10 development platform is an ideal starting point for integration and innovation of connected devices. The main purpose of Snapdragon 865 HDK is to kick start development and testing of devices for original equipment manufacturers (OEMs), hardware/software vendors and developers for faster time to market. This HDK is an ideal platform to kick-start development of embedded devices for Gaming, AR/VR, infotainment, 4K cameras as well as automation solutions.

Rambutan is based on Qualcomm® QCA9557 or Qualcomm® QCA9550 SoC and comes in two temperature ranges: commercial* (Rambutan) and industrial** (Rambutan-I).It is a surface-mountable, dual-sided, Wi-Fi enabled Linux module. Dual-band radio (2.4 or 5 GHz), powerful 720 MHz CPU, 300 Mbps data rate, 128 MB RAM and Flash, and a development kit with multiple interfaces (e.g. Gigabit Ethernet port, PCIe, hardware SPI, etc.) are the main advantages of the Rambutan module. Commercial temperature range: 0-65°C, **Industrial temperature range: -40-85°C

The Pineapple PCIe module is based on the Qualcomm® QCN9074 SoC, a highly integrated wireless local area network (LAN) solution designed for 2.4/5/6 GHz IEEE802.11ax/ac/n/g/b/a applications, including the Wi-Fi 6E standard. With support for Wi-Fi 6E, it delivers enhanced performance and expanded frequency options for even higher data rates and reduced interference. The module performs access point (AP) and station (STA) functionality with 4x4 MIMO and 4 spatial streams, ensuring efficient and reliable data transmission. The QCN9074 chip features a dual-synthesizer WLAN radio with native 160 MHz support, further enhancing the module's capabilities. The module is designed for surface-mount installation and can be soldered onto M.2 and miniPCIe cards for seamless integration. The Pineapple supports the embedded Linux framework FirmUx from 8devices. The software can be also built by using OpenWRT.

Rambutan DVK from 8devices is a thoughtfully designed development kit tailored for the commercial version of the Rambutan system-on-module (SOM). Powered by the advanced Qualcomm® QCA9557 SoC, this high-performance kit seamlessly integrates a wide range of essential interfaces, including Gigabit and Fast Ethernet ports, USB Type-C and USB2.0 connectors, integrated Dual-band antennas, programmable buttons, and more. The Rambutan supports the embedded Linux framework FirmUx from 8devices. The software can be also built by using OpenWRT. Unleash the full potential of your Rambutan projects with this exceptional development kit.

The Telit Cinterion FE990B40 LGA module family enables next-generation, high-performance 5G LGA modules. They feature 5G sub-6 technology with Gigabit LTE and WCDMA support, plus a state-of-the-art multi-constellation GNSS receiver.

This module includes Qualcomm® 9205 LTE modem, offers global bands support for worldwide deployments. Miniature x310 family with flexible perimeter footprint and pin-to-pin compatibility • Multimode LTE Cat-M1 / NB2 • Size: 13.1mm x 14.3mm x 2

The FE910C04 mPCIe enable 5G mid-speed connectivity relying on the latest 3GPP Release 17 RedCap technology. It levels up performance and efficiency compared to LTE, promising the highest level of flexibility by offering customers to move to a secure 5G future easily.

The Telit Cinterion FE990D60 delivers next‑generation, high‑performance 5G connectivity. The module features 5G sub-6 technology with Gigabit LTE and WCDMA support, along with innovative multi constellation GNSS. Built on the Qualcomm® Snapdragon® X85 5G Modem‑RF system and compliant with 3GPP Release 18, it is ideal for advanced industrial and enterprise applications.

The LN920 is an M.2 (NGFF) compact data card with versions available in Category (Cat) 12 and 6 worldwide. They are pre-certified by Tier 1 operators and ideal for mobile computing and IIoT gateways and routers.

Silex’s SX-PCEAX-AP modules are embedded wireless LAN modules using the Qualcomm® QCN9072 chipset, ideal for access points, gateways, and routers in medical and industrial applications. The SX-PCEAX-AP Wi-Fi 6 module enables a stable 2.4GHz/5GHz communication even in crowded wireless environments. Combining both the Wi-Fi 6 and 6E (SX-PCEAX-AP6E) modules can seamlessly add the 6GHz spectrum, achieving tri-band connectivity supporting 2.4GHz, 5GHz and 6GHz.

The BTM395 Bluetooth module features the Qualcomm® QCC3095 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz) technology. It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth speaker, headsets, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

The BTM386 Bluetooth module features the Qualcomm® QCC3086 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz) technology. It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC).Suitable for USB Dongle applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

ASM3142supports two USB3.1 Gen-II ports and perform trusting high speed bandwidth with PCI Express Gen-III x2 supporting. It uses advance process with low voltage supply, following standard PCI Express/USB bus power management and advance chip power management to reduce total power consumption efficiently under idle/standby state.

The BTM581 Bluetooth module features the Qualcomm® QCC5181 chipset, supporting Bluetooth® 5.4 dual mode (2.402 - 2.480 GHz). It covers profiles like A2DP, AVRCP, HFP, HSP, PBAP, SPP, and GATT, with dimensions of 13mm x 20mm x 2.8mm.Equipped with 240 MHz Qualcomm Technologies audio DSPs, an 80 MHz developer - dedicated processor, and a system - managing firmware processor, it offers a flexible QSPI flash programmable platform. Supporting advanced audio codecs (Qualcomm® aptX™ codec, aptX HD, aptx-adaptive, AAC, SBC, LDAC), it has digital and analog microphone interfaces and advanced audio algorithms.Suitable for automotive, Bluetooth earbuds, headsets, and USB Dongle applications, this module leverages robust hardware and software integration for stable, high - performance wireless audio connectivity.

ASM2806, a low latency, low cost and low power 6 lane, maximum 4 downstream ports packet switch. With upstream PCIe Gen3x2 bandwidth, ASM2806 can enable users to build up various high speed IO systems, including server, system storage or communication platforms.

ASM1162, a SATA host controller(AHCI) with upstream PCIe Gen3 x1 and downstream two SATA Gen3 ports. It's a low latency, low cost and low power AHCI controller. With two SATA ports and cascaded port multipliers, ASM1162 can enable users to build up various high speed IO systems, including server, high capacity system storage or surveillance platforms.

ASM1352R is ASMedia’s single chip solution to bridge the USB 3.1 Gen2 to dual SATA interface. ASM1352R supports one USB 3.1 Gen2 ports and two SATA device ports, enabling USB PHY up to 10Gbps in compliance with USB 3.1 specifications and enabling Serial ATA PHYs up to 6Gbps high speed interface, following Serial ATA Revision 3.2 Specification.

ASM1153E is the ASMedia third generation single chip solution, bridging the USB3.0 to Serial ATA host interface with highly integrated SuperSpeed USB3.0, High Speed USB2.0 and SATA1.5/3.0/6.0 Gbps ASMedia self-designed PHYs. Along with excellent compatibility with USB3.0 hosts and SATA devices, ASM1153E uses advanced process technology to optimize the chip power consumption. 

ASM2812, a low latency, low cost and low power 12 lane, maximum 6 downstream ports packet switch. With upstream PCIe Gen3x4 bandwidth, ASM2812 can enable users to build up various high speed IO systems, including server, system storage or communication platforms.

Cavli CQS291 is one among the series of LTE Cat 4 Smart modules with 2G fall back. This Android 14 / Linux based smart module is equipped with an Arm Cortex A53 quad-core CPU architecture with built-in AdrenoTM 702 GPU delivering higher graphics capabilities, better quality images and excellent power performance. The module comes in 6 variants, Worldwide (CQS291-WW), Eurasia and Japan (CQS291-EAJ), North America (CQS291-NA), Australia and New Zealand (CQS291-AN), India (CQS291-IN) and Latin America (CQS291-LA) with every variant supporting multi-constellation GNSS with GPS, BDS, GLONASS, Galileo, QZSS and SBAS. CQS291 supports versatile features such as USB 2.0, Bluetooth 5.0, Wi-Fi & FM making it ideal for wide range of applications. The module supports Qualcomm LA3.0 Automotive Middleware that enables advanced features such as Telemetry and Device management functionalities for connected two-wheelers.

CQ10 is an LTE Cat 1 module with 2G fall back supporting 3GPP release 10 designed for IoT and M2M applications. It delivers a maximum data rate of 10 Mbit/s DL & 5 Mbit/s UL. It has a compact LGA form factor. CQ10 supports In-built GNSS with Qualcomm® Location Suite Gen8C Lite (GPS, GLONASS, BeiDou/Compass, Galileo and QZSS), for precise and dependable positioning. CQ10 supports VoLTE and SMS over IMS/SG/CS and supports wide set Internet protocols and industry-standard interfaces. The CQ10 Module is available in five regional variants, CQ10-EAJ for Eurasia & Japan, CQ10- NA for North America CQ10-IN for India, CQ10-AN for Australia & New Zealand, CQ10-LA for Latin America along with a worldwide variant, CQ10-WW, for global deployments. CQ10 is ideal for IoT applications such as asset tracking, automotive, e-mobility, data loggers, fleet management and environmental monitoring.

The W25Q512NW support the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI, Quad Peripheral Interface (QPI) as well as Double Transfer Rate (DTR): Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 133MHz are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories.

The Synaptics S9Axx is a high performance touch controller with up to 60 sensing pins (up to 40 RX) for use with touchpads of up to 7.8 inches in diagonal. The S9A5H is recommended for use in PCs, and supports self-capacitance, mutual- capacitance, hybrid sensing, and up to 10-finger detection. It supports moisture detection, and high performance hardware filtering for noise mitigation targeting AC charger noise and severe common mode noise. S9A5H security meets and exceeds the NIST SP800-193 requirements for firmware update protection, corruption detection, and recovery.

The Synaptics S98xx is a high performance touch controller with up to 54 sensing pins for use with touchpads of up to 7 inches in diagonal. The S98xx is recommended for use in PCs, and supports self-capacitance, mutual- capacitance, hybrid sensing. It supports moisture detection, and high performance hardware filtering for noise mitigation targeting AC charger noise and severe common mode noise.