The ultra-premium Snapdragon S7 Sound platforms deliver flagship performance and flexibility with best-in-class compute, on-device AI, and audio.
Advanced connectivity includes Bluetooth and micro-power Wi-Fi, enabling breakthrough features like Qualcomm XPAN and Direct to Cloud—for a new era of intelligent hearables. These platforms are ideal for next-gen hearables demanding maximum innovation, intelligence, and feature richness.
Compare products
Note: to leverage the best experience for the product comparison table, please use the desktop to view content.
1 of 3 total products
Product | CPU Clock Speed | DSP Clock Speed | Bluetooth Specification Version | Wi-Fi Features | Audio Qualcomm® aptX™ audio technology support | Qualcomm® Active Noise Cancellation (ANC) technology support | Qualcomm® cVc™ Echo Cancelling and Noise Suppression (ECNS) technology support | Power Consumption Amperage | Qualcomm® Artificial Intelligence (AI) Engine Qualcomm® Sensing Hub Generation | Part Part Number(s) |
|---|---|---|---|---|---|---|---|---|---|---|
Premium | ||||||||||
300 GHz | 2x 500 GHz | Bluetooth® 6.01 | Qualcomm® XPAN technology2 | Qualcomm® aptX™ Audio | Hybrid | 1-mic Earbuds | 3 mA3 | 2nd | QCC7226 |
- 6.2
- S7 Pro Gen 1 Sound Platform
- Base consumption
- Music streaming
