The ultra-premium Snapdragon S7 Sound platforms deliver flagship performance and flexibility with best-in-class compute, on-device AI, and audio.
Advanced connectivity includes Bluetooth and micro-power Wi-Fi, enabling breakthrough features like Qualcomm XPAN and Direct to Cloud—for a new era of intelligent hearables. These platforms are ideal for next-gen hearables demanding maximum innovation, intelligence, and feature richness.
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Product | CPU Clock Speed | DSP Clock Speed | Flash Location | Bluetooth Specification Version | Wi-Fi Features | Qualcomm® Artificial Intelligence (AI) Engine Qualcomm® Sensing Hub Generation | Qualcomm® Sensing Hub Features | Part Part Number(s) |
|---|---|---|---|---|---|---|---|---|
Premium | ||||||||
300 GHz | 2x 500 GHz | Internal | Bluetooth® 5.4 | Qualcomm® XPAN technology1 | 2nd | Qualcomm® Sensing Hub | QCC7226 | |
Other | ||||||||
200 MHz | 350 MHz | Internal | Bluetooth® 5.4 | — | — | — | — |
- S7 Pro Gen 1 Sound Platform
