QCC3081 Module Only Development Board

QCC3086 Module Only Development Board

QCC5181 Development Kit

QCC3083 Development Kit

QCC5181 Module Only Development Board

QCC3095 Development Kit

QCC3095 Module Only Development Board

QCC3091 Module Only Development Board

QCC3091 Development Kit

QCC732x Development Kit V1.0

QCC5229 Development Kit

The Dragonwing IQ-9075 EVK is a comprehensive evaluation platform to test the industrial-grade performance of the Dragonwing IQ-9075 processor for IoT solutions. The Dragonwing IQ-9075 EVK showcases the most common features of the Dragonwing IQ-9075 processor, which is optimized for industrial IoT and robotics applications involving heavy workloads in the most demanding environments like autonomous mobile robots (AMRs) and industrial machinery. The Dragonwing IQ-9075 EVK consists of a mainboard, supporting key interfaces, and optional expansion mezzanine boards to support additional features. It enables developers, OEMs, and ODMs to design and test their solutions powered by the industrial-grade Dragonwing IQ9075 processor integrated with standard interfaces and connectors, mezzanine expandability, and wireless connectivity. Test and prototype software development and hardware designs with less effort and cost to get your product to market faster.

The Dragonwing IQ-8275 EVK showcases the key capabilities of the Dragonwing IQ-8275 processor, purpose-built for robotics, edge AI boxes, gateways, AMRs, industrial automation, and many more applications that require multi-thread computing, independent AI, and graphics processing while minimizing cost and power requirements. Engineered for edge AI operations, it is designed to enable robust computing, high-speed connectivity, and long lifecycle support for mission-critical deployments.

QCC7228 Development Kit

QCC7226 Development Kit

QCC7228+QCP7321 Module Only Development Board

QCC7228 Module Only Development Board

QCC7228+QCP7321 Development Kit

COM-HPC Mini Computer-on-Module based on Qualcomm Dragonwing™ IQ-X Series

This Wi‑Fi SDIO module is a single-stream wireless solution supporting IEEE 802.11a/b/g/n/ac connectivity and is based on the Qualcomm® QCA9377 System-on-Chip. The module supports Wave 2 MU-MIMO (client mode), which is designed to improve network efficiency in compatible WLAN environments compared with earlier 802.11n implementations. Its compact form factor, feature set, and power-conscious design make it well suited for portable-device applications.

The Snapdragon® 8 Gen 2 Mobile Platform is an AI-focused connected-computing platform created by Qualcomm Technologies, Inc. Powered by the Snapdragon® SM8550P SoC, the HDK is built to support natural-language processing, including multi-language translation and transcription, AI-enhanced video capture, and direct voice-command functionality.

Tiny (21mm x 17mm) low-power dynamic mesh module for rapid prototyping of mesh-enabled products. Multi-channel, multi-node relay of video, voice, and data with security focused AES-256 encryption implemented in the DSP. A self-healing dynamic mesh protocol with auto-search and connect with group members, while dynamically optimizing the RF links between nodes in real-time. Wideband voice with virtually unlimited users per channel with 5 simultaneous talkers. Video relay to extend the reach for robots and drones, adding hundreds of meters per hop. Provision to mix streams and to relay device control data across the mesh network. For details see: https://elaratek.com/wp-content/uploads/2026/08/Mesh_Module-2026.pdf

Development Kit for QCC3024 based on BGA package designed to help educe development time and cost when developing Bluetooth Stereo Headsets.

Smux 5.0 Support NFC AI Touchpad Implement

IT8987 is a highly integrated embedded controller with system functions suitable for mobile system applications. The IT8987 directly interfaces to the LPC bus and provides ACPI embedded controller function, keyboard controller (KBC) and matrix scan, PWM and ADC for hardware monitor, PS/2 interface for external keyboard/mouse devices, BRAM, CIR, and system wakeup functions for system power management.

IT81202 is a 32-bit RISC-V Micro-controller and a highly integrated embedded controller with system functions suitable for mobile system applications.

Inforce 6310™ Micro Single Board Computer (SBC) powered by the Qualcomm® SDA450 platform provides vibrant displays and immersive multimedia experiences. It enables concurrent 1080p60 fps HDMI output and 1080p60 fps camera encode. It is designed exclusively to drive digital signage and display use-cases by enabling distribution of your full HD resolution video content smoothly.

The Inforce 6560 Single Board Computer (SBC) combines the heterogeneous compute capabilities of the Qualcomm® SDA660 SoC with 2x2 802.11ac Wi-Fi, Bluetooth 5.x, a full-featured USB-C interface with UltraHD display capability, an integrated battery charging circuitry with battery header, an onboard RTC, and ample internal memory to make it a complete 4K encode/decode plug-n-play system. Qualcomm® AI Engine enables advanced visual computing, enhanced graphics, and machine learning capabilities.

The Inforce 6640 SBC is based on Qualcomm® APQ8096 processor equipped with the Qualcomm® AI Engine and the Qualcomm Spectra™ camera ISP to enable high-end industrial IoT applications, video analytics, advanced medical imaging and teleconferencing use-cases. It has dual band WiFi, Bluetooth 4.0, 4K HDMI-Input and concurrent dual HDMI Outputs rendering capability a complete solution for Capturing & Streaming UHD Video content.

Aikri-22X-90AD-4 development kit is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 kit comprises Qualcomm® QCS2290-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

Aikri-42X-10LD-3 development kit is based on Qualcomm® QRB4210 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its three 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QRB4210 kit comprises Qualcomm® QRB4210-based SoM, a carrier board, and a mezzanine board. It is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras. 

Aikri-22X-90AS-4 System-on-Module (SoM) is based on Qualcomm® QCS2290 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its two 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QCS2290 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

Aikri-42X-10LS-3 System-on-Module (SoM) is based on Qualcomm® QRB4210 SoC and delivers greater performance, better graphics, and broader connectivity options. It supports multiple cameras with its three 4-lane CSI input interfaces. It also supports a 4-lane MIPI DSI. QRB4210 SoM is an ideal choice to kick-start the development of industrial and commercial IoT applications such as industrial handhelds in logistics and warehousing, security panels, and cameras.

The Aikri-40X-5LD-1 development kit comprises of the Qualcomm® QCS405 based SoM mounted on a carrier board, interfaced with a mezzanine board. All native interfaces that the QCS405 supports, such as GPIOs, USB 3.0, PCIe, HDMI, SDIO, I2S, UART, I2C, and SPI are made available on the development kit. The Aikri development kit with QCS405 helps kick-start and optimize your creation of complex, feature-rich smart-audio solutions such as Smart-speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc. within a short turnaround time.

The Aikri-40X-4LD-1 development kit comprises of the Qualcomm® QCS404 based SoM mounted on a carrier board, interfaced with a mezzanine board. All native interfaces that the QCS404 supports, such as GPIOs, USB 3.0, PCIe, SDIO, I2S, UART, I2C, and SPI are made available on the development kit. The Aikri development kit with QCS404 helps kick-start and optimize your creation of complex, feature-rich smart-audio solutions such as Smart speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc. within a short turnaround time.

The Aikri-40X-5LS-1 System on Module (SoM) is powered by Qualcomm® QCS405 SoC, which is designed specifically for smart audio applications. The QCS405 supports features such as Multi-mic Qualcomm® Noise and Echo Cancellation that isolates noisy environments from voice, simultaneous multi-keyword detection to aid voice services. This production-ready SoM has a Yocto Linux BSP pre-loaded and helps manufacturers easily create complex, feature-rich, and voice-supported smart audio applications such as Smart speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc.

The Aikri-40X-4LS-1 System on Module (SoM) is powered by Qualcomm® QCS404 SoC, which is designed specifically for smart audio applications. The QCS404 supports features such as Multi-mic Qualcomm® Noise and Echo Cancellation that isolates noisy environments from voice, simultaneous multi-keyword detection to aid voice services. This production-ready SoM has a Yocto Linux BSP pre-loaded and helps manufacturers easily create complex, feature-rich, and voice-supported smart audio applications such as Smart speakers, Soundbars, Home cinema, Smart assistants, Home Hubs etc.

The eInfochips 855 hardware development kit (HDK) is based on Snapdragon® 855 processor that offers next generation on-device AI capabilities to make voice, camera, gaming and power management smarter, faster and more intuitive. This HDK is an ideal platform to kick-start development of embedded devices for AR/VR, infotainment, 4K cameras as well as automation solutions. The main purpose of Snapdragon 855 HDK is to kick start development and testing of devices for original equipment manufacturers (OEMs), hardware/software vendors and developers for faster time to market.

The Snapdragon® 845 Mobile Platform includes high performance camera and graphics features that are designed to capture advance color information. Qualcomm® Adreno™ 630 GPU and Qualcomm Spectra™ 280 ISP has enabled vivid graphics, crystal-clear audio and improved area awareness, making Snapdragon 845 Mobile Platform ideal for real-life experience solution. To support the ecosystem of technology companies and application providers looking to utilize these advanced features, eInfochips is offering a Hardware Development Kit (HDK) featuring the Snapdragon SDA845 processor. This development kit is designed to help OEMs and device makers in evaluating the processor and peripherals; an ideal starting point for creating high-performance mobile devices, software development and applications.

The eInfochips 865 hardware development kit (HDK) is based on Snapdragon® 865 processor (SM8250). The HDK offers intelligent on-device AI, 2-gigapixel-per-second camera speeds, and high-end graphics at low power consumption. This feature-rich Android 10 development platform is an ideal starting point for integration and innovation of connected devices. The main purpose of Snapdragon 865 HDK is to kick start development and testing of devices for original equipment manufacturers (OEMs), hardware/software vendors and developers for faster time to market. This HDK is an ideal platform to kick-start development of embedded devices for Gaming, AR/VR, infotainment, 4K cameras as well as automation solutions.

New generation of multi-mode Smart LTE Cat 6 modules based on the Qualcomm® SDM660 SoC with Android 9.0 OS is well suited for a wide range of industrial and consumer applications with high date-rate and multimedia requirements.

Quectel EG18 is a series of LTE Advanced category 18 modules optimized specifically for M2M and IoT applications such as business router, home gateway, STB, industrial laptop, and industrial PDA. Adopting the 3GPP Rel. 12 LTE technology, it delivers M2M-optimized speeds of 1.2Gbps downlink and 150Mbps uplink peak data rates. Designed in an LGA form factor, EG18 is compatible with Quectel Cat 6/12 modules EG06 and EG12, which will help customers to migrate between different categories.

BG77 is an ultra-compact LPWA module supporting LTE Cat M1, LTE Cat NB2 and integrated GNSS. It is fully compliant with 3GPP Rel.14 specification and provides maximum data rates of 588 kbps downlink and 1119 kbps uplink. It features ultra-low power consumption by leveraging the integrated RAM/flash as well as the processor supporting ThreadX, achieving up to 70% reduction in PSM leakage and 85% reduction in eDRX current consumption compared to its predecessor.

Based on Qualcomm® Snapdragon™ Automotive 4G Platform, AG520R is a series of automotive grade LTE category 9/19 & C-V2X module developed by Quectel. Designed and manufactured according to IATF 16949:2016 quality management system, it is targeted at the IoV (Internet of Vehicles) applications. Adopting the 3GPP Rel. 14 technology, it features LTE maximally 1.6Gbps downlink and 75Mbps uplink data rates.

Based on the Qualcomm® 9150 C-V2X ASIC, Quectel's AG15 is an automotive grade C-V2X module designed and manufactured according to IATF 16949:2016 standards. It is designed for use in extremely harsh environments and provides superior ESD/EMI protection performance. Through C-V2X PC5 direct communications, AG15 can make traffic smoother and more efficient through paving the way for automated driving and achieving the goal of fully connected traffic.

MeigSmart SLM156 is a high-performance module with multiple modes of NB-IoT/Cat M/EGPRS using Qualcomm® MDM9205 LTE modem. It features extremely low power consumption and ultra-compact size of 21x20x2.3mm profile to ideally suit for size consious applications, such as smart metering, smart city and asset tracking. SLM156 supports LCC package which makes it an ideal solution for large-scale manufacturing. The complete GPS and Voice services meet client-side demands for wide range connectivity.

Powered by Qualcomm Technologies' processors, supporting 4-lane USB, RJ45, RJ12, RJ11, Micro-USB and headset interfaces. Adopting structured light camera to support facial recognition and its adoption in financial payment. ESIM card function starts the new era of sim card, which is a convenient solution for unmanned supermarket, chain restaurants, convenient stores, etc by providing automatic check outs, online orders, membership management, auto closing and warehouse management.

MeiG Smart utilizes Qualcomm Technologies chipsets and narrow band modules to provide customized integrated smart system with narrowband and broadband network. The solution integrates DMR, PDT, TETRA and MPT narrowband private network 4G/3G/2G, WLAN broadband technology to provide end-to-end voice, data and video solution. It makes it possible for industrial customers to realize voice command, multi-media cluster, real-time data interaction and collaborative operation.

The Snapdragon® 8 Gen 3 Mobile Platform delivers premium-level performance across all mobile experiences. The Qualcomm® AI Engine was developed with on-device generative AI. Below are a few highlights of the HDK.

The Open-Q™ 2290 SIP is a cost-effective solution that delivers powerful performance, vivid graphics, dynamic camera capabilities, and a broad range of connectivity options.The design is based on the Qualcomm® QCS2290, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.

Lantronix Open-Q™ 626 µSOM based on the Qualcomm® APQ8053-Pro processor, is an ultra-compact (50mm x 25mm) production-ready, pre-certified SOM that is ideal for powering next-generation connected cameras, and other IoT devices. The feature-rich SOM with its advanced processor technology supports premium 4K video with HEVC capture and playback for optimal balance of quality and bandwidth.

Lantronix’s Open-Q™ 626 µSOM Development Kit is a cost-effective, feature rich, camera tuned, exposed board platform powered by our Open-Q™ 626 µSOM (Micro System on Module) that is based on the Qualcomm™ APQ8053 Pro processor. The Development Kit is ideal for evaluation of the Open-Q™ 626 µSOM (Micro System on Module) as well as jump-starting development of connected camera devices or other high performance embedded products.

The Open-Q™ 865XR SOM Development Kit is a versatile, easy-to-use, exposed board platform, powered by our ultra-compact, production-ready, Open-Q™ 865XR SOM. The SOM utilizes Qualcomm Technologies heterogeneous compute expertise to offer a System-on-Chip with multiple specialized processing cores for powerful AI processing, image and graphics processing, and audio processing.

Lantronix’s Open-Q™ 835 μSOM is an ultra-compact (50mm x 25mm), production-ready SOM that is ideal for products targeting advanced 3-D graphics, lifelike VR and AR experiences, advanced machine learning technology, or the ultimate in photography and videography.Powered by the top-tier Qualcomm® Snapdragon™ 835 processor it is built on the advanced 10nm FinFET process for smaller size and lower power. The 835 μSOM offers numerous peripheral I/O for flexible application in a wide range of advanc

Lantronix’s Open-Q™ 2500 Development Kit is an open frame kit using our ultra-compact (approx. 525mm2), production-ready Open-Q™ 2500 SOM (System on Module), a computing module powered by Qualcomm’s® Snapdragon Wear™ SDW2500 platform. The Open-Q™ 2500 SOM (System on Module) combines critical elements for wearable device innovation: high performance, small size, low power, integrated sensor support, and seamless connectivity.

IoT development kit designed for high-performance compute, accessibility, and flexible and customizable features. The Qualcomm® RB3 Gen 2 Lite Development Kit gives developers a valuable combination of impressive performance and customizable features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation. The Qualcomm RB3 Gen 2 Lite is based on the Qualcomm Dragonwing™ processor. This processor’s scalable performance is designed to deliver superior features and performance across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications. This includes support for Wi-Fi 6E for ubiquitous coverage, a unified software stack, powerful AI, and expanded interfaces across ecosystems. - Key Features: Based on the Qualcomm Dragonwing™ QCS5430 processor. Support for Wi-Fi 6E for ubiquitous coverage. Across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications.

Rambutan is based on Qualcomm® QCA9557 or Qualcomm® QCA9550 SoC and comes in two temperature ranges: commercial* (Rambutan) and industrial** (Rambutan-I).It is a surface-mountable, dual-sided, Wi-Fi enabled Linux module. Dual-band radio (2.4 or 5 GHz), powerful 720 MHz CPU, 300 Mbps data rate, 128 MB RAM and Flash, and a development kit with multiple interfaces (e.g. Gigabit Ethernet port, PCIe, hardware SPI, etc.) are the main advantages of the Rambutan module. Commercial temperature range: 0-65°C, **Industrial temperature range: -40-85°C

The Pineapple PCIe module is based on the Qualcomm® QCN9074 SoC, a highly integrated wireless local area network (LAN) solution designed for 2.4/5/6 GHz IEEE802.11ax/ac/n/g/b/a applications, including the Wi-Fi 6E standard. With support for Wi-Fi 6E, it delivers enhanced performance and expanded frequency options for even higher data rates and reduced interference. The module performs access point (AP) and station (STA) functionality with 4x4 MIMO and 4 spatial streams, ensuring efficient and reliable data transmission. The QCN9074 chip features a dual-synthesizer WLAN radio with native 160 MHz support, further enhancing the module's capabilities. The module is designed for surface-mount installation and can be soldered onto M.2 and miniPCIe cards for seamless integration. The Pineapple supports the embedded Linux framework FirmUx from 8devices. The software can be also built by using OpenWRT.